CN209056480U - A kind of ceramic copper-clad panel assembly applied to IGBT power module encapsulation - Google Patents

Abstract

The utility model discloses a ceramic copper clad plate device applied to IGBT power module packaging, comprising a heat dissipation base plate, a DBC board, a connecting bridge, an IGBT chip, a FWD chip, and an aluminum wire. A DBC plate is arranged above the heat dissipation base plate, and The inner side of the DBC board is provided with the first area of the DBC board, the second area of the DBC board is fixed inside the DBC board, and the inner side of the DBC board is provided with the third area of the DBC board, and the bridge is fixed to the third area of the DBC board The inside of the DBC board is provided with a solder resist frame, and the inner side of the DBC board is provided with a fourth area of the DBC board. The DBC board device applied to the IGBT power module package has IGBT chips, and the third area of the DBC board is connected to the IGBT chip and the FWD chip by welding. The chip is placed, and the IGBT chip, the FWD chip and the DBC board are welded by solder paste to enhance the stability between the two.

Description

A ceramic copper clad laminate device applied to IGBT power module packaging

technical field

The utility model relates to the technical field of semiconductor power device packaging devices, in particular to a ceramic copper clad plate device applied to the packaging of IGBT power modules.

Background technique

With the rapid development of economy and the advancement of science and technology in various regions, IGBT modules are modular semiconductor products that are packaged by IGBT (insulated gate bipolar transistor chip) and FWD (freewheeling diode chip) through a specific circuit bridge. The latter IGBT module is directly applied to the inverter, UPS uninterruptible power supply and other equipment;

In the process of encapsulating IGBT chips into modules, ceramic copper clad laminates (DBC boards) are generally used to achieve insulation, thermal conductivity, welding, electrical conductivity and other properties. DBC is composed of ceramic substrates, bonding layers and conductive layers. A special process method in which copper foil is directly bonded to the surface of alumina or aluminum nitride ceramic substrate at high temperature, which has high thermal conductivity, high adhesion strength, excellent solderability and excellent electrical insulation properties.

When the ceramic CCL devices on the market for IGBT power module packaging work, the packaging yield and packaging efficiency are low, and the phenomenon of electrostatic breakdown of the IGBT module is prone to occur, which brings inconvenience to the packaging work and is difficult to reduce the circuit. Coupling, stray inductance and capacitance in the loop reduce the reliability of the module. For this reason, we propose a ceramic CCL device for IGBT power module packaging.

Utility model content

The purpose of the present utility model is to provide a ceramic copper clad laminate device applied to IGBT power module packaging, so as to solve the problem that the packaging device proposed in the above-mentioned background technology has low packaging yield and packaging efficiency, and is prone to electrostatic breakdown during operation. The IGBT module phenomenon brings inconvenience to the operation of the device, and it is difficult to reduce the coupling, stray inductance and capacitance in the circuit loop, which reduces the reliability of the module.

In order to achieve the above purpose, the present invention provides the following technical solutions: a ceramic copper clad laminate device applied to IGBT power module packaging, comprising a heat dissipation base plate, a DBC board, a bridge, an IGBT chip, a FWD chip, and an aluminum wire, and the heat dissipation base plate A DBC board is arranged on the top of the board, and the first area of the DBC board is arranged on the inner side of the DBC board, the second area of the DBC board is fixed on the inside of the DBC board, and the inner side of the DBC board is provided with a third area of the DBC board. The bridge is fixed inside the third area of the DBC board, the inside of the DBC board is provided with a solder mask, and the inside of the DBC board is provided with the fourth area of the DBC board, and the IGBT chip and the FWD chip are arranged in the third area of the DBC board. The inside of the IGBT chip is provided with an insulating ring, and the aluminum wire is fixed on the IGBT chip and the DBC board.

Preferably, the surface shape of the fourth area of the DBC board is an "L" shape, and the E pole of the chip is led to the E pole bonding area of the fourth area of the DBC board through an aluminum wire, and the connection method is bonding, E pole welding area Connect the electrodes, and the connection method is welding.

Preferably, the IGBT chip and the FWD chip can be placed by the action of the solder resist frame on the inner side of the DBC board.

Preferably, the surface shapes of the first area of the DBC board and the second area of the DBC board are in a "U" shape, which is convenient for the aluminum wire bonding of the GE control electrode, and improves the welding yield of the signal line and the DBC, and the area is relatively small. Small, to a certain extent, the coupling, stray inductance and capacitance in the circuit loop are reduced, and aluminum wires are used to connect the G-pole bonding area and the E-pole bonding area, which can effectively prevent electrostatic breakdown and improve the packaging quality. rate and product reliability.

Preferably, the DBC boards with the same layout are used on the same module, which can reduce the difficulty of material management, and can effectively reduce the difficulty of operation in processes such as printing, patching, and bonding, and improve production efficiency and production yield.

Preferably, the cross-sectional area of the insulating ring is smaller than the cross-sectional area of the IGBT chip, and the outer side of the insulating ring is in contact with the inner wall of the IGBT chip.

Compared with the prior art, the beneficial effect of the present invention is that: the ceramic copper clad plate device applied to the IGBT power module package is provided with an IGBT chip, and the connection method between the third region of the DBC board and the IGBT chip is welding, and the connection between the third area of the DBC board and the IGBT chip is through welding. The role of the inner solder mask can place the IGBT chip, and solder the IGBT chip and the DBC board through solder paste to enhance the stability between the two. At the same time, the first area and the second area of the DBC board are The surface shape is "U" shape, which is convenient for aluminum wire bonding of GE control electrodes, improves the welding yield of signal lines and DBC, and has a small area, which reduces the coupling and stray in the circuit loop to a certain extent. Inductance and capacitance, and two DBC boards with the same layout are used on the same module, which can reduce the difficulty of material management, and can effectively reduce the difficulty of work in printing, patch, bonding and other processes, and improve production efficiency and production yield , and the G-pole bonding area and the E-pole bonding area are connected with aluminum wires, which can effectively prevent electrostatic breakdown, improve packaging yield and product reliability, and the cross-sectional area of the insulating ring is smaller than that of the IGBT chip. The role of the ring can effectively assist the aluminum wire bonding between the G pole and the E pole on the IGBT chip, prevent the IGBT chip from being electrostatically broken down, and enhance the working performance of the IGBT chip.

Description of drawings

1 is a schematic diagram of the utility model device;

2 is a schematic diagram of the internal structure of the heat dissipation base plate of the present invention;

FIG. 3 is a schematic diagram of the connection structure between the IGBT chip and the insulating ring of the present invention.

In the figure: 1. The first area of the DBC board, 2. The second area of the DBC board, 3. The third area of the DBC board, 4. The fourth area of the DBC board, 5. The solder mask frame, 6, The C pole chip bonding area, 7 , C pole electrode welding area, 8, E pole welding area, 9, E pole bonding area, 10, heat dissipation base plate, 11, DBC board, 12, IGBT chip, 13, connecting bridge, 14, aluminum wire, 15, insulation Ring, 16, FWD chip.

Detailed ways

The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the implementations. example. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present invention.

Please refer to FIGS. 1-3 , the present utility model provides a technical solution: a ceramic copper clad laminate device for IGBT power module packaging, comprising a heat dissipation base plate 10 , a DBC board 11 , a bridge 13 , an IGBT chip 12 and a FWD chip 16 , aluminum wire 14, a DBC board 11 is arranged above the heat dissipation bottom plate 10, and the inner side of the DBC board 11 is arranged with the first area 1 of the DBC board, the first area 1 of the DBC board and the second area 2 of the DBC board The surface shape is "U" The shape is convenient for the bonding of the aluminum wire 14 of the GE control electrode, and the welding yield of the signal wire and the DBC board 11 is improved, and the area is small, which reduces the coupling and stray inductance in the circuit loop to a certain extent. It is connected with the capacitor, and the G-pole bonding area and the E-pole bonding area 9 are connected with aluminum wires 14, which can effectively prevent electrostatic breakdown, improve the packaging yield and product reliability. Two DBC boards 11 with the same layout are used in the same On the module, it can reduce the difficulty of material management, and can effectively reduce the difficulty of operation in printing, patch, bonding and other processes, improve production efficiency and production yield, the second area 2 of the DBC board is fixed inside the DBC board 11, and The inner side of the DBC board 11 is provided with a third region 3 of the DBC board, the inner side of the third region 3 of the DBC board is provided with a C-pole chip welding region 6 and a C-pole electrode welding region 7, and the bridge 13 is fixed to the third region 3 of the DBC board. Inside, the solder resist frame 5 is arranged inside the DBC board 11 , and the fourth area 4 of the DBC board is arranged on the inner side of the DBC board 11 . The pole is led to the E pole bonding area 9 of the fourth area 4 of the DBC board, and its connection method is bonding, and the E pole welding area 8 is connected to the electrode, and its connection method is welding, through the action of the solder mask 5 inside the DBC board 11 , the IGBT chip 12 can be placed, and the IGBT chip 12 and the DBC board 11 can be soldered by solder paste to enhance the stability between the two. The inner side of the fourth area 4 of the DBC board is provided with E-pole welding area 8 and The E-pole bonding area 9, the IGBT chip 12 and the FWD chip 16 are arranged inside the third area 3 of the DBC board, and the edge of the IGBT chip 12 is provided with an insulating ring 15, and the cross-sectional area of the insulating ring 15 is smaller than that of the IGBT chip 12. , and the outer side of the insulating ring 15 is in contact with the inner wall of the IGBT chip 12. The function of the insulating ring 15 can effectively assist the bonding of the aluminum wire 14 between the G pole and the E pole on the IGBT chip 12 to avoid the IGBT chip. 12 is broken down by static electricity to enhance the working performance of the IGBT chip 12 , and the aluminum wire 14 is fixed on the IGBT chip 12 and the DBC board 11 .

Working principle: For this type of ceramic CCL device used in IGBT power module packaging, the IGBT chip 12 and the DBC board 11 are first welded with solder paste to enhance the stability between the two, and through the role of the insulating ring 15 , which can effectively assist the G pole and E pole on the IGBT chip 12 to perform the bonding operation through the aluminum wire 14. The first area 1 of the DBC board and the second area 2 of the DBC board have a "U" shape, which is convenient for the GE control pole. The aluminum wire 14 is bonded, and the welding yield of the signal wire and the DBC board 11 is improved, and the area is small, which reduces the coupling, stray inductance and capacitance in the circuit loop to a certain extent, and the G pole The bonding area and the E-pole bonding area 9 are connected by aluminum wires 14, which can effectively prevent electrostatic breakdown, improve the packaging yield and product reliability. Two DBC boards 11 with the same layout are used on the same module, which can reduce material management. Difficulty, and can effectively reduce the difficulty of operation in printing, patch, bonding and other processes, improve production efficiency and production yield.

Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes and modifications can be made to these embodiments without departing from the principles and spirit of the present invention , alternatives and modifications, the scope of the present invention is defined by the appended claims and their equivalents.

Claims (6)

1. A ceramic copper clad laminate device applied to IGBT power module packaging, comprising a heat dissipation base plate (10), a DBC board (11), a connecting bridge (13), an IGBT chip (12), an FWD chip (16), an aluminum wire ( 14), characterized in that a DBC board (11) is arranged above the heat dissipation base plate (10), and a first area (1) of the DBC board is arranged on the inner side of the DBC board (11), and a second area of the DBC board is arranged (2) It is fixed inside the DBC board (11), and the inner side of the DBC board (11) is provided with a third region (3) of the DBC board, and the inner side of the third region (3) of the DBC board is provided with a C-pole chip welding area (6) and C-pole electrode welding area (7), the bridge (13) is fixed inside the third area (3) of the DBC board, and the inside of the DBC board (11) is provided with a solder resist frame (5). ), and the inner side of the DBC board (11) is provided with a fourth region (4) of the DBC board, and the inner side of the fourth region (4) of the DBC board is provided with an E-pole welding area (8) and an E-pole bonding area (9) , the IGBT chip (12) and the FWD chip (16) are arranged inside the third area (3) of the DBC board, and the edge of the IGBT chip (12) is provided with an insulating ring (15), the aluminum wire (14) It is fixed on the IGBT chip (12) and the DBC board (11). 2. A ceramic copper clad laminate device for IGBT power module packaging according to claim 1, characterized in that the surface shape of the fourth region (4) of the DBC board is "L" shape, and the chip is connected by aluminum wires (14). The E pole is led to the E pole bonding area (9) of the fourth area (4) of the DBC board, and the connection method is bonding, and the E pole welding area (8) is connected to the electrode, and the connection method is welding. 3. A ceramic copper clad laminate device applied to IGBT power module packaging according to claim 1, characterized in that through the action of the solder resist frame (5) inside the DBC board (11), the IGBT chip (12) , the FWD chip (16) performs a placement operation. 4. A ceramic copper clad laminate device for IGBT power module packaging according to claim 1, characterized in that the surface shape of the first area (1) of the DBC board and the second area (2) of the DBC board is "U" shape , to facilitate the bonding of the aluminum wire (14) of the GE control pole, and improve the welding yield of the signal wire and DBC, and the area is small, which reduces the coupling in the circuit loop, stray inductance and Capacitance, and the G-pole bonding area and the E-pole bonding area (9) are connected with an aluminum wire (14), which can effectively prevent electrostatic breakdown and improve the packaging yield and product reliability. 5. A ceramic copper clad laminate device for IGBT power module packaging according to claim 1, characterized in that two DBC boards (11) with the same layout are used on the same module, which can reduce the difficulty of material management, and Printing, patch, bonding and other processes can effectively reduce the difficulty of operation, improve production efficiency and production yield. 6. A ceramic copper clad laminate device applied to IGBT power module packaging according to claim 1, characterized in that the cross-sectional area of the insulating ring (15) is smaller than the cross-sectional area of the IGBT chip (12), and the insulating ring (15) The outer side of the IGBT chip is attached to the inner wall of the IGBT chip (12).