CN107203253A - A kind of contact active Phase cooling structure and passive Phase cooling structure - Google Patents

Abstract

The invention discloses a contact type active phase change cooling structure, which comprises a vertically arranged casing with an open top, a top cover is sealed and installed at the top opening of the casing, and at least one cooling fin is vertically arranged on at least one outer part of the casing; A pressure gauge and a vacuum pump connected to the inside of the shell are installed on the outside of the shell. A main board is installed on the inner wall of the shell, and a heating chip is connected to the main board. One end of the pipeline is located in the liquid working medium, and the other end of the pipeline protrudes out of the liquid working medium and is equipped with a nozzle, which is arranged facing the heating chip. The invention also provides a contact passive phase change cooling structure. The invention mainly uses liquid cooling and direct contact heat dissipation, and combines vacuum heat pipe heat transfer and air cooling heat dissipation, so that the heating element can be cooled rapidly, and the heat dissipation effect is greatly improved.

Description

A contact active phase change cooling structure and a passive phase change cooling structure

technical field

The invention belongs to the technical field of computer heat dissipation, and in particular relates to a contact active phase change cooling structure and a passive phase change cooling structure.

Background technique

With the rapid development of electronic technology, people's requirements for computers are getting higher and higher. When the computer is running, it will generate a lot of heat. When the temperature is too high, it will directly burn out the components. Therefore, cooling the computer components is the prerequisite for the normal operation of the computer. At present, in the field of heat dissipation, commonly used technologies include liquid cooling and air cooling. The heat dissipation effect of liquid cooling is more obvious, but the current liquid cooling technology can only solve the heat dissipation of the main heat source, and the structure is complex, and the heat source with small heat generation and irregular shape still needs to cooperate with the air cooling heat dissipation method. For computer heat dissipation, air-cooled heat dissipation technology is relatively mature, and it is also a commonly used heat dissipation technology on the market. However, due to the small specific heat capacity of air, the heat dissipation effect cannot meet the increasing requirements of computer heat dissipation.

Contents of the invention

The purpose of the present invention is to provide a contact-type active phase change cooling structure and a passive phase change cooling structure to solve the problems in the prior art that both liquid cooling and air cooling have defects and poor use effects.

The technical solution adopted in the present invention is: a contact active phase change cooling structure, including a vertically arranged casing with an open top, a top cover is sealed and installed at the top opening of the casing, and at least one outer part of the casing is vertically arranged at least A heat dissipation fin; a pressure gauge and a vacuum pump connected to the inside of the shell are installed on the outside of the shell, a main board is arranged on the inner wall of the shell, a heating chip is connected to the main board, the shell is filled with a liquid working medium, and the liquid working medium is set through a pipeline There is a micro-liquid pump, one end of the pipeline is located in the liquid working medium, and the other end of the pipeline extends out of the liquid working medium and is equipped with a nozzle, which is arranged facing the heating chip.

The present invention is also characterized in that:

The shell is a one-piece structure formed by stamping or welding process;

The liquid working medium is non-conductive, non-corrosive, and easy to phase change under low vacuum; the liquid working medium occupies 5%-90% of the internal space of the shell.

The liquid working medium occupies 30%-50% of the inner space of the shell.

The top cover is sealingly connected with the top opening of the casing through sealing bolts.

At least one fan is provided on the bottom of the casing.

The outer part of the casing is provided with a power supply lead wire, and one end of the power supply lead wire extends out of the cooling fins.

Another technical scheme adopted in the present invention is:

A contact-type passive phase-change cooling structure, comprising a horizontally arranged shell with an open side end, a top cover is installed on the opening of the shell, at least one cooling fin is installed on the outside of the top of the shell, and a Connected to the pressure gauge and vacuum pump, the inner wall of the bottom of the housing is provided with a main board, the main board is connected with a heating chip, the housing is filled with a liquid working medium, and the liquid working medium completely covers the main board and the heating chip.

Another technical solution of the present invention is characterized in that:

The shell is an integrally formed structure by stamping or welding; the liquid working fluid is non-conductive, non-corrosive, and easy to phase change under low vacuum.

The top cover is sealingly connected with the opening of the casing through sealing bolts.

The outer wall of the bottom of the casing is provided with an external lead wire of a power supply.

The beneficial effects of the present invention are: a contact active phase change cooling structure and a passive phase change cooling structure of the present invention, through the direct contact heat dissipation of liquid cooling as the main, the combination of vacuum heat pipe heat transfer and air cooling heat dissipation, so that heat The components cool down quickly, which greatly improves the heat dissipation effect.

Description of drawings

Fig. 1 is a structural schematic diagram of a contact active phase change cooling structure of the present invention;

Fig. 2 is a side view structural schematic diagram of Fig. 1;

Fig. 3 is a structural schematic diagram of a contact passive phase change cooling structure of the present invention.

