CN112433310A - Optical module and optical module subassembly - Google Patents
Optical module and optical module subassembly Download PDFInfo
- Publication number
- CN112433310A CN112433310A CN202011498435.5A CN202011498435A CN112433310A CN 112433310 A CN112433310 A CN 112433310A CN 202011498435 A CN202011498435 A CN 202011498435A CN 112433310 A CN112433310 A CN 112433310A
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- Prior art keywords
- insulating layer
- shell
- optical module
- housing
- optical
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4277—Protection against electromagnetic interference [EMI], e.g. shielding means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4283—Electrical aspects with electrical insulation means
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention discloses an optical module and an optical module assembly, and relates to the technical field of optical modules. The optical module includes a housing, an optoelectronic device, and an insulating layer. The shell is internally provided with a containing cavity, the optoelectronic device is arranged in the containing cavity, the insulating layer is coated on the inner side of the shell and is used for insulating the optoelectronic device from the shell. Compared with the prior art, the optical module provided by the invention adopts the shell provided with the accommodating cavity and the insulating layer coated on the inner side of the shell, so that the insulating effect between the optoelectronic device and the shell can be ensured, the yield is improved, and the processing and the production are convenient.
Description
Technical Field
The invention relates to the technical field of optical modules, in particular to an optical module and an optical module assembly.
Background
At present, in the production process of an optical module, insulation between a photoelectronic device and a shell in the optical module needs to be ensured, and the insulation treatment mode is to manually paste an insulating tape on the outside of the photoelectronic device and then place the photoelectronic device into the shell.
In view of this, it is important to design and manufacture an optical module and an optical module assembly that can ensure an insulation effect, especially in the production of the optical module.
Disclosure of Invention
The invention aims to provide an optical module which can ensure the insulation effect between an optoelectronic device and a shell, improve the yield and facilitate processing and production.
Another objective of the present invention is to provide an optical module assembly, which can ensure the insulation effect between the optoelectronic device and the housing, improve the yield, and facilitate the manufacturing process.
The invention is realized by adopting the following technical scheme.
An optical module comprises a shell, an optoelectronic device and an insulating layer, wherein an accommodating cavity is formed in the shell, the optoelectronic device is installed in the accommodating cavity, the insulating layer is coated on the inner side of the shell, and the insulating layer is used for insulating the optoelectronic device from the shell.
Further, the shell comprises a first shell and a second shell, the first shell and the second shell are detachably connected and jointly enclose an accommodating cavity, the insulating layer comprises a first insulating layer and a second insulating layer, the first insulating layer is coated on the inner side of the first shell, and the second insulating layer is coated on the inner side of the second shell. The first insulating layer is used for insulating the optoelectronic device and the first shell, and the second insulating layer is used for insulating the optoelectronic device and the second shell.
Further, the edge of the first shell is provided with a step part, and the second shell is covered outside the step part and matched with the step part. The second casing can shelter from step portion to improve the sealed effect between first casing and the second casing, prevent that the electromagnetic radiation that optoelectronic device sent from spilling, and can improve the pleasing to the eye degree of shell.
Further, the optical module further comprises a screw, the first shell is provided with a through hole, the second shell is provided with a threaded hole, and the screw is used for being matched with the threaded hole after penetrating through the through hole so as to fix the relative position of the first shell and the second shell. The first housing is prevented from being displaced relative to the second housing.
Further, the insulating layer is made of a polyethylene polymer polyester material.
Further, the thickness of the insulating layer is greater than 0 and less than or equal to 0.1 mm.
Furthermore, the photoelectronic device comprises an optical device, a circuit board and a wave-absorbing layer, wherein the optical device is connected with the circuit board, and the wave-absorbing layer is arranged between the circuit board and the insulating layer and is respectively attached to the circuit board and the insulating layer. The wave-absorbing layer is used for absorbing or greatly weakening the electromagnetic wave energy emitted by the circuit board, so that the electromagnetic radiation and the electromagnetic interference are reduced.
Further, the optical module still includes the buckle, and the mounting hole has been seted up to the buckle, and the part of optical device sets up in the mounting hole, and with the mounting hole cooperation, the optical device is used for being connected with optic fibre, and the buckle is used for spacing and fixed the joint of optic fibre. So as to realize the connection and fixation of the optical fiber and the optical device.
The optical module comprises a cage and the optical module, wherein the optical module is partially arranged in the cage and is clamped with the cage, the optical module comprises a shell, an optoelectronic device and an insulating layer, an accommodating cavity is formed in the shell, the optoelectronic device is arranged in the accommodating cavity, the insulating layer is coated on the inner side of the shell, and the insulating layer is used for insulating the optoelectronic device from the shell.
Further, the optical module includes the shell fragment, and the shell fragment is provided with first extension claw, and first extension claw cooperates with the inner wall of cage, and the cage is provided with the second and extends the claw, and the second extends the claw be used for with the inner wall cooperation of frame, first extension claw and second and extend the claw and all be used for preventing that electromagnetic radiation from spilling.
The optical module and the optical module assembly provided by the invention have the following beneficial effects:
the optical module provided by the invention has the advantages that the housing is internally provided with the accommodating cavity, the optoelectronic device is arranged in the accommodating cavity, the insulating layer is coated on the inner side of the housing and is used for insulating the optoelectronic device from the housing. Compared with the prior art, the optical module provided by the invention adopts the shell provided with the accommodating cavity and the insulating layer coated on the inner side of the shell, so that the insulating effect between the optoelectronic device and the shell can be ensured, the yield is improved, and the processing and the production are convenient.
The optical module assembly provided by the invention comprises the optical module, can ensure the insulation effect between the optoelectronic device and the shell, improves the yield, and is convenient to process and produce.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is an exploded view of an optical module assembly provided by an embodiment of the present invention;
fig. 2 is an exploded view of a light module provided in an embodiment of the present invention;
fig. 3 is a schematic structural diagram of an optoelectronic device mounted in a housing in an optical module according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of the first housing of FIG. 2;
FIG. 5 is a schematic structural view of the second housing of FIG. 2;
fig. 6 is a schematic structural diagram of an elastic sheet in an optical module according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of a cage in an optical module assembly according to an embodiment of the present invention.
Icon: 10-an optical module assembly; 100-an optical module; 110-a housing; 111-a containment cavity; 112-a receiving groove; 113-a first housing; 114-a second housing; 115-through holes; 116-a threaded hole; 117-step portion; 120-an optoelectronic device; 121-an optical device; 122-a circuit board; 123-wave absorbing layer; 130-an insulating layer; 131-a first insulating layer; 132-a second insulating layer; 140-buckling; 141-mounting holes; 150-a spring plate; 151-first extension jaw; 160-screws; 200-cage; 201-second extension claw.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "inside", "outside", "upper", "lower", "horizontal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships conventionally put in use of products of the present invention, and are only for convenience of description and simplicity of description, but do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "connected," "mounted," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Some embodiments of the invention are described in detail below with reference to the accompanying drawings. Features in the embodiments described below may be combined with each other without conflict.
At present, the mode that an insulating tape is manually pasted outside the photoelectronic device to insulate the photoelectronic device from the shell is inconvenient to produce and process, the condition that no insulation exists between the photoelectronic device and the shell due to inaccurate pasting positions of the insulating tape is easy to occur, and the yield is reduced. The present invention provides an optical module assembly 10 that does not require an insulating tape to be attached to the outside of an optoelectronic device, and that can ensure an insulating effect.
Referring to fig. 1, an embodiment of the invention provides an optical module assembly 10 for converting optical signals and electrical signals. The insulating effect between the photoelectronic device and the shell can be ensured, the yield is improved, and the processing and the production are convenient.
The light module assembly 10 includes a cage 200 and a light module 100. The optical module 100 extends into the cage 200, and a part of the optical module 100 is disposed in the cage 200 and is clamped with the cage 200, so as to detachably connect the optical module 100 and the cage 200. The optical module 100 is used for converting between an optical signal and an electrical signal, the cage 200 is used for limiting and fixing the optical module 100, and the cage 200 is also used for shielding electromagnetic radiation in the optical module 100. Specifically, the number of the cages 200 and the optical modules 100 is multiple, the cages 200 are arranged side by side, each optical module 100 extends into one cage 200 and is clamped with the cage 200, and the cages 200 can shield electromagnetic radiation in the optical modules 100 to prevent the electromagnetic radiation between the optical modules 100 from interfering with each other.
Referring to fig. 2, fig. 3, fig. 4 and fig. 5, the optical module 100 includes a housing 110, an optoelectronic device 120, an insulating layer 130, a clip 140 and a spring 150. The housing 110 is provided with a receiving cavity 111 therein, the optoelectronic device 120 is installed in the receiving cavity 111, and the housing 110 is used for shielding and protecting the optoelectronic device 120. The insulating layer 130 is coated on the inner side of the housing 110, the insulating layer 130 is disposed between the housing 110 and the optoelectronic device 120, and the insulating layer 130 is used for insulating the optoelectronic device 120 and the housing 110, so as to meet the insulating requirement of the optical module 100.
It should be noted that the latch 140 is disposed in the receiving cavity 111, the housing 110 can shield and protect the latch 140, and the latch 140 is used for cooperating with a connector of an optical fiber to define a position of the optical fiber. The elastic sheet 150 is sleeved outside the housing 110, and the elastic sheet 150 is used for matching with the cage 200 to prevent electromagnetic radiation in the optical module 100 from leaking out. In this embodiment, buckle 140 integrated into one piece sets up, and production processes is simple, and intensity is high. The outer side of the housing 110 is provided with a receiving groove 112, the elastic sheet 150 is disposed in the receiving groove 112, and the receiving groove 112 can limit the position of the elastic sheet 150.
In this embodiment, the insulating layer 130 is made of polyethylene polymer polyester material, which has good insulating property. But not limited thereto, in other embodiments, the insulating layer 130 may be made of a polyamideimide material, the insulating layer 130 may also be made of a polyimide material, and the material for making the insulating layer 130 is not particularly limited.
In this embodiment, the insulating layer 130 is insulating paint, and the coating manner of the insulating layer 130 is spraying, which is convenient and fast, but not limited thereto, in other embodiments, the coating manner of the insulating layer 130 may be brush coating, chemical deposition, physical deposition, and the like, and the coating manner of the insulating layer 130 is not particularly limited.
It should be noted that the thickness of the insulating layer 130 is greater than 0 and less than or equal to 0.1 mm, so as to avoid affecting the volume inside the accommodating cavity 111 and ensure sufficient insulating effect. In this embodiment, the thickness of the insulating layer 130 is 0.05 mm, but the invention is not limited thereto, and in other embodiments, the thickness of the insulating layer 130 may be 0.01 mm or 0.1 mm, and the thickness of the insulating layer 130 is not particularly limited.
The outer case 110 includes a first case 113 and a second case 114. The first casing 113 and the second casing 114 are detachably connected and jointly enclose the accommodating cavity 111, and the optoelectronic device 120 is disposed between the first casing 113 and the second casing 114. In this embodiment, the optical module 100 further includes a screw 160, the first housing 113 is provided with a through hole 115, the second housing 114 is provided with a threaded hole 116, the through hole 115 is used for the screw 160 to pass through, the threaded hole 116 is used for matching with the screw 160, and the screw 160 is used for matching with the threaded hole 116 after passing through the through hole 115 to fix the relative position of the first housing 113 and the second housing 114, so as to prevent the first housing 113 from displacing relative to the second housing 114. Specifically, the through hole 115 is located at a position corresponding to the threaded hole 116, and the screw 160 passes through the through hole 115 and is tightened with respect to the threaded hole 116 to fixedly mount the first housing 113 to the second housing 114, preventing the first housing 113 from being displaced with respect to the second housing 114.
Further, the number of the through holes 115, the number of the threaded holes 116 and the number of the screws 160 are four, four through holes 115 are arranged on the first housing 113 in a rectangular array, each through hole 115 corresponds to the position of one threaded hole 116, each screw 160 passes through one through hole 115 and is matched with one threaded hole 116, and the plurality of screws 160 cooperate to further fix the relative positions of the first housing 113 and the second housing 114 and prevent the first housing 113 from being displaced relative to the second housing 114.
The insulating layer 130 includes a first insulating layer 131 and a second insulating layer 132, the first insulating layer 131 and the second insulating layer 132 together enclose a cavity, the optoelectronic device 120 is disposed in the cavity, and the first insulating layer 131 and the second insulating layer 132 together function to insulate the optoelectronic device 120. A first insulating layer 131 is coated and arranged on the inner side of the first shell 113, the first insulating layer 131 is arranged between the first shell 113 and the optoelectronic device 120, and the first insulating layer 131 is used for insulating the optoelectronic device 120 and the first shell 113; the second insulating layer 132 is coated and disposed on the inner side of the second casing 114, the second insulating layer 132 is disposed between the second casing 114 and the optoelectronic device 120, and the second insulating layer 132 is used for insulating the optoelectronic device 120 and the second casing 114.
It is worth noting that a step 117 is disposed at an edge of the first casing 113, the second casing 114 is disposed outside the step 117 and is matched with the step 117, and the second casing 114 can shield the step 117, so as to improve a sealing effect between the first casing 113 and the second casing 114, prevent electromagnetic radiation emitted by the optoelectronic device 120 from leaking out, and improve an aesthetic degree of the housing 110.
The optoelectronic device 120 includes an optical device 121, a circuit board 122, and a wave-absorbing layer 123. The optical device 121 is connected to the circuit board 122 to convert an optical signal and an electrical signal. The wave-absorbing layer 123 is disposed between the circuit board 122 and the insulating layer 130, and is respectively attached to the circuit board 122 and the insulating layer 130, and the wave-absorbing layer 123 is configured to absorb or substantially weaken electromagnetic wave energy emitted from the circuit board 122, so as to reduce electromagnetic radiation and electromagnetic interference. The wave-absorbing layer 123 is a conductor, and the insulating layer 130 is attached to the wave-absorbing layer 123 to insulate the wave-absorbing layer 123 from the outer shell 110.
In this embodiment, the buckle 140 has a mounting hole 141, the optical device 121 passes through the mounting hole 141, a portion of the optical device 121 is disposed in the mounting hole 141 and is engaged with the mounting hole 141, the mounting hole 141 can limit the optical device 121, and the optical device 121 is used for being connected to an optical fiber to input an optical signal. The clip 140 is used to limit and fix the connector of the optical fiber, so as to facilitate connection and fixation of the optical fiber to the optical device 121.
Referring to fig. 6 and 7, in the present embodiment, the elastic sheet 150 is provided with a first extending claw 151, and the first extending claw 151 can be matched with an inner wall of the cage 200 and tightly contacted with the inner wall when the optical module 100 is clamped with the cage 200, so as to prevent electromagnetic radiation from leaking. The cage 200 is provided with second extension claws 201, and the second extension claws 201 are adapted to be fitted to an inner wall of an outer frame (not shown) and closely contacted to prevent electromagnetic radiation from leaking out. Specifically, the number of the first extending claws 151 is plural, and the plural first extending claws 151 are arranged on the elastic sheet 150 side by side; the number of the second extending claws 201 is plural, and the second extending claws 201 are arranged side by side on the cage 200. Since the spring plate 150, the cage 200, and the outer frame are all conductors, electromagnetic radiation can be shielded and prevented from leaking.
In the optical module 100 provided in the embodiment of the present invention, the housing 110 is provided with the accommodating cavity 111, the optoelectronic device 120 is installed in the accommodating cavity 111, the insulating layer 130 is coated on the inner side of the housing 110, and the insulating layer 130 is used for insulating the optoelectronic device 120 from the housing 110. Compared with the prior art, the optical module 100 provided by the invention adopts the shell 110 provided with the accommodating cavity 111 and the insulating layer 130 coated on the inner side of the shell 110, so that the insulating effect between the optoelectronic device 120 and the shell 110 can be ensured, the yield is improved, and the processing and the production are convenient. The optical module assembly 10 is reliable and practical, and the user experience is good.
The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The optical module is characterized by comprising a shell, an optoelectronic device and an insulating layer, wherein a containing cavity is formed in the shell, the optoelectronic device is installed in the containing cavity, the insulating layer is coated on the inner side of the shell, and the insulating layer is used for insulating the optoelectronic device and the shell.
2. The optical module according to claim 1, wherein the housing includes a first shell and a second shell, the first shell and the second shell are detachably connected and jointly enclose the accommodating cavity, the insulating layer includes a first insulating layer and a second insulating layer, the first insulating layer is coated on an inner side of the first shell, and the second insulating layer is coated on an inner side of the second shell.
3. The optical module according to claim 2, wherein a step is provided on an edge of the first housing, and the second housing is covered outside the step and is engaged with the step.
4. The optical module according to claim 2, further comprising a screw, wherein the first housing is provided with a through hole, the second housing is provided with a threaded hole, and the screw is configured to fit with the threaded hole after passing through the through hole, so as to fix a relative position of the first housing and the second housing.
5. The optical module of claim 1, wherein the insulating layer is made of a polyethylene polymer polyester material.
6. The optical module of claim 1, wherein the thickness of the insulating layer is greater than 0 and less than or equal to 0.1 mm.
7. The optical module according to claim 1, wherein the optoelectronic device comprises an optical device, a circuit board and a wave-absorbing layer, the optical device is connected with the circuit board, and the wave-absorbing layer is arranged between the circuit board and the insulating layer and respectively attached to the circuit board and the insulating layer.
8. The optical module according to claim 7, further comprising a buckle, wherein the buckle has a mounting hole, a portion of the optical device is disposed in the mounting hole and is engaged with the mounting hole, the optical device is configured to be connected to an optical fiber, and the buckle is configured to limit and fix a connector of the optical fiber.
9. A light module assembly comprising a cage and a light module as claimed in any one of claims 1 to 8, part of the light module being disposed within the cage and being snapped into the cage.
10. The optical module assembly of claim 9, wherein the optical module comprises a spring plate, wherein the spring plate is provided with a first extending claw, the first extending claw is engaged with an inner wall of the cage, the cage is provided with a second extending claw, the second extending claw is used for engaging with an inner wall of an outer frame, and the first extending claw and the second extending claw are both used for preventing electromagnetic radiation from leaking out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011498435.5A CN112433310A (en) | 2020-12-17 | 2020-12-17 | Optical module and optical module subassembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011498435.5A CN112433310A (en) | 2020-12-17 | 2020-12-17 | Optical module and optical module subassembly |
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| Publication Number | Publication Date |
|---|---|
| CN112433310A true CN112433310A (en) | 2021-03-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011498435.5A Pending CN112433310A (en) | 2020-12-17 | 2020-12-17 | Optical module and optical module subassembly |
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| Country | Link |
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| CN (1) | CN112433310A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023201908A1 (en) * | 2022-04-21 | 2023-10-26 | 武汉光迅科技股份有限公司 | Optical element fixation structure |
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|---|---|---|---|---|
| WO2015198667A1 (en) * | 2014-06-27 | 2015-12-30 | 三菱電機株式会社 | Optical transmitter-receiver |
| CN106526765A (en) * | 2017-01-03 | 2017-03-22 | 温州意华接插件股份有限公司 | QSFP interface assembly |
| CN106772833A (en) * | 2016-12-07 | 2017-05-31 | 青岛海信宽带多媒体技术有限公司 | A kind of optical module |
| CN209525488U (en) * | 2019-03-21 | 2019-10-22 | 武汉联特科技有限公司 | A kind of optical module |
| CN211267247U (en) * | 2020-02-26 | 2020-08-14 | 维沃移动通信有限公司 | Circuit board and electronic equipment |
| CN111999829A (en) * | 2020-09-24 | 2020-11-27 | 武汉锐奥特科技有限公司 | Embedded optical module and assembling method thereof |
-
2020
- 2020-12-17 CN CN202011498435.5A patent/CN112433310A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015198667A1 (en) * | 2014-06-27 | 2015-12-30 | 三菱電機株式会社 | Optical transmitter-receiver |
| CN106772833A (en) * | 2016-12-07 | 2017-05-31 | 青岛海信宽带多媒体技术有限公司 | A kind of optical module |
| CN106526765A (en) * | 2017-01-03 | 2017-03-22 | 温州意华接插件股份有限公司 | QSFP interface assembly |
| CN209525488U (en) * | 2019-03-21 | 2019-10-22 | 武汉联特科技有限公司 | A kind of optical module |
| CN211267247U (en) * | 2020-02-26 | 2020-08-14 | 维沃移动通信有限公司 | Circuit board and electronic equipment |
| CN111999829A (en) * | 2020-09-24 | 2020-11-27 | 武汉锐奥特科技有限公司 | Embedded optical module and assembling method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023201908A1 (en) * | 2022-04-21 | 2023-10-26 | 武汉光迅科技股份有限公司 | Optical element fixation structure |
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Application publication date: 20210302 |