CN107203253A - A kind of contact active Phase cooling structure and passive Phase cooling structure - Google Patents
A kind of contact active Phase cooling structure and passive Phase cooling structure Download PDFInfo
- Publication number
- CN107203253A CN107203253A CN201710519999.4A CN201710519999A CN107203253A CN 107203253 A CN107203253 A CN 107203253A CN 201710519999 A CN201710519999 A CN 201710519999A CN 107203253 A CN107203253 A CN 107203253A
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- Prior art keywords
- shell
- cooling structure
- phase cooling
- liquid working
- liquid
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Links
- 238000001816 cooling Methods 0.000 title claims abstract description 39
- 239000007788 liquid Substances 0.000 claims abstract description 62
- 239000000126 substance Substances 0.000 claims abstract description 34
- 238000007789 sealing Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- 230000009466 transformation Effects 0.000 claims description 8
- 238000004080 punching Methods 0.000 claims description 7
- 238000003466 welding Methods 0.000 claims description 7
- 230000000694 effects Effects 0.000 abstract description 7
- 238000005516 engineering process Methods 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 125000001153 fluoro group Chemical class F* 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 208000011117 substance-related disease Diseases 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
Abstract
The invention discloses a kind of contact active Phase cooling structure, including be vertically arranged and top end opening shell, be sealed and installed with top cover at the top end opening of shell, at least one outside portion of shell is vertically arranged at least one radiating fin；Housing exterior is provided with the pressure gauge and vavuum pump being connected with enclosure, the madial wall of shell is provided with mainboard, euthermic chip is connected with mainboard, liquid working substance is filled with shell, Miniature liquid pump is provided with by pipeline in liquid working substance, one end of pipeline is located in liquid working substance, and the other end flashed liquid working medium of pipeline is outer and is provided with shower nozzle, and shower nozzle is just set to euthermic chip.Present invention also offers a kind of passive Phase cooling structure of contact.Vacuum heat-pipe heat transfer and wind-cooling heat dissipating are combined based on the cold directly contact radiating of liquid, heater element is cooled rapidly, drastically increase radiating effect by the present invention.
Description
Technical field
The invention belongs to computer technical field of heat dissipation, and in particular to a kind of contact active Phase cooling structure and passive
Phase cooling structure.
Background technology
With developing rapidly for electronic technology, requirement of the people to computer is also more and more high.Computer operationally can
Substantial amounts of heat is produced, element can be directly burnt out when temperature is too high, therefore is that computer is normally run to computer components radiating
Premise is ensured.At present in field of radiating, common technology has liquid cold and air-cooled technology.The cold radiating effect of liquid is more apparent, but at present
Liquid refrigeration technique can only solve the radiating of main pyrotoxin, and complicated, and small caloric value and irregular shape thermal source stills need to match somebody with somebody
Close wind-cooling heat dissipating mode.For the radiating of computer, wind-cooling heat dissipating Technical comparing is ripe, is also radiating skill conventional on the market
Art, but be due to air specific heat capacity it is smaller, radiating effect radiates growing requirement it is impossible to meet computer.
The content of the invention
It is an object of the invention to provide a kind of contact active Phase cooling structure and passive Phase cooling structure, solve existing
Have in technology liquid-cooling heat radiation and wind-cooling heat dissipating it is each it is defective, the problem of using effect is not good.
The technical solution adopted in the present invention is：A kind of contact active Phase cooling structure, including be vertically arranged and push up
Top cover is sealed and installed with the shell of end opening, the top end opening of shell, at least one outside portion of shell is vertically arranged at least
One radiating fin；Housing exterior is provided with the pressure gauge and vavuum pump being connected with enclosure, and the madial wall of shell is set
Have and euthermic chip is connected with mainboard, mainboard, filled with liquid working substance in shell, be provided with liquid working substance by pipeline miniature
Liquid pump, one end of pipeline is located in liquid working substance, and the other end flashed liquid working medium of pipeline is outer and is provided with shower nozzle, and shower nozzle is just right
Euthermic chip is set.
The features of the present invention is also resided in：
Shell is punching press or the integrally formed structure of welding procedure；
Liquid working substance is the working medium of easy phase transformation under non-conductive, corrosion-free, low vacuum；Liquid working substance accounts for enclosure interior space
5%-90%.
Liquid working substance accounts for the 30%-50% in enclosure interior space.
Top cover is tightly connected at the top end opening by sealing bolt and shell.