In the figure, 1. Housing, 2. Radiating fins, 3. Top cover, 4. Sealing bolts, 5. Pressure gauge, 6. Vacuum pump, 7. Main board, 8. Heating chip, 9. Micro liquid pump, 10. Nozzle , 11. Power external lead, 12. Liquid working medium, 13. Fan, 14. Pipeline.

detailed description

Below in conjunction with accompanying drawing and specific embodiment the present invention is described in further detail:

A contact type active phase change cooling structure of the present invention, as shown in Figure 1 and Figure 2, comprises a vertically arranged shell 1 with an open top, a top cover 3 is sealed at the top opening of the shell 1, at least At least one cooling fin 2 is vertically arranged on one outer side; a pressure gauge 5 and a vacuum pump 6 connected to the inside of the housing 1 are installed on the outside of the housing 1, and a main board 7 is provided on the inner wall of the housing 1, and a heating chip 8 is connected to the main board 7 , the housing 1 is filled with a liquid working medium 12, the liquid working medium 12 is provided with a micro liquid pump 9 through a pipeline 14, one end of the pipeline 14 is located in the liquid working medium 12, and the other end of the pipeline 14 extends out of the liquid working medium 12 and A shower head 10 is installed, and the shower head 10 is arranged facing the heating chip 8 . Among them, the shell 1 is a structure integrally formed by stamping or welding; the liquid working medium 12 is non-conductive, non-corrosive, and easy to phase change under low vacuum; the liquid working medium 12 occupies 5%-90% of the internal space of the shell 1 %, preferably 30%-50%; the top cover 3 is sealed and connected to the top opening of the casing 1 through the sealing bolt 4; the bottom of the casing 1 is provided with at least one fan 13; the outer part of the casing 1 is provided with a power supply external lead 11, One end of the power supply external lead wire 11 extends out of the heat dissipation fin 2 .

A contact type passive phase change cooling structure of the present invention, as shown in Figure 3, comprises a casing 1 which is arranged horizontally and has an open side end, a top cover 3 is mounted on the opening of the casing 1, and a top outside of the casing 1 is installed At least one cooling fin 2, a pressure gauge 5 and a vacuum pump 6 connected to the inside of the shell 1 are installed on the outside of the shell 1, a main board 7 is provided on the bottom inner wall of the shell 1, a heating chip 8 is connected to the main board 7, and the shell 1 is filled with There is a liquid working medium 12, and the liquid working medium 12 completely covers the main board 7 and the heating chip 8. Among them, the shell 1 is an integrally formed structure by stamping or welding process; the liquid working medium 12 is a working medium that is non-conductive, non-corrosive, and easy to phase change under low vacuum; the top cover 3 is sealed and connected to the opening of the shell 1 through the sealing bolt 4 ; The outer wall of the bottom of the shell 1 is provided with an external power lead 11 .

A contact active phase change cooling structure of the present invention, wherein the process requirements of each part are:

1) The shell 1 is integrally formed by stamping or welding process, and the manufacturing process requires no gaps to ensure that there is no leakage after carrying the liquid;

2) The heat dissipation fins are divided into upper and lower parts, both of which adopt the traditional "vertical" natural heat dissipation method. When the heat dissipation area is not enough, the fan 13 under the casing is used to enhance the air flow (as shown in Figure 2);

3) The sealing bolt 4 is used for sealing the top cover 3 and the casing 1;

4) The pressure gauge 5 and the vacuum pump 6 are installed externally as a whole, which is used to extract the air in the casing to ensure the vacuum state; when the pressure P≤set value A, the vacuum pump 6 starts; when the pressure P reaches the set value B, Vacuum pump 6 stops;

5) The main board 7 is closely attached to the shell 1, and is normally installed with the heating chip 8;

6) The number of shower heads 10 is determined according to the key heat dissipation areas in the casing, and the positions of the shower heads 10 are installed at the corresponding positions of the heat-generating chips 8 .

7) The liquid working medium 12 is non-conductive, non-corrosive, and easy to phase change under low vacuum, such as fluorine, silicon oil, ultra-pure water, etc., and the amount of liquid filled in the shell reaches 1/4 of the internal space of the chassis .

After the whole machine is assembled according to the process requirements, the pressure gauge 5 monitors the internal pressure value, and the vacuum pump 6 starts to function to keep the interior in a vacuum state all the time. After the micro-liquid pump 9 is energized, the liquid is pumped into the pipeline 14, and sprayed through the nozzle 10 to areas with high calorific value and need to focus on heat dissipation. The liquid is heated and evaporated to take away the heat, and flows back to the lower end of the shell along the main board 7 . Since part of the upper space of the housing is in a vacuum state at this time, a part of the liquid working medium 12 in the memory will evaporate based on the physical factors of liquid phase transition, and take away the heat from the upper half of the chip area in the housing. Since the liquid working medium 12 has a phase change phenomenon, when the evaporated gas encounters the low-temperature inner wall of the casing, it will be converted from gas to liquid and flow back to the bottom of the case, releasing latent heat at the same time, which is taken away by the cooling fins 2 on the outer wall of the case. Through the circulation phase change heat dissipation inside the chassis, the heat accumulated inside will be dissipated through the heat sink of the casing 1 . When the heat dissipation area outside the shell is insufficient and the temperature does not meet the requirements, a fan 13 can be arranged below the shell to release all the accumulated heat by the fan 13.

A contact passive phase change cooling structure of the present invention, as shown in Fig. 3, puts the whole machine "upside down", directly fills the cooling medium into the machine, and soaks the internal components.

After the whole machine is installed "upside down", the liquid working medium 12 will completely soak the heating chip 8 and the main board 7 . Similarly, the vacuum pump 6 and the pressure gauge 5 keep the inside of the cabinet in a vacuum state all the time. The liquid working medium 12 in the chassis absorbs the heat of the heating element, and after reaching a certain temperature, based on the principle of liquid phase transition, it continuously dissipates heat from the heating chip 8 . Similarly, a fan can be placed outside the cooling fins 2 to force the flow of external air and improve the cooling effect.

In summary, the present invention has the following characteristics:

1) Using the cooling method of liquid directly contacting the heating chip with phase change, changing the traditional computer air-cooling heat dissipation method, greatly improving the heat dissipation efficiency;

2) Based on the liquid phase change technology to dissipate heat from the chip, the overall structure is simple and the cost is low;

3) While it is possible to carry out liquid spray heat dissipation on the main heat dissipation area in a targeted manner, by selecting a suitable nozzle, the heat dissipation of small heat sources and irregular heat sources can be effectively treated, reducing the amount of work;

4) A fan can be placed outside the cooling fins of the shell to force the external air to flow, speed up the gas flow rate, and ensure the normal heat dissipation inside the shell; when the thermal power consumption is small, the fan can be turned off and rely on natural convection for heat dissipation. The size of the heat load, adjust the number of open fans to achieve maximum energy saving;

5) The liquid working medium adopts non-conductive liquid working medium, which has a high safety factor.

The embodiments described above are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

Claims (10)

1. a kind of contact active Phase cooling structure, it is characterised in that including be vertically arranged and top end opening shell (1), Top cover (3) is sealed and installed with the top end opening of shell (1), at least one outside portion of shell (1) is vertically arranged at least one Radiating fin (2)；Pressure gauge (5) and vavuum pump (6) with being connected inside shell (1), shell are installed outside shell (1) (1) madial wall, which is provided with mainboard (7), mainboard (7), is connected with euthermic chip (8), and liquid working substance is filled with shell (1) (12) Miniature liquid pump (9), is provided with by pipeline (14) in liquid working substance (12), one end of the pipeline (14) is located at liquid work In matter (12), the other end flashed liquid working medium (12) of pipeline (14) outside and is provided with shower nozzle (10), and shower nozzle (10) is just to described Euthermic chip (8) is set.

2. a kind of contact active Phase cooling structure according to claim 1, it is characterised in that the shell (1) is Punching press or the integrally formed structure of welding procedure；The liquid working substance (12) is easily phase transformation under non-conductive, corrosion-free, low vacuum Working medium；The liquid working substance (12) accounts for the 5%-90% of the housing (1) inner space.

3. a kind of contact active Phase cooling structure according to claim 2, it is characterised in that the liquid working substance (12) 30%-50% of the housing (1) inner space is accounted for.

4. a kind of contact active Phase cooling structure according to claim 1, it is characterised in that the top cover (3) is led to Sealing bolt (4) is crossed with being tightly connected at the top end opening of the shell (1).

5. a kind of contact active Phase cooling structure according to claim 1, it is characterised in that the shell (1) Bottom is provided with least one fan (13).

6. a kind of contact active Phase cooling structure according to claim 1, it is characterised in that the shell (1) Outside portion is provided with power supply outer lead (11), and the radiating fin (2) is stretched out outside in one end of power supply outer lead (11).

7. a kind of passive Phase cooling structure of contact, it is characterised in that include the shell of a horizontally disposed and side opening (1) top cover (3), is sealed and installed with the opening of shell (1), the top outer of shell (1) is provided with least one radiating fin (2) pressure gauge (5) and vavuum pump (6) with being connected inside shell (1), the bottom of shell (1), are installed outside shell (1) Madial wall, which is provided with mainboard (7), mainboard (7), is connected with euthermic chip (8), and liquid working substance (12), liquid are filled with shell (1) The mainboard (7) and euthermic chip (8) are completely covered body working medium (12).

8. the passive Phase cooling structure of a kind of contact according to claim 7, it is characterised in that the shell (1) is Punching press or the integrally formed structure of welding procedure；The liquid working substance (12) is easily phase transformation under non-conductive, corrosion-free, low vacuum Working medium.

9. the passive Phase cooling structure of a kind of contact according to claim 7, it is characterised in that the top cover (3) is led to Sealing bolt (4) is crossed with being tightly connected at the opening of the shell (1).

10. the passive Phase cooling structure of a kind of contact according to claim 7, it is characterised in that the shell (1) Bottom outside wall is provided with power supply outer lead (11).