CN100580528C - LCD and back light module thereof - Google Patents
LCD and back light module thereof Download PDFInfo
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- CN100580528C CN100580528C CN200710079959A CN200710079959A CN100580528C CN 100580528 C CN100580528 C CN 100580528C CN 200710079959 A CN200710079959 A CN 200710079959A CN 200710079959 A CN200710079959 A CN 200710079959A CN 100580528 C CN100580528 C CN 100580528C
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Abstract
This invention provides one LCD display and its use aphototropism module, wherein, the aphototropism module comprises light source module and back board; the light source module has at least one light part; the back board and light source module are set by near and the back board is set with at least one dissipation protruding part contacting with the light source module relative to the light parts; the dissipation protruding part and light source module comprise heat conductive medium to lower heat resistance value.
Description
Technical field
The present invention relates to a kind of backlight module.Particularly, the LCD that the present invention relates to a kind of backlight module and be used.
Background technology
Because as if display panels (LCD) industry continues toward the development of large scale route, yet relevant challenge difficulty is also increasing.TV-LCD with family's use, display characteristics such as its brightness, contrast, demonstration reaction velocity, visible angle, color representation category and color saturation all must be better than traditional desktop display, even just have a competitive power than plasma scope (PDP) is good.In addition, except display characteristic, Costco Wholesale also is one of consumer's factor of mainly buying consideration.Yet with big molded dimension LCD, the shared cost proportion of backlight module (Backlight) is just high more, and therefore how effectively reducing cost also is the key element that the LCD panel manufacturers is considered.
Generally speaking, the backlight module of display panels is mostly with cold cathode fluorescent tube (CCFL; ColdCathode Fluorescent Lamp), and mainly is divided into straight-down negative and two kinds of backlight module designs of side entering type as backlight.Wherein the side entrance back module designs because of leaded light, makes that the damage rate of light is higher, and then makes backlight illumination restricted.Therefore when panel size is big more, the brightness that the side entrance back module is produced will be difficult to be satisfied, and as a result the substitute is direct type backlight module.Yet in order to promote picture brightness, direct type backlight module certainly will increase fluorescent tube quantity, and relatively power consumption increases, the problem that cost also increases relatively.Other all is the situation that cost is increased such as increasing fluorescent tube length, setting up diffusion barrier to strengthen optical uniformity and may increase plate thickness etc.In addition, under the situation that does not increase plate thickness, promptly in certain space, fluorescent tube too much and solid matter certainly will cause the alternate distance reduction in the fluorescent tube left and right sides to meaning, is difficult for heat radiation and become more.
Traditional panel manufacturer is in order to solve heat dissipation problem, nothing more than additionally installing radiating module additional, for example: cooling devices such as heat radiator (Heat Sink), heat pipe (Heat pipe) or fan.Yet these methods all can make LCD increase many assemblies and weight, and cost also can increase relatively in addition.
Summary of the invention
Fundamental purpose of the present invention is to provide a kind of backlight module of effective reduction heat dissipation path thermal resistance value and the LCD of use thereof.
Another object of the present invention is to provide a kind of backlight module, have the advantages that to increase life of product and increase luminescence efficiency.
Another object of the present invention is to provide a kind of the have backlight module of increase reinforced ribs structure and the LCD of use thereof.
Another object of the present invention is to the LCD that a kind of backlight module is provided and is used, have less spare part and lighter weight.
Another object of the present invention is to the LCD that a kind of backlight module is provided and is used, have cheaper assembly cost.
Another object of the present invention is to provide a kind of backlight module of display brightness increase and LCD that is used thereof of making.
Backlight module of the present invention comprises light source module and backboard.Light source module has at least one luminescence component.The adjacent setting of backboard and light source module, backboard are provided with at least one heat radiation teat.The heat radiation teat contacts with light source module, and corresponding to the luminescence component setting.
In preferred embodiment, more comprise between light source module and the backboard thermally-conductive interface material is set.By being arranged at the thermally-conductive interface material between light source module and the metal backing, it is better to make the thermal effect of luminescence component be passed to the backboard effect.In addition, the preferable fin that is convexly set in backboard that more comprises of heat radiation teat.Fin is protruding to light source module and have end face and contact with light source module.Fin is preferably elongated extension and is arranged on the backboard, and is preferably and is parallel to one of luminescence component the direction setting is set.
