WO2011069321A1 - Heat dissipating device for led side-lighting backlight - Google Patents

Heat dissipating device for led side-lighting backlight Download PDF

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Publication number
WO2011069321A1
WO2011069321A1 PCT/CN2010/000771 CN2010000771W WO2011069321A1 WO 2011069321 A1 WO2011069321 A1 WO 2011069321A1 CN 2010000771 W CN2010000771 W CN 2010000771W WO 2011069321 A1 WO2011069321 A1 WO 2011069321A1
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WIPO (PCT)
Prior art keywords
heat
dissipating
led
plate
heat sink
Prior art date
Application number
PCT/CN2010/000771
Other languages
French (fr)
Chinese (zh)
Inventor
梁静
Original Assignee
广东亚一照明科技有限公司
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Publication of WO2011069321A1 publication Critical patent/WO2011069321A1/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/15—Thermal insulation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Definitions

  • the utility model relates to an LED backlight heat dissipation device, in particular to a side backlight heat dissipation device.
  • the traditional LCD-side backlight produces less heat because it uses a CCFL cold cathode fluorescent tube as its light source. Therefore, this LCD side backlight structure basically does not require an additional heat dissipation design. As a result, the traditional backplane has no heat dissipation and does not require additional design components specifically designed for heat dissipation.
  • the utility model provides an LED side backlight heat dissipation device with good heat dissipation effect.
  • the present invention provides an LED side backlight heat dissipation device, comprising a back plate formed by a bottom wall and a side wall extending perpendicularly from an edge of the bottom wall, and a heat dissipation extruded plate mounted on the bottom wall of the back plate
  • the heat dissipation extrusion plate has a base portion and a side portion extending perpendicularly from the base portion; a circuit board fixed on a side of the heat dissipation extrusion sheet on a side of the heat dissipation extrusion sheet near a surface of the base portion; A plurality of LED light sources mounted on the circuit board.
  • the heat sinking The base of the form has a plurality of fins integrally formed with the heat dissipating plate on one side, such as the heat sink and the base of the heat dissipating plate are cast together; or the heat sink and the heat sink The base of the form is combined and molded, such as the heat sink being welded to the base of the heat sinking plate.
  • the heat dissipation extrusion plate is an aluminum heat dissipation extrusion plate.
  • the insulating thermally conductive sheet is a thermally conductive silicone.
  • the utility model has the advantages that: the heat generated by the LED light source is quickly transmitted to the base portion with the plurality of heat sinks through the side portions of the insulating heat conductive sheet and the heat dissipating extruded sheet, because the heat dissipating plate base has a plurality of raised heat sinks at the base portion
  • the heat dissipation area of the base of the heat dissipation extrusion plate is greatly increased, and the heat generated by the LED light source is no longer needed to be transmitted to the back plate, and can be effectively and timely discharged.
  • the heat generated by the LED light source can be discharged in time and effectively, on the other hand, It will affect the temperature of the entire backplane, so that the optical components mounted on the backplane are less affected by the heat, which can greatly reduce the deformation and bending of the optical components caused by the thermal expansion and thermal stress of the backplane. Therefore, the utility model not only solves the waste heat problem generated by the LED, but also ensures the working life of the LED; and the service life of other devices on the side backlight such as the side backlight module is prolonged.
  • FIG. 1 is a fragmentary view of a circuit board, an insulating thermally conductive sheet, and a heat dissipating extruded sheet of the embodiment of the LED side backlight heat sink of the present invention.
  • 2 is a combination diagram of the LED side backlight heat sink shown in FIG. 1.
  • FIG. 3 is a schematic structural view of Embodiment 1 of the LED side backlight heat dissipation device of the present invention.
  • Figure 4 is an enlarged schematic view of B in Figure 3.
  • FIG. 5 is a schematic structural view showing the shape of a heat sink of a heat dissipation extruded plate of an LED side backlight heat sink according to the present invention.
  • Figure 6 is a cross-sectional view of Figure 4A-A.
  • Fig. 7 is a structural schematic view showing the shape of the heat sink of the heat-dissipating extruded plate of the LED side backlight heat sink of the present invention.
  • Fig. 8 is a structural schematic view showing the shape of the heat sink of the heat-dissipating plate of the LED side backlight heat sink of the present invention.
  • FIG. 9 is a schematic structural view showing the shape of the heat sink of the LED side backlight heat dissipation device of the present invention.
  • FIG. 10 is a partial diagram of a circuit board, an insulating and heat conducting sheet, and a heat dissipating slab of the second embodiment of the LED side backlight heat sink according to the present invention.
  • FIG. 11 is a schematic front view showing the second embodiment of the LED side backlight heat dissipation device of the present invention.
  • FIG. 12 is a schematic diagram showing the reverse structure of the second embodiment of the LED side backlight heat dissipation device of the present invention. detailed description
  • the LED side backlight heat sink 100 provided by the present invention includes a back plate 10 of a suitable shape such as a rectangle.
  • the back sheet 10 is preferably made of a metal material having a high strength and light weight such as aluminum, or Made of low cost plastic.
  • the LED side backlight heat sink 100 further includes a heat dissipation extrusion plate 20 mounted on a sidewall of the back plate 10, and the heat dissipation extrusion plate 20 is inserted into the back plate 10 through a hole in the middle of the metal back plate 10,
  • the heat sinking squeegee 20 is preferably made of a metal material such as aluminum which has good heat dissipation properties.
  • the heat dissipation extrusion plate 20 is composed of a base portion 22 having a plurality of fins 23 integrally formed with the heat dissipation extrusion plate and a side portion 24 extending perpendicularly from the base portion 22.
  • the heat dissipation fins 23 can also be extruded by heat welding or the like.
  • the stencil 20 is formed in combination, and the fins 23 are shaped as shown in one of the following figures 5, 7 and 8.
  • the LED side backlight heat sink 100 further includes a circuit board such as an aluminum substrate circuit board 40 having a good heat dissipation effect.
  • a circuit board such as an aluminum substrate circuit board 40 having a good heat dissipation effect.
  • the aluminum substrate circuit board 40 is attached to a side portion 24 of the heat dissipation extrusion sheet 20 on one side of the base portion 22 via an insulating thermally conductive sheet 30.
  • the circuit board can also be a FR4 fiber circuit board
  • the LED side backlight heat sink 100 further includes a plurality of LED light sources 50 electrically mounted on the aluminum substrate circuit board 40 for cooperation with the aluminum substrate circuit board 40 and in the case of power supply Under the light.
  • the heat radiating strip base 22 Since the heat emitted by the LED light source 50 is quickly transmitted to the heat sinking strip base 22 through the insulating heat conductive sheet 30 and the side portion 24 of the heat sinking strip, the heat radiating strip base 22 has a plurality of heat sinking sheets 20 The formed fins 23 are formed, so that the heat dissipating area of the base portion 22 of the heat dissipating plate 20 is greatly increased, so that the heat is efficiently transferred, thereby solving the waste heat problem generated by the LED 40 and ensuring the working life of the LED 40.
  • the waste heat generated by the LED 40 is quickly transmitted to the base portion 24 of the heat dissipation extrusion plate 20 through the insulating heat conductive sheet 30 and the side portion 24 of the heat dissipation extrusion plate 20, and is directly discharged.
  • the heat is not dissipated through the backplane 10, so the temperature of the entire backplane 10 is not affected, so that the optical components (not shown) mounted on the backplane 10 are less affected by the heat, thereby greatly reducing Due to the occurrence of deformation and bending of an optical component (not shown) caused by thermal expansion and thermal stress of the backing plate 10, the present invention not only solves the problem of waste heat generated by the LED, but also ensures the working life of the LED; The life of other devices such as the side backlight module (not shown) is extended.
  • the LED side backlight heat sink 100 further includes a heat sinking squeegee 20 mounted on the side wall of the backing plate 10, the backing plate 10 being cut away for mounting the heat sinking squeegee 20.
  • the rest is the same as in the first embodiment.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Planar Illumination Modules (AREA)
  • Led Device Packages (AREA)

Abstract

A heat dissipating device for an LED side-lighting backlight (100) includes a back plate (10), a heat dissipating extruded plate (20) mounted on the bottom wall of the back plate (10), an insulated thermally conductive sheet (30), a circuit board (40), and a plurality of LEDs (50) electrically mounted on the circuit board (40). The heat dissipating extruded plate (20) includes a side part (24) and a base part (22) having a plurality of heat dissipating fins (23). The heat produced by the LEDs is transferred to the base part (22) of the heat dissipating extruded plate(20) through the insulated thermally conductive sheet (30) and the side part (22) of the heat dissipating extruded plate(20).

Description

LED侧背光散热装置  LED side backlight heat sink
技术领域 Technical field
本实用新型涉及一种 LED 背光散热装置， 尤其是側背光散热装 The utility model relates to an LED backlight heat dissipation device, in particular to a side backlight heat dissipation device.
'置。 'Set.
背景技术 Background technique
传统的 LCD侧背光，因为采用 CCFL冷阴极荧光灯管作为其光源， 产生较少的热量。所以这种 LCD侧背光结构基本上不需要额外的散热 设计。 因此， 传统背板无散热功能， 也不需要另外设计专门用于散热 的部件。  The traditional LCD-side backlight produces less heat because it uses a CCFL cold cathode fluorescent tube as its light source. Therefore, this LCD side backlight structure basically does not require an additional heat dissipation design. As a result, the traditional backplane has no heat dissipation and does not require additional design components specifically designed for heat dissipation.
现有技术中也存在一种采用 LED作为光源的侧背光板结构。但是 这种 LED冷光源类型侧背光板具有发热较严重的问题，从而容易导致 元器件老化的问题出现， 进而缩短了元器件的使用寿命。  There is also a side backlight structure using an LED as a light source in the prior art. However, such an LED cold light source type side backlight plate has a problem of serious heat generation, which easily causes the problem of aging of components, thereby shortening the service life of components.
因此需要提供一种散热效果良好的 LED侧背光散热装置。  Therefore, it is necessary to provide an LED side backlight heat sink with good heat dissipation effect.
实用新型内容 Utility model content
本实用新型提供一种散热效果良好的 LED侧背光散热装置。  The utility model provides an LED side backlight heat dissipation device with good heat dissipation effect.
为此， 本实用新型提供一种 LED侧背光散热装置， 包括由底壁及从底 壁的边缘垂直延伸形成的侧壁构成的背板，安装在所述背板底壁上的 散热挤型板， 所述散热挤型板具有基部及从基部垂直延伸形成的侧 部；通过绝缘导热薄片锁固在所述散热挤型板的侧部上靠近所述基部 的一个表面上的电路板； 及电性安装在所述电路板上的多个 LED 光 源。 To this end, the present invention provides an LED side backlight heat dissipation device, comprising a back plate formed by a bottom wall and a side wall extending perpendicularly from an edge of the bottom wall, and a heat dissipation extruded plate mounted on the bottom wall of the back plate The heat dissipation extrusion plate has a base portion and a side portion extending perpendicularly from the base portion; a circuit board fixed on a side of the heat dissipation extrusion sheet on a side of the heat dissipation extrusion sheet near a surface of the base portion; A plurality of LED light sources mounted on the circuit board.
作为本实用新型 LED侧背光散热装置优选实施方式，所述散热挤 型板基部一面具有若干与所述散热挤型板一体成型的散热片，如所述 的散热片与散热挤型板基部是一起铸造成型的；或者是所述的散热片 与所述的散热挤型板基部组合成型的 ,如将所述的散热片焊接在所述 的散热挤型板基部。 As a preferred embodiment of the LED side backlight heat sink of the present invention, the heat sinking The base of the form has a plurality of fins integrally formed with the heat dissipating plate on one side, such as the heat sink and the base of the heat dissipating plate are cast together; or the heat sink and the heat sink The base of the form is combined and molded, such as the heat sink being welded to the base of the heat sinking plate.
作为本实用新型 LED侧背光散热装置优另一选实施方式，所述散 热挤型板为铝质散热挤型板。  As an alternative embodiment of the LED side backlight heat dissipation device of the present invention, the heat dissipation extrusion plate is an aluminum heat dissipation extrusion plate.
作为本实用新型 LED侧背光散热装置优另一选实施方式，所述绝 缘导热薄片是导热硅胶。  As an alternative embodiment of the LED side backlight heat sink of the present invention, the insulating thermally conductive sheet is a thermally conductive silicone.
本实用新型的优点在于： 由于 LED光源发出的热量通过绝缘导热 薄片和散热挤型板的侧部迅速传递到带有若干散热片的基部，由于散 热挤型板基部带有许多凸起的散热片，使得散热挤型板基部的散热面 积大大的增加， LED 光源发出的热量不再需要传递到背板也能及时 有效的排出， 一方面 LED光源发出的热量能及时有效的排出， 另一方 面不会影响到整个背板的温度，这样使得安装在背板上面的光学元件 受到的热影响也更少，从而可以大大减少由于背板的热膨胀及热应力 造成的光学元件变形弯曲等情况的出现， 所以， 本实用新型既解决了 LED产生的废热问题， 保证 LED的工作寿命； 又使側背光上的其它装 置比如侧背光模组的使用寿命得以延长。  The utility model has the advantages that: the heat generated by the LED light source is quickly transmitted to the base portion with the plurality of heat sinks through the side portions of the insulating heat conductive sheet and the heat dissipating extruded sheet, because the heat dissipating plate base has a plurality of raised heat sinks at the base portion The heat dissipation area of the base of the heat dissipation extrusion plate is greatly increased, and the heat generated by the LED light source is no longer needed to be transmitted to the back plate, and can be effectively and timely discharged. On the one hand, the heat generated by the LED light source can be discharged in time and effectively, on the other hand, It will affect the temperature of the entire backplane, so that the optical components mounted on the backplane are less affected by the heat, which can greatly reduce the deformation and bending of the optical components caused by the thermal expansion and thermal stress of the backplane. Therefore, the utility model not only solves the waste heat problem generated by the LED, but also ensures the working life of the LED; and the service life of other devices on the side backlight such as the side backlight module is prolonged.
以下将结合附图及具体实施例对本实用新型做进一步说明。 The present invention will be further described below in conjunction with the drawings and specific embodiments.
附图说明 DRAWINGS
图 1为本实用新型 LED侧背光散热装置实施例一电路板、绝缘导热薄 片及散热挤型板的坼分图。 图 2为图 1所示 LED侧背光散热装置组合图。 1 is a fragmentary view of a circuit board, an insulating thermally conductive sheet, and a heat dissipating extruded sheet of the embodiment of the LED side backlight heat sink of the present invention. 2 is a combination diagram of the LED side backlight heat sink shown in FIG. 1.
图 3为本实用新型 LED侧背光散热装置实施例一的结构示意图。 FIG. 3 is a schematic structural view of Embodiment 1 of the LED side backlight heat dissipation device of the present invention.
图 4为图 3中的 B处放大示意图。 Figure 4 is an enlarged schematic view of B in Figure 3.
图 5为本实用新型 LED侧背光散热装置散热挤型板的散热片形状之一 结构示意图。 FIG. 5 is a schematic structural view showing the shape of a heat sink of a heat dissipation extruded plate of an LED side backlight heat sink according to the present invention.
图 6为图 4A— A处截面图。 Figure 6 is a cross-sectional view of Figure 4A-A.
图 7为本实用新型 LED侧背光散热装置散热挤型板的散热片形状之二 结构示意图。 Fig. 7 is a structural schematic view showing the shape of the heat sink of the heat-dissipating extruded plate of the LED side backlight heat sink of the present invention.
图 8为本实用新型 LED侧背光散热装置散热挤型板的散热片形状之三 结构示意图。 Fig. 8 is a structural schematic view showing the shape of the heat sink of the heat-dissipating plate of the LED side backlight heat sink of the present invention.
图 9为本实用新型 LED侧背光散热装置散热挤型板的散热片形状之四 结构示意图。 FIG. 9 is a schematic structural view showing the shape of the heat sink of the LED side backlight heat dissipation device of the present invention.
图 10为本实用新型 LED侧背光散热装置实施例二电路板、 绝缘导热 薄片及散热挤型板的坼分图。 FIG. 10 is a partial diagram of a circuit board, an insulating and heat conducting sheet, and a heat dissipating slab of the second embodiment of the LED side backlight heat sink according to the present invention.
图 11为本实用新型 LED侧背光散热装置实施例二的正面结构示意图。 图 12为本实用新型 LED侧背光散热装置实施例二的反面结构示意图。 具体实施方式 FIG. 11 is a schematic front view showing the second embodiment of the LED side backlight heat dissipation device of the present invention. FIG. 12 is a schematic diagram showing the reverse structure of the second embodiment of the LED side backlight heat dissipation device of the present invention. detailed description
实施例 1 Example 1
如图 1-8所杀，本实用新型提提供的 LED侧背光散热装置 100包 括适当形状比如矩形的背板 10。  As shown in Fig. 1-8, the LED side backlight heat sink 100 provided by the present invention includes a back plate 10 of a suitable shape such as a rectangle.
所示背板 10优选地由强度大重量轻的金属材料比如铝制成， 也可以 用成本低廉的塑料制成。 The back sheet 10 is preferably made of a metal material having a high strength and light weight such as aluminum, or Made of low cost plastic.
LED侧背光散热装置 100进一步包括安装在所述背板 10的側壁 上的散热挤型板 20， 散热挤型板 20穿过金属背板 10中间的破孔再 安装到背板 10上，所述的散热挤型板 20优选地由散热性能良好的金 属材料比如铝制成。 所述散热挤型板 20由具有许多与散热挤型板一 体成型凸起的散热片 23的基部 22及从基部 22垂直延伸形成的側部 24，散热片 23也可以通过焊接等方式与散热挤型板 20组合成型， 所 述的散热片 23的形状如图 5、 7和 8中的一种或其他形状。  The LED side backlight heat sink 100 further includes a heat dissipation extrusion plate 20 mounted on a sidewall of the back plate 10, and the heat dissipation extrusion plate 20 is inserted into the back plate 10 through a hole in the middle of the metal back plate 10, The heat sinking squeegee 20 is preferably made of a metal material such as aluminum which has good heat dissipation properties. The heat dissipation extrusion plate 20 is composed of a base portion 22 having a plurality of fins 23 integrally formed with the heat dissipation extrusion plate and a side portion 24 extending perpendicularly from the base portion 22. The heat dissipation fins 23 can also be extruded by heat welding or the like. The stencil 20 is formed in combination, and the fins 23 are shaped as shown in one of the following figures 5, 7 and 8.
另外， 所述 LED侧背光散热装置 100进一步包括电路板， 例如散热效 果良好的铝基材电路板 40。 优选地， 所述铝基材电路板 40通过绝缘 导热薄片 30贴在所述散热挤型板 20的侧部 24上靠近所述基部 22的 一个表面上。 所述电路板也可以为 FR4纤维电路板 In addition, the LED side backlight heat sink 100 further includes a circuit board such as an aluminum substrate circuit board 40 having a good heat dissipation effect. Preferably, the aluminum substrate circuit board 40 is attached to a side portion 24 of the heat dissipation extrusion sheet 20 on one side of the base portion 22 via an insulating thermally conductive sheet 30. The circuit board can also be a FR4 fiber circuit board
所述 LED侧背光散热装置 100进一步包括多个 LED光源 50，这些 LED 光源 50电性安装在所述铝基材电路板 40上，以便通过与铝基材电路 板 40的配合并且在供电的情况下发光。 The LED side backlight heat sink 100 further includes a plurality of LED light sources 50 electrically mounted on the aluminum substrate circuit board 40 for cooperation with the aluminum substrate circuit board 40 and in the case of power supply Under the light.
由于 'LED光源 50发出的热量通过绝缘导热薄片 30和散热挤型板 的侧部 24迅速传递到散热挤型板基部 22 , 由于散热挤型板基部 22 具有多条与散热挤型板 20—体成型的凸起的散热片 23， 这样使得的 散热挤型板 20基部 22散热面积大大增加，使热量更快的效率传递出 来， 从而很好地解决了 LED40产生的废热问题，保证 LED40的工作寿 命， 同时由于 LED40产生的废热是通过绝缘导热薄片 30和散热挤型 板 20的侧部 24迅速传递到散热挤型板 20基部 24直接散发出去的， 而没有通过背板 10进行散热， 因此不会影响到整个背板 10的温度， 这样使得安装在背板 10上面的光学元件（图中未示）受到的热影响 也更少， 从而可以大大减少由于背板 10的热膨胀及热应力造成的光 学元件（图中未示）变形弯曲等情况的出现， 所以， 本实用新型既解 决了 LED产生的废热问题，保证 LED的工作寿命； 又使侧背光上的其 它装置比如侧背光模组（图中未示） 的使用寿命得以延长。 Since the heat emitted by the LED light source 50 is quickly transmitted to the heat sinking strip base 22 through the insulating heat conductive sheet 30 and the side portion 24 of the heat sinking strip, the heat radiating strip base 22 has a plurality of heat sinking sheets 20 The formed fins 23 are formed, so that the heat dissipating area of the base portion 22 of the heat dissipating plate 20 is greatly increased, so that the heat is efficiently transferred, thereby solving the waste heat problem generated by the LED 40 and ensuring the working life of the LED 40. At the same time, the waste heat generated by the LED 40 is quickly transmitted to the base portion 24 of the heat dissipation extrusion plate 20 through the insulating heat conductive sheet 30 and the side portion 24 of the heat dissipation extrusion plate 20, and is directly discharged. The heat is not dissipated through the backplane 10, so the temperature of the entire backplane 10 is not affected, so that the optical components (not shown) mounted on the backplane 10 are less affected by the heat, thereby greatly reducing Due to the occurrence of deformation and bending of an optical component (not shown) caused by thermal expansion and thermal stress of the backing plate 10, the present invention not only solves the problem of waste heat generated by the LED, but also ensures the working life of the LED; The life of other devices such as the side backlight module (not shown) is extended.
