CN203691414U - High-speed hot swap micro light transceiver module - Google Patents

High-speed hot swap micro light transceiver module Download PDF

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Publication number
CN203691414U
CN203691414U CN201420025752.9U CN201420025752U CN203691414U CN 203691414 U CN203691414 U CN 203691414U CN 201420025752 U CN201420025752 U CN 201420025752U CN 203691414 U CN203691414 U CN 203691414U
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CN
China
Prior art keywords
wave absorption
module
electro
magnetic wave
attenuating device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201420025752.9U
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Chinese (zh)
Inventor
何伟强
张晓峰
许君
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Neo Photonic Technology Co Ltd
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Shenzhen Neo Photonic Technology Co Ltd
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Priority to CN201420025752.9U priority Critical patent/CN203691414U/en
Application granted granted Critical
Publication of CN203691414U publication Critical patent/CN203691414U/en
Active legal-status Critical Current
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Abstract

The utility model provides a high-speed hot swap micro light transceiver module. The high-speed hot swap micro light transceiver module comprises a foundation, an upper cover and a PCB, wherein a gold finger end of the PCB stretches out from an inner side part to an outer side part of the module to connect with an external electrical interface, corresponding to the circumference of the connection space, two side surfaces at a tail portion of the module foundation are provided with a first electromagnetic wave absorption attenuating device, a bottom face of the module foundation is provided with a second electromagnetic wave absorption attenuating device, an opening area formed between the foundation and the upper cover is provided with a third electromagnetic wave absorption attenuating device, and the first, second and third electromagnetic wave absorption attenuating devices are prepared by electromagnetic wave absorption attenuating sheets through pasting and fixing or electromagnetic wave absorption attenuating coating layers. When the module is inserted into a host computer cage, the external electrical interface and the gold finger of the PCB stretching out from the tail end of the module are electrically connected, and thereby anti-electromagnetic interference capability of the module can be further improved.

Description

A kind of high speed hot plug small optical transceiving modular
Technical field
The utility model relates to the above high speed hot plug of a kind of 10G small optical transceiving modular.
Background technology
The above high speed hot plug of 10G small optical transceiving modular (Pluggable Small Form Factor Transceiver), relates to electromagnetic interference EMI (Electromagnetic Interference, hereinafter to be referred as EMI) more and more.EMI is the electromagnetic interference being produced by optical transceiver module internal electronic component.Between the metallic packaging base of high rate optical transceiver module and upper cover owing to being that rigid member is connected, can there is certain gap at its faying face, especially easily cause the electromagnetic wave that module produces to go out and produce EMI from clearance leakage, easily make other electron component normally move.Especially in the time that optical transceiver module speed increases, identical gap will decline greatly to the shield effectiveness of frequency electromagnetic waves.Electromagnetic shielding is to utilize shield to produce attenuation to electromagnetic wave, causes interference or injury thereby reduce electromagnetic wave.Material as shielding is divided into high conductivity material and high-permeability material.Wherein the shielding principle of electric conducting material is to utilize it under electromagnetic effect, will to produce larger induced current, these electric currents will weaken electromagnetic passing through according to Lenz's law, the frequency electromagnetic waves that the electronic devices and components of inside of shield casings produce, is unlikely to affect external equipment or human-body safety.For the electromagnetic shielding of optical transceiver module, adopt in theory one-piece encapsulation, its EMI shield effectiveness is best, but in practical application, and because design and assembling need, integral seamless encapsulation is difficult to often to realize the installation of internal component and fixes.Conventionally electronic devices and components are installed in metab, sealed by a upper cover, will certainly there is some openings and gap in the problem due to machining accuracy between base and upper cover, the electromagnetic wave in module will leak from these openings and gap, affects effectiveness.At present, have good solution for the anti-electromagnetic interference scheme of inside modules.But, in the time that module is inserted main frame cage, after the pcb board golden finger that outside electrical interface stretches out with module tail end is electrically connected, can produce too electromagnetic interference, affect the serviceability of module.
Utility model content
For overcoming above shortcoming, the utility model provides a kind of high speed hot plug small optical transceiving modular of anti-electromagnetic interference.
The utility model provides a kind of high speed hot plug small optical transceiving modular, comprise: a base, a upper cover, a PCB circuit board, described pcb board golden finger end protruding and outside electrical interface in module is connected, corresponding to this connection space surrounding, the two sides of tail surface of described module base is provided with the first electro-magnetic wave absorption attenuating device, the bottom surface of module base is provided with the second electro-magnetic wave absorption attenuating device, and the open area forming between described base and upper cover is provided with the 3rd electro-magnetic wave absorption attenuating device.
Described first, second and third electro-magnetic wave absorption attenuating device is that the stickup of electro-magnetic wave absorption attenuator is fixing.
Described first, second and third electro-magnetic wave absorption attenuating device is electro-magnetic wave absorption decay coating.
Due to the high speed hot plug small optical transceiving modular of said structure, because two sides of tail surface and the bottom surface thereof of module base are respectively equipped with first, second electro-magnetic wave absorption attenuating device, and the open area forming between base and upper cover is also provided with the 3rd electro-magnetic wave absorption attenuating device, like this, in the time that module is inserted main frame cage, after the pcb board golden finger that outside electrical interface stretches out with module tail end is electrically connected, can further improve the anti-electromagnetic interference capability of module.
Accompanying drawing explanation
Fig. 1 represents the utility model high speed hot plug small optical transceiving modular structural representation.
Embodiment
Describe the utility model most preferred embodiment in detail below in conjunction with accompanying drawing.
High speed hot plug small optical transceiving modular as shown in Figure 1, comprise: a base 10, a upper cover 20, a PCB circuit board 30, described pcb board golden finger end protruding and outside electrical interface in module is connected, corresponding to this connection space surrounding, owing to there being electromagnetic interference, therefore be provided with the first electro-magnetic wave absorption attenuating device 11 on the two sides of tail surface of module base 10, the bottom surface of module base 10 is provided with the second electro-magnetic wave absorption attenuating device 12, and the open area forming between described base 10 and upper cover 20 is provided with the 3rd electro-magnetic wave absorption attenuating device 13.Wherein, it is fixing that described first, second and third electro-magnetic wave absorption attenuating device 11,12,13 can adopt electro-magnetic wave absorption attenuator to paste, and also can adopt electro-magnetic wave absorption decay coating.
Due to the high speed hot plug small optical transceiving modular of said structure, because two sides of tail surface and the bottom surface thereof of module base 10 are respectively equipped with first, second electro-magnetic wave absorption attenuating device 11,12, and the open area forming between base 10 and upper cover 20 is also provided with the 3rd electro-magnetic wave absorption attenuating device 13, like this, in the time that module is inserted main frame cage, after outside electrical interface is electrically connected with pcb board 30 golden fingers, the anti-electromagnetic interference capability of module can further improve.

Claims (3)

1. a high speed hot plug small optical transceiving modular, comprise: a base (10), one upper cover (20), one PCB circuit board (30), it is characterized in that, described pcb board golden finger end protruding and outside electrical interface in module is connected, corresponding to this connection space surrounding, the two sides of tail surface of described module base (10) is provided with the first electro-magnetic wave absorption attenuating device (11), the bottom surface of module base (10) is provided with the second electro-magnetic wave absorption attenuating device (12), the open area forming between described base (10) and upper cover (20) is provided with the 3rd electro-magnetic wave absorption attenuating device (13).
2. high speed hot plug small optical transceiving modular according to claim 1, is characterized in that, described first, second and third electro-magnetic wave absorption attenuating device (11,12,13) is pasted and fixed for electro-magnetic wave absorption attenuator.
3. high speed hot plug small optical transceiving modular according to claim 1, is characterized in that, described first, second and third electro-magnetic wave absorption attenuating device (11,12,13) is electro-magnetic wave absorption decay coating.
CN201420025752.9U 2014-01-16 2014-01-16 High-speed hot swap micro light transceiver module Active CN203691414U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420025752.9U CN203691414U (en) 2014-01-16 2014-01-16 High-speed hot swap micro light transceiver module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420025752.9U CN203691414U (en) 2014-01-16 2014-01-16 High-speed hot swap micro light transceiver module

Publications (1)

Publication Number Publication Date
CN203691414U true CN203691414U (en) 2014-07-02

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420025752.9U Active CN203691414U (en) 2014-01-16 2014-01-16 High-speed hot swap micro light transceiver module

Country Status (1)

Country Link
CN (1) CN203691414U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022052920A1 (en) * 2020-09-08 2022-03-17 青岛海信宽带多媒体技术有限公司 Optical module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022052920A1 (en) * 2020-09-08 2022-03-17 青岛海信宽带多媒体技术有限公司 Optical module

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