CN216930407U - Build-up double-layer circuit design aluminum copper substrate - Google Patents
Build-up double-layer circuit design aluminum copper substrate Download PDFInfo
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- CN216930407U CN216930407U CN202122949751.6U CN202122949751U CN216930407U CN 216930407 U CN216930407 U CN 216930407U CN 202122949751 U CN202122949751 U CN 202122949751U CN 216930407 U CN216930407 U CN 216930407U
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Abstract
The utility model discloses a build-up double-layer circuit design aluminum copper substrate and a production process thereof, and the structure comprises: the flexible printed circuit board is connected with the hard board through the middle adhesive layer, and the solder paste printing is connected with the flexible printed circuit board and the hard board. Wherein, flexible line way board includes: the single-sided copper-clad plate comprises a single-sided copper-clad plate, a copper foil surface, a protective film, an assembling hole and a first bonding pad. Compared with the prior art, the utility model realizes the requirement of double-sided wiring, can cancel the mode of drilling and copper plating, reduces the production cost, improves the product quality and reduces the pollution of the processing process to the environment.
Description
Technical Field
The utility model relates to the field of electronics, in particular to a build-up type double-layer circuit design aluminum copper substrate and a production process thereof.
Background
The technology of the LED car lamp is mature day by day, the aluminum-based copper substrate of the heat conduction substrate required by the car lamp is applied more and more widely, the actual demand of the product cannot be met due to the fact that the requirement of the performance of an electronic appliance is improved and single-side wiring is improved, the application of the double-layer aluminum-based copper substrate is increased step by step, the existing process adopts a double-layer copper foil and a mode of drilling and chemical copper plating to meet the demand of an integral double-side wire through an in-hole copper layer, the process is high in complexity, particularly the aluminum-based copper plating needs to adopt partial reducing agents, the yield is low, and the whole environment is polluted greatly by a copper plating mode.
In order to solve the above problems, we have made a series of improvements.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to an aluminum-copper substrate with build-up dual-layer circuit design, which overcomes the above-mentioned disadvantages and shortcomings of the prior art.
Build double-deck circuit design aluminium copper base plate of layer-stepping includes: the lower part of the flexible circuit board is connected with the hard board through the middle adhesive layer, and the solder paste printing is connected with the flexible circuit board and the hard board;
wherein, the flexible wiring board includes: the single-sided copper-clad plate comprises a single-sided copper-clad plate, a copper foil surface, a protective film, an assembly hole and a first bonding pad, wherein the copper foil surface is connected with the single-sided copper-clad plate, the protective film is connected with the surface of the copper foil surface, the assembly hole is formed in the copper foil surface, and the first bonding pad is connected with the single-sided copper-clad plate.
Further, a second bonding pad is arranged on the hard board, and the hard board is connected with the flexible circuit board through the second bonding pad.
Further, the intermediate glue layer is a prepreg or an AD glue.
The utility model has the beneficial effects that:
compared with the prior art, the utility model realizes the requirement of double-sided wiring, can cancel a drilling and copper plating mode, reduces the production cost, improves the product quality and reduces the pollution to the environment in the processing process.
Description of the drawings:
FIG. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a rear view of the flexible wiring board of the present invention.
Fig. 3 is a front view of the flexible wiring board of the present invention.
Reference numerals:
the flexible circuit board 100, the single-sided copper-clad plate 110, the copper foil surface 120, the protective film 130, the assembly hole 140 and the first pad 150.
A hard plate 200, a second pad 210, an intermediate glue layer 300, and a solder paste print 400.
Detailed Description
The present invention will be further described with reference to the following examples. It should be understood that the following examples are illustrative only and are not intended to limit the scope of the present invention.
Example 1
FIG. 1 is a schematic structural diagram of the present invention. Fig. 2 is a rear view of the flexible wiring board of the present invention. Fig. 3 is a front view of the flexible wiring board of the present invention.
As shown in fig. 1 to 3, the build-up type double layer circuit design aluminum copper substrate includes: the flexible printed circuit board comprises a flexible printed circuit board 100, a hard board 200, an intermediate glue layer 300 and a solder paste printing 400, wherein the lower part of the flexible printed circuit board 100 is connected with the hard board 200 through the intermediate glue layer 300, and the solder paste printing 400 is connected with the flexible printed circuit board 100 and the hard board 200;
the flexible wiring board 100 includes: the single-sided copper-clad plate comprises a single-sided copper-clad plate 110, a copper foil surface 120, a protective film 130, an assembly hole 140 and a first bonding pad 150, wherein the copper foil surface 120 is connected with the single-sided copper-clad plate 110, the protective film 130 is connected with the surface of the copper foil surface 120, the assembly hole 140 is formed in the copper foil surface 120, and the first bonding pad 150 is connected with the single-sided copper-clad plate 110.
The hard board 200 is provided with a second bonding pad 210, and the hard board 200 is connected to the flexible circuit board 100 through the second bonding pad 210.
The intermediate adhesive layer 300 is a prepreg or AD adhesive.
The working principle of the utility model is that the single-sided copper-clad plate 110 is cut into the makeup size of the printed circuit board according to the preset size, a lead line is manufactured on the corresponding copper foil surface 120 by adopting the traditional printed circuit board pattern transfer mode, then the protective film 130 is attached, and the assembling hole 140 is punched. And (3) hollowing the position which needs to be electrically connected with the hard board 200 area by adopting a laser cutting or mechanical cutting mode, manufacturing the appearance, jointing the flexible protective film 130, and hollowing the position which needs to be connected with the hard board 200 by adopting laser cutting. The hard board 200 is made of a combined material which can be a copper substrate, an aluminum substrate, a thermoelectric separation copper substrate or an FR4 substrate, the positions of pads are preset on the hard board 200 and the flexible circuit board 100 during circuit manufacturing, the pads are set, and the positions needing welding parts are exposed to be shielded by ink at the other positions through solder resist contraposition exposure. The middle adhesive layer 300 is cut into a required size by laser cutting or mechanical cutting, and then combined with the back of the flexible circuit board 100 after cutting, the flexible circuit board 100 is sequentially combined with the middle adhesive layer 300 and the hard board 200, the combination mode is a top layer flexible circuit board 100, a middle layer prepreg or AD glue, the bottom layer is the hard board 200, then the three layers are connected in a press fit mode through the multilayer circuit board, and the press fit condition depends on the middle adhesive layer 300. Finally, the flexible circuit board 100 and the bottom hard board 200 are electrically connected through the solder paste printing 400, and the other preset pads of the flexible circuit board 100 can realize the multi-layer function.
Through the improvement of the process, a drilling and copper plating mode is cancelled, but no castration is carried out, so that the production cost is reduced, the product quality is improved, and the pollution of the processing process to the environment is reduced.
While the present invention has been described with reference to the specific embodiments, the present invention is not limited thereto, and various changes may be made without departing from the spirit of the present invention.
Claims (3)
1. Build double-deck circuit design aluminium copper base plate of layer-stepping, its characterized in that includes: the flexible printed circuit board comprises a flexible printed circuit board (100), a hard board (200), an intermediate glue layer (300) and a solder paste printing (400), wherein the lower part of the flexible printed circuit board (100) is connected with the hard board (200) through the intermediate glue layer (300), and the solder paste printing (400) is connected with the flexible printed circuit board (100) and the hard board (200);
wherein the flexible wiring board (100) comprises: the copper-clad plate comprises a single-sided copper-clad plate (110), a copper foil surface (120), a protective film (130), an assembly hole (140) and a first bonding pad (150), wherein the copper foil surface (120) is connected with the single-sided copper-clad plate (110), the protective film (130) is connected with the surface of the copper foil surface (120), the assembly hole (140) is formed in the copper foil surface (120), and the first bonding pad (150) is connected with the single-sided copper-clad plate (110).
2. The build-up dual layer circuit design aluminum-copper substrate of claim 1, wherein: and a second bonding pad (210) is arranged on the hard board (200), and the hard board (200) is connected with the flexible circuit board (100) through the second bonding pad (210).
3. The layer-built two-layer circuit design aluminum-copper substrate of claim 1, wherein: the middle glue layer (300) is a prepreg or AD glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122949751.6U CN216930407U (en) | 2021-11-29 | 2021-11-29 | Build-up double-layer circuit design aluminum copper substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122949751.6U CN216930407U (en) | 2021-11-29 | 2021-11-29 | Build-up double-layer circuit design aluminum copper substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216930407U true CN216930407U (en) | 2022-07-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122949751.6U Active CN216930407U (en) | 2021-11-29 | 2021-11-29 | Build-up double-layer circuit design aluminum copper substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216930407U (en) |
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2021
- 2021-11-29 CN CN202122949751.6U patent/CN216930407U/en active Active
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| TR01 | Transfer of patent right |
Effective date of registration: 20221128 Address after: 314001 Room 316, Building 1, No. 70, Yubei Street, Yuxin Town, Nanhu District, Jiaxing City, Zhejiang Province Patentee after: Jiaxing Wenliang Electronic Technology Co.,Ltd. Address before: No. 1168, Xinda Road, Qingpu District, Shanghai, 201799 Patentee before: SHANGHAI WLCP ELECTRICAL & TECHNOLOGY Co.,Ltd. |