CN211267247U - Circuit board and electronic equipment - Google Patents
Circuit board and electronic equipment Download PDFInfo
- Publication number
- CN211267247U CN211267247U CN202020216873.7U CN202020216873U CN211267247U CN 211267247 U CN211267247 U CN 211267247U CN 202020216873 U CN202020216873 U CN 202020216873U CN 211267247 U CN211267247 U CN 211267247U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- layer
- shielding film
- film layer
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The embodiment of the utility model discloses circuit board and electronic equipment. The circuit board comprises a circuit board main body, and an insulating film and a composite shielding film which are sequentially stacked on the circuit board main body; the circuit board comprises a circuit board main body and a composite shielding film, wherein a target device is arranged on the circuit board main body, and the composite shielding film comprises a shielding film layer and a functional film layer which are arranged in a stacked mode; the target device corresponds to the position of the functional film layer; the functional film layer comprises at least one of a wave absorbing layer and a heat dissipation layer. The embodiment of the utility model provides a circuit board has good anti electromagnetic radiation interference ability, still has good heat dispersion simultaneously concurrently.
Description
Technical Field
The embodiment of the utility model provides a relate to communication technology field, more specifically, the utility model relates to a circuit board and electronic equipment.
Background
Circuit boards are widely used in electronic devices, which is an active industry in the electronic component industry. However, in the working process of the electronic device, due to continuous and intermittent changes of the working voltage and current of the electronic device, certain electromagnetic radiation can be generated by internal components or chips, and electromagnetic radiation interference can be caused to other surrounding components or chips. Furthermore, ambient electromagnetic radiation external to the electronic device is also susceptible to electromagnetic radiation interference. Therefore, higher requirements are put on the anti-electromagnetic radiation interference capability of the circuit board.
In prior art solutions, it is common to provide a shielding film on the circuit board to resist electromagnetic radiation interference. Although the existing shielding film can achieve the effects of shielding signal radiation and resisting external signal interference, the shielding film is tightly attached to the circuit board, which usually brings some disadvantages. For some high-radiation chips or high-radiation components on the circuit board, a certain distance is preferably kept between the chip or the component and the shielding film, otherwise, signal radiation, reflection and other adverse conditions occur, and self interference is caused. For example, the surface of the components such as the components made of the radio frequency LTCC material or the radio frequency amplifier can radiate to a certain extent, if the shielding film is tightly attached to the components, the radio frequency signal is reflected back to the component body, which causes the radio frequency index abnormality, and more seriously, the components are burned out. In addition, after the shielding film is tightly attached to the circuit board, the heat dissipation effect is poor due to the sealing property of the shielding film, and particularly, the local temperature of the circuit board is too high at a high-heat-generating component or chip part for a long time, which finally affects the normal use of the circuit board.
Therefore, when the conventional shielding film is attached to a circuit board, the circuit board is locally overheated or signal reflection is easy to occur.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a circuit board and electronic equipment's new technical scheme to solve present circuit board and hug closely components and parts or chip on the circuit board because of the shielding film and the electromagnetic signal transmission that leads to returns components and parts or chip itself, and components and parts or chip radiating problem of being difficult.
In order to solve the above technical problem, according to a first aspect of the present invention, there is provided a circuit board, including a circuit board main body, and an insulating film and a composite shielding film sequentially stacked on the circuit board main body;
the circuit board comprises a circuit board main body and a composite shielding film, wherein a target device is arranged on the circuit board main body, and the composite shielding film comprises a shielding film layer and a functional film layer which are arranged in a stacked mode; the target device corresponds to the position of the functional film layer;
the functional film layer comprises at least one of a wave absorbing layer and a heat dissipation layer.
According to another aspect of the present disclosure, there is provided an electronic device including a housing and a circuit board as described above disposed inside the housing.
According to the utility model provides a circuit board has improved to the barrier film wherein, has add the function rete specially, and the material of function rete is at least one in absorbing material and the heat sink material. Therefore, the space radiation impedance can be effectively changed, and the signal radiation interference is eliminated. Meanwhile, the heat dissipation performance can be effectively improved, and the phenomenon of local overheating of the circuit board is avoided.
Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments of the invention, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
Fig. 1 is a schematic structural diagram of a circuit board according to an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a circuit board according to another embodiment of the present invention.
Fig. 3 is a schematic structural diagram of a circuit board according to another embodiment of the present invention.
Fig. 4 is a schematic structural diagram of a circuit board according to another embodiment of the present invention.
Fig. 5 is a schematic structural diagram of a circuit board according to another embodiment of the present invention.
Fig. 6 is a schematic structural diagram of a circuit board according to another embodiment of the present invention.
Description of reference numerals:
1-circuit board body, 2-insulating film, 3-composite shielding film, 31-shielding film layer, 311-heat dissipation hole, 32-functional film layer and 4-target device.
Detailed Description
Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: unless specifically stated otherwise, the relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present invention.
The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.
Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
According to an embodiment of the present invention, a circuit board is provided, the circuit board may be, for example, a hard circuit board, and may also be a flexible circuit board, which is not limited to this. The embodiment of the utility model provides a circuit board is applicable in the electronic equipment of multiple different grade type, has extensive application prospect.
The embodiment of the utility model provides a circuit board, it is shown with reference to fig. 1-5, and it includes circuit board main part 1 to and superpose in proper order and establish insulating film 2 and compound shielding film 3 on circuit board main part 1. Wherein the circuit board main body 1 is provided with a target device 4. The composite shielding film 3 includes a shielding film layer 31 and a functional film layer 32 which are stacked. The target device 4 corresponds to the location of the functional film layer 32. The functional film layer 31 includes at least one of a wave absorbing layer and a heat dissipating layer.
It should be noted that the circuit board body 1 may be provided with a plurality of component sections and connection areas for connecting the component sections, and various types of components and chips are collectively provided on the component sections. Some of these components and parts, chips have the characteristic of high radiation, some have the characteristic of high fever, and some have both high radiation and high fever characteristic yet, and these components and parts, chips are promptly the target device 4 in the utility model. Referring to fig. 1-5, the portion protruding on the circuit board main body 1 is a component or a chip, in which the target device 4 is included. When the insulating film 2 is provided on the circuit board body 1, the insulating film 2 may cover each component, chip, provided on the circuit board body 1.
Different with conventional circuit board structure, the embodiment of the utility model provides a circuit board has carried out the improvement to the barrier film wherein, has add function rete 32 very much, has formed a compound barrier film 3. The material of the functional film layer 32 may be at least one of a wave-absorbing material and a heat-dissipating material, for example. Further, when the functional film layer 32 is made of a wave-absorbing material, it is equivalent to forming a wave-absorbing material layer, and at this time, the spatial radiation impedance can be effectively changed, and the signal radiation interference can be eliminated. When the functional film layer 32 is made of a heat dissipation material, a heat dissipation material layer is formed, which can effectively improve the heat dissipation effect of the composite shielding film without affecting the shielding effect.
The embodiment of the utility model provides a circuit board, wherein, function rete 32 for example can be located insulating film 2 with shield between the rete 31. That is, the shielding film layer 31 is separated from the insulating film 2 tightly attached to the circuit board main body 1 by the functional film layer 32, so that a certain distance can be formed between the shielding film layer 31 and the target device 4 on the circuit board main body 1, and the shielding film layer 31 is not tightly attached to the target device 4, which is helpful for overcoming the drawbacks in the prior art.
The utility model discloses an among the embodiment, function rete 32 is the layer of inhaling, when folding 3 compound shielding films and establish on insulating film 2, is to combine the layer of inhaling of compound shielding film 3 and insulating film 2 together, and at this moment, inhale the level and be located between insulating film 2 and the shielding rete 31. In this embodiment, the wave-absorbing layer may be used to absorb radiation of the target device 4 on the circuit board main body 1, or electromagnetic signals reflected by the shielding film layer 31, so as to avoid the phenomenon that the electromagnetic signals are reflected back to the body of the target device 4, which causes index abnormality and burnout of the target device 4. Therefore, the radiation interference problem of the element in the shielding film layer can be well solved.
