CN105627122B - It is a kind of directly using metal heat sink as the LED light source module of positive and negative electrode circuit - Google Patents

It is a kind of directly using metal heat sink as the LED light source module of positive and negative electrode circuit Download PDF

Info

Publication number
CN105627122B
CN105627122B CN201610193265.7A CN201610193265A CN105627122B CN 105627122 B CN105627122 B CN 105627122B CN 201610193265 A CN201610193265 A CN 201610193265A CN 105627122 B CN105627122 B CN 105627122B
Authority
CN
China
Prior art keywords
metallic
circuit
light source
source module
led light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201610193265.7A
Other languages
Chinese (zh)
Other versions
CN105627122A (en
Inventor
朱衡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hunan Photoelectric Technology Co., Ltd.
Original Assignee
Hunan Yuegang Mookray Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hunan Yuegang Mookray Industrial Co Ltd filed Critical Hunan Yuegang Mookray Industrial Co Ltd
Priority to CN201610193265.7A priority Critical patent/CN105627122B/en
Publication of CN105627122A publication Critical patent/CN105627122A/en
Priority claimed from PCT/CN2017/083325 external-priority patent/WO2017167314A1/en
Priority claimed from US15/567,081 external-priority patent/US10168005B2/en
Application granted granted Critical
Publication of CN105627122B publication Critical patent/CN105627122B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89Metals

Abstract

The present invention relates to one kind directly using metal heat sink as the LED light source module of positive and negative electrode circuit, the LED light source module, LED chip is directly fixedly connected on metal heat sink, the good electric conductivity of metal heat sink itself is utilized simultaneously, by radiator piecemeal, according to the needs of circuit design, respectively as circuit positive and negative anodes, chip is connected and is connected, and connect conducting with external circuit and forms complete circuit.Other PCB circuit is added without redesign.The LED light source module greatly facilitates circuit design, reduces production technology, lowers production cost.

