CN201307594Y

CN201307594Y - LED thermal conduction structure

Info

Publication number: CN201307594Y
Application number: CNU2008201805968U
Authority: CN
Inventors: 乔治麦尔; 孙建宏; 陈介平
Original assignee: Celsia Technologies Taiwan Inc
Current assignee: Celsia Technologies Taiwan Inc
Priority date: 2008-10-24
Filing date: 2008-12-04
Publication date: 2009-09-09
Anticipated expiration: 2018-12-04

Abstract

The utility model discloses a LED thermal conduction structure which comprises a temperature-uniforming plate, an insulation layer, a conductive layer and a plurality of LED, wherein the insulation layer covers one surface of the temperature-uniforming plate; the conductive layer is set above the insulation layer and is electronically insulated from the temperature-uniforming plate; the conductive layer is provided with a first electrode and a second electrode; the LED is set on the insulation layer and is provided with a first pin that electrically connects the first electrode and a second pin that electrically connects the second electrode; therefore, the LED thermal conduction structure provided in the utility model is provided with favorable heat conduction and heat yielding effect, and can extend LED service life.

Description

The LED heat conduction structure

Technical field

The utility model relates to a kind of heat conduction structure, relates in particular to the heat conduction structure of a kind of LED.

Background technology

Along with constantly development and progress of science and technology, electronic building brick is more and more towards compact trend development, as light-emitting diode (LED), it is because the plurality of advantages such as life-span, power saving and environmental protection that have good brightness, grow, a large amount of and be widely used on the electronic equipment by manufacturer, yet, influence the most apparent the factor of LED length in useful life, for being provided, these LED can under a operational environment than proper temperature, operate.

As existing LED conductive structure, it mainly comprises a substrate, an insulating barrier, a conductive layer and a plurality of LED; This insulating barrier is formed at a surface of this substrate; This conductive layer is formed on this insulating barrier, and with this substrate electrical isolation, this conductive layer has one first electrode and one second electrode; These LED are located at respectively on this insulating barrier, and this LED has one first pin that is electrically connected this first electrode and one second pin that is electrically connected this second electrode; For this reason, to constitute this LED conductive structure.

When using this LED conductive structure, these LED via this first and second electrifying electrodes after, these LED promptly produce luminous energy and heat energy, its luminous energy then irradiates, heat energy then conducts on this substrate via this insulating barrier, again the heat energy that is produced with these LED of this substrate diversion.

Yet existing LED conductive structure still has following disappearance on reality is used, and is slow and heat-conducting effect is limited because of this substrate heat conduction velocity, influences the heat dissipation of this LED, and can reduce the life-span that this LED uses.

Summary of the invention

A purpose of the present utility model is to provide a kind of LED heat conduction structure, and it can have good heat conduction efficiency by the heat energy that the rapid diversion LED of temperature-uniforming plate is produced, to prolong the useful life of LED.

To achieve the above object, the utility model provides a kind of LED heat conduction structure, is made of a temperature-uniforming plate, an insulating barrier, a conductive layer and a plurality of LED; This insulating barrier is coated in a surface of this temperature-uniforming plate; This conductive layer is laid on this insulating barrier, and with this temperature-uniforming plate electrical isolation, this conductive layer has one first electrode and one second electrode; These LED are located at respectively on this insulating barrier, and this LED has one first pin that is electrically connected this first electrode and one second pin that is electrically connected this second electrode.

Another purpose of the present utility model is to provide a kind of LED heat conduction structure, and it with the heat energy that rapid dissipation LED is produced, can have good heat dissipation by the radiating fin group that is sticked at temperature-uniforming plate, to prolong the useful life of LED.

Beneficial functional of the present utility model is: use the utility model diversion or loose and remove the heat energy that LED produced rapidly, can have good lead, heat dissipation, with the useful life of prolongation LED

Below in conjunction with the drawings and specific embodiments the utility model is described in detail, but not as to qualification of the present utility model.

Description of drawings

Fig. 1 is a perspective exploded view of the present utility model;

Fig. 2 is a three-dimensional combination schematic diagram of the present utility model;

Fig. 3 is the schematic diagram of the 3-3 section of Fig. 2;

Fig. 4 is that of the present utility model another implemented illustration.

Wherein, Reference numeral

10..... temperature-uniforming plate

11..... housing 12..... capillary structure

13..... working fluid

20..... insulating barrier

30..... conductive layer

31..... the first electrode 32....., second electrode

40.....LED

41..... the first pin 42....., second pin

50..... radiating fin group

51..... end face 52..... radiating fin

Embodiment

Relevant detailed description of the present utility model and technology contents, conjunction with figs. is described as follows, however appended graphic reference and the explanation usefulness of only providing not is to be used for the utility model is limited.

See also Fig. 1 to Fig. 3, the utility model LED heat conduction structure is made of a temperature-uniforming plate 10, an insulating barrier 20, a conductive layer 30 and a plurality of LED 40.

This temperature-uniforming plate 10 has a housing 11, be attached at a capillary structure 12 of these housing 11 inside and fill in the working fluid 13 of this housing 11 inside, in addition, this temperature-uniforming plate 10 can have also that to be located in this housing 11 inner and in order to increase a supporter (not shown) of these housing 11 intensity.

This insulating barrier 20 is coated in the surface of this temperature-uniforming plate 10, wherein, this insulating barrier 20 can fabrography be printed on this housing 11 of this temperature-uniforming plate 10 or coats with the gluing technology on this housing 11 of this temperature-uniforming plate 10, but do not exceed with these, and described this insulating barrier 20 can be a heat conductive silica gel or made by an epoxide resin material, and it can provide good heat conduction efficiency.

This conductive layer 30 is laid on this insulating barrier 20, preferably, this conductive layer 30 is laid on this insulating barrier 20 in the mode of high pressure driving fit, and with these temperature-uniforming plate 10 electrical isolation, this conductive layer 30 then has one first electrode 31 and one second electrode 32, this first electrode 31 and these second electrode, 32 non-electric connections, described this conductive layer 30 can be a copper foil circuit or an aluminium foil circuit, and this first electrode 31 then can be respectively anode and negative electrode or negative electrode and anode with this second electrode 32.

These LED40 are located at respectively on this insulating barrier 20, this LED40 has one first pin 41 that is electrically connected this first electrode 31 and one second pin 42 that is electrically connected this second electrode 32, described this first pin 41 can be incorporated into this first electrode 31 and this second electrode 32 by welding manner with this second pin 42, or can surface mount technology (SMT) give affixedly, but do not exceed with these.

When using the utility model, see also Fig. 3, after these LED 40 switch on via this first,

second electrode

31,32, these LED 40 promptly produce luminous energy and heat energy, its luminous energy then irradiates, and heat energy then conducts on this temperature-uniforming plate 10 via this insulating barrier 20, and the heat energy that is produced with this temperature-uniforming plate 10 rapid these LED 40 of diversion, can have good heat conduction efficiency, and can prolong the useful life of LED 40.

See also Fig. 4, for of the present utility model another implemented illustration, the difference of present embodiment and previous embodiment is that the utility model also can comprise a radiating fin group 50 on another surface that is connected this temperature-uniforming plate 10, this radiating fin group 50 is reached by an end face 51 and is constituted from 51 extended a plurality of radiating fins 52 of this end face, 10 of this temperature-uniforming plates are attached on this end face 51, for this reason, the heat energy that is produced with this radiating fin group 50 rapid these LED 40 of dissipation, can have good lead, heat dissipation, and can prolong useful life of LED 40.

In sum, use the utility model diversion or loose and remove the heat energy that LED 40 is produced rapidly, can have good lead, heat dissipation, prolonging the useful life of LED 40, and the disadvantages of solution prior art.

Certainly; the utility model also can have other various embodiments; under the situation that does not deviate from the utility model spirit and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the utility model, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the utility model.

Claims

1. a LED heat conduction structure is characterized in that, comprising:

One temperature-uniforming plate;

One insulating barrier is coated in a surface of this temperature-uniforming plate;

One conductive layer is laid on this insulating barrier, and with this temperature-uniforming plate electrical isolation, this conductive layer has one first electrode and one second electrode; And

A plurality of LED are located at respectively on this insulating barrier, and this LED has one first pin that is electrically connected this first electrode and one second pin that is electrically connected this second electrode.

2. LED heat conduction structure according to claim 1 is characterized in that, this temperature-uniforming plate has for a housing of this insulating barrier coating, is attached at a capillary structure of this enclosure interior and fills in working fluid in this enclosure interior.

3. LED heat conduction structure according to claim 1 is characterized in that, this insulating barrier is the epoxide resin material layer.

4. LED heat conduction structure according to claim 1 is characterized in that, this conductive layer is a copper foil circuit.

5. LED heat conduction structure according to claim 1 is characterized in that, this conductive layer high pressure driving fit mode is laid on this insulating barrier.

6. LED heat conduction structure according to claim 1 is characterized in that, also comprises a radiating fin group on another surface that connects this temperature-uniforming plate.

7. LED heat conduction structure according to claim 1 is characterized in that, this first pin and the weldering of this second pin are connected in this first electrode and this second electrode.

8. LED heat conduction structure according to claim 1 is characterized in that, this first pin and this second pin are fixed in this first electrode and this second electrode with surface mount technology.

9. LED heat conduction structure according to claim 1 is characterized in that, this insulating barrier is printed in this surface of this temperature-uniforming plate with fabrography.

10. LED heat conduction structure according to claim 1 is characterized in that, this insulating barrier is coated this surface of this temperature-uniforming plate with the gluing technology.