CN207410581U - A kind of preferable Double-layer flexible circuit board of thermal diffusivity - Google Patents
A kind of preferable Double-layer flexible circuit board of thermal diffusivity Download PDFInfo
- Publication number
- CN207410581U CN207410581U CN201721400103.2U CN201721400103U CN207410581U CN 207410581 U CN207410581 U CN 207410581U CN 201721400103 U CN201721400103 U CN 201721400103U CN 207410581 U CN207410581 U CN 207410581U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- sheet tin
- spray sheet
- layer
- thermal diffusivity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model discloses a kind of preferable Double-layer flexible circuit boards of thermal diffusivity of circuit board technology field,The four corners of the substrate are evenly arranged with four groups of identical supporting items of structure,The top and bottom of the substrate are provided with outboard circuit plate and inner layer circuit board by adhesive linkage respectively,It is provided at the top of the outboard circuit plate described in outer layer spray sheet tin and is provided with oxidation barrier film at the top of outer layer spray sheet tin,The bottom of the inner layer circuit board is provided with internal layer spray sheet tin,Positioning link bar is provided at the bottom four corners of the internal layer spray sheet tin,Blind hole is uniformly provided on the outer circuit plate and inner layer circuit board,And blind hole and thermal vias unicom,The apparatus structure is simple,Anti-oxidant protrusion set by the top of oxidation barrier film,Effectively raise the antioxygenic property of circuit board,Thermal vias and blind hole are mutually matched installation and effectively can provide heat dissipation performance to circuit board,Extend the service life of circuit board.
Description
Technical field
The utility model is related to circuit board technology fields, are specially a kind of preferable Double-layer flexible circuit board of thermal diffusivity.
Background technology
Circuit board makes circuit miniaturization and directly perceivedization, batch production and optimization electrical appliance layout lifting for permanent circuit
It acts on, circuit board is almost the basis of any electronic product, basic as electronic product with the rapid development of electronic industry
The printed circuit board applications of structure are more and more extensive, although electromagnetic product function is enhanced, being beneficial to for application is also more next
It is more extensive, but the requirement for circuit board in electronic product is also higher and higher, for this purpose, it is proposed that a kind of thermal diffusivity is preferable
Double-layer flexible circuit board.
Utility model content
The purpose of this utility model is to provide a kind of preferable Double-layer flexible circuit board of thermal diffusivity, to solve above-mentioned background
The problem of being proposed in technology.
To achieve the above object, the utility model provides following technical solution：A kind of preferable Double-layer flexible electricity of thermal diffusivity
Road plate, including substrate, the four corners of the substrate are evenly arranged with four groups of identical supporting items of structure, the top of the substrate and
Bottom is provided with outer circuit plate and inner layer circuit board by adhesive linkage respectively, and supporting item is uniformly arranged on two groups of adhesive linkages
In opposed inner walls, outer layer spray sheet tin is provided at the top of the outer circuit plate, is provided at the top of the outer layer spray sheet tin anti-
Oxide film, the bottom of the inner layer circuit board are provided with internal layer spray sheet tin, have at the bottom four corners of the internal layer spray sheet tin
Positioning link bar is provided with, thermal vias is offered on the substrate, is uniformly opened on the outer circuit plate and inner layer circuit board
Equipped with blind hole, and blind hole and thermal vias unicom.
Preferably, module hole is both provided on the outer layer spray sheet tin and internal layer spray sheet tin, and module hole centre-to-centre spacing is
2mm, and module hole hole edge is 0.2mm to edges of boards distance, the outer layer spray sheet tin and internal layer spray sheet tin are both provided with pad, and weld
Disk to edges of boards distance be 0.15mm.
Preferably, the positioning link bar is taper connection bar, and positioning link bar is the identical connecting rod of four groups of structures,
And positioning link bar is arranged at the bottom four corners of internal layer spray sheet tin.
Preferably, the thermal vias is the identical five groups of cylindrical holes of structure, and be uniformly provided on adhesive linkage with
The via hole that blind hole matches.
Preferably, the outer circuit plate and inner layer circuit board are epoxy resin board, and outer circuit plate and internal layer are electric
The thickness of road plate is identical.
Preferably, it is evenly arranged with anti-oxidant protrusion at the top of the oxidation barrier film.
Compared with prior art, the beneficial effects of the utility model are：The apparatus structure is simple, the top of oxidation barrier film
Set anti-oxidant protrusion, effectively raises the antioxygenic property of circuit board, and thermal vias and blind hole are mutually matched peace
Dress effectively can provide heat dissipation performance to circuit board, extend the service life of circuit board, and positioning link bar can also facilitate
The installation of circuit board.
Description of the drawings
Fig. 1 is the utility model structure diagram.
In figure：1 substrate, 2 supporting items, 3 adhesive linkages, 4 outer circuit plates, 5 inner layer circuit boards, 6 outer layers spray sheet tin, 7 antioxygens
Change film, 8 internal layers spray sheet tin, 9 positioning link bars, 10 thermal vias, 11 blind holes.
Specific embodiment
The following is a combination of the drawings in the embodiments of the present utility model, and the technical scheme in the embodiment of the utility model is carried out
It clearly and completely describes, it is clear that the described embodiments are only a part of the embodiments of the utility model rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are without making creative work
All other embodiments obtained shall fall within the protection scope of the present invention.
Referring to Fig. 1, the utility model provides a kind of technical solution：A kind of preferable Double-layer flexible circuit board of thermal diffusivity,
Including substrate 1, the four corners of the substrate 1 are evenly arranged with four groups of identical supporting items of structure 2, the top of the substrate 1 and
Bottom is provided with outer circuit plate 4 and inner layer circuit board 5 by adhesive linkage 3 respectively, and supporting item 2 is uniformly arranged on two groups of bondings
In the opposed inner walls of layer 3, the top of the outer circuit plate 4 is provided with outer layer spray sheet tin 6, the top of the outer layer spray sheet tin 6
Oxidation barrier film 7 is provided with, the bottom of the inner layer circuit board 5 is provided with internal layer spray sheet tin 8, the bottom of the internal layer spray sheet tin 8
Portion's four corners are provided with positioning link bar 9, offer thermal vias 10 on the substrate 1, the outer circuit plate 4 and interior
Blind hole 11, and blind hole 11 and 10 unicom of thermal vias are uniformly provided on layer circuit board 5.
Wherein, module hole is both provided on the outer layer spray sheet tin 6 and internal layer spray sheet tin 8, and module hole centre-to-centre spacing is
2mm, and module hole hole edge is 0.2mm to edges of boards distance, the outer layer spray sheet tin (6) and internal layer spray sheet tin 8 are both provided with pad,
And pad to edges of boards distance for 0.15mm, and the boss gong plate tolerance on pad, in +/- 0.1mm, point half tolerance exists after V is cut
+/- 0.15mm, and outer layer spray sheet tin 6 and internal layer spray the panel thickness tolerance of sheet tin 8 for+0.15/-0mm, the positioning link bar
9 be taper connection bar, and positioning link bar 9 is the identical connecting rod of four groups of structures, and positioning link bar 9 is arranged on internal layer spray tin
At the bottom four corners of plate 8, the thermal vias 10 is five groups of identical cylindrical holes of structure, and is uniformly opened up on adhesive linkage 3
There is the via hole to match with blind hole 11, the outer circuit plate 4 and inner layer circuit board 5 are epoxy resin board, and outer layer is electric
Road plate 4 is identical with the thickness of inner layer circuit board 5, and the top of the oxidation barrier film 7 is evenly arranged with anti-oxidant protrusion.
Anti-oxidant protrusion set by the top of oxidation barrier film 7 effectively raises the antioxygenic property of circuit board, dissipates
Heat through-hole 10 and blind hole 11 are mutually matched installation and effectively can provide heat dissipation performance, and positioning link bar 9 to circuit board
Also the installation of circuit board can be facilitated.
While there has been shown and described that the embodiment of the utility model, for the ordinary skill in the art,
It is appreciated that in the case where not departing from the principle of the utility model and spirit can these embodiments be carried out with a variety of variations, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (6)
1. a kind of preferable Double-layer flexible circuit board of thermal diffusivity, including substrate (1), it is characterised in that：The corner of the substrate (1)
Place is evenly arranged with four groups of identical supporting items of structure (2), and the top and bottom of the substrate (1) pass through adhesive linkage (3) respectively
It is provided with outer circuit plate (4) and inner layer circuit board (5), and supporting item (2) is uniformly arranged on the relatively interior of two groups of adhesive linkages (3)
On wall, outer layer spray sheet tin (6) is provided at the top of the outer circuit plate (4), is provided at the top of the outer layer spray sheet tin (6)
Oxidation barrier film (7), the bottom of the inner layer circuit board (5) are provided with internal layer spray sheet tin (8), the internal layer spray sheet tin (8)
Positioning link bar (9) is provided at bottom four corners, thermal vias (10), the outer layer electricity are offered on the substrate (1)
Blind hole (11), and blind hole (11) and thermal vias (10) unicom are uniformly provided on road plate (4) and inner layer circuit board (5).
2. a kind of preferable Double-layer flexible circuit board of thermal diffusivity according to claim 1, it is characterised in that：The outer layer spray
Is both provided with module hole on sheet tin (6) and internal layer spray sheet tin (8), and module hole centre-to-centre spacing is 2mm, and module hole hole edge is to edges of boards
Distance is 0.2mm, and the outer layer spray sheet tin (6) and internal layer spray sheet tin (8) are both provided with pad, and pad is to edges of boards distance
0.15mm。
3. a kind of preferable Double-layer flexible circuit board of thermal diffusivity according to claim 1, it is characterised in that：The positioning connects
Extension bar (9) is taper connection bar, and positioning link bar (9) is the identical connecting rod of four groups of structures, and positioning link bar (9) is set
At the bottom four corners of internal layer spray sheet tin (8).
4. a kind of preferable Double-layer flexible circuit board of thermal diffusivity according to claim 1, it is characterised in that：The heat dissipation is logical
Hole (10) is five groups of identical cylindrical holes of structure, and is uniformly provided on adhesive linkage (3) and is led with what blind hole (11) matched
Through hole.
5. a kind of preferable Double-layer flexible circuit board of thermal diffusivity according to claim 1, it is characterised in that：The outer layer electricity
Road plate (4) and inner layer circuit board (5) are epoxy resin board, and the thickness phase of outer circuit plate (4) and inner layer circuit board (5)
Together.
6. a kind of preferable Double-layer flexible circuit board of thermal diffusivity according to claim 1, it is characterised in that：It is described anti-oxidant
Film is evenly arranged with anti-oxidant protrusion at the top of (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721400103.2U CN207410581U (en) | 2017-10-26 | 2017-10-26 | A kind of preferable Double-layer flexible circuit board of thermal diffusivity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721400103.2U CN207410581U (en) | 2017-10-26 | 2017-10-26 | A kind of preferable Double-layer flexible circuit board of thermal diffusivity |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207410581U true CN207410581U (en) | 2018-05-25 |
Family
ID=62408997
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721400103.2U Expired - Fee Related CN207410581U (en) | 2017-10-26 | 2017-10-26 | A kind of preferable Double-layer flexible circuit board of thermal diffusivity |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207410581U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114335809A (en) * | 2022-01-25 | 2022-04-12 | 深圳市东方芯愿新能源有限公司 | Lithium battery device with double-layer circuit board |
-
2017
- 2017-10-26 CN CN201721400103.2U patent/CN207410581U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114335809A (en) * | 2022-01-25 | 2022-04-12 | 深圳市东方芯愿新能源有限公司 | Lithium battery device with double-layer circuit board |
| CN114335809B (en) * | 2022-01-25 | 2024-03-08 | 深圳市东方芯愿新能源有限公司 | Double-layer circuit board lithium battery device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180525 Termination date: 20191026 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |