CN109713112A - White-light LED chip, lamp bead and White-light LED chip, lamp bead preparation method - Google Patents
White-light LED chip, lamp bead and White-light LED chip, lamp bead preparation method Download PDFInfo
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- CN109713112A CN109713112A CN201711022491.XA CN201711022491A CN109713112A CN 109713112 A CN109713112 A CN 109713112A CN 201711022491 A CN201711022491 A CN 201711022491A CN 109713112 A CN109713112 A CN 109713112A
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Abstract
The embodiment of the present invention provides a kind of White-light LED chip, lamp bead and White-light LED chip, lamp bead preparation method, prepares quantum dot optical film first with glue and at least two quantum dot light electroluminescent materials；Then quantum dot optical film is attached on the light-emitting surface of blue-light LED chip and obtains White-light LED chip.It is covered on blue-light LED chip light-emitting surface since quantum dot light electroluminescent material has been initially formed after optical film, it does not need to be blended in encapsulation glue and be coated in by dispensing on the encapsulating face of blue-light LED chip, therefore it can guarantee that the luminescent material of quantum dot light is dispersed in quantum dot optical film by time enough and technique, to promote the product fine rate of White-light LED chip.Importantly, it is subsequent when preparing white light LEDs lamp bead, without doping fluorescent powder or quantum dot light electroluminescent material in encapsulation glue, the difficulty of packaging operation and the product defect rate of white light LEDs lamp bead are reduced, production efficiency is improved.
Description
Technical field
The present invention relates to LED backlight field more particularly to a kind of White-light LED chips, lamp bead and White-light LED chip, lamp bead
Preparation method.
Background technique
Currently used LED backlight generally uses blue-light LED chip to excite yellow fluorescent powder or same with blue-light LED chip
Shi Jifa red light fluorescent powder, green light fluorescent powder.But in this scheme for obtaining white light by excitated fluorescent powder, because by glimmering
The wide too wide influence of light powder half-wave, so the color gamut value of LED white light backlight is typically not greater than NTSC (National
Television Standards Committee, National Television System Committee) 80%.Meanwhile the excitation of fluorescent powder
Low efficiency, to obtain high colour gamut white light, it is necessary to a large amount of fluorescent powders, so encapsulation blue-light LED chip is to obtain white light LEDs lamp bead
When, need to mix a large amount of fluorescent powder in encapsulation glue, namely in encapsulation glue fluorescent powder it is dense, this greatly increases
The difficulty of packaging operation and the fraction defective of white light LEDs lamp bead are added.
In this case, quanta point material comes into being.Quanta point material has spectrum with size adjustable, emission peak half
A series of outstanding optical characteristics such as wave width, Stokes shift are big, launching efficiency is high.Therefore, using quanta point material come
The phosphor material powder for substituting script, can not only obtain color gamut value > NTSC100% high colour gamut white light, moreover, because quantum dot
Material launching efficiency is high, therefore, when carrying out blue-light LED chip encapsulation, does not need to mix too many quantum in encapsulation glue
Quanta point material concentration is low in point material, namely encapsulation glue, encapsulates more simple.
It is well known that when making white light LEDs lamp bead, usually passing through " dispensing " technique at present in encapsulation blue-light LED chip
Coating is mixed with phosphor material powder or the encapsulation glue of quanta point material directly on the light-emitting surface of blue-light LED chip.In white light LEDs
During the mass production of lamp bead, the dispensing for each blue-light LED chip can all be completed in a very short period of time.But
In gluing process, it is difficult to mix quanta point material uniformly with encapsulation glue, therefore be easy to appear quanta point material group
The problem of poly- failure.So for this problem, it is urgent to provide a solution now.
Summary of the invention
White-light LED chip, lamp bead and White-light LED chip provided in an embodiment of the present invention, lamp bead preparation method, mainly solve
The technical issues of be: solve in the prior art directly by gluing process to blue-light LED chip light-emitting surface coat incorporation quantum dot
When the encapsulation glue of material, it is difficult to ensure that quanta point material and encapsulation glue uniformly mix, so as to cause the production of white light LEDs lamp bead
The high problem of piece fraction defective.
In order to solve the above technical problems, the embodiment of the present invention provides a kind of White-light LED chip preparation method, comprising:
Quantum dot optical film, at least two quantum are prepared using glue and at least two quantum dot light electroluminescent materials
A part in point embedded photoluminescent material issues feux rouges under the excitation of blue light, and another part issues green under the excitation of blue light
Light；
The quantum dot optical film is attached on the light-emitting surface of blue-light LED chip and obtains White-light LED chip.
Optionally, described to prepare quantum dot optical film using glue and at least two quanta point materials and include:
At least two quantum dot lights electroluminescent material is evenly mixed in the glue；
The glue for being blended with quantum dot light electroluminescent material is coated to carrier surface；
By the glue after solidification from the isolated quantum dot optical film of the carrier surface.
Optionally, the described quantum dot optical film is attached on the light-emitting surface of blue-light LED chip obtains white light LEDs core
Piece are as follows:
The quantum dot optical film is attached on the positive light-emitting surface of the blue-light LED chip and obtains white light LEDs core
Piece.
The embodiment of the present invention also provides a kind of white light LEDs lamp bead preparation method, comprising:
White-light LED chip is prepared according to described in any item White-light LED chip preparation methods as above；
It is disposed on the substrate at least one described White-light LED chip to obtain white light LEDs lamp bead.
Optionally, it is described be disposed on the substrate at least one described White-light LED chip to obtain white light LEDs lamp bead include:
The White-light LED chip is fixed to the substrate corresponding position, and by the White-light LED chip and the substrate
Electrical communication；
Coating encapsulation glue forms encapsulation glue-line on the light-emitting surface of the White-light LED chip；
After the encapsulation glue curing or semi-solid preparation, white reflection glue-line is formed in the White-light LED chip surrounding, is made
White light LEDs lamp bead.
Optionally, it is described by least one described White-light LED chip be fixed to the substrate corresponding position include: will at least
Two White-light LED chips are fixed on the substrate；
Coating encapsulation glue includes: by way of molding to described on the light-emitting surface to the White-light LED chip
Substrate is provided with the one side coating encapsulation glue of White-light LED chip, and removing is more after the encapsulation glue curing or semi-solid preparation
Remaining encapsulation glue, the extra encapsulation glue are the encapsulation glue other than each white light LEDs front light-emitting surface；
Described to form white reflection glue-line in the White-light LED chip surrounding, it includes: by secondary that white light LEDs lamp bead, which is made,
The mode of molding forms white reflection glue-line around each White-light LED chip；
The white reflection glue-line and the substrate are carried out according to the arrangement of each White-light LED chip on the substrate
Cutting obtains single white light LEDs lamp bead.
The embodiment of the present invention also provides a kind of White-light LED chip, and the White-light LED chip includes blue-light LED chip, utilizes
The quantum dot optical film of glue and the preparation of at least two quantum dot light electroluminescent materials, the quantum dot optical film are attached at described
On the light-emitting surface of blue-light LED chip, a part in at least two quantum dot lights electroluminescent material is under the excitation of blue light
Feux rouges is issued, another part issues green light under the excitation of blue light.
Optionally, the quantum dot light electroluminescent material be AxMyEz material, the A be Ba, Ag, Na, Fe, In, Cd,
One of Zn, Ga, Mg, Pb, Cs element, the M are one of S, Cl, O, As, N, P, Se, Te, Ti, Zr, Pb element, institute
Stating E is one of S, As, Se, O, Cl, Br, I element；And 1.0≤x≤2.0,1.0≤y≤3.0,0≤z≤4.0；The glue
Water is transparent and heat curing type glue of the refractive index greater than 1.4；The quantum dot optical film with a thickness of 25~680 μm.
Optionally, the quantum dot optical film includes the first film layer and the second film layer for being covered in first film layer,
One in first film layer and second film layer issues feux rouges under blue light excitation, another is issued under blue light excitation
Green light.
The embodiment of the present invention also provides a kind of white light LEDs lamp bead, and the white light LEDs lamp bead includes substrate and as above any
White-light LED chip described in, the White-light LED chip setting is on the substrate.
