CN114771038A - Heat dissipation substrate and preparation equipment thereof - Google Patents
Heat dissipation substrate and preparation equipment thereof Download PDFInfo
- Publication number
- CN114771038A CN114771038A CN202210488577.6A CN202210488577A CN114771038A CN 114771038 A CN114771038 A CN 114771038A CN 202210488577 A CN202210488577 A CN 202210488577A CN 114771038 A CN114771038 A CN 114771038A
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- stamping
- metal core
- heat
- mounting
- mounting plate
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- 239000000758 substrate Substances 0.000 title claims abstract description 116
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 34
- 238000002360 preparation method Methods 0.000 title claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 claims abstract description 80
- 239000002184 metal Substances 0.000 claims abstract description 80
- 239000003822 epoxy resin Substances 0.000 claims abstract description 9
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 9
- 239000000945 filler Substances 0.000 claims abstract description 7
- 238000004080 punching Methods 0.000 claims description 27
- 238000009434 installation Methods 0.000 claims description 18
- 238000009413 insulation Methods 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 16
- 230000000712 assembly Effects 0.000 claims description 12
- 238000000429 assembly Methods 0.000 claims description 12
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- 239000004593 Epoxy Substances 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 239000000463 material Substances 0.000 description 9
- 238000007906 compression Methods 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 230000006835 compression Effects 0.000 description 5
- 238000010030 laminating Methods 0.000 description 2
- 240000007643 Phytolacca americana Species 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0012—Mechanical treatment, e.g. roughening, deforming, stretching
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/206—Insulating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
Abstract
The invention relates to the technical field of heat dissipation substrate preparation, in particular to a heat dissipation substrate and preparation equipment thereof, which comprise a metal core substrate and a heat conduction insulating layer, wherein the metal core substrate is bonded with the heat conduction insulating layer, the heat conduction insulating layer is provided with a plurality of lugs at intervals, the metal core substrate is provided with a plurality of notches corresponding to the lugs, each lug is correspondingly positioned in each notch, the heat conduction insulating layer is formed by mixing epoxy resin and heat conduction filler, and the lugs are positioned in the notches, so that the heat conduction insulating layer and the metal core substrate cannot be dislocated after being used for a long time, and the problem that the heat dissipation substrate is influenced by the fact that the metal core substrate and the heat conduction insulating layer are easy to dislocated after the heat dissipation substrate is used for a long time is solved.
Description
Technical Field
The invention relates to the technical field of heat dissipation substrate preparation, in particular to a heat dissipation substrate and preparation equipment thereof.
Background
The heat dissipation substrate is mostly used for mounting electronic components, and the heat dissipation performance of most heat dissipation substrates is poor.
At present, there is a heat dissipation substrate, in which a heat conductive insulating layer material is disposed on a metal core substrate to enhance the heat dissipation performance of the heat dissipation substrate.
However, most of the metal core substrate and the heat conducting insulating layer are directly bonded together, and after the heat dissipation substrate is used for a long time, the metal core substrate and the heat conducting insulating layer are easily dislocated, which affects the use of the heat dissipation substrate.
Disclosure of Invention
The invention aims to provide a heat dissipation substrate and preparation equipment thereof, which solve the problem that the use of the heat dissipation substrate is influenced because the metal core substrate and a heat conduction insulating layer material of the heat dissipation substrate are easy to dislocate after the heat dissipation substrate is used for a long time.
In order to achieve the above purpose, the present invention provides a heat dissipation substrate, which includes a metal core substrate and a heat conduction insulating layer, wherein the metal core substrate is bonded to the heat conduction insulating layer, the heat conduction insulating layer is provided with a plurality of bumps at intervals, the metal core substrate is provided with a plurality of notches corresponding to the bumps, each bump is correspondingly located inside each notch, and the heat conduction insulating layer is formed by mixing epoxy resin and heat conduction filler.
The epoxy resin is straight-chain epoxy resin, and the heat-conducting filler is one of aluminum oxide, silicon carbide or aluminum nitride.
The invention also provides a preparation device, which is used for preparing the radiating substrate and comprises an installation seat, a first stamping cylinder, a second stamping cylinder, a first stamping template, a second stamping template, a first installation plate, a second installation plate and two pushing components, wherein the first installation plate and the second installation plate are rotatably connected and are both positioned above the installation seat, the two pushing components are respectively arranged below the first installation plate and the second installation plate, the first stamping cylinder is arranged above the first installation plate, the first stamping template is fixedly connected with the output end of the first stamping cylinder, a plurality of stamping notches are arranged at the bottom of the first stamping template at intervals, the second stamping cylinder is arranged above the second installation plate, and the second stamping template is fixedly connected with the output end of the second stamping cylinder, and a plurality of stamping convex blocks are arranged at the bottom of the second stamping template at intervals.
