CN101280891B - Light source module - Google Patents
Light source module Download PDFInfo
- Publication number
- CN101280891B CN101280891B CN2007100921181A CN200710092118A CN101280891B CN 101280891 B CN101280891 B CN 101280891B CN 2007100921181 A CN2007100921181 A CN 2007100921181A CN 200710092118 A CN200710092118 A CN 200710092118A CN 101280891 B CN101280891 B CN 101280891B
- Authority
- CN
- China
- Prior art keywords
- light
- source module
- light source
- heat sink
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
Abstract
A light source module includes a circuit board, a luminous element and a heat radiation board. The circuit board has a punched hole, the luminous element is arranged at a first side of the circuit board, wherein the position of the luminous element is corresponding to the punched hole. The heat radiation board is arranged at a second side of the circuit board and has a projection section, corresponding to the punched hole and the luminous element, wherein the projection section extends into the punched hole in direction of circuit board and contacts with the luminous element.
Description
Technical field
The present invention relates to a kind of light source module, particularly a kind of light source module with high cooling efficiency.
Background technology
Along with the progress of semiconductor and electronics technology, traditional cathode ray tube (CRT) display flat-panel screens little by volume gradually and low radiation replaces.Generally speaking, traditional flat-panel screens mostly utilizes fluorescent tube as backlight (backlight), yet fluorescent tube often has the problem that volume is excessive and service life is short.
For effective utilization and the life-span that promotes light source module, also have at present and utilize volume is less and weight is lighter light emitting diode backlight as flat-panel screens, yet because the too high meeting of temperature has a strong impact on the brightness and the service life of light emitting diode, thus the heat radiation of the light source module beginning become an important problem.
Summary of the invention
The invention provides a kind of light source module, comprise circuit board, light-emitting component and first heat sink.The aforementioned circuit plate has perforation, and above-mentioned light-emitting component is arranged at first side of circuit board, and wherein the position of light-emitting component is corresponding to aforementioned perforation.Aforementioned first heat sink is arranged at second side of circuit board and has first protuberance, corresponding to aforementioned perforation and light-emitting component, wherein first protuberance stretches in the perforation and contacts with light-emitting component towards the circuit board direction, is a depression at the dorsal part of this first protuberance of first heat sink.For example, aforementioned first heat sink can be the aluminium sheet with high thermal conductivity coefficient, and aforementioned light-emitting component can be light emitting diode, and the aforementioned circuit plate can be epoxy resin base material (FR-4) printed circuit board (PCB).
In one embodiment, the aforementioned lights source module also comprises second heat sink, and above-mentioned second heat sink has second protuberance, protrudes and connects first heat sink towards the circuit board direction.In particular, first protuberance can be departed from the position of aforementioned second protuberance, makes to form the gap between first, second heat sink, to promote its heat dissipation.
For above-mentioned purpose of the present invention, feature and advantage can be become apparent, preferred embodiment cited below particularly and conjunction with figs. elaborate.
Description of drawings
Fig. 1 is an expression light source module schematic diagram of the present invention;
Fig. 2 is the schematic diagram of indication circuit plate; And
Fig. 3 is the schematic diagram of another embodiment among expression the present invention.
Description of reference numerals
10 circuit boards, 11 first sides
13 perforation of 12 second sides
20 light-emitting components, 30 first heat sinks
31 first protuberances, 40 second heat sinks
41 second protuberances, 50,60 heat sinks
The specific embodiment
At first see also Fig. 1, light source module in the present embodiment is applicable to electronic installation, for example can be used as the backlight of flat-panel screens inside, it mainly comprises circuit board 10, a plurality of light-emitting component 20 and first heat sink 30, aforementioned circuit plate 10 for example is the FR-4 printed circuit board (PCB), aforementioned light-emitting component 20 for example is a light emitting diode, and 30 of aforementioned heat sinks can utilize the thermal conductivity material high than circuit board 10 made, for example can adopt aluminium sheet as heat sink 30.
As shown in Figure 1, light-emitting component 20 is positioned at first side 11 of circuit board 10, and and circuit board 10 electrically connects, 30 of first heat sinks are arranged at second side 12 of circuit board 10, wherein second side 12 is in contrast to first side 11, the heat energy that can promptly light-emitting component 20 be produced by first heat sink 30 sheds towards the below, and is too high and cause damaging to avoid circuit board 10 or light-emitting component 20 temperature.About the connected mode of the aforementioned circuit plate 10 and first heat sink 30 for example can adopt screw or machinery chimeric, perhaps also can the insulating heat-conductive pad (not shown) with viscosity be set between the circuit board 10 and first heat sink 30, use making both firmly bonding.