The bottom of shell is provided with least one fan.
The outside portion of shell is provided with power supply outer lead, and one end of power supply outer lead is stretched out outside radiating fin.
Another technical scheme of the present invention is：
A kind of passive Phase cooling structure of contact, include the shell of a horizontally disposed and side opening, and shell is opened
Top cover is sealed and installed with mouthful, the top outer of shell is provided with least one radiating fin, and housing exterior is provided with and shell
Pressure gauge and vavuum pump that inside is connected, the bottom inside wall of shell, which is provided with mainboard, mainboard, is connected with euthermic chip, outside
Liquid working substance is filled with shell, mainboard and euthermic chip are completely covered liquid working substance.
The characteristics of another technical scheme of the invention, also resides in：
Shell is punching press or the integrally formed structure of welding procedure；Liquid working substance is easy under non-conductive, corrosion-free, low vacuum
The working medium of phase transformation.
Top cover is tightly connected at the opening by sealing bolt and shell.
The bottom outside wall of shell is provided with power supply outer lead.
The beneficial effects of the invention are as follows：A kind of contact active Phase cooling structure and passive Phase cooling knot of the present invention
Structure, by based on the cold directly contact radiating of liquid, vacuum heat-pipe heat transfer and wind-cooling heat dissipating being combined, make heater element drop rapidly
Temperature, drastically increases radiating effect.
Brief description of the drawings
Fig. 1 is a kind of structural representation of contact active Phase cooling structure of the invention；
Fig. 2 is Fig. 1 side structure schematic view；
Fig. 3 is a kind of structural representation of the passive Phase cooling structure of contact of the invention.
In figure, 1. shells, 2. radiating fins, 3. top covers, 4. sealing bolts, 5. pressure gauges, 6. vavuum pumps, 7. mainboards, 8.
Euthermic chip, 9. Miniature liquid pumps, 10. shower nozzles, 11. power supply outer leads, 12. liquid working substances, 13. fans, 14. pipelines.
Embodiment
The present invention is described in further detail with embodiment below in conjunction with the accompanying drawings：
A kind of contact active Phase cooling structure of the present invention, as shown in Figure 1 and Figure 2, including is vertically arranged and top is opened
Top cover 3 is sealed and installed with the shell 1 of mouth, the top end opening of shell 1, at least one outside portion of shell 1 is vertically arranged at least
One radiating fin 2；The pressure gauge 5 and vavuum pump 6 being connected with inside shell 1, the inner side of shell 1 are installed outside shell 1
Wall, which is provided with mainboard 7, mainboard 7, is connected with euthermic chip 8, is filled with liquid working substance 12, liquid working substance 12 and passes through in shell 1
Pipeline 14 is provided with Miniature liquid pump 9, and one end of pipeline 14 is located in liquid working substance 12, the other end flashed liquid working medium of pipeline 14
12 is outer and be provided with shower nozzle 10, and shower nozzle 10 is just set to euthermic chip 8.Wherein, shell 1 is that punching press or welding procedure are integrally formed
Structure；Liquid working substance 12 is the working medium of easy phase transformation under non-conductive, corrosion-free, low vacuum；It is empty that liquid working substance 12 accounts for the inside of housing 1
Between 5%-90%, preferably 30%-50%；Top cover 3 is by sealing bolt 4 with being tightly connected at the top end opening of shell 1；Outside
The bottom of shell 1 is provided with least one fan 13；The outside portion of shell 1 is provided with power supply outer lead 11, power supply outer lead 11
One end is stretched out outside radiating fin 2.
The passive Phase cooling structure of a kind of contact of the present invention, as shown in figure 3, being opened including a horizontally disposed and side
Top cover 3 is sealed and installed with the shell 1 of mouth, the opening of shell 1, the top outer of shell 1 is provided with least one radiating fin
2, the pressure gauge 5 and vavuum pump 6 being connected with inside shell 1 are installed outside shell 1, the bottom inside wall of shell 1 is provided with
It is connected with mainboard 7, mainboard 7 in euthermic chip 8, shell 1 and is filled with liquid working substance 12, liquid working substance 12 is by mainboard 7 and generates heat
Chip 8 is completely covered.Wherein, shell 1 is punching press or the integrally formed structure of welding procedure；Liquid working substance 12 is non-conductive, nothing
The working medium of easy phase transformation under burn into low vacuum；Top cover 3 is by sealing bolt 4 with being tightly connected at the opening of shell 1；The bottom of shell 1
Portion's lateral wall is provided with power supply outer lead 11.
