CN105627122B - It is a kind of directly using metal heat sink as the LED light source module of positive and negative electrode circuit - Google Patents

It is a kind of directly using metal heat sink as the LED light source module of positive and negative electrode circuit Download PDF

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Publication number
CN105627122B
CN105627122B CN201610193265.7A CN201610193265A CN105627122B CN 105627122 B CN105627122 B CN 105627122B CN 201610193265 A CN201610193265 A CN 201610193265A CN 105627122 B CN105627122 B CN 105627122B
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China
Prior art keywords
metallic object
circuit
light source
source module
led light
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CN201610193265.7A
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Chinese (zh)
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CN105627122A (en
Inventor
朱衡
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Hunan Photoelectric Technology Co., Ltd.
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Hunan Yuegang Mookray Industrial Co Ltd
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Priority to CN201610193265.7A priority Critical patent/CN105627122B/en
Publication of CN105627122A publication Critical patent/CN105627122A/en
Priority to PCT/CN2017/083178 priority patent/WO2017152885A1/en
Priority to PCT/CN2017/083325 priority patent/WO2017167314A1/en
Priority to RU2017136554A priority patent/RU2657864C1/en
Priority to AU2017229070A priority patent/AU2017229070B2/en
Priority to US15/567,081 priority patent/US10168005B2/en
Priority to UAA201710278A priority patent/UA121495C2/en
Priority to PCT/CN2017/086237 priority patent/WO2017167316A1/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

The present invention relates to one kind directly using metal heat sink as the LED light source module of positive and negative electrode circuit, the LED light source module, LED chip is directly fixedly connected on metal heat sink, the good electric conductivity of metal heat sink itself is utilized simultaneously, by radiator piecemeal, according to the needs of circuit design, respectively as circuit positive and negative anodes, chip is connected and is connected, and connect conducting with external circuit and forms complete circuit.Other PCB circuit is added without redesign.The LED light source module greatly facilitates circuit design, reduces production technology, lowers production cost.

Description

It is a kind of directly using metal heat sink as the LED light source module of positive and negative electrode circuit
Technical field
The invention belongs to lighting technical fields, in particular, provide one kind directly using metal heat sink as positive and negative electrode circuit LED light source module.
Background technique
With the development of science and technology, LED solid light source is applied increasingly extensive, is also got over as lighting source Come more.LED light device generally includes radiator, LED chip, pcb board, two electrodes and PCB of LED chip at present Two circuit lands between by conductor wire connect, further, since LED chip especially big figure, high-power LED chip is also There is amount of heat releasing, it is also necessary to LED chip, pcb board, effective thermal coupling between radiator, to realize high efficiency heat radiation.
Summary of the invention
Against the above technical problems, present applicant proposes one kind directly using metal heat sink as the LED of positive and negative electrode circuit Light source module；
The LED light source module includes metallic object an A, the metallic object A by a identical or different shape of n, mutual The small metallic object B (n of insulation>=2) it is connected and fixed composition；
Each small metallic object B surface has the LED chip C of m identical or different quantity（m>=1）, adjacent LED core Piece connects in series or in parallel；
Each small metallic object B is equipped with several circuit connection points, in addition to the circuit connection point, the small metal Body B surface is insulation, and the LED chip C, which is directly bonded or welded, to be fixed on the small metallic object B, while having silica gel to cover It covers on chip and its connection circuit；
Each small metallic object B can design several anodes or negative according to the design needs of integrated circuit Pole, with the chip on the small metallic object B using serial or parallel connection or series, parallel mixing by the way of connect, and with it is other Anode or cathode are connected on small metallic object, can also connect with external circuit, complete circuit required for forming one；
Institute is also used as while radiator of the metallic object A being made of several small metallic object B as the LED light source module State the positive and negative electrode circuit of LED light source module.
Wherein, number of chips is symmetrical on every circuit in series or in parallel that chip all on the metallic object A is formed It is uniformly or asymmetric uniform.
Wherein, the metallic object A is equipped with several through-holes or groove or protrusion, as radiate cross-ventilated channel and Increase heat dissipation area or as with external connection fixed bit or circuit connection position.
Since the connection of the good electric conductivity of metal heat sink material, the heat spreader metals module and external circuit does not need list Solely set up conducting wire, by between the piecemeal after dividing metal heat sink insulation Joining Technology processing, radiator Each piecemeal connects conducting directly as the positive and negative electrode of circuit connection.
Detailed description of the invention
Fig. 1 is LED light source module functional schematic of the present invention；
Fig. 2 is the LED light source module structure chart by taking metallic object B 8 small forms cylinder type metal body A as an example；
Fig. 3 is the LED light source module structure chart by taking several small metallic object B form polyhedral metallic object A as an example.
Specific embodiment
Below with reference to Fig. 1,2,3 and specific embodiment technical solution of the present invention is described further.
Such as 1, shown in 2,3：
One metallic object A can be rule or irregular shape, by n identical or different shape, each other insulate Small metallic object B (B1Bn) is connected and fixed composition.
Each small metallic object B surface has the LED chip C of several identical or different quantity（C1···Cn）, adjacent Chip connects in series or in parallel.
Several circuit connection points are equipped with per small metallic object B, in addition to circuit connection point, small metal body surface is insulation 's.
Chip C, which is directly bonded or welded, to be fixed on small metallic object B, while having silica gel to be covered on chip and its connection circuit On.
Each small metallic object B can design several anodes or cathode according to the design needs of integrated circuit, with Chip on small metallic object B is connected using serial or parallel connection mode.And be connected with anode or cathode on other small metallic objects, It can be connect with external circuit, complete circuit required for forming one.
As shown in Figure 1, metal B four small constitutes the metallic object A of cylindrical type, LED chip c1, c2 on small metal B1, LED chip c3, c4 on small metal B2, LED chip c5, c6 on small metal B3, LED chip c7, c8 on small metal B4, LED chip c1, c2, c3, c4 series connection, LED chip c5, c6, c7, c8 series connection, then in parallel connection, both ends are respectively positive and negative There are positive B1 in pole, the top surface metallic object A respectively, and the ground cathode B2, positive B3, cathode B4, metallic object A is corresponding with two pairs accordingly Positive and negative electrode.
The upper all chips of the big metallic object A of composition either full string, it is complete simultaneously, first go here and there after and or it is first and after go here and there, they are most It is formed by every circuit in series or in parallel that number of chips is symmetrically and evenly to ensure out the uniform of light eventually, of course for reality It needs, under the premise of power supply power supply meets LED chip and works normally, asymmetric can also be uniformly arranged.
As shown in Fig. 2, LED chip（1）, metallic object B 8 small（2）And fixed or circuit connection position（3）According to and Fig. 1 Similar mode combines, and equally constitutes the metallic object A of cylindrical type, if can increase setting to further increase radiating efficiency Dry thermal column（Unused appended drawing reference is shown）.
As shown in figure 3, several small metallic object B form polyhedral metallic object A, if composed big metallic object A is equipped with Dry through-hole or groove or protrusion can also be used as and external as cross-ventilated channel and the increase heat dissipation area of radiating The fixation of connection or circuit connection position.
The above is only the preferred embodiment for the present invention.It should be pointed out that the member of ordinary skill for the art comes It says, without departing from the technical principles of the invention, several improvements and modifications can also be made, these improvements and modifications are also answered This is considered as protection scope of the present invention.

Claims (5)

1. one kind is directly using metal heat sink as the LED light source module of positive and negative electrode circuit, it is characterised in that：
The LED light source module includes metallic object an A, the metallic object A by n identical or different shapes, insulation each other Small metallic object B be connected and fixed composition；Each small metallic object B surface has the LED chip C of m identical or different quantity, phase Adjacent LED chip connects in series or in parallel；Wherein, n>=2, m>=1；
Each small metallic object B is equipped with several circuit connection points, in addition to the circuit connection point, the small metallic object B Surface is insulation, and the LED chip C, which is directly bonded or welded, to be fixed on the small metallic object B, while having silica gel to be covered on On chip and its connection circuit；
Each small metallic object B can design several anodes or cathode according to the design needs of integrated circuit, with Chip on the small metallic object B is connected by the way of serial or parallel connection or series, parallel mixing, and with other small metals Anode or cathode are connected on body, can also connect with external circuit, complete circuit required for forming one；
It is also used as while radiator of the metallic object A being made of several small metallic object B as the LED light source module described The positive and negative electrode circuit of LED light source module.
2. LED light source module as described in claim 1, which is characterized in that all chips are formed every on the metallic object A Number of chips is symmetrically and evenly on item circuit in series or in parallel.
3. LED light source module as described in claim 1, which is characterized in that all chips are formed every on the metallic object A Number of chips is asymmetric uniformly on item circuit in series or in parallel.
4. LED light source module as described in claim 1, which is characterized in that the metallic object A is equipped with several through-holes or groove Or protrusion, as cross-ventilated channel and the increase heat dissipation area of radiating.
5. LED light source module as described in claim 1, which is characterized in that the metallic object A is equipped with several through-holes or groove Or protrusion, as with external connection fixation or circuit connection position.
CN201610193265.7A 2016-03-07 2016-03-30 It is a kind of directly using metal heat sink as the LED light source module of positive and negative electrode circuit Active CN105627122B (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
CN201610193265.7A CN105627122B (en) 2016-03-30 2016-03-30 It is a kind of directly using metal heat sink as the LED light source module of positive and negative electrode circuit
AU2017229070A AU2017229070B2 (en) 2016-03-07 2017-05-05 LED illumination device
PCT/CN2017/083325 WO2017167314A1 (en) 2016-03-30 2017-05-05 Modular lamp
RU2017136554A RU2657864C1 (en) 2016-03-07 2017-05-05 Led lighting device
PCT/CN2017/083178 WO2017152885A1 (en) 2016-03-07 2017-05-05 Led illumination device
US15/567,081 US10168005B2 (en) 2016-03-07 2017-05-05 LED illumination device with arbitrary bending and fixing connector module
UAA201710278A UA121495C2 (en) 2016-03-07 2017-05-05 Led illumination device
PCT/CN2017/086237 WO2017167316A1 (en) 2016-03-30 2017-05-27 Led light source module directly using metal heat sink as positive/negative electrode circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610193265.7A CN105627122B (en) 2016-03-30 2016-03-30 It is a kind of directly using metal heat sink as the LED light source module of positive and negative electrode circuit

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CN105627122A CN105627122A (en) 2016-06-01
CN105627122B true CN105627122B (en) 2018-11-27

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WO (1) WO2017167316A1 (en)

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Publication number Priority date Publication date Assignee Title
RU2657864C1 (en) 2016-03-07 2018-06-18 Хунань Юэган Мукрэй Индастриал Ко., Лтд. Led lighting device
CN105627122B (en) * 2016-03-30 2018-11-27 湖南粤港模科实业有限公司 It is a kind of directly using metal heat sink as the LED light source module of positive and negative electrode circuit
WO2017167314A1 (en) * 2016-03-30 2017-10-05 湖南粤港模科实业有限公司 Modular lamp
EP3567299A4 (en) * 2016-06-24 2020-01-22 Hunan Yuegang Mookray Industrial Co., Ltd. Led illumination device
CN106949443B (en) * 2017-04-25 2019-04-02 湖南粤港模科实业有限公司 A kind of modularized circuit, LED light and modularization lamps and lanterns
CN107202259A (en) * 2017-07-14 2017-09-26 湖南粤港模科实业有限公司 A kind of modularization ball steeps illuminator
CN110388613A (en) * 2019-08-28 2019-10-29 东莞好拍档光电科技有限公司 Negative conductive integral LED car light

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CN101608779A (en) * 2008-06-18 2009-12-23 林恺玉 The radiator structure of light-emitting component
CN201946597U (en) * 2010-12-31 2011-08-24 浙江天宇灯饰有限公司 LED device based on metal flat radiation with red LED chips

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JP3998027B2 (en) * 2005-07-25 2007-10-24 松下電工株式会社 Lighting equipment using LED
CN201348233Y (en) * 2009-01-12 2009-11-18 上海三思电子工程有限公司 LED luminous heat radiation body
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CN202024264U (en) * 2011-03-31 2011-11-02 合肥艾斯克光电科技有限责任公司 Composite radiator structure of LED lamp
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KR101544907B1 (en) * 2013-07-02 2015-08-17 엘에스엠트론 주식회사 LED lighting apparatus and Connecting structure applied for the same
CN105627122B (en) * 2016-03-30 2018-11-27 湖南粤港模科实业有限公司 It is a kind of directly using metal heat sink as the LED light source module of positive and negative electrode circuit
CN205716464U (en) * 2016-03-30 2016-11-23 朱衡 A kind of directly using metal heat sink as the LED light source module of positive and negative electrode circuit

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CN101608779A (en) * 2008-06-18 2009-12-23 林恺玉 The radiator structure of light-emitting component
CN201946597U (en) * 2010-12-31 2011-08-24 浙江天宇灯饰有限公司 LED device based on metal flat radiation with red LED chips

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Address after: 247131 Anhui Province, Chizhou city Guichi District Tang Tian Zhen Ba Yi Cun Hill Group No. 25

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Applicant after: Wang Fang

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Effective date of registration: 20170411

Address after: 415106 Dingcheng District, Hunan City, the town of irrigation district

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Address before: 247131 Anhui Province, Chizhou city Guichi District Tang Tian Zhen Ba Yi Cun Hill Group No. 25

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