The present invention more provides a kind of LCD, and it comprises display panel, backlight module and backboard.Backlight module is arranged at the display panel below.In preferred embodiment, LCD more comprises first housing and one second housing, and the assembling of this display panel and backlight module is fixing wherein respectively by first, second housing.
Description of drawings
Fig. 1 is the decomposing schematic representation of the backlight module of one embodiment of the invention;
The preferred embodiment figure that Fig. 2 combines with backboard for backlight module of the present invention;
Fig. 3 is a preferred embodiment figure of LCD of the present invention, that is adopts the cut-open view of the LCD of direct type backlight module;
Fig. 4 is another preferred embodiment figure of LCD of the present invention, that is adopts the LCD cut-open view of side entrance back module;
Fig. 5 adopts the backlight module cut-open view in LED-backlit source for one embodiment of the invention;
Fig. 6 is a preferred embodiment figure of backboard of the present invention; And
Fig. 7 is another preferred embodiment figure of backboard of the present invention.
Wherein, Reference numeral:
100 backlight modules
102 diffuser plates
104 prismatic lenses
106,171 light guide plate
108 reflecting plates
110 frameworks
120 light source modules
122 luminescence components
150 optical modules
200 backboards
210 heat radiation teats
212 thermal conductance boundary materials (TIM)
220 fins
222 end faces
230 salient points
300 display panels
400 LCD
410 first housings
510 first spaces
Embodiment
The present invention utilizes the structural member of backlight module itself as termal conductor module, and the LCD of energy efficiently radiates heat and the backlight module that is used thereof.In other words, heat radiation certainly (self-cooler) effect by backlight module reduces the luminescence component surface temperature, and then display lighting efficient and brightness are increased.With preferred embodiment, the luminescence component in the backlight module refers to cold cathode fluorescent tube (CCFL).Yet in other different embodiment, luminescence component also can use external electrode fluorescent lamp (EEFL), light emitting diode (LED), flat florescent lamp (FFL; Flat Fluorescent Lamp) or other light emitting source.Below promptly in conjunction with the accompanying drawings, each specific embodiment of the present invention and step thereof are described:
Figure 1 shows that the decomposing schematic representation of the backlight module of one embodiment of the invention.Backlight module 100 of the present invention comprises light source module 120, backboard 200, framework 110 and optical module 150.Optical module 150 preferable diffuser plate 102, prismatic lens 104, light guide plate 106 and reflecting plates 108 of comprising wherein.Optical module 150 is located on the side of framework 110.120 of light source modules have at least one luminescence component 122.In embodiment as shown in Figure 2, preferable employing direct type backlight module 100.In other words, luminescence component 122 is preferably cold cathode fluorescent tube (CCFL), and on average intersperses among on the light source module 120.Yet in other different embodiment, also can adopt for example light sources such as external electrode fluorescent lamp, flat florescent lamp or light emitting diode.Its dorsulum 200 and light source module 120 adjacent settings, and be assembled in the lump on the another side of framework 110.Utilize the luminescence component 122 corresponding settings of some heat radiation teats 210 with the light source module 120 of backboard 200, make each heat radiation teat 210 contact light source module 120.
Figure 2 shows that the synoptic diagram of the embodiment that backlight module of the present invention combines with backboard.Shown in the embodiment of Fig. 2, the backboard 200 that the preferable utilization of the present invention has at least one heat radiation teat 210 combines with backlight module 100, to reach the purpose that reduces thermal resistance value.Its dorsulum 200 materials are preferably and adopt the high material of pyroconductivity, for example: aluminium alloy (Al), galvanized steel plain sheet (SECC), almag (Al-Mg) or the high metal material of other thermal conductivity.In addition, more be added with the high thermally-conductive interface material of heat-conduction coefficient (Thermal Interface material between backlight module 100 and the backboard 200; TIM), for example: heat-conducting cream, heat conductive pad (thermal pad/gap pad), heat conduction mica sheet, heat conduction foam, thermal conductive ceramic plate (thermal paste), thermal conductive silicon film, bond plies media such as (thermal tape), in order to the pyroconductivity of raising unit area or length, and increase heat conducting efficient.Furthermore, utilize the material of backboard 200 itself and the setting of thermally-conductive interface material 212 media, with the thermal resistance value of the heat dissipation path that reduces backlight module 100.
Figure 3 shows that one embodiment of the invention use the cut-open view of above-mentioned backlight module in LCD.The LCD 400 of the embodiment of the invention more comprises display panel 300, first housing 410 and backlight module 100.Display panel 300 is located on backlight module 100 surfaces, for display image.Particularly, by first housing 410 and backboard 200 component groups such as backlight module 100, display panel 300 are set respectively and be positioned at wherein.In embodiment as shown in Figure 3, each heat radiation teat 210 preferable fin 220 that are convexly set in backboard 200 that comprise of backboard 200.Each fin 220 more comprises end face 222, and is main for contacting with light source module 120 and being the scope of adding thermally-conductive interface material 212.Wherein the material of light source module 120 housings preferably adopts the high material of pyroconductivity, please join aforesaid material.In addition, between light source module 120 and the heat radiation teat 210, meaning is between the end face 222 of light source module 120 and fin 220, preferably is provided with thermally-conductive interface material 212, to increase pyroconductivity.
In embodiment as shown in Figure 2, each heat radiation teat 210 preferred elongated extension is arranged on the backboard 200, and is parallel to one of luminescence component 122 the direction setting is set.In other words, the preferable shapes with luminescence component 122 of heat radiation teat 210 quite are provided with, that is quantity, length, the width of itself and luminescence component 122, direction are set and the position correspondingly is covered on the surface of light source module 120.Therefore the luminescence component 122 that is strip is if be provided with 5, and heat radiation teat 210 promptly also will be provided with 5 with strip equally at least.Yet in embodiment as shown in Figure 3, also 2 heat radiation teats 210 can be integrated into a heat radiation teat 210 (as Fig. 3 top) with big end face 222 areas, or be integrated into plural heat radiation teat 210, even link up several heat radiation teats 210 and the mode that is integrated into a heat radiation teat 210 is provided with (as Fig. 3 bottom), visual demand and about design.
It should be noted that the preferable mode moulding of the molding mode of heat radiation teat 210 with bending or punching press at this.Yet in other different embodiment, heat radiation teat 210 also can adopt to penetrate and attach or the alternate manner moulding.In addition, in assembling process, before backboard 200 is assembled with light source module 120, preferable end face 222 surfaces of thermally-conductive interface material 212 of adding earlier in heat radiation teat 210.Yet in other different embodiment, also can after assembling, backboard 200 and light source module 120 impose thermally-conductive interface material 212 each end face 222 position again in heat radiation teat 210.
Therefore luminous and in first space 510 during generation heat energy when luminescence component 122 conductings, can be passed to light source module 120 via cross-ventilation, light source module 120 is direct with thermal energy transfer each heat radiation teat 210 to backboard 200 via easy conductive medium-thermally-conductive interface material 212 again.Therefore, utilize each heat radiation teat 210 to contact/conflict, make outside the easier transmission system of heat energy with light source module 120.In other words, utilize the low-heat resistance material behavior of backboard 200 with heat radiation teat 210 and backboard 200 itself, with thermal energy conduction to backlight module 100, even again by air or alternate manner with thermal energy conduction to LCD 400.Therefore can reduce the air themperature in first space 510 and the surface temperature of luminescence component 122, and then 122 life-spans of luminescence component are increased, even increase luminescence efficiency.
And for example shown in Figure 4, be another preferred embodiment figure of LCD of the present invention.In the present embodiment, the backlight module 100 of LCD 400 adopts the side entrance back module, therefore luminescence component 122 is located at a side of backlight module 100, utilizes special light guide plate 171 that ray guidance is distributed to backlight module 100 and penetrates to display panel 300.In embodiment as shown in Figure 4, luminescence component 122 is preferably cathode fluorescent tube.Yet in other different embodiment, also can adopt as light sources such as external electrode fluorescent lamp or flat florescent lamps; Or be among as shown in Figure 5 the embodiment, also can adopt light emitting diode as luminescence component 122.
In as Fig. 4 or embodiment shown in Figure 5, because luminescence component 122 is located at a side of LCD 400 equally, the heat radiation teat 210 preferable single fins 220 and protruding of being arranged to of backboard 200 to light source module 120.The preferable area of section of end face 222 areas of teat 210 of wherein dispelling the heat more than or equal to the first set space 510 of luminescence component 122.Yet in other different embodiment, the end face 222 of heat radiation teat 210 also can be designed to less area.Therefore to be the heat radiation teat 210 of bending, utilize thermally-conductive interface material 212 to contact with light source module 120 surfaces of low-heat resistance.When luminescence component 122 conductings produced heat energy, heat energy was able to be passed to outside the system via light source module 120, thermally-conductive interface material 212 and heat radiation teat 210 etc.First space 510 and luminescence component 122 surface temperatures are reduced, and then increase by 122 life-spans of luminescence component and display brightness thereof.
In addition, in the embodiment shown in fig. 6, if backlight module adopts the light source setting of straight-down negative, and when the cathode fluorescent tube of luminescence component employing strip or the fluorescent tube of other analogous shape, heat radiation teat 210 shapes of backboard 200 are preferably strip, and are set in parallel in being provided with on the direction of luminescence component 122.If the point-like setting that the luminescence component of straight-down negative is adopted light emitting diode, the preferable salient point 230 of then also adopting of heat radiation teat 210 shapes of backboard 200 is provided with, and please also refer to shown in Figure 7.Salient point 230 shapes described herein are preferably circle.Yet in other different embodiment, salient point 230 shapes also can be similar circle or other difformity.
At last, what this need emphasize be, heat radiation teat of the present invention 210 removes can protruding luminescence component 122 to light source module 120, and transmits outside the used heat at luminescence component 122; Also can heat radiation teat 210 and TIM 212 be set,, can reach the thermal resistance value of reduction heat dissipation path and the effect of other gain equally as the assemblies such as (IC) of the integrated circuit on the printed circuit board (PCB) at the assembly that easily generates heat in the LCD 400.
The present invention is described by above-mentioned related embodiment, yet the foregoing description is only for implementing example of the present invention.Must be pointed out that disclosed embodiment does not limit the scope of the invention.On the contrary, be contained in the modification of claimed spirit of claims and scope and be equal to be provided with and all be contained in the scope of the present invention.
Claims (21)
1. a backlight module is characterized in that, comprises:
One light source module has at least one luminescence component; And
One backboard, adjacent setting with this light source module, this backboard is provided with at least one heat radiation teat, this heat radiation teat contacts with this light source module, and be provided with, and the shape of this heat radiation teat and this luminescence component, quantity, direction is set and is provided with on the surface that the position is covered on this light source module accordingly corresponding to this luminescence component;
One thermally-conductive interface material, this thermally-conductive interface material is arranged between this heat radiation teat and this light source module.
2. backlight module according to claim 1 is characterized in that, this thermally-conductive interface material comprises heat radiation adhesive tape, conducting strip or heat-conducting cream.
3. backlight module according to claim 1 is characterized in that, this heat radiation teat comprises a fin that is convexly set in this backboard, and this fin is protruding in this light source module.
4. backlight module according to claim 3 is characterized in that, the elongated extension of this fin is arranged on this backboard.
5. backlight module according to claim 3 is characterized in that, this fin is parallel to one of this luminescence component direction is set.
6. backlight module according to claim 3 is characterized in that this fin is bent to form by this backboard.
7. backlight module according to claim 1 is characterized in that, this heat radiation teat comprises a salient point that is convexly set in this backboard, and this salient point is protruding in this light source module.
8. backlight module according to claim 1 is characterized in that, this heat radiation teat comprises an end face, and this end face contacts with this light source module.
9. backlight module according to claim 1 is characterized in that this back veneer material comprises metal or alloy.
10. backlight module according to claim 1 is characterized in that this luminescence component comprises cathode fluorescent tube, light emitting diode or external electrode fluorescent lamp.
11. a LCD is characterized in that, comprises:
One display panel;
One backlight module is arranged at this display panel below, and this backlight module comprises:
One light source module has at least one luminescence component; And
One backboard, adjacent setting with this light source module, this backboard is provided with at least one heat radiation teat, this heat radiation teat contacts with this light source module, and be provided with, and the shape of this heat radiation teat and this luminescence component, quantity, direction is set and is provided with on the surface that the position is covered on this light source module accordingly corresponding to this luminescence component;
One thermally-conductive interface material, wherein this thermally-conductive interface material is arranged between this heat radiation teat and this light source module.
12. LCD according to claim 11 is characterized in that, more comprises one first housing, this first housing and this backboard are fixing wherein with this display panel and this backlight module.
13. LCD according to claim 11 is characterized in that, this thermally-conductive interface material comprises heat radiation adhesive tape, conducting strip or heat-conducting cream.
14. LCD according to claim 11 is characterized in that, this heat radiation teat comprises a fin that is convexly set in this backboard, and this fin is protruding in this light source module.
15. LCD according to claim 14 is characterized in that, the elongated extension of this fin is arranged on this backboard.
16. LCD according to claim 14 is characterized in that, this fin is parallel to one of this luminescence component direction is set.
17. LCD according to claim 14 is characterized in that, this fin is bent to form by this backboard.
18. LCD according to claim 11 is characterized in that, this heat radiation teat comprises a salient point that is convexly set in this backboard, and this salient point is protruding in this light source module.
19. LCD according to claim 11 is characterized in that, this heat radiation teat comprises an end face, and this end face and this light source module are conflicted.
20. LCD according to claim 11 is characterized in that, this back veneer material comprises metal or alloy.
21. LCD according to claim 11 is characterized in that, this luminescence component comprises cathode fluorescent tube, light emitting diode or external electrode fluorescent lamp.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710079959A CN100580528C (en) | 2007-02-27 | 2007-02-27 | LCD and back light module thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710079959A CN100580528C (en) | 2007-02-27 | 2007-02-27 | LCD and back light module thereof |
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| CN101017282A CN101017282A (en) | 2007-08-15 |
| CN100580528C true CN100580528C (en) | 2010-01-13 |
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| CN200710079959A Active CN100580528C (en) | 2007-02-27 | 2007-02-27 | LCD and back light module thereof |
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Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101487943B (en) * | 2008-01-17 | 2013-04-24 | 奇美电子股份有限公司 | Backlight module and LCD using the same |
| CN102472909A (en) * | 2009-07-02 | 2012-05-23 | 夏普株式会社 | Liquid crystal display apparatus |
| JP2011124194A (en) * | 2009-12-14 | 2011-06-23 | Canon Inc | Display panel and image display device |
| CN101865389A (en) * | 2010-06-17 | 2010-10-20 | 深圳市华星光电技术有限公司 | Backlight module and display device |
| US8540386B2 (en) | 2010-06-17 | 2013-09-24 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Backlight module and display apparatus |
| CN102064266B (en) * | 2010-11-03 | 2013-02-27 | 宁波江丰电子材料有限公司 | Backboard for LED (light-emitting diode) chip and preparation method thereof |
| CN102003662A (en) * | 2010-11-18 | 2011-04-06 | 深圳市华星光电技术有限公司 | Edge type backlight module capable of strengthening local cooling |
| US20120127749A1 (en) * | 2010-11-18 | 2012-05-24 | Shenzhen China Star Optoelectronics Technology Co.Ltd | Side-light type backlight module with local heat-dissipation enhancement |
| CN102620182B (en) * | 2011-04-28 | 2014-04-23 | 深圳市华星光电技术有限公司 | Backlight module and coating mode for backboard of backlight module |
| US8752997B2 (en) | 2011-04-28 | 2014-06-17 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Backlight module and method for coating a thermal conducting material on the backlight module |
| JP5089788B1 (en) * | 2011-05-13 | 2012-12-05 | シャープ株式会社 | Liquid crystal display |
| CN102865503B (en) * | 2012-08-28 | 2015-09-30 | 深圳市华星光电技术有限公司 | Backlight module and heat abstractor |
| CN107436507A (en) * | 2016-05-25 | 2017-12-05 | 鸿富锦精密工业（深圳）有限公司 | Backlight module and apply its display device |
| CN106597740A (en) * | 2016-12-22 | 2017-04-26 | 深圳市华星光电技术有限公司 | Backlight module and liquid crystal display |
| CN114660851B (en) * | 2022-04-12 | 2024-02-09 | Tcl华星光电技术有限公司 | Backlight module and display device |
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2007
- 2007-02-27 CN CN200710079959A patent/CN100580528C/en active Active
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