In the present embodiment, aforementioned circuit plate 10 is provided with a plurality of perforation 13, and above-mentioned perforation 13 runs through circuit board 10 and connects first, second side 11,12, and its position then corresponds respectively to each light-emitting component 20.In addition, be formed with a plurality of first protuberances 31 on aforementioned first heat sink 30, its position corresponds respectively to each perforation 13 and light-emitting component 20.In particular, aforementioned first protuberance 31 protrudes towards circuit board 10 directions, and stretch in the corresponding perforation 13 and then and contact with light-emitting component 20, the heat energy that produced of light-emitting component 20 can directly see through first heat sink 30 and promptly transmits towards the below thus, and then can significantly promote radiating effect.Wherein, be connected effectively in order to ensure between first protuberance 31 and the light-emitting component 20, also can between the light-emitting component 20 and first protuberance 31 insulating heat-conductive pad (not shown) be set, the heat energy that makes light-emitting component 20 be produced can promptly be passed to first heat sink 30.In particular, aforementioned light-emitting component 20 and bore a hole and 13 for example can adopt matrix-style and arrange (as shown in Figure 2), yet also visual needed light field design are with light-emitting component 20 and bore a hole and 13 take other specific modes to arrange.
In addition, the aforementioned lights source module also can be provided with a plurality of heat sinks to promote its heat dissipation.Then see also Fig. 3, light source module has in another embodiment more been set up second heat sink 40 except being provided with first heat sink 30.As previously mentioned, first heat sink 30 is arranged at second side 12 of circuit board 10, and wherein first protuberance 31 on first heat sink 30 passes the perforation 13 of circuit board 10 and then contacts with light-emitting component 20.On the other hand, aforementioned second heat sink 40 is connected in first heat sink, 30 surface below and has a plurality of second protuberances 41, wherein second protuberance 41 protrudes and butt first heat sink 30 towards circuit board 10 directions, first protuberance 31 is then departed from its position, can make thus to form the gap between first, second heat sink 30,40, to increase area of dissipation and to promote heat dissipation.In like manner, also can set up several heat sinks (heat sink 50,60 as shown in Figure 3) if necessary in first, second heat sink 30,40 belows to strengthen the heat dissipation of its light source module.
In sum, the invention provides a kind of light source module,, and utilize protuberance on the heat sink to pass aforementioned perforation and contact with light-emitting component wherein by on circuit board, forming perforation, can promote the heat dissipation of light source module, use and avoid circuit board or light-emitting component Yin Gaowen and cause damaging.
Though the present invention discloses as above with aforesaid preferred embodiment; right its is not in order to limit the present invention; those skilled in the art without departing from the spirit and scope of the present invention, when can doing a little change and retouching, so protection scope of the present invention is as the criterion when looking the accompanying Claim person of defining.
Claims (10)
1. light source module comprises:
Circuit board has first side, second side and perforation, and wherein this second side is in contrast to this first side, and this perforation runs through this circuit board and connects this first, second side;
Light-emitting component is arranged at this first side and electrically connects this circuit board, and wherein bore a hole corresponding to this in the position of this light-emitting component; And
First heat sink is arranged at this second side and has first protuberance, and corresponding to this perforation and this light-emitting component, wherein this first protuberance stretches in this perforation and contacts with this light-emitting component, is a depression at the dorsal part of this first protuberance of first heat sink.
2. light source module as claimed in claim 1, it is made than the material of this circuit plate hight that wherein this first heat sink adopts thermal conductivity.
3. light source module as claimed in claim 1, wherein this light-emitting component is a light emitting diode.
4. light source module as claimed in claim 1, wherein this circuit board comprises epoxy resin base material printed circuit board (PCB).
5. light source module as claimed in claim 1, wherein this light source module also comprises a plurality of light-emitting components, this circuit board also comprises a plurality of perforation, and this first heat sink also comprises a plurality of first protuberances, the position of these a plurality of light-emitting components corresponds respectively to this a plurality of perforation, and these a plurality of first protuberances stretch into respectively in these a plurality of perforation.
