CN218548421U

CN218548421U - Radiator with electromagnetic shielding function

Info

Publication number: CN218548421U
Application number: CN202222811193.1U
Authority: CN
Inventors: 张鹏飞
Original assignee: Hangzhou Vango Technologies Inc
Current assignee: Hangzhou Vango Technologies Inc
Priority date: 2022-10-25
Filing date: 2022-10-25
Publication date: 2023-02-28
Anticipated expiration: 2032-10-25

Abstract

The utility model discloses a radiator with electromagnetic shielding function, which is applied to industrial control equipment and comprises conductive foam, a first heat conducting pad and an electromagnetic shielding and heat radiating component, wherein the electromagnetic shielding and heat radiating component comprises a first heat radiating layer, the upper surface of the first heat radiating layer is provided with a first shielding diameter and a second shielding diameter, the first heat conducting pad is fixedly connected between the first shielding diameter and the second shielding diameter on the upper surface of the first heat radiating layer, and the conductive foam surrounds the first shielding diameter and the second shielding diameter; the main control board is provided with a windowing area, bare copper is paved around the windowing area, and the lower surface of the core board is attached to the upper surface of the main control board, so that components on the core board are positioned in the windowing area; the upper surface of the conductive foam is connected with the bare copper on the periphery of the windowing area, and the component is connected with the first heat conducting pad. The utility model discloses realize radiator and electromagnetic shield function on same structure, improved the stability and the reliability of main control chip operation in high temperature environment to and the interference killing feature under harsh electromagnetic environment.

Description

Radiator with electromagnetic shielding function

Technical Field

The utility model belongs to the technical field of the electromagnetic shield heat dissipation, especially, relate to a radiator of electromagnetic shield function.

Background

The industrial control equipment has higher requirements on heat dissipation, static resistance and electromagnetic interference resistance of the main control chip, for example, in a power acquisition terminal, under the condition that the ambient temperature is 70 ℃, when the load of the main control chip is 50%, the junction temperature of the main control chip is not more than 100 ℃; the electrostatic discharge immunity of the whole machine is 4 grades, and the radio frequency radiation electromagnetic field immunity of the whole machine is 3/4 grades; the installation positions of the power acquisition terminals are dispersed, the working environment is complex, the field maintenance is inconvenient, and a self-cooling radiator is adopted in combination with the requirement on the protection performance. In the prior art, as disclosed in chinese patent CN107546197A, "electronic device and heat dissipation and electromagnetic shielding structure thereof" describes a heat dissipation and electromagnetic shielding structure including a shielding frame and a heat dissipation member, the electromagnetic shielding and heat dissipation structure is separated, and there are operations such as stress, secondary welding, etc. during the assembly process, which may cause abnormal situations such as solder paste melting and tin short circuit, etc., and is not favorable for assembly, and the main control chip is unstable in operation in a high temperature environment and poor in anti-interference capability in a harsh electromagnetic environment, etc.

SUMMERY OF THE UTILITY MODEL

Utility model purpose: the utility model aims to solve the technical problem that to prior art not enough, provide a radiator of electromagnetic shield function.

In order to solve the technical problem, the utility model discloses a radiator of electromagnetic shield function is applied to industrial control equipment, industrial control equipment includes main control chip, and main control chip is the main heat source, also is the object that needs to carry out the electromagnetic shield protection, the radiator includes electrically conductive bubble cotton, first heat conduction pad and electromagnetic shield heat dissipation part, electromagnetic shield heat dissipation part include first heat dissipation layer and with the heat conduction mechanism of first heat dissipation layer lower surface integrated into one piece, first heat dissipation layer upper surface is provided with first shielding footpath and second shielding footpath, first heat conduction pad fixed connection is between first shielding footpath and second shielding footpath on first heat dissipation layer upper surface, and electrically conductive bubble cotton encloses first shielding footpath and second shielding footpath; the main control chip is laid with bare copper all around, and the cotton upper surface of electrically conductive bubble aligns with the bare copper all around of main control chip and is connected, and the main control chip is connected with first heat conduction pad. The upper surface of the first heat dissipation layer of the electromagnetic shielding heat dissipation part is provided with two shielding diameters and conductive foam with the thickness matched with the heights of the two shielding diameters, and the electromagnetic shielding heat dissipation part, the conductive foam and the main control board form a closed space, namely a conductive cavity, which plays a role of electromagnetic shielding; the main control chip on the core board is enclosed in the cavity, so that the anti-electromagnetic compatibility and the anti-static capability are improved.

Furthermore, the heat conducting mechanism is an inverted T-shaped heat radiating member, the radiator further comprises a second heat conducting pad and a heat exchange plate, the lower surface of the inverted T-shaped heat radiating member is fixedly connected with the upper surface of the second heat conducting pad, and the lower surface of the second heat conducting pad is connected with the upper surface of the heat exchange plate; the industrial control equipment further comprises a shell, and the lower surface of the heat exchange plate is connected with the inner surface of the shell. The lower surface of the inverted T-shaped heat radiating part plays a role in soaking and heat radiating, heat is conducted to the heat exchange plate through the first heat conducting pad, the electromagnetic shielding heat radiating part and the second heat conducting pad, the heat exchange plate is attached to the inner surface of the shell, and the area of the heat exchange plate is large so as to obtain large heat radiating efficiency. The structure is suitable for industrial control equipment with poor natural heat dissipation conditions (such as a plastic shell), incapability of using air cooling (the product has requirements on design life and is inconvenient to replace a fan) and limited cost (such as a heat pipe technology, the cost can be very high), for example, an electric power acquisition terminal. At present, the shell of the electric power acquisition terminal product is made of plastic, and the plastic has high thermal resistance and is not beneficial to heat dissipation; in order to meet the waterproof and dustproof requirements of the IP51 grade, the shell needs to be sealed, which is more unfavorable for heat dissipation. By adopting the structure, the electromagnetic shielding protection can be carried out on the main control chip while the heat dissipation requirement is met.

Furthermore, the heat conduction mechanism is parallel arranged radiating fins, the industrial control equipment further comprises a shell, a shutter is arranged on the shell, heat exchange can be efficiently carried out with the environment, and the industrial control equipment is suitable for the situation that the shutter is arranged or air cooling can be carried out.

Further, the industrial control equipment further comprises a main control board and a core board arranged on the main control board, and the main control chip is positioned on the core board.

Furthermore, the radiator also comprises a back plate and a fastening component, wherein the back plate is positioned above the main control plate, and the electromagnetic shielding heat dissipation component, the main control plate and the back plate are sequentially penetrated through the fastening component and then are fixedly connected. The backplate plays fixed and balanced mechanical stress's effect for nuclear core plate presss from both sides between backplate and electrically conductive magnetic shield heat dissipation part, guarantees first heat conduction pad, nuclear core plate and the first heat dissipation layer in close contact with of electromagnetic shield heat dissipation part, improves the heat conduction efficiency between the interface.

Furthermore, a group of connecting holes are formed in the back plate, corresponding first through holes are formed in the main control panel, corresponding second through holes are formed in the first heat dissipation layer, the second through holes, the first through holes and the connecting holes are aligned, and the main control panel is fixedly connected after being penetrated through the fastening components in sequence.

Furthermore, the main control chip is positioned on the lower surface of the core board, the main control board is provided with a windowing area, the bare copper is laid around the windowing area, and the lower surface of the core board is attached to the upper surface of the main control board, so that the main control chip is positioned in the windowing area; after the second through hole, the first through hole and the connecting hole are aligned, the upper surface of the conductive foam is just aligned and connected with the bare copper around the windowing area.

Further, the fastening part comprises a screw, a spring and a fastening gasket, the spring and the fastening gasket are sequentially sleeved on the screw, the screw sleeved with the spring and the fastening gasket sequentially penetrates through the second through hole, the first through hole and the connecting hole, and fastening connection is carried out through a nut. First heat dissipation layer on the electromagnetic shielding radiating component links together through screw, spring and fastening gasket and backplate, presss from both sides nuclear core plate between backplate and the conductive magnetic shielding radiating component, guarantees first heat conduction pad, the first heat dissipation layer in close contact with of nuclear core plate and electromagnetic shielding radiating component, improves the heat conduction efficiency between the interface.

Further, the electromagnetic shielding heat dissipation part, the back plate and the heat exchange plate are made of aluminum materials; the height of the first shielding diameter and the second shielding diameter, the thickness of the conductive foam, the thickness of the first heat conducting pad, the height of the main control chip, the thickness of the core board and the thickness of the main control board are matched with each other.

Further, main control chip is located nuclear core plate lower surface, and nuclear core plate upper surface and main control board lower surface welded connection, naked copper is laid around nuclear core plate lower surface main control chip.

Has the advantages that: this application realizes radiator and electromagnetic shield function on same structure, has improved the stability and the reliability of main control chip operation in high temperature environment to and the interference killing feature under the harsh electromagnetic environment. The application combines the characteristics of industrial control equipment, and has the characteristics of simple structure, high cost performance, convenience in production and assembly and easiness in batch production.

Drawings

These and/or other advantages of the present invention will become more apparent from the following detailed description of the present invention when taken in conjunction with the accompanying drawings.

Fig. 1 is a cross-sectional view of an assembled heat sink with an electromagnetic shielding function according to an embodiment of the present disclosure.

Fig. 2 is an exploded view of a heat sink with an electromagnetic shielding function according to an embodiment of the present disclosure.

Fig. 3 is an exploded view of a heat sink with electromagnetic shielding function according to an embodiment of the present disclosure.

Fig. 4 is an exploded view of a heat sink with electromagnetic shielding function according to an embodiment of the present disclosure.

Fig. 5 is a thermal simulation diagram of a heat sink with electromagnetic shielding function according to an embodiment of the present application.

Detailed Description

Embodiments of the present invention will be described below with reference to the accompanying drawings.

The self-cooling radiator is composed of a heat conduction part and a heat exchange part. Because of the requirements of cost and thermal resistance, the radiator is made of aluminum material. The shape of the aluminum heat sink affects the EMC (Electro Magnetic Compatibility, especially the EMC performance of the main control chip), which requires the design of the heat sink structure.

The embodiment of the application discloses a radiator with an electromagnetic shielding function, which is applied to industrial control equipment, wherein the industrial control equipment comprises a main control chip, as shown in fig. 1, the radiator comprises conductive foam 8, a first heat conducting pad 7 and an electromagnetic shielding heat radiating part 6, the electromagnetic shielding heat radiating part 6 comprises a first heat radiating layer 61 and a heat conducting mechanism 62 integrally formed with the lower surface of the first heat radiating layer 61, the upper surface of the first heat radiating layer 61 is provided with a first shielding diameter 611 and a second shielding diameter 612, the first heat conducting pad 7 is fixedly connected between the first shielding diameter 611 and the second shielding diameter 612 on the upper surface of the first heat radiating layer 61, and the conductive foam 8 surrounds the first shielding diameter 611 and the second shielding diameter 612; bare copper is laid around the main control chip, the upper surface of the conductive foam 8 is connected with the bare copper around the main control chip in an aligned mode, and the main control chip is connected with the first heat conducting pad 7.

In an alternative implementation manner, as shown in fig. 2 and fig. 3, the heat conducting mechanism 62 is an inverted T-shaped heat dissipating member, the heat sink further includes a second heat conducting pad 2 and a heat exchanging plate 1, a lower surface of the inverted T-shaped heat dissipating member is fixedly connected to an upper surface of the second heat conducting pad 2, and a lower surface of the second heat conducting pad 2 is connected to an upper surface of the heat exchanging plate 1; the industrial control equipment also comprises a shell 12, and the lower surface of the heat exchange plate 1 is connected with the inner surface of the shell 12, for example, fixedly connected through a 0.2mm heat conduction double-sided adhesive tape. The first heat dissipation layer 61 and the inverted T-shaped heat dissipation member form an I-shaped electromagnetic shielding heat dissipation member 6, the areas of the horizontal portions at two ends need to be enlarged, the size of the first heat dissipation layer 61 depends on the area of a main control chip, so that the main control chip is enclosed inside a formed cavity, the cross section of the vertical portion is related to the material used by the vertical portion and the heat power of a heat source, the larger the power of the heat source is, the larger the cross sectional area needs to be, the higher the heat conductivity coefficient of the material used by the vertical portion is, and the smaller the cross sectional area is.

In another alternative implementation manner, as shown in fig. 4, the heat conducting mechanism 62 is a heat sink disposed in parallel, the industrial control device further includes a housing 12, and the housing 12 is provided with a louver.

The industrial control equipment further comprises a main control board 9 and a core board 10 installed on the main control board 9, and the main control chip is located on the core board 10.

The radiator further comprises a back plate 11 and fastening components, wherein the back plate 11 is located above the main control board 9, and the electromagnetic shielding and heat dissipation component 6, the main control board 9 and the back plate 11 are sequentially and fixedly connected after penetrating through the fastening components.

The back plate 11 is provided with a group of connection holes 111, the main control plate 9 is provided with corresponding first through holes 92, the first heat dissipation layer 61 is provided with corresponding second through holes 613, and the second through holes 613, the first through holes 92 and the connection holes 111 are aligned and are fixedly connected after being penetrated through by fastening components in sequence.

In some embodiments, the main control chip is located on the lower surface of the core board 10, the main control board 9 is provided with a windowing area 91, the bare copper is laid around the windowing area 91, and the lower surface of the core board 10 is attached to the upper surface of the main control board 9, so that the main control chip is located in the windowing area 91; after the second through hole 613, the first through hole 92 and the connection hole 111 are aligned, the upper surface of the conductive foam 8 is exactly aligned and connected with the bare copper around the windowing region 91.

In other embodiments, the main control chip is located on the lower surface of the core board 10, the upper surface of the core board 10 is connected to the lower surface of the main control board 9 by welding, and the bare copper is laid around the main control chip on the lower surface of the core board 10.

The fastening part comprises a screw 3, a spring 4 and a fastening gasket 5, the spring 4 and the fastening gasket 5 are sequentially sleeved on the screw 3, the screw sleeved with the spring 4 and the fastening gasket 5 sequentially penetrates through the second through hole 613, the first through hole 92 and the connecting hole 111, and fastening connection is performed through a nut. The screw 3 can be plated with nickel by SAE 1018, the spring 4 can be plated with nickel by a piano steel wire, and the fastening gasket 5 can be plated with nickel by SK 7.

The electromagnetic shielding and heat dissipating member 6, the back plate 11 and the heat exchange plate 1 are made of aluminum materials. The electromagnetic shielding heat dissipation part 6 can adopt a rectangular tube aluminum profile A1 6063 with black anode, the back plate 11 can adopt SPCC + SAE1215 nickel plating, and the heat exchange plate 1 can be washed white by using A1 1100. The height of the first shielding diameter 611 and the second shielding diameter 612, the thickness of the conductive foam 8, the thickness of the first heat conducting pad 7, the height of the main control chip, the thickness of the core plate and the thickness of the main control plate are matched with each other, so that the electromagnetic shielding heat dissipation part, the conductive foam and the main control plate form a closed space, and the main control chip is surrounded in the cavity.

In order to achieve a good heat dissipation effect, the heat conductivity coefficient of the material of the first heat conduction pad 7 and the second heat conduction pad 2 is high, for example, a heat conduction silica gel pad, heat conduction silicone grease, heat conduction gel and the like can be used, the thickness, the heat conductivity coefficient, the heat conduction area and the like of the heat conduction pad need to be matched with the power of a heat source, and the heat conductivity coefficient is recommended to be greater than or equal to 5W/(m · K).

As shown in fig. 5, heat emitted from the main control chip on the core board 10 is mainly conducted to the lower surface of the case through the heat sink of the present embodiment.

The utility model provides a radiator of electromagnetic shield function, the method and the way of specifically realizing this technical scheme are many, above only the utility model discloses a detailed implementation should point out, to the ordinary technical personnel of this technical field, do not deviating from the utility model discloses under the prerequisite of principle, can also make a plurality of improvements and moist decorations, these improve and moist decorations should also be regarded as the utility model discloses a scope of protection. All the components not specified in the present embodiment can be realized by the prior art.