The embodiment of the utility model provides a circuit board when assembling it, it is optional, can be attached on circuit board main part 1 with insulating film 2 earlier, insulating film 2 is used for wrapping up each components and parts, chip on circuit board main part 1 this moment, and of course this includes target device 4 wherein. Then, the composite shielding film 3 is disposed on the insulating film 2, and before the composite shielding film 3 is disposed on the insulating film 2, some high-radiation devices or chips, that is, the insulating film 2 corresponding to the upper side of the target device 4, may be removed, as shown in fig. 2, so that the high-radiation devices or chips can be exposed out of the insulating film 2, and then the wave-absorbing layer is directly attached to the high-radiation devices or chips. Of course, the insulating film 2 may be optionally not removed during this process, as shown in fig. 1. It should be noted that the removal or non-removal of the insulating film 2 mainly depends on whether the insulating film 2 affects the wave-absorbing effect of the wave-absorbing layer. For example, when the insulating film 2 causes a high-radiation component or a chip to be not close enough to the wave-absorbing layer, which results in a poor wave-absorbing effect, the insulating film 2 must be removed, so as to facilitate the wave-absorbing layer to exert its performance better.
As a method of removing the insulating film 2, laser removal or the like can be employed. The laser mode is simple to realize, easy to operate, not easy to damage other parts of the insulating film, high in removal speed and beneficial to improving the production efficiency. Of course, other removal methods may be used to remove the insulating film. For example, using physical removal. Specifically, blade cutting or the like may be employed. The person skilled in the art can select it flexibly according to the specific situation without limitation.
The embodiment of the utility model provides a circuit board, it is optional, shielding rete 31 can be located insulating film 2 with between the function rete 32. That is, when the composite shielding film 3 is provided on the insulating film 2, the shielding film layer 31 is bonded to the insulating film 2, and the functional film layer 32 is arranged on the shielding film layer 31. That is, the functional film layer 32 is provided on the shielding film layer 31, and the functional film layer 32 is separated from the insulating film 2 by the shielding film layer 31.
In a specific embodiment of the present invention, referring to fig. 3, the functional film 32 includes a first heat dissipation layer, and when the composite shielding film 3 is stacked on the insulating film 2, the shielding film 31 of the composite shielding film 3 is attached to the insulating film 2, and at this time, the shielding film 31 is located between the insulating film 2 and the first heat dissipation layer, that is, the first heat dissipation layer is located on the shielding film 31. In this embodiment, the first heat dissipation layer can absorb heat generated during the operation of the target device 4 on the circuit board body 1 and dissipate the heat rapidly. This embodiment can be under the condition that does not influence shielding effect, and the local overheated condition of circuit board main part 1 is avoided appearing in the heat dispersion of fine promotion composite shielding film 3. It should be further noted that, in this embodiment, the target device 4 corresponds to the first heat dissipation layer, and if the wave absorption layer is further included, the wave absorption layer may be placed in the shielding film layer 31.
On the basis of the above embodiment, the functional film layer 32 may further include a first heat absorbing layer. Specifically, when the functional film layer 32 has this first heat absorbing layer, the first heat absorbing layer is located between the insulating film 2 and the shielding film layer 31.
Similarly, before the composite shielding film 3 is disposed on the insulating film 2, some high-heat-generating components or chips, that is, the corresponding insulating film 2 above the target device 4, may be removed, so that the high-heat-generating components or chips can be exposed outside the insulating film 2, and then the shielding film 31 and the heat dissipation layer are attached to the high-radiation components or chips. Of course, the insulating film 2 may be optionally not removed. The removal or non-removal of the insulating film 2 depends on whether the insulating film 2 affects the heat conduction and heat dissipation effects of the heat dissipation layer. For example, when the insulating film 2 causes a high heat generating component or the chip and the heat dissipation layer are not close enough to each other, the heat conduction and dissipation effects are deteriorated, the insulating film 2 must be removed.
As a method of removing the insulating film 2, laser removal or the like can be used. The laser mode is simple to realize, easy to operate, not easy to damage other parts of the insulating film, high in removal speed and beneficial to improving the production efficiency. Of course, other removal methods may be used to remove the insulating film. For example, using physical removal. Specifically, blade cutting or the like may be employed. The person skilled in the art can select it flexibly according to the specific situation without limitation.
The embodiment of the utility model provides a circuit board, compound barrier film 3 is including function rete 32 and shielding rete 31. The functional film layer 32 includes at least one of a heat dissipation layer and a wave absorption layer.
The embodiment of the utility model provides an in, the main function of heat dissipation layer is the good radiating effect of realization, and its material can select for example to adopt silica gel class heat dissipation material or graphite class heat dissipation material (for example graphite alkene heat dissipation material). These materials all have a better heat dissipation effect, and are more suitable for solving the problem of heat generation of electronic devices compared with common heat dissipation materials. The silica gel heat dissipation material has low thermal resistance and high heat conduction performance, is a high-flexibility heat conduction material, and can cover a microcosmic uneven surface so as to be fully contacted with the target device 4 to improve the heat conduction efficiency. The graphite heat dissipation material has the advantages of high heat conduction efficiency, good plasticity and easy film preparation.
In the embodiment of the utility model provides an in, the material of absorbing layer can adopt graphite material, carbon fiber material, ferrite material or conducting polymer material for example. The materials can play a good wave absorbing property. The wave-absorbing layer formed by the materials can be used for absorbing radiation signals radiated by the target device 4 or reflected by the shielding film layer 31, so that the problem of radiation interference of self components in the shielding film layer 31 can be solved. Particularly, the graphite material and the ferrite material in the materials have wave absorption performance and good heat dissipation performance, belong to wave absorption materials with good heat dissipation performance, and can solve the problems of radiation reflection and heat dissipation at the same time.
In the embodiment of the present invention, the shielding film layer 31 is made of metal material. For example, the shielding film layer 31 may be made of copper, copper alloy, iron alloy, or the like. The electromagnetic shielding film has conductivity, can play a good electromagnetic shielding effect, and can prevent external electromagnetic signals from generating electromagnetic interference on components inside the shielding film.
The embodiment of the utility model provides a circuit board, it is shown with reference to fig. 3-5 compound shielding film 3's shielding rete 31 is last to be provided with heat radiation structure at least locally for realize good radiating effect.
In a specific embodiment of the present invention, referring to fig. 3, the composite shielding film 3 includes a shielding film layer 31 and a functional film layer 32, wherein the shielding film layer 31 and the target device 4 are provided with a heat dissipation structure at a position, and the heat dissipation structure includes a plurality of heat dissipation holes 311. The functional film layer 32 is a heat dissipation layer. When the composite shielding film 3 is attached to the insulating layer 2, the shielding film layer 31 faces the insulating layer 2 and is attached to the insulating layer 2, and the functional film layer 32 is located on the shielding film layer 31. Under this structure, by shielding rete 31 on a plurality of louvres 311 with the circuit board main part 1 on the heat that target device 4 produced give off function rete 32, because function rete 32 is the heat dissipation layer, consequently can distribute away the heat fast to this can reach better radiating effect, thereby avoid target device 4 on the circuit board to lead to the high temperature because of the unable quick effluvium of long-term use heat, influence the normal use of circuit board.
In a specific embodiment of the present invention, referring to fig. 4 and 5, the composite shielding film 3 includes a shielding film layer 31 and a functional film layer 32, wherein the shielding film layer 31 is provided with a heat dissipation structure, and the heat dissipation structure includes a plurality of heat dissipation holes 311. The functional film layer 32 is made of a wave-absorbing material with good heat dissipation performance, such as a graphite material or a ferrite material. At this time, when the composite shielding film 3 is attached to the insulating layer 2, the functional film layer 32 is attached to the insulating layer 2, and the shielding film layer 31 is stacked on the functional film layer 32. Under the structure, the radiation of the target device 4 on the circuit board main body 1 is absorbed by the functional film layer 32, or the electromagnetic signal reflected by the shielding film layer 31 is avoided, so that the phenomenon that the signal is reflected back to the body of the target device 4 is avoided. Meanwhile, the functional film 32 has good heat dissipation performance, and can transfer heat to the shielding film 31, and the heat generated by the target device 4 on the circuit board body 1 is dissipated by the heat dissipation holes 311 on the shielding film 31. In this embodiment, both can solve the problem of radiation reflection well, can also well promote the radiating effect of components and parts, chip etc. under the condition that does not influence shielding effect.
Furthermore, the embodiment of the utility model provides an in, if mainly to solve the heat dissipation problem of circuit board, can also adopt a simpler structure. In a specific embodiment of the present invention, referring to fig. 6, the composite shielding film 3 may only have a shielding film layer 31, and a heat dissipation structure is disposed on the shielding film layer 31, and the heat dissipation structure includes a plurality of heat dissipation holes 311. Good heat dissipation is achieved by the heat dissipation holes 311. Under this structure, after the insulating film 2 is disposed on the circuit board body 1, the composite shielding film 3 is covered on the insulating film 2, and since the composite shielding film 3 has the plurality of heat dissipation holes 311, heat generated from the target device 4 on the circuit board body 1 can be dissipated.
Wherein, the heat dissipation holes 311 may be, for example, circular holes, square holes, triangular holes, etc., and those skilled in the art may flexibly adjust according to the needs without limitation. The aperture of the heat dissipation holes 311 may be controlled to be, for example, 0.1mm to 0.5 mm. The aperture size of the heat dissipation hole 311 is not absolute, and those skilled in the art can reasonably adjust the aperture size of the heat dissipation hole 311 as needed, for example, the aperture size can be controlled to about 1 mm.
In addition, the arrangement of the heat dissipation holes 311 may be adjusted by those skilled in the art as needed. For example, the plurality of heat dissipation holes 311 may be arranged in a matrix or in a honeycomb. Of course, the heat dissipation holes 311 may be arranged densely only in the high heat generation region, and the heat dissipation holes 311 are not provided or only a small number of heat dissipation holes 311 are provided in other regions that generate less heat.
The heat dissipation structure on the shielding film 31 is not limited to the above-mentioned heat dissipation hole 311. Openings may be provided in the insulating film 2 at positions corresponding to the target devices 4 to form a grid-like structure. In addition, optionally, the target device 4 may be in contact with the functional film layer at the opening, so that a good heat dissipation effect can be ensured. There may be a number of grid holes on the grid-like structure. Wherein, the grid hole can be, for example, circular, triangle, rhombus, etc., and the utility model discloses do not do the restriction to this. The size range of the grid holes on the grid-like structure can be controlled to be 0.1mm-0.5mm, for example. The size of the grid holes is not absolute, and those skilled in the art can reasonably adjust the size of the grid holes as needed, for example, the size can be controlled to about 1 mm. In addition, those skilled in the art can also appropriately adjust the arrangement density of the grid holes on the grid structure as required to achieve a good heat dissipation effect.
The embodiment of the utility model provides a circuit board, insulating film 2 for example includes insulating body layer and adhesive linkage, the insulating body layer passes through the adhesive linkage with the laminating of circuit board main part 1 to make insulating film 2 can stabilize, firmly combine with circuit board main part 1. Finally, the insulating film 2 covers the circuit board main body 1.
The embodiment of the utility model provides a circuit board, compound shielding film 3 wherein has shielding rete 31 be provided with the ground connection region on the shielding rete 31, and, be formed with on the insulating film 2 with the fretwork region that the ground connection region corresponds. After the insulating film 2 is arranged on the circuit board main body 1 (provided with chips and components), the composite shielding film 3 needs to be arranged on the insulating film 2, at this time, the shielding film layer 31 on the composite shielding film 3 is conductive, the grounding mode of the composite shielding film 3 is that the insulating film 2 at the corresponding position is burnt through by using laser and the like at the place needing grounding to form the hollow area, and then the grounding area on the shielding film layer 31 is directly contacted with the circuit board main body 1 for grounding.
According to another embodiment of the present invention, there is also provided an electronic apparatus. The electronic device comprises a housing and a circuit board as described above, the circuit board being arranged inside the housing. Because the circuit board is arranged in the shell, heat on the circuit board is not easy to dissipate, and at the moment, if the circuit board included in the electronic equipment is the circuit board in the embodiment, the heat can be well dissipated.
The electronic device may be, for example, a mobile phone, a tablet computer, a notebook computer, a Personal Digital Assistant (PDA), a mobile internet access device, a navigator or a wearable device, and the present invention is not limited thereto.
The embodiment of the utility model provides an electronic equipment, owing to include above-mentioned arbitrary embodiment the circuit board to can solve the technical problem the same with above-mentioned embodiment, also can realize the technical effect the same with above-mentioned embodiment, no longer describe here.
Although certain specific embodiments of the present invention have been described in detail by way of example, it should be understood by those skilled in the art that the foregoing examples are for purposes of illustration only and are not intended to limit the scope of the invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.
Claims (10)
1. A circuit board, characterized by: the circuit board comprises a circuit board main body, and an insulating film and a composite shielding film which are sequentially stacked on the circuit board main body;
the circuit board comprises a circuit board main body and a composite shielding film, wherein a target device is arranged on the circuit board main body, the composite shielding film comprises a shielding film layer and a functional film layer which are arranged in a stacked mode, and the target device corresponds to the functional film layer in position;
the functional film layer comprises at least one of a wave absorbing layer and a heat dissipation layer.
2. The circuit board of claim 1, wherein: the functional film layer is located between the insulating film and the shielding film layer.
3. The circuit board of claim 1, wherein: the functional film layer includes a first heat dissipation layer, and the shielding film layer is located between the insulating film and the first heat dissipation layer.
4. The circuit board of claim 3, wherein: the functional film layer further includes a first heat absorbing layer located between the insulating film and the shielding film layer.
5. The circuit board of claim 1, wherein: and a plurality of heat dissipation holes are formed in the positions, corresponding to the target devices, on the shielding film layer.
6. The circuit board of claim 5, wherein: the aperture of the heat dissipation hole is 0.1mm-0.5 mm.
7. The circuit board of claim 1, wherein: an opening is provided in the insulating film at a position corresponding to the target device.
8. The circuit board of claim 7, wherein: the target device is in contact with the functional film layer at the aperture.
9. The circuit board of claim 1, wherein: the shielding film layer is provided with a grounding area, and a hollow area corresponding to the grounding area is formed on the insulating film.
10. An electronic device, characterized in that: comprising a housing and a circuit board according to any of claims 1-9, which circuit board is arranged inside the housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020216873.7U CN211267247U (en) | 2020-02-26 | 2020-02-26 | Circuit board and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020216873.7U CN211267247U (en) | 2020-02-26 | 2020-02-26 | Circuit board and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211267247U true CN211267247U (en) | 2020-08-14 |
Family
ID=71960718
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020216873.7U Active CN211267247U (en) | 2020-02-26 | 2020-02-26 | Circuit board and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211267247U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112433310A (en) * | 2020-12-17 | 2021-03-02 | 成都优博创通信技术有限公司 | Optical module and optical module subassembly |
-
2020
- 2020-02-26 CN CN202020216873.7U patent/CN211267247U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112433310A (en) * | 2020-12-17 | 2021-03-02 | 成都优博创通信技术有限公司 | Optical module and optical module subassembly |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4408255A (en) | Absorptive electromagnetic shielding for high speed computer applications | |
| US7848108B1 (en) | Heatsink with periodically patterned baseplate structure | |
| US7842381B2 (en) | Thermally conductive EMI shield | |
| JP4251747B2 (en) | High frequency shield | |
| US9968004B2 (en) | Thermal interface materials including electrically-conductive material | |
| US6011299A (en) | Apparatus to minimize integrated circuit heatsink E.M.I. radiation | |
| KR20040089097A (en) | Emi shielding including a lossy medium | |
| TWM241965U (en) | EMI-Attenuating air ventilation panel | |
| CN106455419A (en) | Heat dissipation structure of electronic equipment | |
| CN211267247U (en) | Circuit board and electronic equipment | |
| CN210725770U (en) | Electronic equipment heat dissipation assembly and electronic equipment | |
| WO2022063239A1 (en) | Packaging body and preparation method therefor, terminal and electronic device | |
| JP2015535392A (en) | Thermally conductive element and method for forming the thermally conductive element | |
| CN113286418B (en) | High-performance electromagnetic radiation suppression structure | |
| CN210840545U (en) | Wave-absorbing shielding film with heat dissipation and conduction functions | |
| CN113823622A (en) | Chip packaging device and electronic equipment | |
| CN113363728A (en) | Miniaturized ultra-wideband metamaterial wave absorber structure for inhibiting electromagnetic radiation and application | |
| CN112447631A (en) | Heat radiation structure of packaged chip | |
| CN218071925U (en) | Combined heat dissipation shielding structure and electronic component | |
| US20220264763A1 (en) | Metamaterial heat spreader | |
| JP2021129059A (en) | Electronic apparatus | |
| US20240179883A1 (en) | Slotted absorber | |
| WO2023241486A1 (en) | Antenna heat dissipation assembly and base station | |
| CN213662053U (en) | Circuit board easy to radiate heat during double-sided cloth | |
| CN216820529U (en) | Anti-interference electromagnetic shielding film |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |