CN108735691A - A kind of heat dissipating method and device of portable computer high power chip bga - Google Patents
A kind of heat dissipating method and device of portable computer high power chip bga Download PDFInfo
- Publication number
- CN108735691A CN108735691A CN201810593105.0A CN201810593105A CN108735691A CN 108735691 A CN108735691 A CN 108735691A CN 201810593105 A CN201810593105 A CN 201810593105A CN 108735691 A CN108735691 A CN 108735691A
- Authority
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- China
- Prior art keywords
- heat
- chip bga
- pcb board
- copper plate
- bga
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of heat dissipating methods and device of portable computer high power chip bga, heat conduction is carried out respectively over and under to strengthen the chip bga heat dissipation in chip bga by way of increasing thermal conductive surface, increase the thermal conductive surface of the chip bga by increasing lower part conducting copper plate at the back side in the chip bga welding corresponding pcb board region, partial heat is made to pass through the pcb board export at the chip bga back side.A kind of radiator of portable computer high power chip bga of the present invention is compared to the prior art, have the characteristics that reasonable design, simple in structure, easy to use, good heat dissipation effect, using this method in the case where not increasing complete machine thickness, effective heat dissipation of high power B GA encapsulation chips can be achieved, meet the secure heat dissipation of high-power die under the small bulk of portable product, and realize relatively simple, good manufacturability.
Description
Technical field
The present invention relates to computer technical field of heat dissipation, specifically a kind of portable computer high power BGA package
The heat dissipating method and device of chip.
Background technology
The chips such as CPU, the bridge piece of BGA package are small in portable product, such as notebook, tablet product because of its package area
Middle extensive application, but due to silicon chip area is smaller and calorific value is very big, this is a greatly test to heat dissipation, and tradition is just
It is above euthermic chip plus heat radiation module to take formula computer radiating mode, will be dissipated by fan after heat derives using heat pipe
Heat, such as the radiating mode mentioned in utility model patent ZL 2,004 2 0407893.7, but usually chip area is limited, and dissipates
The heat conductivility of thermal module is directly related with contact area, and there is also heat conduction limit values for heat pipe itself, and which has limited certain high
Application of the power chip bga in portable product, low-power chip performance is relatively low, to limit to a certain extent
The promotion of portable product performance.One important feature of portable product is exactly its portability, current portable production
Product all develop to lightening direction, and the space reserved to cooling system is smaller, are especially limited on thickness direction more strictly,
Therefore, the heat dissipation problem that high power consumption chip how is solved under small bulk, is the lightening needs of current portable computer
One of solve the problems, such as.
Invention content
The technical assignment of the present invention is to provide a kind of heat dissipating method and device of portable computer high power chip bga.
The technical assignment of the present invention is realized in the following manner：
A kind of heat dissipating method of portable computer high power chip bga, in BGA package by way of increasing thermal conductive surface
Chip carries out heat conduction to strengthen the chip bga heat dissipation, by the chip bga respectively over and under
The back side in welding corresponding pcb board region increases lower part conducting copper plate to increase the thermal conductive surface of the chip bga, makes part
Heat is exported by the pcb board at the chip bga back side.
Increase via on the pcb board, and fill heat-conducting insulation material in the via, while described
The pcb board back side of chip bga welding region increases lying copper region domain to reinforce heat conduction, reduces the pcb board heat
Resistance.
Increase void region on the pcb board, makes the lower part conducting copper plate and the chip bga
Rear-face contact, to further decrease the thermal contact resistance at the chip bga back side and the lower part conducting copper plate.
The chip bga uses top heat pipe and lower part heat pipe by heat derives respectively over and under, described
The heat of chip bga front and back collected on a heat sink by the top heat pipe and lower part heat pipe, then
Heat is taken away using waterproof radiating fan.
A kind of radiator of portable computer high power chip bga, including pcb board, chip bga, on
Portion's conducting copper plate, top heat pipe, lower part conducting copper plate, lower part heat pipe, cooling fin and waterproof radiating fan；
The chip bga is welded on made of epoxy resin on the pcb board, the chip bga it is upper
Surface applies heat-conducting insulation material, and the top conducting copper plate compresses the heat-conducting insulation material, the top heat conduction
One end of copper coin and the top heat pipe welds together, and the other end of the top heat pipe is crimped on described by pressing plate
Cooling fin on；
The lower part conducting copper plate is installed below the chip bga, the lower part conducting copper plate with it is described
One end of lower part heat pipe weld together, the other end of the lower part heat pipe is welded on the cooling fin；
It is configured with separate cavities on the casing of the cooling fin side, the waterproof cooling wind is installed in the separate cavities
Fan.
It is provided with gasket between the cooling fin and the casing.
The pcb board corresponds to the intermediate of pad in the chip bga and via is arranged, and in the via
Heat-conducting insulation material is filled, and corresponds to the pcb board back side setting lying copper region domain, institute in the welding chip bga
Heat-conducting insulation material is applied on the lying copper region domain stated, the heat conduction that the lower part conducting copper plate compresses on the lying copper region domain is exhausted
Edge material.
The pcb board intermediate region configures void region, the void region correspond to the chip bga without
The middle section of pin distribution.
The void region is passed through by the intermediate raised portion of lower part conducting copper plate, in the lower part conducting copper plate
Between projection portion contacted with the middle section that the chip bga back side is distributed without pin.
The lower part conducting copper plate and the top conducting copper plate are fixed on by screw and the pcb board respectively
Together.
Compared to the prior art a kind of radiator of portable computer high power chip bga of the present invention, has
There is the features such as reasonable design, simple in structure, easy to use, good heat dissipation effect, using this method in the feelings for not increasing complete machine thickness
, it can be achieved that effective heat dissipation of high power B GA encapsulation chips, meets high-power die under the small bulk of portable product under condition
Secure heat dissipation, and realize relatively simple, good manufacturability.
Description of the drawings
Attached drawing 1 is a kind of structural schematic diagram of the radiator of portable computer high power chip bga.
Attached drawing 2 is a kind of side structure schematic view of the radiator of portable computer high power chip bga.
Attached drawing 3 is the structural schematic diagram of pcb board.
Attached drawing 4 is the A of attached drawing 3 to structural schematic diagram.
Attached drawing 5 is enlarged structure schematic diagram at H in attached drawing 4.
Attached drawing 6 is another example structure schematic diagram of pcb board.
Attached drawing 7 be in attached drawing 6 A to structural schematic diagram.
In figure：1.PCB plates, 2. pads, 3. epoxy resin, 4. vias, 5. lying copper region domains, 6. void regions, 7.BGA encapsulation
Chip, 8. heat-conducting insulation materials, 9. top conducting copper plates, 10. top heat pipes, 11. lower part conducting copper plates, 12. lower part heat pipes,
13. cooling fin, 14. pressing plates, 15. casings, 16. separate cavities, 17. waterproof radiating fans, 18. gaskets, 19. screws.
Specific implementation mode
Embodiment 1：
A kind of heat dissipating method of portable computer high power chip bga, in BGA package by way of increasing thermal conductive surface
Chip 7 carries out heat conduction and radiates to strengthen the chip bga 7 respectively over and under, by the BGA package core
The back side in 1 region of the corresponding pcb board of the welding of piece 7 increases lower part conducting copper plate 11 to increase the heat conduction of the chip bga 7
Face makes the pcb board 1 that partial heat passes through 7 back side of chip bga export.
Increase via 4 on the pcb board 1, and fill heat-conducting insulation material 8 in the via 4, while in institute
1 back side of pcb board for 7 welding region of chip bga stated increases lying copper region domain 5 to reinforce heat conduction, reduces described
1 thermal resistance of pcb board.
The chip bga 7 uses top heat pipe 10 and lower part heat pipe 12 by heat derives respectively over and under,
The heat of 7 front and back of chip bga collects in heat dissipation by the top heat pipe 10 and lower part heat pipe 12
On piece 13, then heat is taken away using waterproof radiating fan 17.
A kind of radiator of portable computer high power chip bga, including pcb board 1, chip bga 7,
Top conducting copper plate 9, top heat pipe 10, lower part conducting copper plate 11, lower part heat pipe 12, cooling fin 13 and waterproof radiating fan 17；
The chip bga 7 is welded on pcb board 1 described made of epoxy resin 3, the chip bga 7
Upper surface apply heat-conducting insulation material 8, the top conducting copper plate 9 compresses the heat-conducting insulation material 8, and described is upper
Portion's conducting copper plate 9 and one end of the top heat pipe 10 weld together, and the other end of the top heat pipe 10 passes through pressure
Plate 14 is crimped on the cooling fin 13；
The lower section of the chip bga 7 is equipped with the lower part conducting copper plate 11, the lower part conducting copper plate 11 with
One end of the lower part heat pipe 12 welds together, and the other end of the lower part heat pipe 12 is welded on the cooling fin 13
On；It is configured with separate cavities 16 on the casing 15 of 13 side of cooling fin, is equipped in the separate cavities 16 described anti-
Water-cooled fan 17；It is provided with gasket 18 between the cooling fin 13 and the casing 15.
The pcb board 1 corresponds to the intermediate of pad 2 in the chip bga 7 and via 4 is arranged, and in the mistake
Heat-conducting insulation material 8 is filled in hole 4, and is corresponded to 1 back side of the pcb board setting in the welding chip bga 7 and covered copper
Region 5, heat-conducting insulation material 8 is applied on the lying copper region domain 5, and the lower part conducting copper plate 11 compresses the lying copper region
Heat-conducting insulation material 8 on domain 5；
The lower part conducting copper plate 11 and the top conducting copper plate 9 are fixed by screw 19 and the pcb board 1 respectively
Together.
Embodiment 2：
A kind of heat dissipating method of portable computer high power chip bga, in BGA package by way of increasing thermal conductive surface
Chip 7 carries out heat conduction and radiates to strengthen the chip bga 7 respectively over and under, by the BGA package core
The back side in 1 region of the corresponding pcb board of the welding of piece 7 increases lower part conducting copper plate 11 to increase the heat conduction of the chip bga 7
Face makes the pcb board 1 that partial heat passes through 7 back side of chip bga export.
Increase via 4 on the pcb board 1, and fill heat-conducting insulation material 8 in the via 4, while in institute
1 back side of pcb board for 7 welding region of chip bga stated increases lying copper region domain 5 to reinforce heat conduction, reduces described
1 thermal resistance of pcb board.
Increase void region 6 on the pcb board 1, makes the lower part conducting copper plate 11 and the BGA package core
The rear-face contact of piece 7, to further decrease connecing for 7 back side of chip bga and the lower part conducting copper plate 11
Touch thermal resistance.
The chip bga 7 uses top heat pipe 10 and lower part heat pipe 12 by heat derives respectively over and under,
The heat of 7 front and back of chip bga collects in heat dissipation by the top heat pipe 10 and lower part heat pipe 12
On piece 13, then heat is taken away using waterproof radiating fan 17.
A kind of radiator of portable computer high power chip bga, including pcb board 1, chip bga 7,
Top conducting copper plate 9, top heat pipe 10, lower part conducting copper plate 11, lower part heat pipe 12, cooling fin 13 and waterproof radiating fan 17；
The chip bga 7 is welded on pcb board 1 described made of epoxy resin 3, the chip bga 7
Upper surface apply heat-conducting insulation material 8, the top conducting copper plate 9 compresses the heat-conducting insulation material 8, and described is upper
Portion's conducting copper plate 9 and one end of the top heat pipe 10 weld together, and the other end of the top heat pipe 10 passes through pressure
Plate 14 is crimped on the cooling fin 13；
The lower section of the chip bga 7 is equipped with the lower part conducting copper plate 11, the lower part conducting copper plate 11 with
One end of the lower part heat pipe 12 welds together, and the other end of the lower part heat pipe 12 is welded on the cooling fin 13
On；It is configured with separate cavities 16 on the casing 15 of 13 side of cooling fin, is equipped in the separate cavities 16 described anti-
Water-cooled fan 17；It is provided with gasket 18 between the cooling fin 13 and the casing 15, gasket 18 can be realized scattered
Sealing between backing 13 and casing 15 makes being isolated for internal component and external cooling air duct, meets portioned product waterproof, anti-
The requirement drenched with rain.
The pcb board 1 corresponds to the intermediate of pad 2 in the chip bga 7 and via 4 is arranged, and in the mistake
Heat-conducting insulation material 8 is filled in hole 4, and is corresponded to 1 back side of the pcb board setting in the welding chip bga 7 and covered copper
Region 5, heat-conducting insulation material 8 is applied on the lying copper region domain 5, and the lower part conducting copper plate 11 compresses the lying copper region
Heat-conducting insulation material 8 on domain 5.
1 intermediate region of pcb board configures void region 6, and the void region 6 corresponds to the BGA package core
The middle section that piece 7 is distributed without pin.
The void region 6 is passed through by the intermediate raised portion of lower part conducting copper plate 11, the lower part conducting copper plate
11 intermediate raised portion is contacted with the middle section that 7 back side of chip bga is distributed without pin；The lower guide
Hot copper coin 11 and the top conducting copper plate 9 are fixed together by screw 19 and the pcb board 1 respectively.
The present invention increases lower part heat dissipation, but because of 1 back side meeting of pcb board compared with conventional portable computer cooling system
Component is placed, as long as the height of control lower part conducting copper plate 11 and lower part heat pipe 12, it is high to be no more than 1 back side component of pcb board
Degree, so that it may under the premise of realization does not increase complete machine thickness, improve the heat-sinking capability of cooling system.
The technical personnel in the technical field can readily realize the present invention with the above specific embodiments,.But it answers
Work as understanding, the present invention is not limited to above-mentioned several specific implementation modes.On the basis of the disclosed embodiments, the technology
The technical staff in field can arbitrarily combine different technical features, to realize different technical solutions.
Claims (10)
1. a kind of heat dissipating method of portable computer high power chip bga, which is characterized in that by increasing thermal conductive surface
Mode carries out heat conduction to strengthen the chip bga heat dissipation, by described respectively over and under in chip bga
The back side in the corresponding pcb board region of chip bga welding increase lower part conducting copper plate to increase the chip bga
Thermal conductive surface makes partial heat pass through the pcb board export at the chip bga back side.
2. heat dissipating method according to claim 1, which is characterized in that increase via on the pcb board, and described
Via in fill heat-conducting insulation material, while increasing at the pcb board back side of the chip bga welding region
Heat conduction is reinforced in lying copper region domain, reduces the pcb board thermal resistance.
3. heat dissipating method according to claim 1, which is characterized in that increase void region on the pcb board, make institute
The rear-face contact of the lower part conducting copper plate stated and the chip bga, to further decrease the chip bga
The thermal contact resistance at the back side and the lower part conducting copper plate.
4. heat dissipating method according to claim 1, which is characterized in that the chip bga is distinguished over and under
Using top heat pipe and lower part heat pipe by heat derives, the heat of the chip bga front and back passes through described
Top heat pipe and lower part heat pipe collect on a heat sink, are then taken away heat using waterproof radiating fan.
5. a kind of radiator of portable computer high power chip bga, which is characterized in that sealed including pcb board, BGA
Cartridge chip, top conducting copper plate, top heat pipe, lower part conducting copper plate, lower part heat pipe, cooling fin and waterproof radiating fan；
The chip bga is welded on made of epoxy resin on the pcb board, the chip bga it is upper
Surface applies heat-conducting insulation material, and the top conducting copper plate compresses the heat-conducting insulation material, the top heat conduction
One end of copper coin and the top heat pipe welds together, and the other end of the top heat pipe is crimped on described by pressing plate
Cooling fin on；
The lower part conducting copper plate is installed below the chip bga, the lower part conducting copper plate with it is described
One end of lower part heat pipe weld together, the other end of the lower part heat pipe is welded on the cooling fin；
It is configured with separate cavities on the casing of the cooling fin side, the waterproof cooling wind is installed in the separate cavities
Fan.
6. a radiator according to claim 5, which is characterized in that set between the cooling fin and the casing
It is equipped with gasket.
7. radiator according to claim 5, which is characterized in that the pcb board is in the chip bga pair
It answers the intermediate of pad that via is set, and fills heat-conducting insulation material in the via, and the BGA package core described in welding
Piece corresponds to the pcb board back side setting lying copper region domain, and heat-conducting insulation material, the lower part are applied on the lying copper region domain
Conducting copper plate compresses the heat-conducting insulation material on the lying copper region domain.
8. radiator according to claim 5, which is characterized in that the pcb board intermediate region configures void region,
The void region corresponds to the middle section that the chip bga is distributed without pin.
9. radiator according to claim 8, which is characterized in that the void region is by the conducting copper plate of lower part
Between projection portion pass through, the intermediate raised portion of the lower part conducting copper plate and the chip bga back side are without pin
The middle section of distribution contacts.
10. radiator according to claim 5, which is characterized in that the lower part conducting copper plate and the top
Conducting copper plate is fixed together by screw and the pcb board respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810593105.0A CN108735691A (en) | 2018-06-11 | 2018-06-11 | A kind of heat dissipating method and device of portable computer high power chip bga |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810593105.0A CN108735691A (en) | 2018-06-11 | 2018-06-11 | A kind of heat dissipating method and device of portable computer high power chip bga |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108735691A true CN108735691A (en) | 2018-11-02 |
Family
ID=63932710
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810593105.0A Pending CN108735691A (en) | 2018-06-11 | 2018-06-11 | A kind of heat dissipating method and device of portable computer high power chip bga |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108735691A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109740267A (en) * | 2019-01-07 | 2019-05-10 | 郑州云海信息技术有限公司 | The design drawing edit methods and relevant apparatus of CPU in a kind of pcb board |
| CN111725163A (en) * | 2020-06-23 | 2020-09-29 | 扬州通信设备有限公司 | Electronic switch installation method for reducing thermal impedance |
| US20230262923A1 (en) * | 2022-02-11 | 2023-08-17 | Getac Technology Corporation | Electronic device |
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| US20230262923A1 (en) * | 2022-02-11 | 2023-08-17 | Getac Technology Corporation | Electronic device |
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Application publication date: 20181102 |
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