CN207503151U - A kind of novel computer memory bank heat sink - Google Patents
A kind of novel computer memory bank heat sink Download PDFInfo
- Publication number
- CN207503151U CN207503151U CN201721728846.2U CN201721728846U CN207503151U CN 207503151 U CN207503151 U CN 207503151U CN 201721728846 U CN201721728846 U CN 201721728846U CN 207503151 U CN207503151 U CN 207503151U
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- China
- Prior art keywords
- heat sink
- notch
- heat
- memory bar
- heat dissipation
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model discloses a kind of novel computer memory bank heat sinks, including heat sink, the heat sink is rectangular configuration, the bottom of heat sink offers strip notch, the width of notch is more than the maximum gauge of memory bar, the length of notch is identical with the length of heat sink, the depth of notch is more than the width of memory bar, the outside of heat sink is arranged with multiple radiating fins, graphene heat dissipation film is fitted on the inner wall of the notch respectively, graphene heat dissipation film is connect respectively with two end faces of memory bar.Notch on heat sink is connect in a manner of plugging with memory bar, radiating fin is distributed on heat sink, graphene heat dissipation film has been bonded on the inner wall of heat sink notch, graphene heat dissipation film is contacted with the surface of memory bar, graphene heat dissipation film has excellent heat-conductive characteristic, the heat that memory bar is generated when working long hours can be taken away, efficiently solves memory bar heat dissipation problem, considerably increases the stability of memory work.
Description
Technical field
The utility model is related to computer annex technical fields, and in particular to a kind of novel computer memory bank heat dissipation
Plate.
Background technology
Computer application has penetrated into the every field of society, increasingly changes traditional work, study and life
Mode living has become essential electronic equipment in daily life, working and learning.In the prior art, computer leads to
Often include main frame, display, keyboard and mouse etc., and main frame is computer most importantly component.
With the development of computer technology, when present people select purchase computer, more favor in compact, light, beautiful
The mainframe box of sight type, therefore minimize the developing direction as current computer.However when the volume for requiring computer cabinet
During reduction, while also imply that the heat flow density in cabinet increases, in cabinet in relatively narrow confined space, air is more
It is not easy to circulate, causes the heat that central processing unit (CPU), north bridge chips or other components are distributed that can not diffuse as early as possible to machine
Outside case, high temperature is formed in cabinet, therefore for the computer cabinet of small form factor requirements, it is machine to solve its heat dissipation problem
Case can reach one of matter of utmost importance of small form factor requirements.
Internal store insert slot for computer is located at mainboard side, close to CPU, this design can make memory and CPU distances closer to,
Outside electromagnetic interference is reduced, increases stability.But because CPU calorific values are huge, cooling fin is mounted on CPU
And radiator fan, the heat that CPU is transmitted to cooling fin by radiator fan is blown around along the groove on cooling fin, close to CPU's
Memory bar slot must not be not subject to a large amount of hot winds, since the heat dissipation effect of memory bar slot in itself is very poor while bears big calorimetric again
Wind is under thermal environment for a long time, influences the connection of the stability and equipment of memory, be easy to cause memory bar job insecurity and
Loose contact causes computer corruption, blue screen that can not even start, and influences computer normal operation.
Utility model content
To be solved in the utility model is the deficiencies in the prior art, and it is an object of the present invention to provide a kind of novel calculator memory
Heat sink.
The utility model is achieved through the following technical solutions：
A kind of novel computer memory bank heat sink, including heat sink, the heat sink is rectangular configuration, heat sink
Bottom offers strip notch, and the width of notch is more than the maximum gauge of memory bar, the length of notch and the length of heat sink
Identical, the depth of notch is more than the width of memory bar, and the outside of heat sink is arranged with multiple radiating fins, the inner wall of the notch
Upper to be fitted with graphene heat dissipation film respectively, graphene heat dissipation film is connect respectively with two end faces of memory bar.
Preferred embodiment, the inner wall of the notch are be bonded by heat-conducting cream with graphene heat dissipation film.
Preferred embodiment, the heat sink are aluminum alloy material.
Preferred embodiment, the heat sink top are equipped with handle.
The utility model compared with prior art, has the following advantages and advantages：Notch on heat sink is with slotting
The mode pulled out is connect with memory bar, and radiating fin is distributed on heat sink, and the heat that radiating fin generates memory bar dissipates
It loses, graphene heat dissipation film has been bonded on the inner wall of heat sink notch, graphene heat dissipation film is contacted with the surface of memory bar, graphite
Alkene heat dissipation film has excellent heat-conductive characteristic, can take away the heat that memory bar is generated when working long hours, make memory bar
Operating ambient temperature it is constant, so as to ensure the even running of memory bar, efficiently solve the problems, such as memory heat radiation, considerably increase
The stability of memory bar work.
Description of the drawings
Attached drawing described herein is used for providing further understanding the utility model embodiment, forms the one of the application
Part does not form the restriction to the utility model embodiment.In the accompanying drawings：
Fig. 1 is a kind of front view of novel computer memory bank heat sink of the utility model；
Fig. 2 is a kind of bottom view of novel computer memory bank heat sink of the utility model；
Fig. 3 is a kind of stereogram of novel computer memory bank heat sink of the utility model.
Label and corresponding parts title in attached drawing：
1- heat sinks, 2- radiating fins, 3- notches, 4- handles, 5- graphene cooling fins.
Specific embodiment
For the purpose of this utility model, technical solution and advantage is more clearly understood, with reference to embodiment and attached drawing,
The utility model is described in further detail, and the exemplary embodiment and its explanation of the utility model are only used for explaining this
Utility model is not intended to limit the scope of the present invention.
Embodiment
As shown in Figure 1 to Figure 3, a kind of novel computer memory bank heat sink of the utility model including heat sink 1, dissipates
Hot plate 1 is rectangular configuration, and the bottom of heat sink 1 offers strip notch 3, and the width of notch 3 is more than the maximum thickness of memory bar
Degree, the length of notch 3 is identical with the length of heat sink 1, and the depth of notch 3 is more than the width of memory bar, and the external of heat sink 1 is arranged
Multiple radiating fins 2 are shown, the quantity of radiating fin 2 can determine according to specific needs, and the temperature height of memory bar fever can
Increase the quantity of radiating fin 2 with selection, so as to enhance heat dissipation effect.Graphene is fitted on the inner wall of notch 3 respectively to dissipate
Hotting mask 5, graphene heat dissipation film 5 are connect respectively with two end faces of memory bar.
Operation principle：Radiator on the memory bar on computer motherboard is installed, is opened up on the heat sink 1 of radiator
Have a notch 3 to match with memory bar, the notch 3 of heat sink 1 all enveloped memory bar during installation, the surface of memory bar with
The inner wall contact of notch 3, the heat that memory bar generates when working will be conducted on heat sink 1, and the outside of heat sink 1 is also set
Have multiple radiating fins 2, radiating fin 2 increases the contact area of heat sink 1 and extraneous air, radiating fin 2 enhance with
The heat transfer of air plays the effect for accelerating cooling.Graphene is bonded on the inner wall of the notch 3 of heat sink 1 simultaneously to dissipate
Hotting mask 5, graphene heat dissipation film 5 and the outer surface of memory bar are in close contact, and the heat of memory bar passes through 5 heat of graphene heat dissipation film
Amount is conducted again on heat sink 1, due to 5 good endothermic effect of graphene heat dissipation film, accelerates the heat of memory bar to unofficial biography
It leads, plays the effect to cool down rapidly.
Preferred embodiment scheme, the inner wall of notch 3 is be bonded by heat-conducting cream with graphene heat dissipation film 5, heat-conducting cream be specially for
Electronic component heat transfer and the novel alicyclic organic made have good insulation performance and heat-conductive characteristic.
Preferred embodiment scheme, heat sink 1 are aluminum alloy material, and heat sink 1 is easy to process using aluminum alloy material, quality
Gently, good heat dissipation effect, it is at low cost, it is suitble to large-scale production.
Preferred embodiment scheme, 1 top of heat sink are equipped with handle 4, and heat sink 1 or dismounting heat dissipation are installed on memory bar
During plate 1, only need manually according to the pressing of the installation and removal direction of memory bar or on pull handle and 4 dismounting heat sink can be completed.
Above-described specific embodiment, the purpose of this utility model, technical solution and advantageous effect have been carried out into
One step is described in detail, it should be understood that the foregoing is merely specific embodiment of the present utility model, is not used to limit
Determine the scope of protection of the utility model, within the spirit and principle of the utility model, any modification for being made equally is replaced
It changes, improve, should be included within the scope of protection of this utility model.
Claims (4)
1. a kind of novel computer memory bank heat sink, including heat sink, which is characterized in that the heat sink is rectangle knot
Structure, the bottom of heat sink offer strip notch, and the width of notch is more than the maximum gauge of memory bar, and the length of notch is with dissipating
The length of hot plate is identical, and the depth of notch is more than the width of memory bar, and the outside of heat sink is arranged with multiple radiating fins, described
Graphene heat dissipation film is fitted on the inner wall of notch respectively, graphene heat dissipation film is connect respectively with two end faces of memory bar.
2. a kind of novel computer memory bank heat sink according to claim 1, which is characterized in that the notch it is interior
Wall is be bonded by heat-conducting cream with graphene heat dissipation film.
3. a kind of novel computer memory bank heat sink according to claim 1, which is characterized in that the heat sink is
Aluminum alloy material.
A kind of 4. novel computer memory bank heat sink according to claim 1, which is characterized in that the heat sink top
Portion is equipped with handle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721728846.2U CN207503151U (en) | 2017-12-13 | 2017-12-13 | A kind of novel computer memory bank heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721728846.2U CN207503151U (en) | 2017-12-13 | 2017-12-13 | A kind of novel computer memory bank heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207503151U true CN207503151U (en) | 2018-06-15 |
Family
ID=62509435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721728846.2U Expired - Fee Related CN207503151U (en) | 2017-12-13 | 2017-12-13 | A kind of novel computer memory bank heat sink |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207503151U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107861594A (en) * | 2017-12-13 | 2018-03-30 | 成都强思科技有限公司 | A kind of computer memory bank heat abstractor |
-
2017
- 2017-12-13 CN CN201721728846.2U patent/CN207503151U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107861594A (en) * | 2017-12-13 | 2018-03-30 | 成都强思科技有限公司 | A kind of computer memory bank heat abstractor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180615 Termination date: 20181213 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |