CN203811851U - Light transceiver module - Google Patents

Light transceiver module Download PDF

Info

Publication number
CN203811851U
CN203811851U CN201420131490.4U CN201420131490U CN203811851U CN 203811851 U CN203811851 U CN 203811851U CN 201420131490 U CN201420131490 U CN 201420131490U CN 203811851 U CN203811851 U CN 203811851U
Authority
CN
China
Prior art keywords
metal shielding
shielding board
osa
upper cover
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201420131490.4U
Other languages
Chinese (zh)
Inventor
王自力
彭奇
黄远军
许远忠
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Source Photonics Chengdu Co Ltd
Original Assignee
Source Photonics Chengdu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Source Photonics Chengdu Co Ltd filed Critical Source Photonics Chengdu Co Ltd
Priority to CN201420131490.4U priority Critical patent/CN203811851U/en
Application granted granted Critical
Publication of CN203811851U publication Critical patent/CN203811851U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

The utility model relates to a light transceiver module. The module comprises a light port and an electricity port that are disposed at the two ends of a housing. An OSA is disposed at the side, which is near the light port, of the housing, and a PCB is disposed at the side, which is near the electricity port, of the housing. The housing comprises a base and an upper cover. A metal shield plate is disposed between the OSA and the upper cover. The lower end of the metal shield plate is provided with a plug port. The neck part of the OSA is in electric connection with the housing through the metal shield plate. Thus, the neck part of the OSA is connected to the ground through the housing, and the EMI in the OSA is eliminated. Furthermore, since the metal shield plate can separate the OSA from the electricity port in space, the EMI is prevented from directly penetrating from the gap between the OSA and the housing.

Description

A kind of optical transceiver module
Technical field
The utility model relates to a kind of photoelectric device, particularly a kind of optical transceiver module.
Background technology
Integrated module of optical transceiver major function is to realize photoelectricity/electro-optical conversion, being called for short optical module, conventionally optoelectronic device, functional circuit and optical interface etc., consisting of, is the important component part of optical fiber telecommunications system, according to the difference of packing forms, be mainly divided into SFP, GBIC, XFP etc.Wherein, SFP optical module is the little package module of hot plug, and the volume ratio GBIC module of SFP optical module reduces half, can on identical panel, configure and have more more than one times port number, and other function fundamental sums GBIC optical module is consistent.
There is EMI leakage problem in existing many optical modules, for example: SFP module is given prominence to outside frame, they probably produce EMI, or the EMI of leakage system inside, therefore, how to avoid EMI scattering is the technical matters of wanting solution in optical module field always, and existing optical module mainly exists following weak point:
1, between existing housing and OSA neck, have space, the electromagnetic radiation of enclosure interior is very easily held and is spread out formation electromagnetic interference (EMI) by OSA;
2, existing optical module is assembled by seam by upper shell, lower house conventionally, because upper and lower casing supports by rigid, the electromagnetic wave of specific wavelength, wave band can be just from the formation electromagnetic interference (EMI) that sheds of the seam crossing between upper and lower casing;
3, existing circuit board is made by the spaced sheet metal of some layers conventionally, and thereby circuit board itself is owing to easily occurring short circuit phenomenon after being directly connected with housing, cannot directly be connected to come conductive earthing to eliminate electromagnetic radiation with housing, therefore, after circuit board energising, still there is more serious electromagnetic interference (EMI).
Utility model content
Goal of the invention of the present utility model is: the problem existing for prior art, provides a kind of enclosure interior EMI that can effectively reduce to the optical module of external diffusion.
To achieve these goals, the technical solution adopted in the utility model is:
A kind of optical transceiver module, comprise the light mouth and the electricity mouthful that are divided into housing two ends, described enclosure interior is provided with OSA near a side of light mouth, described enclosure interior is provided with PCB circuit board near a side of electricity mouth, described housing comprises base and upper cover, between described OSA and upper cover, be provided with metal shielding board, the lower end of described metal shielding board is provided with interface, and described metal shielding board is electrically connected to the neck of OSA by interface; The inner side of described upper cover is provided with for holding the mounting groove of metal shielding board, the groove width of described mounting groove is greater than the thickness of metal shielding board, on described metal shielding board, be provided with elastic press, one end of described elastic press is electrically connected to metal shielding board, and the other end of described elastic press is outwards given prominence to and is electrically connected to mounting groove along the thickness direction of metal shielding board.
It should be noted that, OSA herein comprises TOSA and/or the ROSA that is divided into the left and right sides in housing, and OSA neck is column.
Adopt such structure, by metal shielding board, OSA neck is electrically connected to housing, make the OSA neck can be by frame ground, thereby the EMI on OSA is dredged; In addition, because metal shielding board itself can carry out barrier to the space between OSA and electricity mouth from space, thereby reduce EMI, directly by the space between OSA and housing, pass.
Preferably, between described metal shielding board and base, be provided with conducting foam.Adopt such structure, the conducting foam by flexible material is closely connected metal shielding board with base, has the better beneficial effect of stability of electrical connection.
Preferably, described elastic press is bent to form by the sidepiece of metal shielding board, and the end of described elastic press is crimped on mounting groove.Adopt such structure, have be electrically connected to that stability is better, convenient processing and manufacture, dismounting beneficial effect easily.
Preferably, described metal shielding board is flexible board, and the width of the interface of described metal shielding board lower end is less than OSA neck external diameter.Adopt such structure, the interface of metal shielding board and OSA neck closely cassette are connected, and have the better beneficial effect of the stability of electrical connection.
Preferably, the both sides of described upper cover are respectively provided with one for holding the mounting groove of metal shielding board.Adopt such structure, the left and right sides of metal shielding board is connected in respectively in two mounting grooves in about upper cover, and easy accessibility, connective stability are good.
Preferably, the both sides of described base are respectively provided with a side shield extending upward, the link slot that the biside plate of described upper cover caves in to the inside, the outer wall of described two link slots is limited between the inwall of two side shields, the upper surface indentation of described side shield, the mating surface indentation of described link slot and side shield upper surface.Adopt such structure, be different from existing base with upper cover, be connected in flush joint mode, by base is arranged to after zigzag with the mating surface that is connected of upper cover, avoided wavelength, the corresponding electromagnetic wave of wave band in housing just from flush joint, to pass, there is better effectiveness.
Preferably, the lower surface indentation of the link slot of described upper cover, side shield inner side on described base, with the mating surface indentation of link slot lower surface.Adopt such structure, by set up one group of jagged mating surface in the inner side of base and upper cover, further avoided wavelength, the corresponding electromagnetic wave of wave band in housing just from flush joint, to pass, there is better effectiveness.
Preferably, between described PCB circuit board and upper cover, be provided with conducting foam, on described PCB circuit board, be provided with several plated through-holes, described plated through-hole through-thickness runs through PCB circuit board, the upper surface of described conducting foam is electrically connected to upper cover, and the lower surface of described conducting foam is electrically connected to plated through-hole.Adopt such structure, by the plated through-hole running through is set on PCB circuit board, metal sandwich on PCB circuit board is electrically connected to conducting foam by plated through-hole, finally by being electrically connected to of conductive foam and upper cover, by the metal sandwich in PCB circuit board and housing conducting.
Preferably, described plated through-hole is spaced along the Width of PCB circuit board.Adopt such structure, plated through-hole is arranged and is the structure that is similar to fence on PCB circuit board, is more conducive to eliminate the EMI in PCB circuit board.
In sum, owing to having adopted technique scheme, the beneficial effects of the utility model are:
1, by metal shielding board, OSA neck is electrically connected to housing, makes the OSA neck can be by frame ground, thereby the EMI on OSA is dredged; In addition, because metal shielding board itself can carry out barrier to the space between OSA and electricity mouth from space, thereby reduce EMI, directly by the space between OSA and housing, pass.
2, be different from existing base with upper cover, be connected in flush joint mode, by base is arranged to after zigzag with the mating surface that is connected of upper cover, avoid wavelength, the corresponding electromagnetic wave of wave band in housing just from flush joint, to pass, there is better effectiveness.
3, by the plated through-hole running through is set on PCB circuit board, metal sandwich on PCB circuit board is electrically connected to conducting foam by plated through-hole, finally by being electrically connected to of conductive foam and upper cover, by the metal sandwich in PCB circuit board and housing conducting.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
The schematic diagram of Fig. 2 the utility model inner structure;
Fig. 3 is the local enlarged diagram of the utility model inner structure;
Fig. 4 is the perspective view of upper cover in the utility model.
Mark in figure: housing-1; Base-1a; Upper cover-1b; OSA-2; PCB circuit board-3; Metal shielding board-4; Interface-5; Mounting groove-6; Elastic press-7; Conducting foam-8; Side shield-9; Link slot-10; Plated through-hole-11.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in detail.
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.
As shown in Figures 1 to 4, a kind of optical transceiver module of the present embodiment, comprise the light mouth and the electricity mouthful that are divided into housing 1 two ends, wherein light mouth is the one end that is provided with OSA2, be positioned at right-hand member shown in Fig. 1, electricity mouthful is the one end that is provided with PCB circuit board 3, be positioned at 1 left end of housing shown in Fig. 1, the inner side near light mouth of housing 1 is provided with OSA2, OSA2 comprises TOSA and/or the ROSA that is divided into the housing 1 interior left and right sides, in the present embodiment, OSA is optical module, OSA2 neck is column, the inner side near electricity mouth of housing 1 is provided with PCB circuit board 3, housing 1 comprises base 1a and upper cover 1b, between OSA2 and upper cover 1b, be provided with metal shielding board 4, the lower end of metal shielding board 4 is provided with interface 5, metal shielding board 4 is electrically connected to the neck of OSA2 by interface 5, the inner side of upper cover 1b is provided with for holding the mounting groove 6 of metal shielding board 4, the groove width of mounting groove 6 is greater than the thickness of metal shielding board 4, concrete, the both sides of upper cover 1b are respectively provided with one for holding the mounting groove 6 of metal shielding board 4, the left and right sides of metal shielding board 4 is connected in respectively in two mounting grooves 6 in about upper cover 1b, and easy accessibility, connective stability are good.On metal shielding board 4, be provided with elastic press 7, one end of elastic press 7 is electrically connected to metal shielding board 4, the other end of elastic press 7 is outwards outstanding along the thickness direction of metal shielding board 4, and be electrically connected to mounting groove 6, wherein, elastic press 7 is bent to form by the sidepiece of metal shielding board 4, the end of elastic press 7 is crimped on mounting groove 6, it is better that such elastic press 7 has the stability of electrical connection, convenient processing and manufacture, dismounting is beneficial effect easily, in the present embodiment, in order to promote electrical connection stability, between metal shielding board 4 and base 1a, be provided with conducting foam 8, in the present embodiment, in order to promote electrical connection stability, metal shielding board 4 is flexible board, the width of the interface 5 of metal shielding board 4 lower ends is less than OSA2 neck external diameter, the interface 5 that such structure makes metal shielding board 4 and OSA2 neck closely cassette are connected.
By metal shielding board 4, OSA2 neck is electrically connected to housing 1, makes the OSA2 neck can be by housing 1 ground connection, thereby the EMI on OSA2 is dredged; In addition, because metal shielding board 4 itself can carry out barrier to the space between OSA2 and electricity mouth from space, thereby reduce EMI, directly by the space between OSA2 and housing 1, pass.
Further, in the present embodiment, the both sides of base 1a are respectively provided with a side shield 9 extending upward, the link slot 10 that the biside plate of upper cover 1b caves in to the inside, the outer wall of two link slots 10 is limited between the inwall of two side shields 9, the upper surface indentation of side shield 9, the mating surface indentation of link slot 10 and side shield 9 upper surfaces.Adopt such structure, be different from existing base 1a with upper cover 1b, be connected in flush joint mode, by base 1a is arranged to after zigzag with the mating surface that is connected of upper cover 1b, avoided the interior wavelength of housing 1, the corresponding electromagnetic wave of wave band just from flush joint, to pass, there is better effectiveness, the lower surface indentation of the link slot 10 of upper cover 1b, the upper side shield of base 1a 9 inner sides, with the mating surface indentation of link slot 10 lower surfaces.Adopt such structure, by setting up one group of jagged mating surface in the inner side of base 1a and upper cover 1b, further avoided the interior wavelength of housing 1, the corresponding electromagnetic wave of wave band just from flush joint, to pass, there is better effectiveness.
Further, in the present embodiment, between PCB circuit board 3 and upper cover 1b, be provided with conducting foam 8, on PCB circuit board 3, be provided with several plated through-holes 11, plated through-hole 11 through-thickness run through PCB circuit board 3, the upper surface of conducting foam 8 is electrically connected to upper cover 1b, and the lower surface of conducting foam 8 is electrically connected to plated through-hole 11.Adopt such structure, by the plated through-hole 11 running through is set on PCB circuit board 3, metal sandwich on PCB circuit board 3 is electrically connected to conducting foam 8 by plated through-hole 11, finally by being electrically connected to of conductive foam and upper cover 1b, by the metal sandwich in PCB circuit board 3 and housing 1 conducting, plated through-hole 11 is spaced along the Width of PCB circuit board 3.Adopt such structure, plated through-hole 11 is arranged and is the structure that is similar to fence on PCB circuit board 3, is more conducive to eliminate the EMI in PCB circuit board 3.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all any modifications of doing within spirit of the present utility model and principle, be equal to and replace and improvement etc., within all should being included in protection domain of the present utility model.

Claims (7)

1. an optical transceiver module, comprise the light mouth and the electricity mouthful that are divided into housing two ends, described enclosure interior is provided with OSA near a side of light mouth, described enclosure interior is provided with PCB circuit board near a side of electricity mouth, described housing comprises base and upper cover, it is characterized in that: between described OSA and upper cover, be provided with metal shielding board, the lower end of described metal shielding board is provided with interface, described metal shielding board is electrically connected to the neck of OSA by interface; The inner side of described upper cover is provided with for holding the mounting groove of metal shielding board, the groove width of described mounting groove is greater than the thickness of metal shielding board, on described metal shielding board, be provided with elastic press, one end of described elastic press is electrically connected to metal shielding board, and the other end of described elastic press is outwards given prominence to and is electrically connected to mounting groove along the thickness direction of metal shielding board.
2. optical transceiver module according to claim 1, is characterized in that: between described metal shielding board and base, be provided with conducting foam.
3. optical transceiver module according to claim 2, is characterized in that: described elastic press is bent to form by the sidepiece of metal shielding board, and the end of described elastic press is crimped on mounting groove.
4. optical transceiver module according to claim 3, is characterized in that: described metal shielding board is flexible board, and the width of the interface of described metal shielding board lower end is less than OSA neck external diameter.
5. optical transceiver module according to claim 4, is characterized in that: the both sides of described upper cover are respectively provided with one for holding the mounting groove of metal shielding board.
6. according to arbitrary described optical transceiver module in claim 1 to 5, it is characterized in that: between described PCB circuit board and upper cover, be provided with conducting foam, on described PCB circuit board, be provided with several plated through-holes, described plated through-hole through-thickness runs through PCB circuit board, the upper surface of described conducting foam is electrically connected to upper cover, and the lower surface of described conducting foam is electrically connected to plated through-hole.
7. optical transceiver module according to claim 6, is characterized in that: described plated through-hole is spaced along the Width of PCB circuit board.
CN201420131490.4U 2014-03-21 2014-03-21 Light transceiver module Active CN203811851U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420131490.4U CN203811851U (en) 2014-03-21 2014-03-21 Light transceiver module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420131490.4U CN203811851U (en) 2014-03-21 2014-03-21 Light transceiver module

Publications (1)

Publication Number Publication Date
CN203811851U true CN203811851U (en) 2014-09-03

Family

ID=51450584

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420131490.4U Active CN203811851U (en) 2014-03-21 2014-03-21 Light transceiver module

Country Status (1)

Country Link
CN (1) CN203811851U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105572816A (en) * 2015-12-23 2016-05-11 宁波环球广电科技有限公司 Multichannel parallel light transmitting and receiving module
CN108828732A (en) * 2018-06-20 2018-11-16 青岛海信宽带多媒体技术有限公司 Optical module
CN111239934A (en) * 2020-03-18 2020-06-05 青岛海信宽带多媒体技术有限公司 Optical module
CN113791475A (en) * 2021-08-25 2021-12-14 武汉兴思为光电科技有限公司 Optical module and communication device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105572816A (en) * 2015-12-23 2016-05-11 宁波环球广电科技有限公司 Multichannel parallel light transmitting and receiving module
CN108828732A (en) * 2018-06-20 2018-11-16 青岛海信宽带多媒体技术有限公司 Optical module
CN111239934A (en) * 2020-03-18 2020-06-05 青岛海信宽带多媒体技术有限公司 Optical module
CN111239934B (en) * 2020-03-18 2021-08-24 青岛海信宽带多媒体技术有限公司 Optical module
CN113791475A (en) * 2021-08-25 2021-12-14 武汉兴思为光电科技有限公司 Optical module and communication device

Similar Documents

Publication Publication Date Title
CN203811851U (en) Light transceiver module
USRE48778E1 (en) Optical module and assembly method thereof
JP5869274B2 (en) Communication device cage
US9039301B2 (en) Optical transceiver having enhanced EMI tolerance
JP5732699B2 (en) Touch control screen and mobile communication device
US10288825B2 (en) Optical module
US7994434B2 (en) Electromagnetic interference shielding apparatus and method
US20130178102A1 (en) Cable assembly having shielding plates between conductive wires for crosstalk reduction
CN102714379A (en) Shielded connector
US9042722B2 (en) Optical transceiver having enhanced EMI tolerance
CN204669368U (en) A kind of integrated module of optical transceiver
CN106461888B (en) Optical transceiver
US20040116165A1 (en) Small form factor transceiver
JP2015001563A (en) Optical module
TWM517932U (en) High frequency connector continuously grounding to improve crosstalk
JP2013029639A (en) Optical connector and electromagnetic noise reflector
CN106873097A (en) A kind of optical module
JP2018017861A (en) Optical module
CN203691413U (en) Anti-electromagnetic interference light transceiver module
CN205176335U (en) Optical module
TWM505729U (en) A high frequency connector structure
EP1510844A1 (en) An optical fibre connector with electromagnetic shielding
TW201628290A (en) Electrical connector
CN204408844U (en) The electromagnetic screen of light-emitting device
CN203691414U (en) High-speed hot swap micro light transceiver module

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant