CN215073143U - High-efficient radiating multilayer circuit board - Google Patents
High-efficient radiating multilayer circuit board Download PDFInfo
- Publication number
- CN215073143U CN215073143U CN202121495270.6U CN202121495270U CN215073143U CN 215073143 U CN215073143 U CN 215073143U CN 202121495270 U CN202121495270 U CN 202121495270U CN 215073143 U CN215073143 U CN 215073143U
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- China
- Prior art keywords
- heat
- heat conduction
- circuit board
- prepreg
- copper foil
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003292 glue Substances 0.000 claims abstract description 42
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 49
- 239000011889 copper foil Substances 0.000 claims description 38
- 239000011241 protective layer Substances 0.000 claims description 18
- 230000017525 heat dissipation Effects 0.000 claims description 7
- 239000011247 coating layer Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 10
- 230000005855 radiation Effects 0.000 abstract description 4
- 230000005540 biological transmission Effects 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 27
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 239000000758 substrate Substances 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Images
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses a high-efficient radiating multilayer circuit board, including the circuit board main part, the edge of circuit board main part is provided with the heat conduction frame, contain first basic unit and second basic unit in the structure of circuit board main part, the top of first basic unit is provided with first prepreg, the bottom of second basic unit is provided with the second prepreg. A high-efficient radiating multilayer circuit board, glue through first heat conduction respectively between each layer, the second is heat-conducting to glue, the third is heat-conducting to glue, the fourth is heat-conducting to glue, the fifth is heat-conducting to glue and is spliced fixedly with the sixth is heat-conducting to glue, make and possess good heat-conducting ability between each layer, the middle level adopts the heat conduction net, heat transfer to heat conduction net, heat conduction net is again to the transmission all around with the heat, transmit to heat conduction frame, at last by fin conduction to outside, heat radiation structure is rationally distributed, and the heat transfer effect is excellent, thereby increase substantially the radiating effect, bring better user prospect.
Description
Technical Field
The utility model relates to a multilayer circuit board field, in particular to high-efficient radiating multilayer circuit board.
Background
The multilayer wiring board is generally produced by patterning an inner layer, forming a single-sided or double-sided substrate by printing and etching, placing the substrate between designated layers, heating, pressing, and bonding, and drilling holes in the substrate in the same manner as in the through-hole plating method for the double-sided substrate.
The existing multilayer circuit board has certain disadvantages when in use, the heat dissipation effect is general, when the heat is too high, the operation of an electronic element mounted on the multilayer circuit board is easily influenced, meanwhile, the adverse phenomena of bulging, deformation and the like of partial layers can be caused, the layer is locally separated from other layers, and the multilayer circuit board cannot work normally.
SUMMERY OF THE UTILITY MODEL
A primary object of the present invention is to provide a high-efficient heat dissipation multilayer circuit board, which can effectively solve the problems in the background art.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a high-efficient radiating multilayer circuit board, includes the circuit board main part, the edge of circuit board main part is provided with the heat conduction frame, contain first basic unit and second basic unit in the structure of circuit board main part, the top of first basic unit is provided with first prepreg, the bottom of second basic unit is provided with the second prepreg, the top of first prepreg is provided with first copper foil, the bottom of second prepreg is provided with the second copper foil, the top of first copper foil is provided with first printing protective layer, the bottom of second copper foil is provided with second printing protective layer.
Preferably, be provided with first heat conduction glue between first basic unit and the first prepreg, the top of first basic unit is through the bottom fixed connection of first heat conduction glue with first prepreg, be provided with second heat conduction glue between second basic unit and the second prepreg, the lower part of second basic unit passes through the top fixed connection of second heat conduction glue with the second prepreg.
Preferably, a third heat-conducting glue is arranged between the first prepreg and the first copper foil, the top of the first prepreg is fixedly connected with the bottom of the first copper foil through the third heat-conducting glue, a fourth heat-conducting glue is arranged between the second prepreg and the second copper foil, and the bottom of the second prepreg is fixedly connected with the bottom of the second copper foil through the fourth heat-conducting glue.
Preferably, a fifth heat-conducting adhesive is arranged between the first copper foil and the first printing protective layer, the top of the first copper foil is fixedly connected with the bottom of the first printing protective layer through the fifth heat-conducting adhesive, a sixth heat-conducting adhesive is arranged between the second copper foil and the second printing protective layer, and the bottom of the second copper foil is fixedly connected with the bottom of the second printing protective layer through the sixth heat-conducting adhesive.
Preferably, a heat conduction net is fixedly installed between the first base layer and the second base layer, the peripheral outer edges of the heat conduction net are fixedly connected with the peripheral inner edges of the heat conduction frame, and fins are fixedly installed on the peripheral outer edges of the heat conduction frame.
Preferably, the heat conduction frame, the fins and the heat conduction net are all made of copper, and the heat conduction frame, the fins and the heat conduction net are all provided with insulating coating layers.
Compared with the prior art, the utility model discloses following beneficial effect has: this high-efficient radiating multilayer circuit board, glue through first heat conduction respectively between each layer, the second heat conduction glues, the third heat conduction glues, the fourth heat conduction glues, the fifth heat conduction glues and bonds fixedly with the sixth heat conduction glue, make to possess good heat conductivility between each layer, middle level adopts the heat conduction net, heat transfer to heat conduction net, the heat conduction net is again with the heat to transmission all around, transmit to heat conduction frame, at last by fin conduction to outside, the heat radiation structure is rationally distributed, and the heat transfer effect is excellent, thereby greatly improve the radiating effect, do benefit to people and use, the whole structure is simple, high operation convenience is realized, the effect of using is better for traditional mode.
Drawings
Fig. 1 is a front view of the high-efficient heat dissipation multilayer circuit board of the present invention.
Fig. 2 is a schematic structural diagram of a circuit board main body in a high-efficiency heat-dissipation multilayer circuit board of the present invention.
Fig. 3 is a schematic structural view of a heat conducting net in a multi-layer circuit board with high heat dissipation efficiency.
In the figure: 1. a circuit board main body; 2. a heat conducting frame; 3. a fin; 4. a thermally conductive mesh; 5. a first base layer; 6. a second base layer; 7. a first semi-cured sheet; 8. a second prepreg; 9. a first copper foil; 10. a second copper foil; 11. a first printing protective layer; 12. a second printing protective layer; 13. and an insulating coating layer.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
As shown in fig. 1 to 3, a multilayer circuit board with high heat dissipation efficiency includes a circuit board main body 1, a heat conducting frame 2 is disposed at an edge of the circuit board main body 1, the circuit board main body 1 includes a first base layer 5 and a second base layer 6, a first prepreg 7 is disposed on a top of the first base layer 5, a second prepreg 8 is disposed on a bottom of the second base layer 6, a first copper foil 9 is disposed on a top of the first prepreg 7, a second copper foil 10 is disposed on a bottom of the second prepreg 8, a first printing protection layer 11 is disposed on a top of the first copper foil 9, and a second printing protection layer 12 is disposed on a bottom of the second copper foil 10.
Furthermore, a first heat-conducting glue is arranged between the first base layer 5 and the first semi-cured sheet 7, the top of the first base layer 5 is fixedly connected with the bottom of the first semi-cured sheet 7 through the first heat-conducting glue, a second heat-conducting glue is arranged between the second base layer 6 and the second semi-cured sheet 8, and the lower portion of the second base layer 6 is fixedly connected with the top of the second semi-cured sheet 8 through the second heat-conducting glue, so that good heat-conducting capacity is achieved between each layer.
Furthermore, a third heat-conducting glue is arranged between the first prepreg 7 and the first copper foil 9, the top of the first prepreg 7 is fixedly connected with the bottom of the first copper foil 9 through the third heat-conducting glue, a fourth heat-conducting glue is arranged between the second prepreg 8 and the second copper foil 10, and the bottom of the second prepreg 8 is fixedly connected with the bottom of the second copper foil 10 through the fourth heat-conducting glue, so that each layer has good heat-conducting capacity.
Furthermore, a fifth heat-conducting adhesive is arranged between the first copper foil 9 and the first printing protective layer 11, the top of the first copper foil 9 is fixedly connected with the bottom of the first printing protective layer 11 through the fifth heat-conducting adhesive, a sixth heat-conducting adhesive is arranged between the second copper foil 10 and the second printing protective layer 12, and the bottom of the second copper foil 10 is fixedly connected with the bottom of the second printing protective layer 12 through the sixth heat-conducting adhesive, so that good heat-conducting capacity is achieved between each layer.
Further, fixed mounting has heat conduction net 4 between first basic unit 5 and the second basic unit 6, the outside edge all around of heat conduction net 4 all with heat conduction frame 2 inside edge fixed connection all around, the outside edge all around of heat conduction frame 2 all fixed mounting has fin 3, the middle level adopts heat conduction net 4, heat transfer to heat conduction net 4, heat conduction net 4 is again to heat transfer all around, transfer to heat conduction frame 2, at last by fin 3 conduction to outside, the heat radiation structure is rationally distributed, and the heat transfer effect is excellent, thereby the radiating effect is greatly improved.
Further, the heat conduction frame 2, the fins 3 and the heat conduction net 4 are made of copper, and the heat conduction frame 2, the fins 3 and the heat conduction net 4 are all provided with insulating coating layers 13, so that the heat conduction frame 2, the fins 3 and the heat conduction net 4 are prevented from participating in signal transmission.
What need to explain, the utility model relates to a high-efficient radiating multilayer circuit board, glue through first heat conduction respectively between each layer in the 1 structure of circuit board main part, the second heat conduction is glued, the third heat conduction is glued, the fourth heat conduction is glued, the fifth heat conduction is glued fixedly with the bonding of sixth heat conduction glue, make and possess good heat conductivility between each layer, middle level adopts heat conduction net 4, heat transfer is to heat conduction net 4, heat conduction net 4 is again with the heat to transmission all around, transmit to heat conduction frame 2, at last by fin 3 conduction to outside, the heat radiation structure is rationally distributed, and the heat transfer effect is excellent, thereby increase substantially the radiating effect, and is comparatively practical.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. The utility model provides a high-efficient radiating multilayer circuit board, includes circuit board main part (1), its characterized in that: the edge of circuit board main part (1) is provided with heat conduction frame (2), contain first basic unit (5) and second basic unit (6) in the structure of circuit board main part (1), the top of first basic unit (5) is provided with first prepreg (7), the bottom of second basic unit (6) is provided with second prepreg (8), the top of first prepreg (7) is provided with first copper foil (9), the bottom of second prepreg (8) is provided with second copper foil (10), the top of first copper foil (9) is provided with first printing protective layer (11), the bottom of second copper foil (10) is provided with second printing protective layer (12).
2. A multilayer circuit board for dissipating heat efficiently according to claim 1, wherein: be provided with first heat conduction glue between first basic unit (5) and first prepreg (7), the bottom fixed connection of first heat conduction glue and first prepreg (7) is passed through at the top of first basic unit (5), be provided with second heat conduction glue between second basic unit (6) and second prepreg (8), the low portion of second basic unit (6) is through the top fixed connection of second heat conduction glue and second prepreg (8).
3. A multilayer circuit board for dissipating heat efficiently according to claim 1, wherein: the novel prepreg is characterized in that a third heat-conducting glue is arranged between the first prepreg (7) and the first copper foil (9), the top of the first prepreg (7) is fixedly connected with the bottom of the first copper foil (9) through the third heat-conducting glue, a fourth heat-conducting glue is arranged between the second prepreg (8) and the second copper foil (10), and the bottom of the second prepreg (8) is fixedly connected with the bottom of the second copper foil (10) through the fourth heat-conducting glue.
4. A multilayer circuit board for dissipating heat efficiently according to claim 1, wherein: a fifth heat-conducting glue is arranged between the first copper foil (9) and the first printing protective layer (11), the top of the first copper foil (9) is fixedly connected with the bottom of the first printing protective layer (11) through the fifth heat-conducting glue, a sixth heat-conducting glue is arranged between the second copper foil (10) and the second printing protective layer (12), and the bottom of the second copper foil (10) is fixedly connected with the bottom of the second printing protective layer (12) through the sixth heat-conducting glue.
5. A multilayer circuit board for dissipating heat efficiently according to claim 1, wherein: fixed mounting has heat conduction net (4) between first basic unit (5) and second basic unit (6), the outside edge all around of heat conduction net (4) all with the inboard edge fixed connection all around of heat conduction frame (2), the outside edge all around of heat conduction frame (2) all fixed mounting has fin (3).
6. The multilayer circuit board with high heat dissipation efficiency of claim 5, wherein: the heat conduction frame (2), the fins (3) and the heat conduction net (4) are all made of copper, and the heat conduction frame (2), the fins (3) and the heat conduction net (4) are all provided with insulating coating layers (13).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121495270.6U CN215073143U (en) | 2021-07-02 | 2021-07-02 | High-efficient radiating multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121495270.6U CN215073143U (en) | 2021-07-02 | 2021-07-02 | High-efficient radiating multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215073143U true CN215073143U (en) | 2021-12-07 |
Family
ID=79226950
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121495270.6U Expired - Fee Related CN215073143U (en) | 2021-07-02 | 2021-07-02 | High-efficient radiating multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215073143U (en) |
-
2021
- 2021-07-02 CN CN202121495270.6U patent/CN215073143U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20211207 |