CN205717062U - A kind of Surface-mount LED lamp substrate - Google Patents

A kind of Surface-mount LED lamp substrate Download PDF

Info

Publication number
CN205717062U
CN205717062U CN201620525818.XU CN201620525818U CN205717062U CN 205717062 U CN205717062 U CN 205717062U CN 201620525818 U CN201620525818 U CN 201620525818U CN 205717062 U CN205717062 U CN 205717062U
Authority
CN
China
Prior art keywords
aluminium sheet
led lamp
ceramic wafer
mount led
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201620525818.XU
Other languages
Chinese (zh)
Inventor
阮献忠
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TAIZHOU SHUANGYU ELECTRONIC CO Ltd
Original Assignee
TAIZHOU SHUANGYU ELECTRONIC CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TAIZHOU SHUANGYU ELECTRONIC CO Ltd filed Critical TAIZHOU SHUANGYU ELECTRONIC CO Ltd
Priority to CN201620525818.XU priority Critical patent/CN205717062U/en
Application granted granted Critical
Publication of CN205717062U publication Critical patent/CN205717062U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

The utility model discloses a kind of Surface-mount LED lamp substrate, belong to technical field of electronic devices, solve the problem of Surface-mount LED lamp substrate poor heat radiation in prior art.Including the copper foil plate from bottom to top set gradually, ceramic wafer and aluminium sheet, Surface-mount LED lamp is fixed on described copper foil plate, the side of described ceramic wafer is zigzag, the side that described aluminium sheet is adjacent with described ceramic wafer is zigzag, the engagement of described ceramic wafer and described aluminium sheet is one overall, described aluminium sheet be arranged over projection.This utility model novel structure, radiating effect are preferable, it is ensured that the normal service life of Surface-mount LED lamp;The contact area of aluminium sheet and ceramic wafer is big, and between be provided with conduction oil, the integral heat sink excellent of substrate;Trapezoidal projection above aluminium sheet makes have certain distance between substrate and required fixed position, adds air circulation, easy to use.