6. light source module as claimed in claim 5, wherein these a plurality of light-emitting components are the matrix-style arrangement with these a plurality of perforation.
7. light source module as claimed in claim 1, wherein this light source module also comprises second heat sink, this second heat sink connects this first heat sink.
8. light source module as claimed in claim 7, wherein this second heat sink has second protuberance, and this second protuberance is towards this circuit board direction protrusion and connect this first heat sink.
9. light source module as claimed in claim 8, wherein this first protuberance of the position deviation of this second protuberance.
10. light source module as claimed in claim 9 wherein has the gap between this first, second heat sink.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2007100921181A CN101280891B (en) | 2007-04-02 | 2007-04-02 | Light source module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2007100921181A CN101280891B (en) | 2007-04-02 | 2007-04-02 | Light source module |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101280891A CN101280891A (en) | 2008-10-08 |
CN101280891B true CN101280891B (en) | 2010-10-06 |
Family
ID=40013490
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007100921181A Active CN101280891B (en) | 2007-04-02 | 2007-04-02 | Light source module |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN101280891B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102155725A (en) * | 2010-02-11 | 2011-08-17 | 亿光电子工业股份有限公司 | Cooling device and illumination lamp comprising same |
CN102889561A (en) * | 2012-09-12 | 2013-01-23 | 广东宏泰照明科技有限公司 | High-power LED (light-emitting diode) thermoelectric separation structure |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2741193Y (en) * | 2004-04-08 | 2005-11-16 | 吴裕朝 | Light-emitting diode device, radiating system of light-emitting diode and illuminator therewith |
TW200620720A (en) * | 2006-03-01 | 2006-06-16 | Mutual Tek Ind Co Ltd | Circuit board of back light module of LED capable of increasing heat dissipating efficiency and the manufacturing method thereof |
-
2007
- 2007-04-02 CN CN2007100921181A patent/CN101280891B/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2741193Y (en) * | 2004-04-08 | 2005-11-16 | 吴裕朝 | Light-emitting diode device, radiating system of light-emitting diode and illuminator therewith |
TW200620720A (en) * | 2006-03-01 | 2006-06-16 | Mutual Tek Ind Co Ltd | Circuit board of back light module of LED capable of increasing heat dissipating efficiency and the manufacturing method thereof |
Non-Patent Citations (1)
Title |
---|
JP 2005-5437 A,全文. |
Also Published As
Publication number | Publication date |
---|---|
CN101280891A (en) | 2008-10-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100764380B1 (en) | Slim type back light unit | |
US7795635B2 (en) | Backlight unit equipped with light emitting diodes | |
CN101826593B (en) | Wiring board contributable to reduction in thickness of light emitting apparatus and having high versatility | |
CN100580528C (en) | LCD and back light module thereof | |
US8564011B2 (en) | Light-emitting diode package structure | |
US20110019126A1 (en) | Apparatus for radiating heat of light emitting diode and liquid crystal display using the same | |
KR20080007961A (en) | Cooling device of led module and manufacturing method thereof | |
US20090073701A1 (en) | Electrical connecting apparatus | |
JP2009522804A (en) | Light emitting diode package, method for manufacturing the same, and backlight unit including the same | |
WO2007139195A1 (en) | Led light source unit | |
JPWO2008093440A1 (en) | LED light source unit | |
CN101307893A (en) | Lighting device | |
CN202182365U (en) | LED light strip, side light type backlight module and display | |
US8878228B2 (en) | Method for producing large lighting with power LED | |
CN101191949A (en) | Backlight module and LCD device | |
TW200837309A (en) | Light modules | |
US10980111B2 (en) | Circuit board and display device | |
CN101280891B (en) | Light source module | |
CN101975376B (en) | Luminous source heat-dissipation structure of backlight module | |
KR101221568B1 (en) | Backlight Unit having LEDs and Method for manufacturing the same | |
US20110019415A1 (en) | Heat dissipating module of light emitting diode | |
CN206401355U (en) | A kind of anti-static LED aluminium substrate | |
KR101363070B1 (en) | Led lighting module | |
KR20190076627A (en) | Lighting apparatus and manufacturing method of the same | |
US8829537B2 (en) | Integrated apparatus including driver chips, a power supply and LED chips on an isolative substrate |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant |