CN203691414U - High-speed hot swap micro light transceiver module - Google Patents
High-speed hot swap micro light transceiver module Download PDFInfo
- Publication number
- CN203691414U CN203691414U CN201420025752.9U CN201420025752U CN203691414U CN 203691414 U CN203691414 U CN 203691414U CN 201420025752 U CN201420025752 U CN 201420025752U CN 203691414 U CN203691414 U CN 203691414U
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- Prior art keywords
- wave absorption
- module
- electro
- magnetic wave
- attenuating device
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- Expired - Lifetime
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- 238000010521 absorption reaction Methods 0.000 claims abstract description 30
- 230000003287 optical effect Effects 0.000 claims description 16
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 2
- 239000010931 gold Substances 0.000 abstract 2
- 229910052737 gold Inorganic materials 0.000 abstract 2
- 239000011247 coating layer Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 2
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000005288 electromagnetic effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model provides a high-speed hot swap micro light transceiver module. The high-speed hot swap micro light transceiver module comprises a foundation, an upper cover and a PCB, wherein a gold finger end of the PCB stretches out from an inner side part to an outer side part of the module to connect with an external electrical interface, corresponding to the circumference of the connection space, two side surfaces at a tail portion of the module foundation are provided with a first electromagnetic wave absorption attenuating device, a bottom face of the module foundation is provided with a second electromagnetic wave absorption attenuating device, an opening area formed between the foundation and the upper cover is provided with a third electromagnetic wave absorption attenuating device, and the first, second and third electromagnetic wave absorption attenuating devices are prepared by electromagnetic wave absorption attenuating sheets through pasting and fixing or electromagnetic wave absorption attenuating coating layers. When the module is inserted into a host computer cage, the external electrical interface and the gold finger of the PCB stretching out from the tail end of the module are electrically connected, and thereby anti-electromagnetic interference capability of the module can be further improved.
Description
Technical field
The utility model relates to the above high speed hot plug of a kind of 10G small optical transceiving modular.
Background technology
The above high speed hot plug of 10G small optical transceiving modular (Pluggable Small Form Factor Transceiver), relates to electromagnetic interference EMI (Electromagnetic Interference, hereinafter to be referred as EMI) more and more.EMI is the electromagnetic interference being produced by optical transceiver module internal electronic component.Between the metallic packaging base of high rate optical transceiver module and upper cover owing to being that rigid member is connected, can there is certain gap at its faying face, especially easily cause the electromagnetic wave that module produces to go out and produce EMI from clearance leakage, easily make other electron component normally move.Especially in the time that optical transceiver module speed increases, identical gap will decline greatly to the shield effectiveness of frequency electromagnetic waves.Electromagnetic shielding is to utilize shield to produce attenuation to electromagnetic wave, causes interference or injury thereby reduce electromagnetic wave.Material as shielding is divided into high conductivity material and high-permeability material.Wherein the shielding principle of electric conducting material is to utilize it under electromagnetic effect, will to produce larger induced current, these electric currents will weaken electromagnetic passing through according to Lenz's law, the frequency electromagnetic waves that the electronic devices and components of inside of shield casings produce, is unlikely to affect external equipment or human-body safety.For the electromagnetic shielding of optical transceiver module, adopt in theory one-piece encapsulation, its EMI shield effectiveness is best, but in practical application, and because design and assembling need, integral seamless encapsulation is difficult to often to realize the installation of internal component and fixes.Conventionally electronic devices and components are installed in metab, sealed by a upper cover, will certainly there is some openings and gap in the problem due to machining accuracy between base and upper cover, the electromagnetic wave in module will leak from these openings and gap, affects effectiveness.At present, have good solution for the anti-electromagnetic interference scheme of inside modules.But, in the time that module is inserted main frame cage, after the pcb board golden finger that outside electrical interface stretches out with module tail end is electrically connected, can produce too electromagnetic interference, affect the serviceability of module.
Utility model content
For overcoming above shortcoming, the utility model provides a kind of high speed hot plug small optical transceiving modular of anti-electromagnetic interference.
The utility model provides a kind of high speed hot plug small optical transceiving modular, comprise: a base, a upper cover, a PCB circuit board, described pcb board golden finger end protruding and outside electrical interface in module is connected, corresponding to this connection space surrounding, the two sides of tail surface of described module base is provided with the first electro-magnetic wave absorption attenuating device, the bottom surface of module base is provided with the second electro-magnetic wave absorption attenuating device, and the open area forming between described base and upper cover is provided with the 3rd electro-magnetic wave absorption attenuating device.
Described first, second and third electro-magnetic wave absorption attenuating device is that the stickup of electro-magnetic wave absorption attenuator is fixing.
Described first, second and third electro-magnetic wave absorption attenuating device is electro-magnetic wave absorption decay coating.
Due to the high speed hot plug small optical transceiving modular of said structure, because two sides of tail surface and the bottom surface thereof of module base are respectively equipped with first, second electro-magnetic wave absorption attenuating device, and the open area forming between base and upper cover is also provided with the 3rd electro-magnetic wave absorption attenuating device, like this, in the time that module is inserted main frame cage, after the pcb board golden finger that outside electrical interface stretches out with module tail end is electrically connected, can further improve the anti-electromagnetic interference capability of module.
Accompanying drawing explanation
Fig. 1 represents the utility model high speed hot plug small optical transceiving modular structural representation.
Embodiment
Describe the utility model most preferred embodiment in detail below in conjunction with accompanying drawing.
High speed hot plug small optical transceiving modular as shown in Figure 1, comprise: a base 10, a upper cover 20, a PCB circuit board 30, described pcb board golden finger end protruding and outside electrical interface in module is connected, corresponding to this connection space surrounding, owing to there being electromagnetic interference, therefore be provided with the first electro-magnetic wave absorption attenuating device 11 on the two sides of tail surface of module base 10, the bottom surface of module base 10 is provided with the second electro-magnetic wave absorption attenuating device 12, and the open area forming between described base 10 and upper cover 20 is provided with the 3rd electro-magnetic wave absorption attenuating device 13.Wherein, it is fixing that described first, second and third electro-magnetic wave absorption attenuating device 11,12,13 can adopt electro-magnetic wave absorption attenuator to paste, and also can adopt electro-magnetic wave absorption decay coating.
Due to the high speed hot plug small optical transceiving modular of said structure, because two sides of tail surface and the bottom surface thereof of module base 10 are respectively equipped with first, second electro-magnetic wave absorption attenuating device 11,12, and the open area forming between base 10 and upper cover 20 is also provided with the 3rd electro-magnetic wave absorption attenuating device 13, like this, in the time that module is inserted main frame cage, after outside electrical interface is electrically connected with pcb board 30 golden fingers, the anti-electromagnetic interference capability of module can further improve.
Claims (3)
1. a high speed hot plug small optical transceiving modular, comprise: a base (10), one upper cover (20), one PCB circuit board (30), it is characterized in that, described pcb board golden finger end protruding and outside electrical interface in module is connected, corresponding to this connection space surrounding, the two sides of tail surface of described module base (10) is provided with the first electro-magnetic wave absorption attenuating device (11), the bottom surface of module base (10) is provided with the second electro-magnetic wave absorption attenuating device (12), the open area forming between described base (10) and upper cover (20) is provided with the 3rd electro-magnetic wave absorption attenuating device (13).
2. high speed hot plug small optical transceiving modular according to claim 1, is characterized in that, described first, second and third electro-magnetic wave absorption attenuating device (11,12,13) is pasted and fixed for electro-magnetic wave absorption attenuator.
3. high speed hot plug small optical transceiving modular according to claim 1, is characterized in that, described first, second and third electro-magnetic wave absorption attenuating device (11,12,13) is electro-magnetic wave absorption decay coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420025752.9U CN203691414U (en) | 2014-01-16 | 2014-01-16 | High-speed hot swap micro light transceiver module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420025752.9U CN203691414U (en) | 2014-01-16 | 2014-01-16 | High-speed hot swap micro light transceiver module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203691414U true CN203691414U (en) | 2014-07-02 |
Family
ID=51013263
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420025752.9U Expired - Lifetime CN203691414U (en) | 2014-01-16 | 2014-01-16 | High-speed hot swap micro light transceiver module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203691414U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110191525A (en) * | 2019-06-26 | 2019-08-30 | 深圳市鑫汇科股份有限公司 | Electromagnetic heating apparatus |
| WO2022052920A1 (en) * | 2020-09-08 | 2022-03-17 | 青岛海信宽带多媒体技术有限公司 | Optical module |
-
2014
- 2014-01-16 CN CN201420025752.9U patent/CN203691414U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110191525A (en) * | 2019-06-26 | 2019-08-30 | 深圳市鑫汇科股份有限公司 | Electromagnetic heating apparatus |
| WO2022052920A1 (en) * | 2020-09-08 | 2022-03-17 | 青岛海信宽带多媒体技术有限公司 | Optical module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140702 |
|
| CX01 | Expiry of patent term |