Description

A kind of Surface-mount LED lamp substrate
Technical field
This utility model relates to technical field of electronic devices, specifically, particularly relates to a kind of Surface-mount LED lamp substrate.
Background technology
(up to 100,000 hours), luminous soft is extremely grown in power consumption minimum (less than 0.1W), service life owing to Surface-mount LED lamp has With etc. advantage, so being widely used at present.Generally, Surface-mount LED lamp needs to be fixed on substrate, and this substrate includes being fixed on one Copper foil plate, ceramic wafer and the aluminium sheet risen.Wherein, Surface-mount LED lamp is fixed on copper foil plate, thus realizes and the connection of power supply, meanwhile, Ceramic wafer plays insulating effect, aluminium sheet plays thermolysis.Having a disadvantage in that: during installation, aluminium sheet is fixed needed for being often close to Position, have impact on the integral heat sink of substrate, in turn results in Surface-mount LED lamp and damages because of poor heat radiation, have impact on Surface-mount LED lamp Service life, it is therefore necessary to improved.
Summary of the invention
In order to solve the problems referred to above, the utility model discloses a kind of Surface-mount LED lamp substrate, solve in prior art The problem of Surface-mount LED lamp substrate poor heat radiation, it is provided that a kind of perfect heat-dissipating, constitutionally stable Surface-mount LED lamp substrate.
This utility model is achieved through the following technical solutions:
A kind of Surface-mount LED lamp substrate, including the copper foil plate from bottom to top set gradually, ceramic wafer and aluminium sheet, Surface-mount LED lamp Being fixed on described copper foil plate, the side of described ceramic wafer is zigzag, and the side that described aluminium sheet is adjacent with described ceramic wafer is Zigzag, the engagement of described ceramic wafer and described aluminium sheet is one overall, described aluminium sheet be arranged over projection.
It is provided with conduction oil between described ceramic wafer and described aluminium sheet.
Described projection is trapezoidal projection.
Compared with prior art, the beneficial effects of the utility model are:
This utility model novel structure, radiating effect are preferable, it is ensured that the normal service life of Surface-mount LED lamp;Aluminium sheet and pottery The contact area of porcelain plate is big, and between be provided with conduction oil, the integral heat sink excellent of substrate;Trapezoidal projection above aluminium sheet makes Obtain, between substrate and required fixed position, there is certain distance, add air circulation, easy to use.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
In Fig. 1: 1, Surface-mount LED lamp;2, copper foil plate;3, ceramic wafer;4, conduction oil;5, aluminium sheet;6, projection.
Detailed description of the invention
Below in conjunction with the accompanying drawings this utility model is further illustrated:
A kind of Surface-mount LED lamp substrate, including the copper foil plate 2 from bottom to top set gradually, ceramic wafer 3 and aluminium sheet 5, LED pastes Sheet lamp 1 is fixed on described copper foil plate 2, and the side of described ceramic wafer 3 is zigzag, and described aluminium sheet 5 is adjacent with described ceramic wafer 3 Side be zigzag, described ceramic wafer 3 and the engagement of described aluminium sheet 5 are one overall, and being arranged over of described aluminium sheet 5 is convex Block 6.
It is provided with conduction oil 4 between described ceramic wafer 3 and described aluminium sheet 5.
Described projection 6 is trapezoidal projection.
As shown in Figure of description Fig. 1, a kind of Surface-mount LED lamp substrate, including the copper foil plate 2 from bottom to top set gradually, Ceramic wafer 3 and aluminium sheet 5, Surface-mount LED lamp 1 is fixed on copper foil plate 2, and the side of ceramic wafer 3 is zigzag, aluminium sheet 5 and ceramic wafer 3 Adjacent side is zigzag, and ceramic wafer 3 is an entirety with the engagement of aluminium sheet 5, is provided with heat conduction between porcelain plate 3 and aluminium sheet 5 Oil 4, aluminium sheet 5 be arranged over trapezoidal projection 6.The laciniation of ceramic wafer and aluminium sheet adds between ceramic wafer and aluminium sheet Contact area, is more beneficial for the transmission of heat, simultaneously between conduction oil be also beneficial to the transmission of heat, sawtooth can be rectangle or its His shape, additionally aluminium sheet be provided above trapezoidal projection, the contact area between trapezoidal projection and aluminium sheet more than aluminium sheet with required Contact area between fixed position, i.e. adds area of dissipation, nor affects on the fixing intensity of substrate simultaneously, and trapezoidal projection makes Obtain and there is between aluminium sheet and required fixed position certain distance, increase air and circulate more preferably to dispel the heat.
This utility model novel structure, radiating effect are preferable, it is ensured that the normal service life of Surface-mount LED lamp;Aluminium sheet and pottery The contact area of porcelain plate is big, and between be provided with conduction oil, the integral heat sink excellent of substrate;Trapezoidal projection above aluminium sheet makes Obtain, between substrate and required fixed position, there is certain distance, add air circulation, easy to use.
In sum, preferred embodiment the most of the present utility model, not it is used for limiting what this utility model was implemented Scope, all equalizations done according to shape, structure, feature and the spirit described in this utility model right change and repair Decorations, all should be included in right of the present utility model.

Claims (3)

1. a Surface-mount LED lamp substrate, including the copper foil plate (2) from bottom to top set gradually, ceramic wafer (3) and aluminium sheet (5), Surface-mount LED lamp (1) is fixed on described copper foil plate (2), it is characterised in that: the side of described ceramic wafer (3) is zigzag, described The side that aluminium sheet (5) is adjacent with described ceramic wafer (3) is zigzag, described ceramic wafer (3) and the engagement of described aluminium sheet (5) Be one overall, described aluminium sheet (5) be arranged over projection (6).
A kind of Surface-mount LED lamp substrate the most according to claim 1, it is characterised in that: described ceramic wafer (3) and described aluminium sheet (5) conduction oil (4) it is provided with between.
A kind of Surface-mount LED lamp substrate the most according to claim 1, it is characterised in that: described projection (6) is trapezoidal projection.
CN201620525818.XU 2016-06-02 2016-06-02 A kind of Surface-mount LED lamp substrate Expired - Fee Related CN205717062U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201620525818.XU CN205717062U (en) 2016-06-02 2016-06-02 A kind of Surface-mount LED lamp substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201620525818.XU CN205717062U (en) 2016-06-02 2016-06-02 A kind of Surface-mount LED lamp substrate

Publications (1)

Publication Number Publication Date
CN205717062U true CN205717062U (en) 2016-11-23

Family

ID=57300710

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201620525818.XU Expired - Fee Related CN205717062U (en) 2016-06-02 2016-06-02 A kind of Surface-mount LED lamp substrate

Country Status (1)

Country Link
CN (1) CN205717062U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108601207A (en) * 2018-06-22 2018-09-28 东莞市斯慕电子商务有限公司 The LED circuit board of good heat dissipation effect
CN108848607A (en) * 2018-06-22 2018-11-20 东莞市鹏辉金属制品有限公司 High thermal conductivity wiring board
CN109227358A (en) * 2018-10-17 2019-01-18 段明旭 A kind of Millstone oil cooled system system
CN110225692A (en) * 2019-06-19 2019-09-10 绵阳富临精工机械股份有限公司 A kind of controller radiator structure and electronic water pump heat dissipating method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108601207A (en) * 2018-06-22 2018-09-28 东莞市斯慕电子商务有限公司 The LED circuit board of good heat dissipation effect
CN108848607A (en) * 2018-06-22 2018-11-20 东莞市鹏辉金属制品有限公司 High thermal conductivity wiring board
CN109227358A (en) * 2018-10-17 2019-01-18 段明旭 A kind of Millstone oil cooled system system
CN109227358B (en) * 2018-10-17 2020-11-20 泗县泽农秸秆回收利用有限公司 Grind quick-witted mill oil cooling system
CN110225692A (en) * 2019-06-19 2019-09-10 绵阳富临精工机械股份有限公司 A kind of controller radiator structure and electronic water pump heat dissipating method

Similar Documents

Publication Publication Date Title
US8398260B2 (en) Heat-dissipation structure of LED lamp
CN205717062U (en) A kind of Surface-mount LED lamp substrate
EP2085681A2 (en) LED illuminating device, LED light source module, and LED support member
CN201894041U (en) Heat dissipation structure for multi-power device
CN201425286Y (en) Heat dissipation structure of LED lamp
CN204785894U (en) Durable LED lamps and lanterns dispel heat
CN201954506U (en) LED lamp and radiator thereof
CN204593313U (en) A kind of LED metal base printed circuit board heat abstractor
CN201992605U (en) Heat sink for high-power LED (light-emitting diode) lamps
CN205037277U (en) A radiator for LED lamp and electron device
CN207455200U (en) A kind of movable chimeric Surface-mount LED lamp
CN204285396U (en) A kind of LED radiator
CN208954978U (en) A kind of ceramic heat sink
CN107255264A (en) A kind of radiator structure of LED lamp
CN207035047U (en) A kind of radiator structure of LED lamp
CN204404119U (en) A kind of radiator structure of lamp ballasts
CN207514824U (en) A kind of LED lamp structure with aeration type heat dissipation
CN210511167U (en) Synergistic heat dissipation device for LED table lamp and LED table lamp
CN202769568U (en) Substrate of light-emitting diode (LED) surface-mounted lamp
CN103672465A (en) Led lamp
CN203421659U (en) High power light emitting diode (LED) radiator
CN206514105U (en) A kind of squared line clearance light
CN205782742U (en) A kind of printed wiring board of preventing light attenuation high power laser luminaire
CN205372291U (en) Integration hollow out construction heat dissipation LED down lamp
CN204756846U (en) LED garden lamp integral type heat radiation structure

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20161123

Termination date: 20170602