Description

It is a kind of directly using metal heat sink as the LED light source module of positive and negative electrode circuit
Technical field
The invention belongs to lighting technical fields, in particular, provide one kind directly using metal heat sink as positive and negative electrode circuit LED light source module.
Background technique
With the development of science and technology, LED solid light source is applied increasingly extensive, is also got over as lighting source Come more.LED light device generally includes radiator, LED chip, pcb board, two electrodes and PCB of LED chip at present Two circuit lands between by conductor wire connect, further, since LED chip especially big figure, high-power LED chip is also There is amount of heat releasing, it is also necessary to LED chip, pcb board, effective thermal coupling between radiator, to realize high efficiency heat radiation.
Summary of the invention
Against the above technical problems, present applicant proposes one kind directly using metal heat sink as the LED of positive and negative electrode circuit Light source module;
The LED light source module includes metallic object an A, the metallic object A by a identical or different shape of n, mutual The small metallic object B (n of insulation>=2) it is connected and fixed composition;
Each small metallic object B surface has the LED chip C of m identical or different quantity(m>=1), adjacent LED core Piece connects in series or in parallel;
Each small metallic object B is equipped with several circuit connection points, in addition to the circuit connection point, the small metal Body B surface is insulation, and the LED chip C, which is directly bonded or welded, to be fixed on the small metallic object B, while having silica gel to cover It covers on chip and its connection circuit;
Each small metallic object B can design several anodes or negative according to the design needs of integrated circuit Pole, with the chip on the small metallic object B using serial or parallel connection or series, parallel mixing by the way of connect, and with it is other Anode or cathode are connected on small metallic object, can also connect with external circuit, complete circuit required for forming one;
Institute is also used as while radiator of the metallic object A being made of several small metallic object B as the LED light source module State the positive and negative electrode circuit of LED light source module.
Wherein, number of chips is symmetrical on every circuit in series or in parallel that chip all on the metallic object A is formed It is uniformly or asymmetric uniform.
Wherein, the metallic object A is equipped with several through-holes or groove or protrusion, as radiate cross-ventilated channel and Increase heat dissipation area or as with external connection fixed bit or circuit connection position.
Since the connection of the good electric conductivity of metal heat sink material, the heat spreader metals module and external circuit does not need list Solely set up conducting wire, by between the piecemeal after dividing metal heat sink insulation Joining Technology processing, radiator Each piecemeal connects conducting directly as the positive and negative electrode of circuit connection.
Detailed description of the invention
Fig. 1 is LED light source module functional schematic of the present invention;
Fig. 2 is the LED light source module structure chart by taking metallic object B 8 small forms cylinder type metal body A as an example;
Fig. 3 is the LED light source module structure chart by taking several small metallic object B form polyhedral metallic object A as an example.
Specific embodiment
Below with reference to Fig. 1,2,3 and specific embodiment technical solution of the present invention is described further.
Such as 1, shown in 2,3:
One metallic object A can be rule or irregular shape, by n identical or different shape, each other insulate Small metallic object B (B1Bn) is connected and fixed composition.
Each small metallic object B surface has the LED chip C of several identical or different quantity(C1···Cn), adjacent Chip connects in series or in parallel.
Several circuit connection points are equipped with per small metallic object B, in addition to circuit connection point, small metal body surface is insulation 's.
Chip C, which is directly bonded or welded, to be fixed on small metallic object B, while having silica gel to be covered on chip and its connection circuit On.
Each small metallic object B can design several anodes or cathode according to the design needs of integrated circuit, with Chip on small metallic object B is connected using serial or parallel connection mode.And be connected with anode or cathode on other small metallic objects, It can be connect with external circuit, complete circuit required for forming one.
As shown in Figure 1, metal B four small constitutes the metallic object A of cylindrical type, LED chip c1, c2 on small metal B1, LED chip c3, c4 on small metal B2, LED chip c5, c6 on small metal B3, LED chip c7, c8 on small metal B4, LED chip c1, c2, c3, c4 series connection, LED chip c5, c6, c7, c8 series connection, then in parallel connection, both ends are respectively positive and negative There are positive B1 in pole, the top surface metallic object A respectively, and the ground cathode B2, positive B3, cathode B4, metallic object A is corresponding with two pairs accordingly Positive and negative electrode.
The upper all chips of the big metallic object A of composition either full string, it is complete simultaneously, first go here and there after and or it is first and after go here and there, they are most It is formed by every circuit in series or in parallel that number of chips is symmetrically and evenly to ensure out the uniform of light eventually, of course for reality It needs, under the premise of power supply power supply meets LED chip and works normally, asymmetric can also be uniformly arranged.
As shown in Fig. 2, LED chip(1), metallic object B 8 small(2)And fixed or circuit connection position(3)According to and Fig. 1 Similar mode combines, and equally constitutes the metallic object A of cylindrical type, if can increase setting to further increase radiating efficiency Dry thermal column(Unused appended drawing reference is shown).
As shown in figure 3, several small metallic object B form polyhedral metallic object A, if composed big metallic object A is equipped with Dry through-hole or groove or protrusion can also be used as and external as cross-ventilated channel and the increase heat dissipation area of radiating The fixation of connection or circuit connection position.
The above is only the preferred embodiment for the present invention.It should be pointed out that the member of ordinary skill for the art comes It says, without departing from the technical principles of the invention, several improvements and modifications can also be made, these improvements and modifications are also answered This is considered as protection scope of the present invention.

Claims (5)

1. one kind is directly using metal heat sink as the LED light source module of positive and negative electrode circuit, it is characterised in that:
The LED light source module includes metallic object an A, the metallic object A by n identical or different shapes, insulation each other Small metallic object B be connected and fixed composition;Each small metallic object B surface has the LED chip C of m identical or different quantity, phase Adjacent LED chip connects in series or in parallel;Wherein, n>=2, m>=1;
Each small metallic object B is equipped with several circuit connection points, in addition to the circuit connection point, the small metallic object B Surface is insulation, and the LED chip C, which is directly bonded or welded, to be fixed on the small metallic object B, while having silica gel to be covered on On chip and its connection circuit;
Each small metallic object B can design several anodes or cathode according to the design needs of integrated circuit, with Chip on the small metallic object B is connected by the way of serial or parallel connection or series, parallel mixing, and with other small metals Anode or cathode are connected on body, can also connect with external circuit, complete circuit required for forming one;
It is also used as while radiator of the metallic object A being made of several small metallic object B as the LED light source module described The positive and negative electrode circuit of LED light source module.
2. LED light source module as described in claim 1, which is characterized in that all chips are formed every on the metallic object A Number of chips is symmetrically and evenly on item circuit in series or in parallel.
3. LED light source module as described in claim 1, which is characterized in that all chips are formed every on the metallic object A Number of chips is asymmetric uniformly on item circuit in series or in parallel.
4. LED light source module as described in claim 1, which is characterized in that the metallic object A is equipped with several through-holes or groove Or protrusion, as cross-ventilated channel and the increase heat dissipation area of radiating.
5. LED light source module as described in claim 1, which is characterized in that the metallic object A is equipped with several through-holes or groove Or protrusion, as with external connection fixation or circuit connection position.
CN201610193265.7A 2016-03-30 2016-03-30 It is a kind of directly using metal heat sink as the LED light source module of positive and negative electrode circuit Active CN105627122B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610193265.7A CN105627122B (en) 2016-03-30 2016-03-30 It is a kind of directly using metal heat sink as the LED light source module of positive and negative electrode circuit

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
CN201610193265.7A CN105627122B (en) 2016-03-30 2016-03-30 It is a kind of directly using metal heat sink as the LED light source module of positive and negative electrode circuit
PCT/CN2017/083325 WO2017167314A1 (en) 2016-03-30 2017-05-05 Modular lamp
US15/567,081 US10168005B2 (en) 2016-03-07 2017-05-05 LED illumination device with arbitrary bending and fixing connector module
RU2017136554A RU2657864C1 (en) 2016-03-07 2017-05-05 Led lighting device
AU2017229070A AU2017229070B2 (en) 2016-03-07 2017-05-05 LED illumination device
PCT/CN2017/083178 WO2017152885A1 (en) 2016-03-07 2017-05-05 Led illumination device
PCT/CN2017/086237 WO2017167316A1 (en) 2016-03-30 2017-05-27 Led light source module directly using metal heat sink as positive/negative electrode circuit

Publications (2)

Publication Number Publication Date
CN105627122A CN105627122A (en) 2016-06-01
CN105627122B true CN105627122B (en) 2018-11-27

Family

ID=56042309

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610193265.7A Active CN105627122B (en) 2016-03-30 2016-03-30 It is a kind of directly using metal heat sink as the LED light source module of positive and negative electrode circuit

Country Status (2)

Country Link
CN (1) CN105627122B (en)
WO (1) WO2017167316A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2657864C1 (en) 2016-03-07 2018-06-18 Хунань Юэган Мукрэй Индастриал Ко., Лтд. Led lighting device
EP3567299A4 (en) * 2016-06-24 2020-01-22 Hunan Yuegang Mookray Industrial Co., Ltd. Led illumination device
CN105627122B (en) * 2016-03-30 2018-11-27 湖南粤港模科实业有限公司 It is a kind of directly using metal heat sink as the LED light source module of positive and negative electrode circuit
WO2017167314A1 (en) * 2016-03-30 2017-10-05 湖南粤港模科实业有限公司 Modular lamp
CN106949443B (en) * 2017-04-25 2019-04-02 湖南粤港模科实业有限公司 A kind of modularized circuit, LED light and modularization lamps and lanterns

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101608779A (en) * 2008-06-18 2009-12-23 林恺玉 The radiator structure of light-emitting component
CN201946597U (en) * 2010-12-31 2011-08-24 浙江天宇灯饰有限公司 LED device based on metal flat radiation with red LED chips

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3998027B2 (en) * 2005-07-25 2007-10-24 松下電工株式会社 Lighting equipment using LED
CN201348233Y (en) * 2009-01-12 2009-11-18 上海三思电子工程有限公司 LED luminous heat radiation body
JP4910023B2 (en) * 2009-08-27 2012-04-04 シャープ株式会社 Light source device
CN201526932U (en) * 2009-11-06 2010-07-14 陈子文 Radiating structure of element of light-emitting diode (LED)
CN101707234A (en) * 2009-11-18 2010-05-12 珠海晟源同泰电子有限公司 LED luminescence module and manufacture method thereof
CN101968213B (en) * 2010-09-10 2012-07-04 谭永生 LED radiator
CN202024264U (en) * 2011-03-31 2011-11-02 合肥艾斯克光电科技有限责任公司 Composite radiator structure of LED lamp
CN102252279B (en) * 2011-04-13 2012-09-26 广州南科集成电子有限公司 Thermoelectric separation-type LED integrated light source plate and manufacturing method thereof
CN102569284B (en) * 2012-03-16 2016-03-30 广东科立盈光电技术有限公司 The LED that New LED luminescence chip and assembling thereof are formed
KR101544907B1 (en) * 2013-07-02 2015-08-17 엘에스엠트론 주식회사 LED lighting apparatus and Connecting structure applied for the same
CN105627122B (en) * 2016-03-30 2018-11-27 湖南粤港模科实业有限公司 It is a kind of directly using metal heat sink as the LED light source module of positive and negative electrode circuit
CN205716464U (en) * 2016-03-30 2016-11-23 朱衡 A kind of directly using metal heat sink as the LED light source module of positive and negative electrode circuit

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101608779A (en) * 2008-06-18 2009-12-23 林恺玉 The radiator structure of light-emitting component
CN201946597U (en) * 2010-12-31 2011-08-24 浙江天宇灯饰有限公司 LED device based on metal flat radiation with red LED chips

Also Published As

Publication number Publication date
CN105627122A (en) 2016-06-01
WO2017167316A1 (en) 2017-10-05

Similar Documents

Publication Publication Date Title
CN105627122B (en) It is a kind of directly using metal heat sink as the LED light source module of positive and negative electrode circuit
CN106208623B (en) Power module
WO2012060545A1 (en) Led array module and manufacturing method thereof
CN105161467B (en) A kind of power module for electric car
CN106972762A (en) Power module
CN201689922U (en) Light-emitting diode radiating device
CN205716464U (en) A kind of directly using metal heat sink as the LED light source module of positive and negative electrode circuit
CN102088017A (en) LED SMD (surface mount type)packaging module
KR20150089609A (en) Power semiconductor module
CN208781834U (en) Radiator structure
CN207831285U (en) A kind of flexibility filament and LED lamp
CN103298246B (en) LED high pressure resistant circuit pcb board and the high voltage bearing circuit connecting method of LED
CN104465594A (en) Rectification component with embedded cooling fins and manufacturing method thereof
CN102544300A (en) LED packaging structure
CN204144252U (en) The sub-LED light emission device of integration excess
CN208587747U (en) A kind of LED patch for being easy to radiate
CN101413651A (en) Sealed type power supply apparatus modularization apparatus
CN203596351U (en) LED-COB (chip on board) light source
CN204029869U (en) The loose heat conduction base plate for packaging of a kind of middle low power LED
CN103647006B (en) A kind of LED-COB light source and preparation method thereof
CN210837798U (en) Deep ultraviolet LED substrate circuit and deep ultraviolet LED light source device
CN207305059U (en) A kind of PCB circuit board of high efficiency and heat radiation multilayer
CN201307594Y (en) LED thermal conduction structure
CN208457905U (en) A kind of radiator structure of circuit of light sources
CN205155595U (en) COB circuit integrated optical source

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20170123

Address after: 247131 Anhui Province, Chizhou city Guichi District Tang Tian Zhen Ba Yi Cun Hill Group No. 25

Applicant after: Zhu Xiangyang

Applicant after: Wen Yanchuan

Applicant after: Ye Chengzhi

Applicant after: Wang Fang

Address before: 246000 Anqing science and Technology Park, Huaining Industrial Park, Anhui, China, No. nine

Applicant before: Zhu Heng

TA01 Transfer of patent application right
TA01 Transfer of patent application right

Effective date of registration: 20170411

Address after: 415106 Dingcheng District, Hunan City, the town of irrigation district

Applicant after: Hunan Photoelectric Technology Co., Ltd.

Address before: 247131 Anhui Province, Chizhou city Guichi District Tang Tian Zhen Ba Yi Cun Hill Group No. 25

Applicant before: Zhu Xiangyang

Applicant before: Wen Yanchuan

Applicant before: Ye Chengzhi

Applicant before: Wang Fang

CB02 Change of applicant information
CB02 Change of applicant information

Address after: 415106 Changde Town, Dingcheng District, Hunan, Hunan, Changde hi tech Industrial Park, Dingcheng Road, Changde science and technology innovation industry park thirteenth

Applicant after: Hunan Hong Kong and Hong Kong Ke Ye Industrial Co., Ltd.

Address before: 415106 Dingcheng District, Hunan City, the town of irrigation district

Applicant before: Hunan Photoelectric Technology Co., Ltd.

GR01 Patent grant
GR01 Patent grant