CN108601207A - The LED circuit board of good heat dissipation effect - Google Patents
The LED circuit board of good heat dissipation effect Download PDFInfo
- Publication number
- CN108601207A CN108601207A CN201810652132.0A CN201810652132A CN108601207A CN 108601207 A CN108601207 A CN 108601207A CN 201810652132 A CN201810652132 A CN 201810652132A CN 108601207 A CN108601207 A CN 108601207A
- Authority
- CN
- China
- Prior art keywords
- wiring board
- base plate
- convex block
- metal base
- board ontology
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a kind of LED circuit boards of good heat dissipation effect, are related to printed wiring board technical field.Including wiring board ontology, the wiring board ontology includes metal base plate, the conductive layer for the AlN ceramic heat-conducting layer of insulating heat-conductive and positioned at AlN ceramic heat-conducting layer upper surface positioned at metal base plate upper surface, the upper surface of the metal base plate is equipped with several upward protrusions, the height of the protrusion is less than the thickness of AlN ceramic heat-conducting layer, it is welded with LED on the conductive layer, one or several sides of the wiring board ontology are equipped with convex block, the convex block is equipped with location hole, is connected using arc transition between the convex block and two sides of wiring board ontology.The wiring board can not only be installed on the position of particular/special requirement, and good heat dissipation effect, improve the performance of LED.
Description
Technical field
The present invention relates to printed wiring board technical field more particularly to a kind of LED circuit boards of good heat dissipation effect.
Background technology
LED has many advantages, such as energy-saving and environmental protection, becomes forth generation solid state lighting lamps and lanterns.LED circuit board is manufacture LED light source
Important electronic unit, be the supporter of electronic component, be electronic component electrical connection supplier.LED line road at present
Plate when mounted, is mainly fixed on the part by the mounting hole of its own, but since the structure of some components is more special
Very, therefore there is certain difficulty in the wiring board of regular shape when mounted.In addition, LED can be sent out greatly during luminous
The heat of amount, therefore, the heat dissipation of LED circuit board are must solve the technical issues of.
Invention content
Technical problem to be solved by the invention is to provide a kind of LED circuit boards of good heat dissipation effect, and the wiring board is not
It is only mountable on the position of particular/special requirement, and good heat dissipation effect, improves the performance of LED.
In order to solve the above technical problems, the technical solution used in the present invention is：A kind of LED line road of good heat dissipation effect
Plate, including wiring board ontology, it is characterised in that：The wiring board ontology includes metal base plate, positioned at metal base plate upper surface
Conductive layer for the AlN ceramic heat-conducting layer of insulating heat-conductive and positioned at AlN ceramic heat-conducting layer upper surface, the metal base plate
Upper surface is equipped with several upward protrusions, the height of the protrusion less than AlN ceramic heat-conducting layer thickness, on the conductive layer
It is welded with LED, one or several sides of the wiring board ontology are equipped with convex block, and the convex block is equipped with location hole, described
It is connected using arc transition between convex block and two sides of wiring board ontology.
Further technical solution is：The protrusion is cuboid-type, square build and/or hilly endemic area.
It is using advantageous effect caused by above-mentioned technical proposal：On one or several sides of the wiring board ontology
It equipped with convex block, is attached, wiring board can be installed on privileged sites using camber line between convex block and wiring board ontology；And
The wiring board is equipped with several upward protrusions in the upper surface of metal base plate, is led with AlN ceramic to increase metal base plate
The contact area of thermosphere improves heat conduction efficiency, enhances heat dissipation effect, improves the performance of LED.
Description of the drawings
Fig. 1 is the schematic cross-sectional view of wiring board ontology in the present invention；
Fig. 2 is the schematic cross-sectional view of the present invention；
Wherein：1, metal base plate 2, AlN ceramic heat-conducting layer 3, conductive layer 4, protrusion 5, convex block 6, location hole.
Specific implementation mode
With reference to the attached drawing in the embodiment of the present invention, technical solution in the embodiment of the present invention carries out clear, complete
Ground describes, it is clear that described embodiment is only a part of the embodiment of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Many details are elaborated in the following description to facilitate a thorough understanding of the present invention, still the present invention can be with
Implemented different from other manner described here using other, those skilled in the art can be without prejudice to intension of the present invention
In the case of do similar popularization, therefore the present invention is not limited by following public specific embodiment.
As shown in Figure 1, the invention discloses a kind of LED circuit board of good heat dissipation effect, including wiring board ontology, the line
Road plate ontology includes metal base plate 1, positioned at 1 upper surface of metal base plate for the AlN ceramic heat-conducting layer 2 of insulating heat-conductive and position
Conductive layer 3 in 2 upper surface of AlN ceramic heat-conducting layer.The upper surface of the metal base plate 1 is equipped with several upward protrusions 4, institute
The height for stating protrusion 4 is less than the thickness of AlN ceramic heat-conducting layer 2.Described raised 4 can be cuboid-type, square build, hilly endemic area
One or more of, it can be configured as needed.The wiring board the upper surface of metal base plate be equipped with several to
On protrusion improve heat conduction efficiency, enhancing heat dissipation effect to increase the contact area of metal base plate and AlN ceramic heat-conducting layer
Fruit improves the performance of LED.
As shown in Fig. 2, being welded with LED on the conductive layer 3, one or several sides of the wiring board ontology are equipped with
Convex block 5, the convex block 5 are equipped with location hole 6, and arc transition is used between the convex block 5 and two sides of wiring board ontology
Connection.One or several sides of the wiring board ontology be equipped with convex block, between convex block and wiring board ontology using camber line into
Wiring board, can be installed on privileged sites by row connection.
Claims (2)
1. a kind of LED circuit board of good heat dissipation effect, including wiring board ontology, it is characterised in that：The wiring board ontology includes
Metal base plate (1), be located at metal base plate (1) upper surface for the AlN ceramic heat-conducting layer (2) of insulating heat-conductive and positioned at AlN
The upper surface of the conductive layer (3) of ceramic layer (2) upper surface, the metal base plate (1) is equipped with several upward protrusions
(4), the height of raised (4) is less than the thickness of AlN ceramic heat-conducting layer (2), and LED is welded on the conductive layer (3), described
One or several sides of wiring board ontology are equipped with convex block (5), and the convex block (5) is equipped with location hole (6), the convex block
(5) it is connect using arc transition between two sides of wiring board ontology.
2. the LED circuit board of good heat dissipation effect according to claim 1, it is characterised in that：The protrusion (4) is cuboid
Type, square build and/or hilly endemic area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810652132.0A CN108601207A (en) | 2018-06-22 | 2018-06-22 | The LED circuit board of good heat dissipation effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810652132.0A CN108601207A (en) | 2018-06-22 | 2018-06-22 | The LED circuit board of good heat dissipation effect |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108601207A true CN108601207A (en) | 2018-09-28 |
Family
ID=63633895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810652132.0A Withdrawn CN108601207A (en) | 2018-06-22 | 2018-06-22 | The LED circuit board of good heat dissipation effect |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108601207A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202652690U (en) * | 2012-05-31 | 2013-01-02 | 周荣清 | Circuit board |
| CN103415143A (en) * | 2013-08-06 | 2013-11-27 | 鑫茂电子（昆山）有限公司 | Led circuit board |
| CN203457424U (en) * | 2013-08-06 | 2014-02-26 | 鑫茂电子（昆山）有限公司 | Led circuit board |
| CN205717062U (en) * | 2016-06-02 | 2016-11-23 | 泰州市双宇电子有限公司 | A kind of Surface-mount LED lamp substrate |
| CN207021295U (en) * | 2017-05-23 | 2018-02-16 | 福建华清电子材料科技有限公司 | A kind of heat-radiating substrate with insulating radiation layer |
-
2018
- 2018-06-22 CN CN201810652132.0A patent/CN108601207A/en not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202652690U (en) * | 2012-05-31 | 2013-01-02 | 周荣清 | Circuit board |
| CN103415143A (en) * | 2013-08-06 | 2013-11-27 | 鑫茂电子（昆山）有限公司 | Led circuit board |
| CN203457424U (en) * | 2013-08-06 | 2014-02-26 | 鑫茂电子（昆山）有限公司 | Led circuit board |
| CN205717062U (en) * | 2016-06-02 | 2016-11-23 | 泰州市双宇电子有限公司 | A kind of Surface-mount LED lamp substrate |
| CN207021295U (en) * | 2017-05-23 | 2018-02-16 | 福建华清电子材料科技有限公司 | A kind of heat-radiating substrate with insulating radiation layer |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100517025C (en) | Backlight unit provided with light emitting diodes thereon | |
| CN101888740B (en) | Convex metal printed circuit board and manufacturing method thereof | |
| JP4969332B2 (en) | Substrate and lighting device | |
| CN101413655B (en) | Heat radiation structure of LED lamp backlight device | |
| KR101367360B1 (en) | Flexible heat dissipating substrate for led lighting module and led lighting module with the same | |
| CN101881393A (en) | LED lamp structure capable of conducting heat by using metal base plate and metal solder | |
| KR20090111505A (en) | Penetrating-type connector for combining into metal PCB, and LED lighting module having the same | |
| CN103974598A (en) | Circuit board | |
| KR200449331Y1 (en) | Chip LED lighting device | |
| CN205717062U (en) | A kind of Surface-mount LED lamp substrate | |
| TW200837309A (en) | Light modules | |
| CN201589092U (en) | LED light source module for generating rectangular light spot | |
| CN201215303Y (en) | Radiating module of high heat radiation LED lamp | |
| CN205248305U (en) | LED lamp of two sides light -emitting | |
| CN103199068A (en) | Integration circuit integrated structure | |
| CN108601207A (en) | The LED circuit board of good heat dissipation effect | |
| JP3158243U (en) | Light emitting diode heat dissipation module | |
| CN100539804C (en) | High heat-conductivity conducting carrier plate | |
| CN207455482U (en) | A kind of mounting structure of car light LED chip | |
| CN100373234C (en) | Backlight module | |
| CN101280891B (en) | Light source module | |
| CN208487570U (en) | The novel copper-based core plate of new-energy automobile LED headlight | |
| CN108848607A (en) | High thermal conductivity wiring board | |
| CN101329057A (en) | LED luminous module with heat radiation structure | |
| JP3153627U (en) | Light emitting diode lighting device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180928 |
|
| WW01 | Invention patent application withdrawn after publication |