CN202769568U - Substrate of light-emitting diode (LED) surface-mounted lamp - Google Patents
Substrate of light-emitting diode (LED) surface-mounted lamp Download PDFInfo
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- CN202769568U CN202769568U CN201220377385XU CN201220377385U CN202769568U CN 202769568 U CN202769568 U CN 202769568U CN 201220377385X U CN201220377385X U CN 201220377385XU CN 201220377385 U CN201220377385 U CN 201220377385U CN 202769568 U CN202769568 U CN 202769568U
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- substrate
- led
- mounted lamp
- smd lamp
- led smd
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Abstract
The utility model discloses a substrate of a light-emitting diode (LED) surface-mounted lamp. The substrate of LED surface-mounted lamp comprises a copper foil plate, a ceramic plate, and an aluminum plate which are sequentially arranged from bottom to top, wherein the LED surface-mounted lamp is fixed on the copper foil plate, and the upper surface of the aluminum plate is provided with a heat-dissipation convex block. After optimization, the heat-dissipation convex block is an aluminum convex block or a ceramic convex block. The substrate of the LED surface-mounted lamp has the advantage of being good in heat-dissipation effect, so that the normal service life of the LED surface-mounted lamp is maintained, and the installation is convenient.
Description
Technical field
The present invention relates to technical field of electronic devices, especially relate to a kind of LED SMD lamp substrate.
Background technology
Because having, the LED SMD lamp extremely grow (can reach 100,000 hours), the luminous advantage such as soft in power consumption minimum (not enough 0.1W), service life, so be widely used at present.Usually, the LED SMD lamp need to be fixed on the substrate, and this substrate comprises copper foil plate, ceramic wafer and the aluminium sheet that is fixed together.Wherein, the LED SMD lamp is fixed on copper foil plate, thereby realizes being connected with power supply connection.Simultaneously, ceramic wafer plays insulating effect, aluminium sheet plays thermolysis.Its defective is: during installation, aluminium sheet often is close to required fixing position, thus radiating effect have a greatly reduced quality, and then cause the LED SMD lamp to damage because of poor heat radiation.Therefore be necessary to be improved.
Summary of the invention
Deficiency for above-mentioned prior art exists the purpose of this invention is to provide a kind of LED SMD lamp substrate, and it is better that it has radiating effect, thereby the LED SMD lamp can keep the characteristics of normal service life.
To achieve these goals, the technical solution adopted in the present invention is: LED SMD lamp substrate, comprise the copper foil plate, ceramic wafer, the aluminium sheet that set gradually from bottom to up, and wherein, the LED SMD lamp is fixed on the copper foil plate, and described aluminium sheet upper surface is provided with the heat radiation projection.
Described heat radiation projection is the aluminium projection.
Described heat radiation projection is ceramic projection.
After adopting said structure, the present invention is compared with existing technology the advantage that has and is: 1, radiating effect is better, thereby the LED SMD lamp can keep normal service life.After LED SMD lamp substrate of the present invention was installed, aluminium sheet and required fixed position had certain distance, thereby can guarantee that aluminium sheet normally dispels the heat, and then provided normal working environment for the LED SMD lamp.2, easy for installation.LED SMD lamp substrate of the present invention is same as common substrate when installing, thereby meets people's use habit, and is comparatively convenient.
Description of drawings
The present invention is further described below in conjunction with drawings and Examples:
Fig. 1 is that the master of embodiments of the invention looks cutaway view;
Fig. 2 is the top view of Fig. 1.
Among the figure: 11, copper foil plate, 12, ceramic wafer, 13, aluminium sheet; 20, heat radiation projection; 30, LED SMD lamp.
The specific embodiment
The following stated only is preferred embodiment of the present invention, does not therefore limit protection scope of the present invention.
Embodiment, see illustrated in figures 1 and 2: LED SMD lamp substrate comprises the copper foil plate 11, ceramic wafer 12, the aluminium sheet 13 that set gradually from bottom to up.Wherein, LED SMD lamp 30 is fixed on the copper foil plate 11,13 thermolysis of aluminium sheet, and ceramic wafer 12 is used for insulation.Simultaneously, these aluminium sheet 13 upper surfaces are provided with heat radiation projection 20.Like this, when substrate is close to required fixed position, under the support of heat radiation projection 20, has certain distance between aluminium sheet 13 and the required fixed position, and can ventilate between the position of aluminium sheet 13 and required installation, thereby not only can guarantee that aluminium sheet 13 normally dispels the heat, and radiating effect increases on the original basis.
Optimize, heat radiation projection 20 can be taked the aluminium projection.Like this, heat radiation projection 20 and aluminium sheet 13 can one prepare, thereby have reduced preparation cost.Heat radiation projection 20 also can be ceramic projection.Like this, 13 distribute heats of aluminium sheet can not conduct on the required fixed position of substrate by heat radiation projection 20.
Claims (3)
1.LED SMD lamp substrate, comprise the copper foil plate (11), ceramic wafer (12), the aluminium sheet (13) that set gradually from bottom to up, wherein, LED SMD lamp (30) is fixed on the copper foil plate (11), it is characterized in that: described aluminium sheet (13) upper surface is provided with heat radiation projection (20).
2. LED SMD lamp substrate according to claim 1, it is characterized in that: described heat radiation projection (20) is the aluminium projection.
3. LED SMD lamp substrate according to claim 1, it is characterized in that: described heat radiation projection (20) is ceramic projection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201220377385XU CN202769568U (en) | 2012-08-01 | 2012-08-01 | Substrate of light-emitting diode (LED) surface-mounted lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201220377385XU CN202769568U (en) | 2012-08-01 | 2012-08-01 | Substrate of light-emitting diode (LED) surface-mounted lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202769568U true CN202769568U (en) | 2013-03-06 |
Family
ID=47776136
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201220377385XU Expired - Fee Related CN202769568U (en) | 2012-08-01 | 2012-08-01 | Substrate of light-emitting diode (LED) surface-mounted lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202769568U (en) |
-
2012
- 2012-08-01 CN CN201220377385XU patent/CN202769568U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130306 Termination date: 20130801 |