CN114660851B - Backlight module and display device - Google Patents

Backlight module and display device Download PDF

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Publication number
CN114660851B
CN114660851B CN202210381063.0A CN202210381063A CN114660851B CN 114660851 B CN114660851 B CN 114660851B CN 202210381063 A CN202210381063 A CN 202210381063A CN 114660851 B CN114660851 B CN 114660851B
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China
Prior art keywords
plate
heat dissipation
lamp panel
backlight module
lamp
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CN202210381063.0A
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Chinese (zh)
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CN114660851A (en
Inventor
邓创华
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TCL Huaxing Photoelectric Technology Co Ltd
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TCL Huaxing Photoelectric Technology Co Ltd
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Priority to CN202210381063.0A priority Critical patent/CN114660851B/en
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    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336Illuminating devices
    • G02F1/133628Illuminating devices with cooling means
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336Illuminating devices
    • G02F1/133602Direct backlight
    • G02F1/133603Direct backlight with LEDs

Abstract

The invention provides a backlight module and a display device, wherein the backlight module comprises a lamp panel, a lamp source and a heat radiation structure, the heat radiation structure comprises a plurality of heat radiation components extending along a first direction, each heat radiation component comprises a contact part and a connection part, the contact part is attached to one side surface of the lamp panel far away from the lamp source, and orthographic projection of at least one lamp source on the heat radiation structure is positioned in an attaching surface of the contact part and the lamp panel; the connecting part is arranged on the opposite surface of the contact part and is used for connecting adjacent heat dissipation components; according to the invention, the contact part of the heat radiation component is attached to the surface of one side of the lamp panel far away from the lamp source, and the orthographic projection of at least one lamp source on the heat radiation structure is arranged in the attaching surface of the contact part and the lamp panel, so that the heat generated by the lamp source can be conducted to the heat radiation structure through the shortest path, the heat resistance is reduced, the temperature of the lamp panel is reduced, namely, the heat radiation efficiency of the backlight module is improved, the influence of local overheating on the display effect is avoided, and the reliability of products is improved.

Description

Backlight module and display device
Technical Field
The present invention relates to the field of display technologies, and in particular, to a backlight module and a display device.
Background
The liquid crystal display (Liquid Crystal Display, LCD) requires a light source provided by a backlight module, typically a light emitting diode (Light Emitting Diode, LED). The direct type backlight adopting the Local dimming technology can remarkably improve contrast ratio and display effect, and is applied to products at present. The more the number of the local dimming areas is, the better the display effect is, and correspondingly, the more the number of the LEDs is, but the higher the temperature of the backlight module is, the influence on the display effect and the reliability is caused. Therefore, it is necessary to solve the heat dissipation problem of such backlight.
In the prior art, the back plate is arranged between the lamp panel and the radiating fins, and the back plate is designed into a special-shaped structure with a plurality of buffer cavities, so that a large amount of heat which cannot be timely conducted out is released into the buffer cavities to be relieved, and the abnormal occurrence caused by local overheating is avoided. However, the buffer cavities are of a closed structure, air cannot circulate, only air heat conduction can be utilized, but the efficiency of the air heat conduction is very low, so that the buffer cavities play a role in heat preservation (similar to a down jacket), the actual heat dissipation area finally conducted to the outer side is a heat dissipation fin, namely the final heat dissipation area is not increased, and the heat dissipation effect is not improved; in addition, the LED in the prior art is positioned above the buffer cavity, a part of heat generated by the LED is conducted and conducted by the lamp panel, the heat needs to be conducted to the wall of the buffer cavity along the plane of the lamp panel, the temperature of the lamp panel is increased, and the heat conducting efficiency is low. Therefore, it is necessary to improve this defect.
Disclosure of Invention
The embodiment of the invention provides a backlight module which is used for solving the technical problems that the backlight module in the prior art not only increases the temperature of a lamp panel, but also has low heat conduction efficiency through air heat conduction and heat dissipation of the lamp panel.
The embodiment of the invention provides a backlight module, which comprises a lamp panel, a lamp source and a heat dissipation structure; the lamp source is positioned on the lamp panel; the heat dissipation structure is positioned at one side of the lamp panel far away from the lamp source; the heat dissipation structure comprises a plurality of heat dissipation components extending along a first direction, each heat dissipation component comprises a contact part and a connecting part, the contact part is attached to one side surface of the lamp panel, which is far away from the lamp source, and the orthographic projection of at least one lamp source on the heat dissipation structure is positioned in the attaching surface of the contact part and the lamp panel; the connecting part is arranged on the opposite surface of the contact part, and is used for connecting adjacent heat dissipation components.
In the backlight module provided by the embodiment of the invention, the connecting part is provided with a plurality of first through holes, and the first through holes extend along the thickness direction of the connecting part; and/or the contact part is provided with a plurality of second through holes, and the second through holes extend along the thickness direction of the contact part.
In the backlight module provided by the embodiment of the invention, when the plurality of second through holes are arranged on the contact part, one end of the second through holes adjacent to the lamp panel is closed, and one end of the second through holes far away from the lamp panel is communicated with the outside.
In the backlight module provided by the embodiment of the invention, the contact part comprises a first plate, and the connection part comprises a first connection plate, a second plate and a second connection plate; one end of the first connecting plate is connected with the first plate; the second plate is connected with the other end of the first connecting plate, and the second plate is arranged in parallel with the first plate; one end of the second connecting plate is connected with the second plate, and the other end of the second connecting plate is connected with the first plate of the adjacent one of the heat dissipation assemblies.
In the backlight module provided by the embodiment of the invention, the connecting part is provided with a plurality of first through holes, and the first through holes extend along the thickness direction of the connecting part; wherein the distribution density of the first through holes on the second plate is smaller than the distribution density of the first through holes on the first connecting plate and/or the second connecting plate.
In the backlight module provided by the embodiment of the invention, a first included angle is formed between the first connecting plate and the second plate, a second included angle is formed between the second connecting plate and the second plate, and the angle value of the first included angle is equal to the angle value of the second included angle.
In the backlight module provided by the embodiment of the invention, the contact part comprises a first plate, and the connecting part comprises a first connecting plate and a second connecting plate; one end of the first connecting plate is connected with the first plate; one end of the second connecting plate is connected with the first connecting plate, and the other end of the second connecting plate is connected with the first plate of the adjacent heat dissipation assembly.
In the backlight module provided by the embodiment of the invention, the first connecting plate and the second connecting plate are symmetrically arranged about the boundary line between the first connecting plate and the second connecting plate.
In the backlight module provided by the embodiment of the invention, the backlight module comprises a plurality of heat dissipation structures arranged along the light emitting side direction of the backlight module.
The embodiment of the invention also provides a display device which comprises the optical switch panel and the backlight module, wherein the optical switch panel is positioned on the light emitting side of the backlight module.
The beneficial effects are that: the embodiment of the invention provides a backlight module, which comprises a lamp panel, a lamp source and a heat dissipation structure; the lamp source is positioned on the lamp panel; the heat dissipation structure is positioned at one side of the lamp panel far away from the lamp source; the heat dissipation structure comprises a plurality of heat dissipation components extending along a first direction, each heat dissipation component comprises a contact part and a connecting part, the contact part is attached to one side surface of the lamp panel, which is far away from the lamp source, and the orthographic projection of at least one lamp source on the heat dissipation structure is positioned in the attaching surface of the contact part and the lamp panel; the connecting part is arranged on the opposite surface of the contact part and is used for connecting adjacent heat dissipation components; according to the invention, the contact part of the heat radiation component is attached to the surface of one side of the lamp panel far away from the lamp source, and the orthographic projection of at least one lamp source on the heat radiation structure is arranged in the attaching surface of the contact part and the lamp panel, so that the heat generated by the lamp source can be conducted to the heat radiation structure through the shortest path, the heat resistance is reduced, the temperature of the lamp panel is reduced, namely, the heat radiation efficiency of the backlight module is improved, the influence of local overheating on the display effect is avoided, and the reliability of products is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the description of the embodiments will be briefly described below.
Fig. 1 is a cross-sectional view of a backlight module according to an embodiment of the invention.
Fig. 2 is a perspective view of another backlight module according to an embodiment of the invention.
Fig. 3 is a schematic diagram of a basic structure of a heat dissipation structure according to an embodiment of the present invention.
Fig. 4 is a schematic basic structure of another heat dissipation structure according to an embodiment of the present invention.
Fig. 5 is a schematic basic structure of a further heat dissipation structure according to an embodiment of the present invention.
Fig. 6 is a cross-sectional view of a backlight module according to another embodiment of the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. In the drawings, the size and thickness of the components depicted in the drawings are not to scale for clarity and ease of understanding and description.
Referring to fig. 1, a cross-sectional view of a backlight module according to an embodiment of the invention is shown, wherein the backlight module includes a lamp panel 10, a lamp source 20 and a heat dissipation structure 30; the light source 20 is located on the light board 10; the heat dissipation structure 30 is located at a side of the lamp panel 10 away from the lamp source 20; the heat dissipation structure 30 includes a plurality of heat dissipation components 31 extending along a first direction, each heat dissipation component 31 includes a contact portion 311 and a connection portion 312, the contact portion 311 is attached to a surface of the lamp panel 10 away from the lamp source 20, and a front projection of at least one of the lamp sources 20 on the heat dissipation structure 30 is located in an attaching plane of the contact portion 311 and the lamp panel 10; the connection portion 312 is disposed opposite to the contact portion 311, and the connection portion 312 is used for connecting adjacent heat dissipation assemblies 31.
It can be appreciated that the prior art alleviates by first releasing a large amount of heat that cannot be conducted away in time into the buffer chamber, thereby avoiding local overheating induced anomalies. The buffer cavity is of a closed structure, air cannot circulate, only air heat conduction can be utilized, but the efficiency of the air heat conduction is low; in addition, the LED in the prior art is positioned above the buffer cavity, a part of heat generated by the LED is conducted and conducted by the lamp panel, the heat needs to be conducted to the wall of the buffer cavity along the plane of the lamp panel, the temperature of the lamp panel is increased, and the heat conducting efficiency is low. According to the invention, the contact part 311 of the heat radiation assembly 31 is attached to the surface of one side of the lamp panel 10 far away from the lamp sources 20, and the orthographic projection of at least one lamp source 20 on the heat radiation structure 30 is arranged in the attaching surface of the contact part 311 and the lamp panel 10, so that the heat generated by the lamp source 20 can be directly transmitted to the contact part 311 of the heat radiation structure 30 through the lamp panel 10, namely, the heat can be rapidly transmitted to the heat radiation structure 30 through the shortest path, the thermal resistance is reduced, the temperature of the lamp panel 10 is reduced, namely, the heat radiation efficiency of the backlight module is improved, the influence of local overheating on the display effect is avoided, and the reliability of products is improved.
It should be noted that, the backlight module provided in the embodiment of the present invention is a direct type LED backlight module, where the backlight module includes a plurality of dimming areas, at least one light source 20 is disposed in each dimming area, and the display effect can be improved by independently controlling the light sources 20 in the dimming areas.
It should be noted that the first direction may be any direction, for example, left or right, and only the first direction is illustrated as right in fig. 1, and the plurality of heat dissipation assemblies 31 extend in the right direction. It can be understood that, because the connecting portion 312 and the contact portion 311 are disposed on different sides, the plurality of heat dissipation components 31 of the heat dissipation structure 30 have a bending structure along the first direction, so that the backlight module is easy to bend in another direction (different from the first direction), i.e. the backlight module provided by the embodiment of the invention can be also suitable for the backlight of the curved display product.
The connection portion 312 is used to connect adjacent heat dissipation assemblies 31, and means that the connection portion 312 may be connected to a connection portion of an adjacent heat dissipation assembly 31, or may be directly connected to a contact portion 311 of an adjacent heat dissipation assembly 31.
Next, please refer to fig. 2, which is a perspective view of another backlight module according to an embodiment of the present invention, wherein the backlight module includes a lamp panel 10, a lamp source 20 and a heat dissipation structure 30; the light source 20 is located on the light board 10; the heat dissipation structure 30 is located at a side of the lamp panel 10 away from the lamp source 20; the heat dissipation structure 30 includes a plurality of heat dissipation components 31 extending along a first direction, each heat dissipation component 31 includes a contact portion 311 and a connection portion 312, the contact portion 311 is attached to a surface of the lamp panel 10 away from the lamp source 20, and a front projection of at least one of the lamp sources 20 on the heat dissipation structure 30 is located in an attaching plane of the contact portion 311 and the lamp panel 10; the connection portion 312 is disposed opposite to the contact portion 311, and the connection portion 312 is used for connecting adjacent heat dissipation assemblies 31. In this embodiment, the connection portion 312 is provided with a plurality of first through holes 40, and the first through holes 40 extend in the thickness direction of the connection portion 312; and/or the contact portion 311 is provided with a plurality of second through holes 50 (as shown in fig. 4 or 5), and the second through holes 50 extend in the thickness direction of the contact portion 311.
It can be appreciated that, in this embodiment, the connection portion 312 (i.e. the surface not contacting the lamp panel 10) is provided with the plurality of first through holes 40 and/or the contact portion 311 is provided with the plurality of second through holes 50, so that heat convection can be enhanced, a heat dissipation effect can be enhanced, a heat dissipation efficiency of the backlight module can be improved, a temperature of the lamp panel 10 can be reduced, an influence of local overheating on a display effect can be avoided, and reliability of a product can be improved.
Specifically, this embodiment includes three embodiments, the first embodiment is shown in fig. 3, which is a schematic basic structural diagram of a heat dissipation structure provided by the embodiment of the present invention, and in the embodiment of fig. 3, a plurality of first through holes 40 are only provided on the connection portion 312. The contact portion 311 of the heat dissipating structure 30 is attached to a side surface of the lamp panel 10 (fig. 1) away from the lamp source 20 (fig. 1), so that a through hole is not required to be provided on the contact portion 311, the connection portion 312 of the heat dissipating structure 30 is not in contact with the lamp panel 10, and a plurality of first through holes 40 are provided on the connection portion 312, thereby increasing heat convection and improving heat dissipation effect. In addition, in the plane perpendicular to the light emitting side of the backlight module, along the direction perpendicular to the first direction, the cavity formed between the contact portion 311 and the connection portions 312 on both sides thereof has a through channel, so that strong convection of chimney effect (i.e. hot air flowing upward and cold air entering from the bottom) can be formed, and the heat dissipation effect is greatly improved. The heat dissipation structure 30 provided by the embodiment of the invention can be processed by stamping, and is convenient to process and low in cost.
Second, as shown in fig. 4, a basic structure of another heat dissipation structure provided in an embodiment of the present invention is shown in fig. 4, where a plurality of second through holes 50 are only provided on the contact portion 311. Wherein, the end of the second through hole 50 adjacent to the lamp panel 10 (fig. 1) is closed, and the end of the second through hole 50 away from the lamp panel 10 is communicated with the outside. Specifically, since the contact portion 311 is attached to a surface of the lamp panel 10 away from the lamp source 20 (as shown in fig. 1), one end of the second through hole 50 on the contact portion 311, which is adjacent to the lamp panel 10, is closed by the lamp panel 10, and heat generated by the lamp source 20 can be directly conducted from the second through hole 50 to the outside through the lamp panel 10 for heat dissipation, so that the heat dissipation path is short, and the heat dissipation effect of the backlight module is improved.
Third, as shown in fig. 5, a basic structure of a further heat dissipation structure according to an embodiment of the present invention is shown in fig. 5, where a plurality of first through holes 40 are provided on the connection portion 312 and a plurality of second through holes 50 are provided on the contact portion 311. The heat generated by the light source 20 (as shown in fig. 1) can be conducted to the outside through the second through hole 50 on the contact portion 311, and can also form heat convection through the first through hole 40 on the connection portion 312, so as to accelerate heat dissipation and achieve high heat dissipation efficiency.
In one embodiment, the plurality of first through holes 40 and the plurality of second through holes 50 are uniformly distributed. It can be appreciated that, in this embodiment, the heat in the plurality of heat dissipation components 31 can be dispersed more uniformly by setting the plurality of first through holes 40 and the plurality of second through holes 50 to be uniformly distributed, so that the influence of local overheating on the display effect is avoided, and the reliability of the product is improved.
With continued reference to fig. 1, in one embodiment, the contact portion 311 comprises a first plate, and the connection portion 312 comprises a first connection plate 3121, a second plate 3122, and a second connection plate 3123; one end of the first connection plate 3121 is connected to the first plate; the second plate 3122 is connected to the other end of the first connection plate 3121, the second plate 3122 being disposed in parallel with the first plate; one end of the second connection plate 3123 is connected to the second plate 3122, and the other end of the second connection plate 3123 is connected to the first plate of an adjacent one of the heat radiation assemblies 31.
It can be appreciated that the present embodiment divides the connection portion 312 into the first connection plate 3121, the second plate 3122 and the second connection plate 3123, and the second plate 3122 is disposed parallel to the first plate, so that the first plate forms a first cavity with one first connection plate 3121 and one second connection plate 3123 respectively adjacent to the left and right, the second plate 3122 forms a second cavity with one first connection plate 3121 and one second connection plate 3123 respectively adjacent to the left and right, and the first cavity is symmetrically disposed with the second cavity, so that the heat dissipation structure 30 is more stable and is not easy to deform.
In one embodiment, the connection portion 312 is provided with a plurality of first through holes 40, and the first through holes 40 extend in the thickness direction of the connection portion 312; wherein the distribution density of the first through holes 40 on the second plate 3122 is smaller than the distribution density of the first through holes 40 on the first connection plate 3121 and/or the second connection plate 3123.
It can be appreciated that the heat convection is enhanced between two adjacent heat dissipation components 31 through the first through holes 40 on the first connection plate 3121 and the second connection plate 3123, and the heat dissipation effect can be further improved by arranging the first through holes 40 on the first connection plate 3121 and/or the second connection plate 3123 more densely.
In one embodiment, a first angle a is formed between the first connection plate 3121 and the second plate 3122, a second angle b is formed between the second connection plate 3123 and the second plate 3122, and an angle value of the first angle a is equal to an angle value of the second angle b.
It can be appreciated that, in this embodiment, by setting the included angle between the first connection plate 3121 and the second plate 3122 to be equal to the included angle between the second connection plate 3123 and the second plate 3122, the first connection plate 3121 and the second connection plate 3123 are symmetrically disposed with respect to the second plate 3122, so that the heat conducted from the light source 20 to the contact portion 311 can be uniformly conducted to the first connection plate 3121 and the second connection plate 3123, and the heat dissipation effect of the backlight module is improved.
Next, referring to fig. 6, a cross-sectional view of a backlight module according to an embodiment of the invention is shown, wherein the backlight module includes a lamp panel 10, a lamp source 20 and a heat dissipation structure 30; the light source 20 is located on the light board 10; the heat dissipation structure 30 is located at a side of the lamp panel 10 away from the lamp source 20; the heat dissipation structure 30 includes a plurality of heat dissipation components 31 extending along a first direction, each heat dissipation component 31 includes a contact portion 311 and a connection portion 312, the contact portion 311 is attached to a surface of the lamp panel 10 away from the lamp source 20, and a front projection of at least one of the lamp sources 20 on the heat dissipation structure 30 is located in an attaching plane of the contact portion 311 and the lamp panel 10; the connection portion 312 is disposed opposite to the contact portion 311, and the connection portion 312 is used for connecting adjacent heat dissipation assemblies 31.
In the present embodiment, the contact portion 311 includes a first plate, and the connection portion 312 includes a first connection plate 3121 and a second connection plate 3123; one end of the first connection plate 3121 is connected to the first plate; one end of the second connection plate 3123 is connected to the first connection plate 3121, and the other end of the second connection plate 3123 is connected to the first plate of an adjacent one of the heat radiation assemblies 31.
It can be appreciated that the present embodiment omits the second plate 3122 (as shown in fig. 1 to 5) as compared with the embodiment of fig. 1 to 5 by dividing the connection portion 312 into the first connection plate 3121 and the second connection plate 3123, and thus, the interval between the plurality of light sources 20 can be reduced, the distribution density of the light sources 20 can be increased, thereby improving the display effect.
It should be noted that, in this embodiment, a plurality of through holes (not shown) may be disposed on the connection portion 312 (i.e., the first connection plate 3121 and the second connection plate 3123), so as to enhance heat convection, enhance heat dissipation effect, improve heat dissipation efficiency of the backlight module, reduce temperature of the lamp panel 10, avoid influence of local overheating on display effect, and improve product reliability.
In one embodiment, the first connection plate 3121 and the second connection plate 3123 are symmetrically disposed about a boundary line c between the first connection plate 3121 and the second connection plate 3123.
It can be appreciated that, in the present embodiment, by arranging the first connection plate 3121 and the second connection plate 3123 to be symmetrical with respect to the boundary line c between the first connection plate 3121 and the second connection plate 3123, the heat conducted from the light source 20 to the contact portion 311 can be uniformly conducted to the first connection plate 3121 and the second connection plate 3123, thereby improving the heat dissipation effect of the backlight module.
In one embodiment, the backlight module includes a plurality of heat dissipation structures (not shown) arranged along a light emitting side direction of the backlight module. It is understood that the heat dissipating structure may be multi-layered. That is, a plurality of heat dissipation structures are disposed on one side of the lamp panel away from the lamp source, wherein the heat dissipation components in two adjacent heat dissipation structures can extend towards different directions, for example, the heat dissipation components in the heat dissipation structure of the first layer extend towards a first direction, and the heat dissipation components in the heat dissipation structure of the second layer extend towards a direction perpendicular to the first direction.
The embodiment of the invention also provides a display device, which comprises an optical switch panel and the backlight module, wherein the optical switch panel is positioned on the light emitting side of the backlight module, and the structure of the backlight module is shown in fig. 1 to 6 and related description, and is not repeated here. The display device provided by the embodiment of the invention can be as follows: products or components with display function such as mobile phones, tablet computers, notebook computers, televisions, digital cameras, navigator and the like.
In summary, the backlight module provided by the embodiment of the invention includes a lamp panel, a lamp source and a heat dissipation structure; the lamp source is positioned on the lamp panel; the heat dissipation structure is positioned at one side of the lamp panel far away from the lamp source; the heat dissipation structure comprises a plurality of heat dissipation components extending along a first direction, each heat dissipation component comprises a contact part and a connecting part, the contact part is attached to one side surface of the lamp panel, which is far away from the lamp source, and the orthographic projection of at least one lamp source on the heat dissipation structure is positioned in the attaching surface of the contact part and the lamp panel; the connecting part is arranged on the opposite surface of the contact part and is used for connecting adjacent heat dissipation components; according to the invention, the contact part of the heat radiation component is attached to the surface of one side of the lamp panel far away from the lamp source, and the orthographic projection of at least one lamp source on the heat radiation structure is arranged in the attaching surface of the contact part and the lamp panel, so that the heat generated by the lamp source can be conducted to the heat radiation structure through the shortest path, the heat resistance is reduced, the temperature of the lamp panel is reduced, namely, the heat radiation efficiency of the backlight module is improved, the influence of local overheating on the display effect is avoided, the reliability of the product is improved, and the technical problems that the backlight module in the prior art radiates heat through air heat conduction and the heat conduction of the lamp panel are solved, the temperature of the lamp panel is increased, and the heat conduction efficiency is low are solved.
The backlight module and the display device provided by the embodiment of the invention are described in detail. It should be understood that the exemplary embodiments described herein are to be considered merely descriptive for aiding in the understanding of the method of the present invention and its core concepts and not for limiting the invention.

Claims (4)

1. A backlight module, comprising:
a lamp panel;
the lamp source is positioned on the lamp panel;
the heat dissipation structure is positioned at one side of the lamp panel far away from the lamp source;
the heat dissipation structure comprises a plurality of heat dissipation components extending along a first direction, each heat dissipation component comprises a contact part and a connecting part, the contact part is attached to one side surface of the lamp panel, which is far away from the lamp source, and the orthographic projection of at least one lamp source on the heat dissipation structure is positioned in the attaching surface of the contact part and the lamp panel; the connecting part is arranged on the opposite surface of the contact part and is used for connecting the adjacent heat dissipation components;
the contact portion includes a first plate;
one of the connection portions includes:
a first connection plate, one end of which is connected with the first plate;
a second plate, one end of which is connected with the other end of the first connecting plate, and which is arranged in parallel with the first plate; and
one end of the second connecting plate is connected with the other end of the second plate, and the other end of the second connecting plate is connected with the first plate of the adjacent heat dissipation assembly;
the first plate and the first connecting plate and the second connecting plate which are adjacent to and connected with the first plate enclose a first cavity extending along a second direction, the second plate and the first connecting plate and the second connecting plate which are adjacent to and connected with the second plate enclose a second cavity extending along the second direction, both ends of the first cavity and the second cavity in the second direction are provided with openings, the first cavity and the second cavity are symmetrically arranged, and the second direction is perpendicular to the first direction;
the connecting part is provided with a plurality of first through holes, and the contact part is provided with a plurality of second through holes; the distribution density of the first through holes on the second plate is smaller than that of the first through holes on the first connecting plate and/or the second connecting plate, the first connecting plate and the second connecting plate are symmetrically arranged relative to the second plate, and a first included angle value formed between the first connecting plate and the second plate is the same as a second included angle value formed between the second connecting plate and the second plate.
2. The backlight module according to claim 1, wherein the first through hole extends in a thickness direction of the connection portion; the second through hole extends in a thickness direction of the contact portion.
3. The backlight module according to claim 2, wherein when the plurality of second through holes are provided on the contact portion, one end of the second through holes adjacent to the lamp panel is closed, and one end of the second through holes far from the lamp panel is communicated with the outside.
4. A display device comprising an optical switch panel and a backlight module according to any one of claims 1 to 3, wherein the optical switch panel is located on a light emitting side of the backlight module.
CN202210381063.0A 2022-04-12 2022-04-12 Backlight module and display device Active CN114660851B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210381063.0A CN114660851B (en) 2022-04-12 2022-04-12 Backlight module and display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210381063.0A CN114660851B (en) 2022-04-12 2022-04-12 Backlight module and display device

Publications (2)

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CN114967240B (en) * 2022-08-02 2022-12-23 惠科股份有限公司 Backlight module and display device
CN115113439B (en) * 2022-08-23 2022-12-23 惠科股份有限公司 Backlight module and display device

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