CN206575657U - Water proof type prints pcb board - Google Patents
Water proof type prints pcb board Download PDFInfo
- Publication number
- CN206575657U CN206575657U CN201720024681.4U CN201720024681U CN206575657U CN 206575657 U CN206575657 U CN 206575657U CN 201720024681 U CN201720024681 U CN 201720024681U CN 206575657 U CN206575657 U CN 206575657U
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- layer
- circuit board
- metal substrate
- proof type
- circuit
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Abstract
The utility model discloses a kind of water proof type printing pcb board, including metal substrate, copper foil layer, resin waterproof layer, desiccant layer, antistatic backing, screen layer and metallic radiating layer, the copper foil layer is located at metal substrate upper surface, the circuit formed in the copper foil layer provided with etching, resin waterproof layer sealing is coated on circuit external, the desiccant layer, antistatic backing, screen layer and metallic radiating layer are cascadingly set on metal substrate lower surface, and provided with waterproof film layer between screen layer and metallic radiating layer.Thereby, circuit is sealed up by using resin waterproof layer, prevents moisture from being entered by circuit board bottom using waterproof film layer, and combine desiccant layer and absorb steam, prevent circuit from making moist.In addition, antistatic backing and screen layer that the circuit board bottom is set can prevent circuit board from being disturbed by exterior static and signal, its job stability is improved, and metallic radiating layer can accelerate the radiating of circuit board, extend circuit board service life.
Description
Technical field
The utility model is related to field of circuit boards technology, refers in particular to a kind of water proof type printing pcb board.
Background technology
Circuit board（Printed Circuit Board, abbreviation PCB）, also known as wiring board, pcb board, aluminium base, high frequency plate,
Ultra-thin wiring board, ultrathin circuit board, printing（Copper lithographic technique）Circuit board etc..Circuit board it is main by pad, via, mounting hole,
Wire, component, connector, filling, electrical boundary etc. are constituted.Therefore circuit board, is most afraid of that water inlet is led due to internal integrated circuit
Cause the short circuit of monoblock circuit board, existing circuit board water proofing property is poor, easily by such environmental effects cause circuit board water inlet by
Tide, causes circuit board not use.Therefore, reply available circuit plate is improved, to improve the water resistance of circuit board.
Utility model content
In view of this, in view of the existing deficiencies of the prior art, its main purpose is to provide a kind of water proof type to the utility model
Pcb board is printed, it by using resin waterproof layer, waterproof film layer and makes circuit board have powerful waterproof with reference to desiccant layer
Effect.
To achieve the above object, the utility model is using following technical scheme：
A kind of water proof type prints pcb board, it is characterised in that：Include metal substrate, copper foil layer, resin waterproof layer, drying
Oxidant layer, antistatic backing, screen layer and metallic radiating layer, the copper foil layer are located at metal substrate upper surface, in setting on the copper foil layer
Have etching formed circuit, the resin waterproof layer sealing be coated on circuit external, the desiccant layer, antistatic backing, screen layer and
Metallic radiating layer is cascadingly set on metal substrate lower surface, and is provided between screen layer and metallic radiating layer waterproof
Film layer.
It is used as a kind of preferred scheme：It is provided with the board side wall for preventing water by above-mentioned gap between layers
The fluid sealant of entrance.
It is used as a kind of preferred scheme：The metal substrate thickness is 30 ~ 50 μm.
It is used as a kind of preferred scheme：The resin waterproofing layer thickness is 15 ~ 30 μm.
It is used as a kind of preferred scheme：The waterproof film layer thickness is 20 ~ 35 μm.
The utility model has clear advantage and beneficial effect compared with prior art, specifically, by above-mentioned technology
Scheme is understood, is sealed up circuit by using resin waterproof layer, is prevented moisture from being entered by circuit board bottom using waterproof film layer,
And desiccant layer absorption steam is combined, prevent circuit from making moist, so that, make circuit board that there is powerful waterproof effect.In addition, the electricity
The antistatic backing and screen layer that road plate bottom is set can prevent circuit board from being disturbed by exterior static and signal, improve its work
Make stability, and metallic radiating layer can accelerate the radiating of circuit board, extend circuit board service life.
More clearly to illustrate architectural feature of the present utility model and effect, come below in conjunction with the accompanying drawings with specific embodiment pair
It is described in detail.
Brief description of the drawings
Fig. 1 is the circuit board stratiform structural representation of the utility model.
Accompanying drawing identifier declaration：
10th, metal substrate 20, copper foil layer
30th, resin waterproof layer 40, desiccant layer
50th, antistatic backing 60, screen layer
70th, metallic radiating layer 80, waterproof film layer
90th, fluid sealant.
Embodiment
The utility model is as shown in figure 1, a kind of water proof type printing pcb board, includes metal substrate 10, copper foil layer 20, tree
Fat waterproof layer 30, desiccant layer 40, antistatic backing 50, screen layer 60 and metallic radiating layer 70, wherein：
The thickness of metal substrate 10 is 30 ~ 50 μm, and the copper foil layer 20 is located at the upper surface of metal substrate 10, in the copper foil layer 20
On be provided with etching formed circuit；The thickness of resin waterproof layer 30 is 15 ~ 30 μm, and its sealing is coated on circuit external；This is done
Drying prescription layer 40, antistatic backing 50, screen layer 60 and metallic radiating layer 70 are stacked gradually positioned at the following table of metal substrate 10 from top to bottom
On face, and it is provided between screen layer 60 and metallic radiating layer 70 waterproof film layer 80, the thickness of waterproof film layer 80 is 20 ~
35μm。
In addition, in being provided with the fluid sealant for preventing water from being entered by above-mentioned gap between layers on board side wall
90。
Design focal point of the present utility model is, seals up circuit by using resin waterproof layer, utilizes waterproof film layer
Prevent moisture from being entered by circuit board bottom, and combine desiccant layer absorption steam, prevent circuit from making moist, so that, have circuit board
There is powerful waterproof effect.In addition, antistatic backing and screen layer that the circuit board bottom is set can prevent circuit board by outer
The interference of portion's electrostatic and signal, improves its job stability, and metallic radiating layer can accelerate the radiating of circuit board, extend circuit
Plate service life.
It is described above, only it is preferred embodiment of the present utility model, not technical scope of the present utility model is made
Any limitation, thus it is every according to technical spirit of the present utility model to any trickle amendment made for any of the above embodiments, equivalent become
Change with modification, in the range of still falling within technical solutions of the utility model.
Claims (5)
1. a kind of water proof type prints pcb board, it is characterised in that：Include metal substrate, copper foil layer, resin waterproof layer, drier
Layer, antistatic backing, screen layer and metallic radiating layer, the copper foil layer are located at metal substrate upper surface, are provided with the copper foil layer
The circuit formed is etched, resin waterproof layer sealing is coated on circuit external, the desiccant layer, antistatic backing, screen layer and gold
Category heat dissipating layer is cascadingly set on metal substrate lower surface, and it is thin to be provided between screen layer and metallic radiating layer waterproof
Film layer.
2. water proof type according to claim 1 prints pcb board, it is characterised in that：Use is provided with the board side wall
In the fluid sealant for preventing that water from being entered by above-mentioned gap between layers.
3. water proof type according to claim 1 prints pcb board, it is characterised in that：The metal substrate thickness is 30 ~ 50 μ
m。
4. water proof type according to claim 1 prints pcb board, it is characterised in that：The resin waterproofing layer thickness is 15 ~ 30
μm。
5. water proof type according to claim 1 prints pcb board, it is characterised in that：The waterproof film layer thickness is 20 ~ 35
μm。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720024681.4U CN206575657U (en) | 2017-01-10 | 2017-01-10 | Water proof type prints pcb board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720024681.4U CN206575657U (en) | 2017-01-10 | 2017-01-10 | Water proof type prints pcb board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206575657U true CN206575657U (en) | 2017-10-20 |
Family
ID=60060898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720024681.4U Active CN206575657U (en) | 2017-01-10 | 2017-01-10 | Water proof type prints pcb board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206575657U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109148410A (en) * | 2018-07-23 | 2019-01-04 | 河源市宝腾软件科技有限公司 | A kind of integrated circuit board and preparation method thereof |
| CN109600980A (en) * | 2018-11-08 | 2019-04-09 | 嘉兴瑞冠包装材料有限公司 | A kind of electromagnetic shielding film |
| CN109621886A (en) * | 2019-01-23 | 2019-04-16 | 珠海恒格电子科技有限公司 | A kind of composite drying agent and preparation method thereof based on PCB dry film waste residue |
| CN110972459A (en) * | 2019-11-20 | 2020-04-07 | 中南林业科技大学 | Wood-plastic composite wave-absorbing material and preparation method thereof |
| CN111601453A (en) * | 2020-05-30 | 2020-08-28 | 深圳鹏渤信息科技有限公司 | Novel flexible circuit board |
| WO2021253472A1 (en) * | 2020-06-19 | 2021-12-23 | 昆山达卡特电子有限公司 | Waterproof electronic core pcb |
| CN114390771A (en) * | 2021-12-29 | 2022-04-22 | 昆山苏新电子有限公司 | 5G wiring high-density high-performance circuit board with waterproof structure |
-
2017
- 2017-01-10 CN CN201720024681.4U patent/CN206575657U/en active Active
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109148410A (en) * | 2018-07-23 | 2019-01-04 | 河源市宝腾软件科技有限公司 | A kind of integrated circuit board and preparation method thereof |
| CN109148410B (en) * | 2018-07-23 | 2020-05-19 | 肇庆久量光电科技有限公司 | Integrated circuit board and preparation method thereof |
| CN109600980A (en) * | 2018-11-08 | 2019-04-09 | 嘉兴瑞冠包装材料有限公司 | A kind of electromagnetic shielding film |
| CN109600980B (en) * | 2018-11-08 | 2022-08-19 | 嘉兴瑞冠包装材料有限公司 | Electromagnetic shielding film |
| CN109621886A (en) * | 2019-01-23 | 2019-04-16 | 珠海恒格电子科技有限公司 | A kind of composite drying agent and preparation method thereof based on PCB dry film waste residue |
| CN109621886B (en) * | 2019-01-23 | 2022-08-19 | 珠海恒格微电子装备有限公司 | Composite drying agent based on PCB dry film waste residues and preparation method thereof |
| CN110972459A (en) * | 2019-11-20 | 2020-04-07 | 中南林业科技大学 | Wood-plastic composite wave-absorbing material and preparation method thereof |
| CN111601453A (en) * | 2020-05-30 | 2020-08-28 | 深圳鹏渤信息科技有限公司 | Novel flexible circuit board |
| CN111601453B (en) * | 2020-05-30 | 2024-03-15 | 广东航能电路科技有限公司 | Novel flexible circuit board |
| WO2021253472A1 (en) * | 2020-06-19 | 2021-12-23 | 昆山达卡特电子有限公司 | Waterproof electronic core pcb |
| CN114390771A (en) * | 2021-12-29 | 2022-04-22 | 昆山苏新电子有限公司 | 5G wiring high-density high-performance circuit board with waterproof structure |
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