CN216820529U - Anti-interference electromagnetic shielding film - Google Patents
Anti-interference electromagnetic shielding film Download PDFInfo
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- CN216820529U CN216820529U CN202220473774.6U CN202220473774U CN216820529U CN 216820529 U CN216820529 U CN 216820529U CN 202220473774 U CN202220473774 U CN 202220473774U CN 216820529 U CN216820529 U CN 216820529U
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Abstract
The utility model relates to the technical field of electromagnetic shielding films, in particular to an anti-interference electromagnetic shielding film, which comprises a first conducting layer, a second conducting layer arranged below the first conducting layer, a release film layer arranged below the second conducting layer, an outer shielding layer arranged on the first conducting layer, and a heat dissipation layer sprayed on the outer shielding layer; in practical application, the heat dissipation layer can effectively dissipate heat of the flexible circuit board; the outer shielding layer can shield electromagnetic interference of the outside to the flexible circuit board; the shielding performance of the anti-interference electromagnetic shielding film is improved through the first conducting layer and the second conducting layer, and the flexible circuit board is prevented from interfering the outside; the flexible printed circuit board has good anti-interference and electromagnetic shielding effects and good heat dissipation effect, and effectively prolongs the service life of the flexible printed circuit board.
Description
Technical Field
The utility model relates to the technical field of electromagnetic shielding films, in particular to an anti-interference electromagnetic shielding film.
Background
In recent years, in order to prevent the electronic machine from performing malfunction due to the interference of electromagnetic waves received from the outside or the interference of electromagnetic waves received between the internal electronic components, an electromagnetic shielding film is often used to cover the flexible circuit board (abbreviated as FPC) to protect the flexible circuit board from the external EMI and reduce the interference of the flexible circuit board itself to the outside; however, the flexible circuit board can emit a large amount of heat in the use process, the existing anti-interference electromagnetic shielding film only has the electromagnetic shielding effect, the heat inside the flexible circuit board cannot be led out, and the service life of the flexible circuit board is seriously influenced.
SUMMERY OF THE UTILITY MODEL
The utility model aims to overcome the defects, and provides the anti-interference electromagnetic shielding film which has good anti-interference and electromagnetic shielding effects, also has a good heat dissipation effect, and effectively prolongs the service life of the flexible circuit board.
In order to achieve the purpose, the utility model adopts the following technical scheme:
an anti-interference electromagnetic shielding film comprises a first conducting layer, a second conducting layer arranged below the first conducting layer, a release film layer arranged below the second conducting layer, an outer shielding layer arranged on the first conducting layer, and a heat dissipation layer sprayed on the outer shielding layer.
Further, the first conductive layer is a first conductive grid, and the first conductive grid comprises a grid-shaped first groove and a first conductive material filled in the first groove; the second conductive layer is a second conductive grid, and the second conductive grid comprises a grid-shaped second groove and a second conductive material filled in the second groove.
Further, the depth and width of the first trench are not equal to the depth and width of the second trench, and the first conductive material is different from the second conductive material.
Further, the outer shielding layer is a copper foil film, and the thickness range of the copper foil film is 15-20 μm.
Further, the heat dissipation layer is made of thermal radiation paint by spraying.
The utility model has the beneficial effects that:
in practical application, the heat dissipation layer can effectively dissipate heat of the flexible circuit board; the outer shielding layer can shield electromagnetic interference of the outside to the flexible circuit board; the shielding performance of the anti-interference electromagnetic shielding film is improved through the first conducting layer and the second conducting layer, and the flexible circuit board is prevented from interfering the outside; the flexible printed circuit board has good anti-interference and electromagnetic shielding effects and good heat dissipation effect, and effectively prolongs the service life of the flexible printed circuit board.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
reference numerals: a first conductive layer 1; a first trench 11; a second conductive layer 2; the second trench 21; a release film layer 3; an outer shield layer 4; and a heat dissipation layer 5.
Detailed Description
As shown in fig. 1, an anti-interference electromagnetic shielding film includes a first conductive layer 1, a second conductive layer 2 disposed below the first conductive layer 1, a release film layer 3 disposed below the second conductive layer 2, an outer shielding layer 4 disposed above the first conductive layer 1, and a heat dissipation layer 5 sprayed on the outer shielding layer 4.
When in use, the heat dissipation layer 5 can effectively dissipate heat for the flexible circuit board; the outer shielding layer 4 can shield electromagnetic interference of the outside to the flexible circuit board; the shielding performance of the anti-interference electromagnetic shielding film is improved through the first conducting layer 1 and the second conducting layer 2, and the flexible circuit board is prevented from interfering the outside; the flexible printed circuit board has good anti-interference and electromagnetic shielding effects and good heat dissipation effect, and effectively prolongs the service life of the flexible printed circuit board.
As shown in fig. 1, the first conductive layer 1 is a first conductive grid, and the first conductive grid includes a grid-shaped first trench 11 and a first conductive material filled in the first trench 11; the second conductive layer 2 is a second conductive grid, and the second conductive grid includes a grid-shaped second trench 21 and a second conductive material filled in the second trench 21; in this embodiment, through setting up first electrically conductive net and the electrically conductive net of second, effectively promoted the shielding performance of anti-interference electromagnetic shield membrane, prevent that flexible circuit board self from producing the external world interference.
As shown in fig. 1, the depth and width of the first trench 11 are not equal to the depth and width of the second trench 21, and the first conductive material is different from the second conductive material; in this embodiment, when the depth and width of the first trench 11 are not equal to the depth and width of the second trench 21, and the first conductive material is different from the second conductive material, different layers have different conductive materials and thus have different shielding bands, so that the shielding bands of the electromagnetic shielding film are widened, and the market demand can be better satisfied.
As shown in fig. 1, the outer shielding layer 4 is a copper foil film, and the thickness of the copper foil film is in the range of 15-20 μm; in the embodiment, when the thickness of the copper foil film is in the range of 15-20 μm, the copper foil film is thin enough and has good electromagnetic shielding performance.
As shown in fig. 1, the heat dissipation layer 5 is made of thermal radiation paint by spraying; in the embodiment, the thermal radiation coating consisting of the nano silicon dioxide and the silicon resin is sprayed on the copper foil film, and the anti-interference electromagnetic shielding film radiates heat conducted by the flexible circuit board outwards in an infrared mode by depending on the thermal radiation capability of the thermal radiation coating, so that the heat is dissipated.
The specific embodiments described herein are merely illustrative of the spirit of the utility model. Various modifications, additions and substitutions for the described embodiments may be made by those skilled in the art without departing from the scope and spirit of the utility model as defined by the accompanying claims.
Claims (5)
1. An anti-interference electromagnetic shielding film, comprising: including first conducting layer (1), set up in second conducting layer (2) under first conducting layer (1), set up in release film layer (3) under second conducting layer (2), set up in outer shielding layer (4) on first conducting layer (1), and the spraying is in heat dissipation layer (5) on outer shielding layer (4).
2. An anti-tamper electromagnetic shielding film according to claim 1, wherein: the first conductive layer (1) is a first conductive grid which comprises a grid-shaped first groove (11) and a first conductive material filled in the first groove (11); the second conductive layer (2) is a second conductive grid, and the second conductive grid comprises a grid-shaped second groove (21) and a second conductive material filled in the second groove (21).
3. An anti-tamper electromagnetic shielding film according to claim 2, wherein: the depth and width of the first trench (11) are not equal to the depth and width of the second trench (21), and the first conductive material is different from the second conductive material.
4. An anti-tamper electromagnetic shielding film according to claim 1, wherein: the outer shielding layer (4) is a copper foil film, and the thickness range of the copper foil film is 15-20 mu m.
5. An anti-tamper electromagnetic shielding film according to claim 1, wherein: the heat dissipation layer (5) is made of thermal radiation paint by spraying.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220473774.6U CN216820529U (en) | 2022-03-07 | 2022-03-07 | Anti-interference electromagnetic shielding film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220473774.6U CN216820529U (en) | 2022-03-07 | 2022-03-07 | Anti-interference electromagnetic shielding film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216820529U true CN216820529U (en) | 2022-06-24 |
Family
ID=82043379
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220473774.6U Active CN216820529U (en) | 2022-03-07 | 2022-03-07 | Anti-interference electromagnetic shielding film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216820529U (en) |
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2022
- 2022-03-07 CN CN202220473774.6U patent/CN216820529U/en active Active
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