The output end of the first stamping cylinder is provided with a first stamping template for stamping the heat-conducting insulating layer, the output end of the second stamping cylinder is provided with a second stamping template for stamping the metal core substrate, the heat-conducting insulating layer and the metal core substrate are respectively placed on the first mounting plate and the second mounting plate, the first stamping cylinder and the second stamping cylinder simultaneously operate to respectively stamp the heat-conducting insulating layer and the metal core substrate, the first stamping template extrudes the heat-conducting insulating layer to compress the heat-conducting insulating layer, the surface of the heat-conducting insulating layer is formed into the convex block under the action of the stamping notch, and the second stamping template stamps the metal core substrate under the action of the stamping convex block, punching the notch on the metal core substrate, then driving the first punching template and the second punching template to reset by the first punching cylinder and the second punching cylinder respectively, smearing adhesive on the heat-conducting insulating layer and the metal core substrate by a worker, then the two pushing assemblies push the first mounting plate and the second mounting plate to rotate simultaneously so as to ensure that the first mounting plate and the second mounting plate are jointed, thereby attaching the heat conductive insulating layer and the metal core substrate to insert the bump of the heat conductive insulating layer into the recess of the metal core substrate, the heat dissipation substrate is not easy to be dislocated with the material of the heat conduction insulating layer after being used for a long time, therefore, the problem that the use of the radiating substrate is influenced due to the fact that the metal core substrate and the heat conducting insulating layer material are prone to dislocation after the radiating substrate is used for a long time is solved.
The top of the first mounting plate and the top of the second mounting plate are both provided with mounting cavities for placing metal core substrates or heat conducting insulation layers.
The mounting cavity of the first mounting plate is used for mounting the heat conduction insulation layer, and the mounting cavity of the second mounting plate is used for mounting the metal core substrate, so that the heat conduction insulation layer and the metal core substrate are positioned conveniently.
The top of mount pad is provided with L shape mounting panel, first punching press cylinder with second punching press cylinder all with L shape mounting panel fixed connection.
The L-shaped mounting plate is used for mounting the first stamping cylinder and the second stamping cylinder.
Wherein, promote the subassembly including promoting cylinder, connecting block and slider, first mounting panel with the bottom of second installation piece all is provided with the spout, the slider activity sets up the inside of spout, it is in to promote the cylinder setting the inside of mount pad, the connecting block with promote the output fixed connection of cylinder, the connecting block with the slider is articulated.
When the metal core substrate and the heat conduction insulating layer are punched and coated, the pushing cylinder operates to drive the connecting block to move, so that the sliding block slides inside the sliding groove to push the first mounting plate and the second mounting plate to rotate, so that the first mounting plate and the second mounting plate are rotationally attached to each other, and the heat conduction insulating layer and the metal core substrate are bonded together.
The preparation equipment further comprises two movable assemblies, wherein the two movable assemblies are respectively arranged in the first mounting plate and the second mounting plate in the mounting cavity.
The movable assembly is used for pushing the heat-conducting insulating plate or the metal core substrate out of the mounting cavity
The heat-conducting insulating layer and the metal core substrate are respectively placed on the first mounting plate and the second mounting plate, the first stamping cylinder and the second stamping cylinder simultaneously operate to respectively stamp the heat-conducting insulating layer and the metal core substrate, the first stamping template extrudes the heat-conducting insulating layer to compress the heat-conducting insulating layer, the surface of the heat-conducting insulating layer forms the convex block under the action of the stamping notch, the second stamping template stamps the metal core substrate, the metal core substrate is stamped to form the notch under the action of the stamping convex block, and then the first stamping cylinder and the second stamping cylinder respectively drive the first stamping template and the second stamping template to reset, the staff is in heat conduction insulation layer with scribble the adhesive on the metal core substrate, then two promote the subassembly and promote simultaneously first mounting panel with the second mounting panel rotates, makes first mounting panel with the laminating of second mounting panel, thereby makes heat conduction insulation layer with the laminating of metal core substrate, with heat conduction insulation layer the lug inserts in the metal core substrate in the notch, make the heat dissipation substrate after using for a long time metal core substrate with be difficult for the dislocation between the heat conduction insulation layer material to the problem of heat dissipation substrate use is influenced to easy dislocation between metal core substrate after having solved the long-time use of heat dissipation substrate and the heat conduction insulation layer material.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below.
Fig. 1 is a structural cross-sectional view of a heat dissipation substrate according to a first embodiment of the present invention.
FIG. 2 is a sectional view showing the structure of a manufacturing apparatus according to a first embodiment of the present invention.
FIG. 3 is a sectional view showing the structure of a manufacturing apparatus according to a second embodiment of the present invention.
Fig. 4 is a sectional view of the other side surface of the first mounting plate of a manufacturing apparatus of a second embodiment of the present invention.
FIG. 5 is a sectional view showing the construction of a manufacturing apparatus according to a third embodiment of the present invention.
Fig. 6 is a partially enlarged view of a portion a in fig. 5 of the third embodiment of the present invention.
101-metal core substrate, 102-heat conducting insulation layer, 103-lug, 104-notch, 105-mounting seat, 106-first stamping cylinder, 107-second stamping cylinder, 108-first stamping template, 109-second stamping template, 110-first mounting plate, 111-second mounting plate, 112-stamping notch, 113-stamping lug, 114-mounting cavity, 115-L-shaped mounting plate, 116-pushing cylinder, 117-connecting block, 118-sliding block, 119-sliding groove, 201-movable plate, 202-abutting spring, 203-accommodating groove, 204-driving plate, 301-compression spring, 302-fixing frame and 303-accommodating cavity.
Detailed Description
Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, and the embodiments described below with reference to the accompanying drawings are exemplary and intended to be illustrative of the present invention and should not be construed as limiting the present invention.
The first embodiment of the present application is:
referring to fig. 1, fig. 1 is a cross-sectional view of a heat dissipation substrate according to a first embodiment of the invention. The invention provides a heat dissipation substrate, which comprises a metal core substrate 101 and a heat conduction insulating layer 102, wherein the metal core substrate 101 is bonded with the heat conduction insulating layer 102, a plurality of bumps 103 are arranged at intervals on the heat conduction insulating layer 102, a plurality of notches 104 are arranged on the metal core substrate 101 corresponding to the bumps 103, each bump 103 is correspondingly positioned in each notch 104, and the heat conduction insulating layer 102 is formed by mixing epoxy resin and heat conduction filler.
Specifically, the epoxy resin is straight-chain epoxy resin, and the heat-conducting filler is one of aluminum oxide, silicon carbide and aluminum nitride.
For the present embodiment, a plurality of bumps 103 are disposed on the heat conducting insulating layer 102, a plurality of notches 104 are disposed on the metal core substrate 101, an adhesive is coated on the heat conducting insulating layer 102 and the metal core substrate 101, and then the bumps 103 of the heat conducting insulating layer 102 are inserted into the notches 104 of the metal core substrate 101 in alignment, so as to bond the heat conducting insulating layer 102 and the metal core substrate 101 together, and since the bumps 103 are located inside the notches 104, the heat conducting insulating layer 102 and the metal core substrate 101 are not dislocated after being used for a long time, thereby solving the problem that the heat dissipating substrate is affected by the easy dislocation between the materials of the heat conducting insulating layer 102 and the metal core substrate 101 after the heat dissipating substrate is used for a long time.
Referring to fig. 2, fig. 2 is a sectional view of a manufacturing apparatus according to a first embodiment of the present invention. The invention also provides a preparation device, which is used for preparing the radiating substrate and comprises a mounting seat 105, a first stamping cylinder 106, a second stamping cylinder 107, a first stamping template 108, a second stamping template 109, a first mounting plate 110, a second mounting plate 111 and two pushing assemblies;
for the present embodiment, the first mounting plate 110 and the second mounting plate 111 are rotatably connected and located above the mounting base 105, the two pushing assemblies are respectively disposed below the first mounting plate 110 and the second mounting plate 111, the first punching cylinder 106 is disposed above the first mounting plate 110, the first punching template 108 is fixedly connected to an output end of the first punching cylinder 106, a plurality of punching recesses 112 are disposed at a bottom interval of the first punching template 108, the second punching cylinder 107 is disposed above the second mounting plate 111, the second punching template 109 is fixedly connected to an output end of the second punching cylinder 107, a plurality of punching protrusions 113 are disposed at a bottom interval of the second punching template 109, the first punching template 108 for punching the heat-conducting insulating layer 102 is disposed at an output end of the first punching cylinder 106, the output end of the second stamping cylinder 107 is provided with a second stamping template 109 for stamping the metal core substrate 101, the heat-conducting insulating layer 102 and the metal core substrate 101 are respectively placed on the first mounting plate 110 and the second mounting plate 111, the first stamping cylinder 106 and the second stamping cylinder 107 simultaneously operate to respectively stamp the heat-conducting insulating layer 102 and the metal core substrate 101, the first stamping template 108 extrudes the heat-conducting insulating layer 102 to compress the heat-conducting insulating layer 102, the surface of the heat-conducting insulating layer 102 forms the bump 103 under the action of the stamping notch 112, the second stamping template 109 stamps the metal core substrate 101, and the metal core substrate 101 is stamped out of the notch 104 under the action of the stamping bump 113, then the first stamping air cylinder 106 and the second stamping air cylinder 107 respectively drive the first stamping template 108 and the second stamping template 109 to reset, a worker coats adhesive on the heat-conducting insulating layer 102 and the metal core substrate 101, then the two pushing assemblies push the first mounting plate 110 and the second mounting plate 111 to rotate simultaneously, so that the first mounting plate 110 and the second mounting plate 111 are attached, thereby adhering the heat conductive insulating layer 102 and the metal core substrate 101 to insert the bump 103 of the heat conductive insulating layer 102 into the recess 104 of the metal core substrate 101, the heat dissipation substrate is not easy to be dislocated between the materials of the metal core substrate 101 and the heat conduction insulating layer 102 after being used for a long time, therefore, the problem that the heat dissipation substrate is affected by the fact that the materials of the metal core substrate 101 and the heat conduction insulating layer 102 are prone to dislocation after the heat dissipation substrate is used for a long time is solved.
Specifically, the top of each of the first mounting plate 110 and the second mounting plate 111 is provided with a mounting cavity 114 for placing the metal core substrate 101 or the heat conducting and insulating layer 102, the mounting cavity 114 of the first mounting plate 110 is used for mounting the heat conducting and insulating layer 102, and the mounting cavity 114 of the second mounting plate 111 is used for mounting the metal core substrate 101, so as to position the heat conducting and insulating layer 102 and the metal core substrate 101.
Preferably, the top of the mounting seat 105 is provided with an L-shaped mounting plate 115, the first punching cylinder 106 and the second punching cylinder 107 are both fixedly connected with the L-shaped mounting plate 115, and the L-shaped mounting plate 115 is used for mounting the first punching cylinder 106 and the second punching cylinder 107.
Further, the pushing assembly includes a pushing cylinder 116, a connecting block 117 and a sliding block 118, the bottoms of the first mounting plate 110 and the second mounting plate are respectively provided with a sliding slot 119, the sliding block 118 is movably disposed inside the sliding slot 119, the pushing cylinder 116 is disposed inside the mounting seat 105, the connecting block 117 is fixedly connected to the output end of the pushing cylinder 116, the connecting block 117 is hinged to the sliding block 118, the pushing cylinder 116 is obliquely disposed in the mounting seat 105, the sliding block 118 can slide inside the sliding slot 119, when the metal core substrate 101 and the heat-conducting insulating layer 102 are punched and the glue is applied, the pushing cylinder 116 operates to drive the connecting block 117 to move, so that the sliding block 118 slides inside the sliding slot 119 to push the first mounting plate 110 and the second mounting plate 111 to rotate, so that the first mounting plate 110 and the second mounting plate 111 are rotatably attached to each other, thereby bonding the thermal insulation layer 102 and the metal core substrate 101 together.
When the manufacturing apparatus of this embodiment is used, the heat-conducting insulating layer 102 and the metal core substrate 101 are respectively placed on the first mounting plate 110 and the second mounting plate 111, the first stamping cylinder 106 and the second stamping cylinder 107 operate simultaneously to respectively stamp the heat-conducting insulating layer 102 and the metal core substrate 101, the first stamping die plate 108 extrudes the heat-conducting insulating layer 102 to compress the heat-conducting insulating layer 102, the bump 103 is formed on the surface of the heat-conducting insulating layer 102 under the action of the stamping notch 112, the second stamping die plate 109 stamps the metal core substrate 101, the metal core substrate 101 is stamped out of the notch 104 under the action of the stamping bump 113, and then the first stamping cylinder 106 and the second stamping cylinder 107 respectively drive the first stamping die plate 108 and the second stamping die plate 109 to reset, an operator coats an adhesive on the heat-conducting insulation layer 102 and the metal core substrate 101, and the pushing cylinder 116 operates to drive the connecting block 117 to move, so that the sliding block 118 slides in the sliding groove 119 to push the first mounting plate 110 and the second mounting plate 111 to rotate, so that the first mounting plate 110 and the second mounting plate 111 rotate and are attached to each other, and the heat-conducting insulation layer 102 and the metal core substrate 101 are attached to each other.
The second embodiment of the present application is:
referring to fig. 3 and 4 on the basis of the first embodiment, fig. 3 is a structural sectional view of a manufacturing apparatus according to a second embodiment of the present invention, and fig. 4 is a sectional view of the other side surface of a first mounting plate of the manufacturing apparatus according to the second embodiment of the present invention. The heat dissipation substrate and the preparation device thereof in this embodiment further include two movable assemblies, where the movable assemblies include a movable plate 201, two abutting springs 202, and two moving plates 204;
for the present embodiment, the two movable assemblies are respectively disposed inside the mounting cavities 114 of the first mounting plate 110 and the second mounting plate 111, and the movable assemblies are used for pushing the heat-conducting insulating plate or the metal core substrate 101 out of the mounting cavities 114.
Specifically, both sides of the installation cavity 114 are provided with accommodating grooves 203, two abutting springs 202 are respectively arranged inside the accommodating grooves 203 on both sides of the installation cavity 114 and abut against the movable plate 201, the movable plate 201 is movably arranged inside the installation cavity 114, the abutting springs 202 abut against the movable plate 201, so that the movable plate 201 is attached to the bottom of the installation cavity 114, a worker can stir the movable plate 201 to enable the movable plate 201 to move outside the installation cavity 114, and the heat conduction insulating layer 102 or the metal core substrate 101 can be pushed out of the installation cavity 114, so that the heat conduction insulating layer 102 or the metal core substrate 101 can be taken conveniently.
In addition, the two poking pieces 204 are respectively fixedly connected with two ends of the movable piece 201, and the side edges of the movable piece 201 are provided with the poking pieces 204, so that a worker can poke the movable piece 201 through the poking pieces 204.
When the manufacturing apparatus of this embodiment is used, after the heat-conducting insulating layer 102 and the metal core substrate 101 are bonded together, the movable plate 201 can be moved by moving the moving plate 204, so as to push the heat-conducting insulating layer 102 or the metal core substrate 101 out of the mounting cavity 114.
The third embodiment of the present application is:
referring to fig. 5 and 6, fig. 5 is a sectional view of a third embodiment of a manufacturing apparatus according to the present invention, and fig. 6 is a partially enlarged view of a portion a in fig. 5 according to the third embodiment of the present invention. The heat dissipation substrate and the preparation device thereof in this embodiment further include a fixing assembly, where the fixing assembly includes a compression spring 301 and a fixing frame 302;
for the present embodiment, the fixing components are disposed at two sides of the mounting cavity 114, and the fixing components are used for fixing the metal core substrate 101 or the thermal insulation layer 102 in the mounting cavity 114.
Specifically, the two sides of the mounting cavity 114 are provided with accommodating cavities 303, the fixing frame 302 is movably disposed inside the accommodating cavities 303, the compression spring 301 is disposed below the fixing frame 302, the fixing frame 302 can move inside the accommodating cavities 303, and the compression spring 301 is in a compression state to pull the fixing frame 302, so that the fixing frame 302 abuts against the heat-conducting insulating layer 102 or the metal core substrate 101 in the mounting cavity 114, and the heat-conducting insulating layer 102 or the metal core substrate 101 is fixed.
When the manufacturing apparatus of this embodiment is used, the heat-conducting insulating layer 102 or the metal core substrate 101 is fixed in the mounting cavity 114 by the mutual cooperation of the fixing frame 302 and the compression spring 301, so as to facilitate punching.
While the above disclosure describes one or more preferred embodiments of the present invention, it should be understood that there is no intent to limit the scope of the claims, and it is intended that all or a portion of the process flow of the above embodiments be practiced and equivalents thereof within the scope of the claims.
Claims (7)
1. A heat dissipation substrate is characterized in that,
including metal core base plate and heat conduction insulation layer, the metal core base plate with the heat conduction insulation layer bonds, the heat conduction insulation layer interval is provided with a plurality of lugs, the metal core base plate corresponds the lug is provided with a plurality of notches, each the lug corresponds and is located each the inside of notch, the heat conduction insulation layer is formed by epoxy and the mixture of heat conduction filler.
2. The heat dissipating substrate of claim 1,
the epoxy resin is straight-chain epoxy resin, and the heat-conducting filler is one of aluminum oxide, silicon carbide or aluminum nitride.
3. A production apparatus for producing the heat-dissipating substrate according to claim 2,
comprises a mounting seat, a first stamping cylinder, a second stamping cylinder, a first stamping template, a second stamping template, a first mounting plate, a second mounting plate and two pushing components, wherein the first mounting plate and the second mounting plate are rotatably connected, and are both positioned above the mounting seat, the two pushing components are respectively arranged below the first mounting plate and the second mounting plate, the first stamping cylinder is arranged above the first mounting plate, the first stamping template is fixedly connected with the output end of the first stamping cylinder, a plurality of stamping notches are arranged at the bottom of the first stamping template at intervals, the second stamping cylinder is arranged above the second mounting plate, the second stamping die plate is fixedly connected with the output end of the second stamping cylinder, and a plurality of stamping convex blocks are arranged at the bottom of the second stamping die plate at intervals.
4. The manufacturing apparatus of claim 3,
the top of first mounting panel with the second mounting panel all is provided with the installation cavity that is used for placing metal core base plate or heat conduction insulating layer.
5. The manufacturing apparatus of claim 4,
the top of mount pad is provided with L shape mounting panel, first punching press cylinder with second punching press cylinder all with L shape mounting panel fixed connection.
6. The manufacturing apparatus of claim 5,
the pushing assembly comprises a pushing cylinder, a connecting block and a sliding block, a sliding groove is formed in the bottom of the second mounting block, the sliding block is movably arranged inside the sliding groove, the pushing cylinder is arranged inside the mounting seat, the connecting block is fixedly connected with the output end of the pushing cylinder, and the connecting block is hinged to the sliding block.
7. The manufacturing apparatus of claim 6,
the preparation equipment further comprises two movable assemblies, wherein the two movable assemblies are respectively arranged in the mounting cavity of the first mounting plate and the mounting cavity of the second mounting plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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Citations (7)
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| JPH0929859A (en) * | 1995-07-17 | 1997-02-04 | Yokohama Rubber Co Ltd:The | Method and apparatus for laminating sheet-like material |
| US20010042863A1 (en) * | 1999-07-28 | 2001-11-22 | Satoshi Yamada | Semiconductor device and manufacturing method thereof |
| US20090084753A1 (en) * | 2007-09-28 | 2009-04-02 | Victor Ramos | Process For Tooling For Manufacture Of A Composite Part Composite Stopper Obtained By Such A Process Or Such Tooling |
| JP2016096218A (en) * | 2014-11-13 | 2016-05-26 | 三菱化学株式会社 | Method of manufacturing lamination substrate, and method of manufacturing electronic device |
| CN207021295U (en) * | 2017-05-23 | 2018-02-16 | 福建华清电子材料科技有限公司 | A kind of heat-radiating substrate with insulating radiation layer |
| CN207014886U (en) * | 2017-07-07 | 2018-02-16 | 福建华清电子材料科技有限公司 | A kind of heat conduction aluminium nitride substrate |
| CN109285819A (en) * | 2017-07-21 | 2019-01-29 | 聚鼎科技股份有限公司 | Heat radiation substrate |
-
2022
- 2022-05-06 CN CN202210488577.6A patent/CN114771038B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0929859A (en) * | 1995-07-17 | 1997-02-04 | Yokohama Rubber Co Ltd:The | Method and apparatus for laminating sheet-like material |
| US20010042863A1 (en) * | 1999-07-28 | 2001-11-22 | Satoshi Yamada | Semiconductor device and manufacturing method thereof |
| US20090084753A1 (en) * | 2007-09-28 | 2009-04-02 | Victor Ramos | Process For Tooling For Manufacture Of A Composite Part Composite Stopper Obtained By Such A Process Or Such Tooling |
| JP2016096218A (en) * | 2014-11-13 | 2016-05-26 | 三菱化学株式会社 | Method of manufacturing lamination substrate, and method of manufacturing electronic device |
| CN207021295U (en) * | 2017-05-23 | 2018-02-16 | 福建华清电子材料科技有限公司 | A kind of heat-radiating substrate with insulating radiation layer |
| CN207014886U (en) * | 2017-07-07 | 2018-02-16 | 福建华清电子材料科技有限公司 | A kind of heat conduction aluminium nitride substrate |
| CN109285819A (en) * | 2017-07-21 | 2019-01-29 | 聚鼎科技股份有限公司 | Heat radiation substrate |
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| CN114771038B (en) | 2023-12-08 |
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