A kind of contact active Phase cooling structure of the present invention, the technological requirement of wherein each several part is：
1) shell 1 is integrally formed using punching press or welding procedure, and manufacture craft requires tight, it is ensured that nothing after carrying liquid
Seepage；
2) two parts about 2 points of radiating fin are inadequate in area of dissipation all using traditional " vertical " natural heat dissipation mode
When, the enhancing air flow of fan 13 (as shown in Figure 2) below outer shell；
3) sealing bolt 4 is used for the sealing of top cover 3 and shell 1；
4) pressure gauge 5 and the overall external installation of vavuum pump 6, are detached, it is ensured that vacuum state for the air in shell；Work as pressure
During power P≤setting value A, vavuum pump 6 starts；When pressure P reaches setting value B, vavuum pump 6 stops；
5) mainboard 7 is brought into close contact shell 1, and with the normal mounting of euthermic chip 8；
6) quantity of shower nozzle 10 is determined according to the emphasis heat dissipation region in shell, and the position of shower nozzle 10 is arranged on euthermic chip
8 correspondence position.
7) liquid working substance 12 is using the easy working medium of phase transformation under non-conductive, corrosion-free, low vacuum, such as fluorine class, silicone oil, ultrapure
Water etc., the liquid measure being filled with shell reaches the 1/4 of enclosure interior.
After complete machine is assembled by technological requirement, the monitoring internal pressure value of pressure gauge 5, vavuum pump 6 starts effect, keeps internal
All the time it is in vacuum state.After Miniature liquid pump 9 is powered, liquid is squeezed into pipeline 14, is sprayed onto that caloric value is big, need by shower nozzle 10
The region for wanting emphasis to radiate.Heat is taken away in heated liquid evaporation, and flows back to shell lower end along mainboard 7.Due to shell now
Upper segment space is in vacuum state, and physical factor of the liquid working substance 12 based on liquid phase-change of internal memory can evaporate a part, band
Walk the heat of top half chip area in shell.Because liquid working substance 12 has phase transition phenomena, the gas of evaporation runs into shell
During the inwall of interior low temperature, liquid can be converted into by gas and flow back to cabinet bottom, while latent heat is discharged, dissipating on cabinet outer wall
Hot fin 2 is taken away.By the circulating phase-change heat of cabinet inside, being gathered in the heat of inside can be dissipated by the fin of shell 1
Issue.When the area of dissipation of housing exterior is not enough, temperature does not reach requirement, fan 13 can be set below shell, leaned on
Fan 13 all discharges the heat of accumulation.
A kind of passive Phase cooling structure of contact of the present invention, as shown in figure 3, it " puts complete machine " upside down, will directly dissipate
Hot working fluid is filled with machine, and inner member is soaked.
After complete machine " putting upside down " is installed, liquid working substance 12 is set to be completely soaked euthermic chip 8 and mainboard 7.Equally, vavuum pump
6 and pressure gauge 5 cabinet inside is remained under vacuum conditions.Liquid working substance 12 in cabinet absorbs the heat of heater element
Amount, reaches after certain temperature, based on liquid phase-change principle, euthermic chip 8 is persistently radiated.Equally, can be in radiating fin 2
Fan is laid in outside, forces flow of external air, improves radiating effect.
In summary, the invention has the characteristics that：
1) type of cooling of phase transformation is directly contacted to euthermic chip with liquid, changes traditional computer wind-cooling heat dissipating side
Formula, substantially increases radiating efficiency；
2) chip is radiated based on liquid phase-change technology, overall structure is simple, and cost is relatively low；
3) while targetedly can carrying out liquid spray cooling to main heat sink region, the suitable spray of selection is passed through
Head, can be effectively treated to the radiating of small thermal source and irregular hot source, reduce quantities；
4) fan can be laid outside the radiating fin of shell, flow of external air is forced, accelerates the flow velocity of gas, it is ensured that
The proper heat reduction of enclosure interior heat；When heat power consumption is small, fan can be closed, by Natural Heat Convection, according to heat
The quantity of fan is opened in payload, adjustment, realizes maximum energy-conservation；
5) liquid working substance uses nonconducting liquid working substance, and safety coefficient is high.
Embodiments described above is only a part of embodiment of the invention, rather than whole embodiments.Based on this
Embodiment in invention, the every other reality that those of ordinary skill in the art are obtained under the premise of creative work is not made
Example is applied, the scope of protection of the invention is belonged to.
Claims (10)
1. a kind of contact active Phase cooling structure, it is characterised in that including be vertically arranged and top end opening shell (1),
Top cover (3) is sealed and installed with the top end opening of shell (1), at least one outside portion of shell (1) is vertically arranged at least one
Radiating fin (2)；Pressure gauge (5) and vavuum pump (6) with being connected inside shell (1), shell are installed outside shell (1)
(1) madial wall, which is provided with mainboard (7), mainboard (7), is connected with euthermic chip (8), and liquid working substance is filled with shell (1)
(12) Miniature liquid pump (9), is provided with by pipeline (14) in liquid working substance (12), one end of the pipeline (14) is located at liquid work
In matter (12), the other end flashed liquid working medium (12) of pipeline (14) outside and is provided with shower nozzle (10), and shower nozzle (10) is just to described
Euthermic chip (8) is set.
2. a kind of contact active Phase cooling structure according to claim 1, it is characterised in that the shell (1) is
Punching press or the integrally formed structure of welding procedure；The liquid working substance (12) is easily phase transformation under non-conductive, corrosion-free, low vacuum
Working medium；The liquid working substance (12) accounts for the 5%-90% of the housing (1) inner space.
3. a kind of contact active Phase cooling structure according to claim 2, it is characterised in that the liquid working substance
(12) 30%-50% of the housing (1) inner space is accounted for.
4. a kind of contact active Phase cooling structure according to claim 1, it is characterised in that the top cover (3) is led to
Sealing bolt (4) is crossed with being tightly connected at the top end opening of the shell (1).
5. a kind of contact active Phase cooling structure according to claim 1, it is characterised in that the shell (1)
Bottom is provided with least one fan (13).
6. a kind of contact active Phase cooling structure according to claim 1, it is characterised in that the shell (1)
Outside portion is provided with power supply outer lead (11), and the radiating fin (2) is stretched out outside in one end of power supply outer lead (11).
7. a kind of passive Phase cooling structure of contact, it is characterised in that include the shell of a horizontally disposed and side opening
(1) top cover (3), is sealed and installed with the opening of shell (1), the top outer of shell (1) is provided with least one radiating fin
(2) pressure gauge (5) and vavuum pump (6) with being connected inside shell (1), the bottom of shell (1), are installed outside shell (1)
Madial wall, which is provided with mainboard (7), mainboard (7), is connected with euthermic chip (8), and liquid working substance (12), liquid are filled with shell (1)
The mainboard (7) and euthermic chip (8) are completely covered body working medium (12).
8. the passive Phase cooling structure of a kind of contact according to claim 7, it is characterised in that the shell (1) is
Punching press or the integrally formed structure of welding procedure；The liquid working substance (12) is easily phase transformation under non-conductive, corrosion-free, low vacuum
Working medium.
9. the passive Phase cooling structure of a kind of contact according to claim 7, it is characterised in that the top cover (3) is led to
Sealing bolt (4) is crossed with being tightly connected at the opening of the shell (1).
10. the passive Phase cooling structure of a kind of contact according to claim 7, it is characterised in that the shell (1)
Bottom outside wall is provided with power supply outer lead (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710519999.4A CN107203253A (en) | 2017-06-30 | 2017-06-30 | A kind of contact active Phase cooling structure and passive Phase cooling structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710519999.4A CN107203253A (en) | 2017-06-30 | 2017-06-30 | A kind of contact active Phase cooling structure and passive Phase cooling structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107203253A true CN107203253A (en) | 2017-09-26 |
Family
ID=59910617
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710519999.4A Pending CN107203253A (en) | 2017-06-30 | 2017-06-30 | A kind of contact active Phase cooling structure and passive Phase cooling structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107203253A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110099555A (en) * | 2019-06-13 | 2019-08-06 | 北京丰联奥睿科技有限公司 | A kind of funneling subregion liquid cooled server cabinet |
| CN112146496A (en) * | 2020-09-30 | 2020-12-29 | 河南瀚光科技有限公司 | Radiator with liquid phase change and microporous structure |
| WO2023071705A1 (en) * | 2021-11-01 | 2023-05-04 | 华为技术有限公司 | Heat dissipation assembly, vehicle module, and vehicle |
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