Claims

1. The radiator with the electromagnetic shielding function is characterized by being applied to industrial control equipment, wherein the industrial control equipment comprises a main control chip, the radiator comprises conductive foam (8), a first heat-conducting pad (7) and an electromagnetic shielding heat-radiating part (6), the electromagnetic shielding heat-radiating part (6) comprises a first heat-radiating layer (61) and a heat-conducting mechanism (62) which is integrally formed with the lower surface of the first heat-radiating layer (61), a first shielding diameter (611) and a second shielding diameter (612) are arranged on the upper surface of the first heat-radiating layer (61), the first heat-conducting pad (7) is fixedly connected between the first shielding diameter (611) and the second shielding diameter (612) on the upper surface of the first heat-radiating layer (61), and the conductive foam (8) surrounds the first shielding diameter (611) and the second shielding diameter (612); the periphery of the main control chip is paved with bare copper, the upper surface of the conductive foam (8) is connected with the peripheral bare copper of the main control chip in an aligning manner, and the main control chip is connected with the first heat conducting pad (7).

2. The heat sink with electromagnetic shielding function according to claim 1, wherein the heat conducting mechanism (62) is an inverted T-shaped heat dissipating member, the heat sink further comprises a second heat conducting pad (2) and a heat exchanging plate (1), a lower surface of the inverted T-shaped heat dissipating member is fixedly connected with an upper surface of the second heat conducting pad (2), and a lower surface of the second heat conducting pad (2) is connected with an upper surface of the heat exchanging plate (1); the industrial control equipment further comprises a shell (12), and the lower surface of the heat exchange plate (1) is connected with the inner surface of the shell (12).

3. The heat sink with electromagnetic shielding function according to claim 1, wherein the heat conducting mechanism (62) is a parallel arrangement of heat dissipating fins, the industrial control equipment further comprises a housing (12), and a louver is disposed on the housing (12).

4. The heat sink with electromagnetic shielding function according to claim 2 or 3, wherein the industrial control equipment further comprises a main control board (9) and a core board (10) mounted on the main control board (9), and the main control chip is located on the core board (10).

5. The radiator with the electromagnetic shielding function according to claim 4, further comprising a back plate (11) and a fastening component, wherein the back plate (11) is located above the main control board (9), and the electromagnetic shielding heat dissipation component (6), the main control board (9) and the back plate (11) are sequentially penetrated through the fastening component and then fixedly connected.

6. The heat sink with the electromagnetic shielding function according to claim 5, wherein the back plate (11) has a set of connection holes (111), the main control board (9) has a corresponding first through hole (92), the first heat dissipation layer (61) has a corresponding second through hole (613), and the second through hole (613), the first through hole (92) and the connection holes (111) are aligned and sequentially pass through a fastening member for fixing connection.

7. The heat sink with electromagnetic shielding function according to claim 6, wherein the main control chip is located on a lower surface of the core board (10), the main control board (9) is provided with a window area (91), the bare copper is laid around the window area (91), and the lower surface of the core board (10) is attached to an upper surface of the main control board (9), so that the main control chip is located in the window area (91); after the second through hole (613), the first through hole (92) and the connecting hole (111) are aligned, the upper surface of the conductive foam (8) is exactly aligned and connected with the bare copper around the windowing area (91).

8. The heat sink with the electromagnetic shielding function according to claim 7, wherein the fastening component comprises a screw (3), a spring (4) and a fastening gasket (5), the spring (4) and the fastening gasket (5) are sequentially sleeved on the screw (3), and the screw sleeved with the spring (4) and the fastening gasket (5) sequentially penetrates through the second through hole (613), the first through hole (92) and the connecting hole (111) and is fastened and connected through a nut.

9. The heat sink with electromagnetic shielding function according to claim 8, wherein the electromagnetic shielding heat dissipating member (6), the back plate (11) and the heat exchange plate (1) are made of aluminum material; the heights of the first shielding diameter (611) and the second shielding diameter (612), the thickness of the conductive foam (8), the thickness of the first heat conducting pad (7), the height of the main control chip, the thickness of the core board and the thickness of the main control board are matched with each other.

10. The heat sink with electromagnetic shielding function according to claim 6, wherein the main control chip is located on a lower surface of the core board (10), an upper surface of the core board (10) is connected to a lower surface of the main control board (9) by soldering, and the bare copper is laid around the main control chip on the lower surface of the core board (10).