实施例 2 Example 2
如图 9-11所示， LED侧背光散热装置 100进一步包括安装在所 述背板 10的侧壁上的散热挤型板 20 , 背板 10被切除一部分用来安 装散热挤型板 20。  As shown in Figures 9-11, the LED side backlight heat sink 100 further includes a heat sinking squeegee 20 mounted on the side wall of the backing plate 10, the backing plate 10 being cut away for mounting the heat sinking squeegee 20.
其余与实施例 1相同。  The rest is the same as in the first embodiment.
所述实施例为本实用新型较佳的实施方式，但并不代表仅仅受所 述实施例的限制，其它的任何未背离本实用新型的精神实质与原理的 情况下所做出的任何改变、 修饰、 替代、 组合、 简化， 均应视为与本 实用新型等效的置换方式， 均包含在本实用新型的保护范围之内。  The embodiment is a preferred embodiment of the present invention, but it is not intended to be limited by the embodiment, and any other changes made without departing from the spirit and principle of the present invention, Modifications, substitutions, combinations, and simplifications are to be considered as equivalent to the present invention, and are included in the scope of the present invention.

Claims

权 利 要 求 Rights request
1、 一种 LED侧背光散热装置， 包括由底壁及从底壁的边缘垂直 延伸形成的侧壁构成的背板， 其特征在于进一步包括：  An LED-side backlight heat sink, comprising: a back panel formed by a bottom wall and a sidewall extending perpendicularly from an edge of the bottom wall, wherein the method further comprises:
安装在所述背板底壁上的散热挤型板， 所述散热挤型板具有基 部及从基部垂直延伸形成的侧部； 通过绝缘导热薄片锁固在所述散 热挤型板的侧部上靠近所述基部的一个表面上的电路板； 及电性安 装在所述电路板上的多个 LED光源。  a heat dissipating squeegee mounted on a bottom wall of the backing plate, the heat dissipating squeegee having a base portion and a side portion extending perpendicularly from the base portion; being locked on a side of the heat dissipating squeegee plate by an insulating heat conducting sheet a circuit board on a surface adjacent to the base; and a plurality of LED light sources electrically mounted on the circuit board.
2、 根据权利要求 1所述的 LED侧背光散热装置， 其特征在于： 所述散热挤型板基部一面具有若干与所述散热挤型板一体成型的散 热片。  2. The LED-side backlight heat sink according to claim 1, wherein: the heat-dissipating plate base has a plurality of heat-dissipating sheets integrally formed with the heat-dissipating extruded plate on one side.
3、 根据权利要求 1所述的 LED侧背光散热装置， 其特征在于： 所述散热挤型板基部一面具有若干与所述散热挤型板组合成型的散 热片。  3. The LED-side backlight heat sink according to claim 1, wherein: one side of the base portion of the heat-dissipating plate has a plurality of heat-dissipating sheets formed in combination with the heat-dissipating plate.
4、 根据权利要求 3所述的 LED侧背光散热装置， 其特征在于： 所述散热挤型板基部一面具有若干与所述散热挤型板组合成型的散 热片是将所述的散热片焊接在所述的散热挤型板基部的。  The LED-side backlight heat sink according to claim 3, wherein: the heat-dissipating plate base has a plurality of heat-dissipating fins formed on the one side of the heat-dissipating plate, and the heat sink is welded to the heat sink. The heat dissipating extruded plate base.
5、 根据权利要求 2或 3或 4所述的 LED侧背光散热装置， 其特 征在于： 所述散热挤型板为铝质散热挤型板。  The LED-side backlight heat sink according to claim 2 or 3 or 4, wherein the heat-dissipating extruded plate is an aluminum heat-dissipating extruded plate.
6、 根据权利要求 5所述的 LED侧背光散热装置， 其特征在于： 所述绝缘导热薄片是导热硅胶。  6. The LED-side backlight heat sink according to claim 5, wherein: the insulating and thermally conductive sheet is a thermally conductive silicone.
7、 根据权利要求 1或 2或 3或 4所述的 LED侧背光散热装置， 其特征在于： 所述电路板为铝基材电路板或 FR4纤维电路板。  The LED-side backlight heat sink according to claim 1 or 2 or 3 or 4, wherein the circuit board is an aluminum substrate circuit board or an FR4 fiber circuit board.
PCT/CN2010/000771 2009-12-11 2010-06-01 Heat dissipating device for led side-lighting backlight WO2011069321A1 (en)

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