CN102809129A - Surface-mount LED lamp substrate - Google Patents
Surface-mount LED lamp substrate Download PDFInfo
- Publication number
- CN102809129A CN102809129A CN2012102708561A CN201210270856A CN102809129A CN 102809129 A CN102809129 A CN 102809129A CN 2012102708561 A CN2012102708561 A CN 2012102708561A CN 201210270856 A CN201210270856 A CN 201210270856A CN 102809129 A CN102809129 A CN 102809129A
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- CN
- China
- Prior art keywords
- lamp substrate
- led paster
- mount led
- aluminium sheet
- paster lamp
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention discloses a surface-mount LED lamp substrate which sequentially comprises a copper foil board, a ceramic board and an aluminum board from bottom to top. Surface-mount LED lamps are fixed on the copper foil board. Radiating protrusions are arranged on the upper surface of the aluminum board. After modification, the radiating protrusions are aluminum protrusions or ceramic protrusions. The surface-mount LED lamp substrate has the advantages of convenience in mounting and fine radiating effect so that normal service lives of the surface-mount LED lamps can be kept.
Description
Technical field
The present invention relates to technical field of electronic devices, especially relate to a kind of LED paster lamp substrate.
Background technology
Because having, LED paster light fixture extremely grow (can reach 100,000 hours), luminous advantage such as soft in power consumption minimum (not enough 0.1W), service life, so be widely used at present.Usually, LED paster lamp need be fixed on the substrate, and this substrate comprises copper foil plate, ceramic wafer and the aluminium sheet that is fixed together.Wherein, LED paster lamp is fixed on copper foil plate, thereby realizes and being connected of power supply.Simultaneously, ceramic wafer plays insulating effect, aluminium sheet plays thermolysis.Its defective is: during installation, aluminium sheet often is close to required fixing position, thus radiating effect have a greatly reduced quality, and then cause LED paster lamp to damage because of poor heat radiation.Therefore be necessary to improve.
Summary of the invention
Deficiency to above-mentioned prior art exists the purpose of this invention is to provide a kind of LED paster lamp substrate, and it is better that it has radiating effect, thereby LED paster lamp can keep the characteristics in normal service life.
To achieve these goals, the technical scheme that the present invention adopted is: LED paster lamp substrate, comprise the copper foil plate, ceramic wafer, the aluminium sheet that set gradually from bottom to up, and wherein, LED paster lamp is fixed on the copper foil plate, and said aluminium sheet upper surface is provided with the heat radiation projection.
Said heat radiation projection is the aluminium projection.
Said heat radiation projection is ceramic projection.
After adopting said structure, the present invention compares the advantage that is had with prior art and is: 1, radiating effect is better, thereby LED paster lamp can keep normal service life.After LED paster lamp substrate of the present invention was installed, aluminium sheet and required fixed position had certain distance, thereby can guarantee that aluminium sheet normally dispels the heat, and then for LED paster lamp normal working environment are provided.2, easy for installation.LED paster lamp substrate of the present invention is same as common substrate when installing, thereby meets people's use habit, and is comparatively convenient.
Description of drawings
Below in conjunction with accompanying drawing and embodiment the present invention is further specified:
Fig. 1 is that the master of embodiments of the invention looks cutaway view;
Fig. 2 is the vertical view of Fig. 1.
Among the figure: 11, copper foil plate, 12, ceramic wafer, 13, aluminium sheet; 20, heat radiation projection; 30, LED paster lamp.
The specific embodiment
The following stated is merely preferred embodiment of the present invention, does not therefore limit protection scope of the present invention.
Embodiment, see illustrated in figures 1 and 2: LED paster lamp substrate comprises the copper foil plate 11, ceramic wafer 12, the aluminium sheet 13 that set gradually from bottom to up.Wherein, LED paster lamp 30 is fixed on the copper foil plate 11,13 thermolysis of aluminium sheet, and ceramic wafer 12 is used for insulation.Simultaneously, these aluminium sheet 13 upper surfaces are provided with heat radiation projection 20.Like this; When substrate is close to required fixed position; Under the support of heat radiation projection 20, have certain distance between aluminium sheet 13 and the required fixed position, and can ventilate between the position of aluminium sheet 13 and required installation; Thereby not only can guarantee that aluminium sheet 13 normally dispels the heat, and radiating effect increases on the original basis.
Optimize, heat radiation projection 20 can be taked the aluminium projection.Like this, heat radiation projection 20 can one prepare with aluminium sheet 13, thereby has reduced preparation cost.Heat radiation projection 20 also can be ceramic projection.Like this, 13 distribute heats of aluminium sheet can not conduct on the required fixed position of substrate through heat radiation projection 20.
Claims (3)
1.LED paster lamp substrate; Comprise the copper foil plate (11), ceramic wafer (12), the aluminium sheet (13) that set gradually from bottom to up; Wherein, LED paster lamp (30) is fixed on the copper foil plate (11), it is characterized in that: said aluminium sheet (13) upper surface is provided with heat radiation projection (20).
2. LED paster lamp substrate according to claim 1 is characterized in that: said heat radiation projection (20) is the aluminium projection.
3. LED paster lamp substrate according to claim 1 is characterized in that: said heat radiation projection (20) is ceramic projection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102708561A CN102809129A (en) | 2012-08-01 | 2012-08-01 | Surface-mount LED lamp substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102708561A CN102809129A (en) | 2012-08-01 | 2012-08-01 | Surface-mount LED lamp substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102809129A true CN102809129A (en) | 2012-12-05 |
Family
ID=47232923
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012102708561A Pending CN102809129A (en) | 2012-08-01 | 2012-08-01 | Surface-mount LED lamp substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102809129A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108709168A (en) * | 2018-05-31 | 2018-10-26 | 苏州盛威佳鸿电子科技有限公司 | A kind of Surface-mount LED lamp substrate |
-
2012
- 2012-08-01 CN CN2012102708561A patent/CN102809129A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108709168A (en) * | 2018-05-31 | 2018-10-26 | 苏州盛威佳鸿电子科技有限公司 | A kind of Surface-mount LED lamp substrate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20121205 |