The beneficial effects of the present invention are:
The White-light LED chip, lamp bead and the White-light LED chip that there is provided according to embodiments of the present invention, lamp bead preparation method, first
Quantum dot optical film is prepared using glue and at least two quantum dot light electroluminescent materials；Then quantum dot optical film is attached at
White-light LED chip is obtained on the light-emitting surface of blue-light LED chip.Firstly, compared with using the scheme of conventional fluorescent powder, in the present invention
White-light LED chip quantum dot light electroluminescent material is utilized, can make the color gamut value of LED product be promoted to NTSC100% with
On, better visual experience is brought for user.Simultaneously because quantum dot light electroluminescent material is covered after being initially formed optical film
It covers on blue-light LED chip light-emitting surface, does not need to be blended in the envelope for being coated in blue-light LED chip in encapsulation glue by dispensing
On dress face, therefore it can guarantee that the luminescent material of quantum dot light is dispersed in quantum dot optics by time enough and technique
In film, to promote the product fine rate of White-light LED chip.Importantly, encapsulation obtains white light in the solution of the present invention
When LED lamp bead, the way being directly packaged to blue-light LED chip in existing scheme has been abandoned, but by being set on substrate
It sets the White-light LED chip for having been able to issue white light and obtains white light LEDs lamp bead, so without the doping fluorescent powder in encapsulation glue
Or quantum dot light electroluminescent material, the difficulty of packaging operation and the product defect rate of white light LEDs lamp bead are reduced, production is improved
Efficiency.
Other features of the invention and corresponding beneficial effect are described in the aft section of specification, and should be managed
Solution, at least partly beneficial effect is apparent from from the record in description of the invention.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of the White-light LED chip provided in the embodiment of the present invention one；
Fig. 2 is a kind of flow chart for preparing White-light LED chip provided in the embodiment of the present invention one；
Fig. 3 is a kind of flow chart for preparing quantum dot optical film provided in the embodiment of the present invention one；
Fig. 4 is a kind of structural schematic diagram of the quantum dot optical film provided in the embodiment of the present invention one；
Fig. 5 is to the cutting schematic diagram that quantum dot optical film is cut in Fig. 4；
Fig. 6 is a kind of structural schematic diagram of the White-light LED chip provided in the embodiment of the present invention two；
Fig. 7 is a kind of schematic diagram for preparing white light LEDs lamp bead in the embodiment of the present invention two in batches；
Fig. 8 is a kind of structural schematic diagram of the white light LEDs lamp bead provided in the embodiment of the present invention three；
Fig. 9 is the structural schematic diagram of another white light LEDs lamp bead provided in the embodiment of the present invention three；
Figure 10 is a kind of flow chart of the encapsulation White-light LED chip provided in the embodiment of the present invention three；
Figure 11 is a kind of schematic diagram that the batch provided in the embodiment of the present invention three prepares white light LEDs lamp bead；
Figure 12 is the cutting schematic diagram cut to white light LEDs lamp beads multiple in Figure 11；
Figure 13 is a kind of arrangement schematic diagram of White-light LED chip in the white light LEDs lamp bead provided in the embodiment of the present invention three；
Figure 14 is another arrangement signal of White-light LED chip in the white light LEDs lamp bead provided in the embodiment of the present invention three
Figure.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, below by specific embodiment knot
Attached drawing is closed to be described in further detail the embodiment of the present invention.It should be appreciated that specific embodiment described herein is only used to
It explains the present invention, is not intended to limit the present invention.
Embodiment one:
It is difficult to be evenly mixed in envelope in gluing process to solve quantum dot light electroluminescent material in existing encapsulation scheme
The problem of filling in glue, being easy to appear the reunion failure of quantum dot light electroluminescent material, the present embodiment provides a kind of white light LEDs cores
Piece, and the preparation method of the White-light LED chip is introduced, referring to Figure 1 shown in White-light LED chip a kind of structure
Schematic diagram:
White-light LED chip 10 includes blue-light LED chip 11 and quantum dot optical film 12.Wherein quantum dot optical film 12 attaches
On the light-emitting surface of blue-light LED chip 11.It should be understood that can have 5 for a blue-light LED chip 11
A light-emitting surface, i.e. 4 sides and a top surface.In the present embodiment, it is complete can to cover blue-light LED chip 11 for quantum dot optical film 12
The light-emitting surface in portion can also only cover on the part light-emitting surface of blue-light LED chip 11, such as positive (namely top surface) shines
Face.The blue-light LED chip front mentioned here actually namely front of White-light LED chip 10, White-light LED chip 10 is just
Face refers to when encapsulating White-light LED chip, a light-emitting surface corresponding with package substrate.Because subsequent to white light LED core
When piece 10 is packaged, the surrounding of blue-light LED chip 11 may be coated by other materials to be wrapped up.In such case
Under, no matter whether four sides of blue-light LED chip 11, which can issue white light, all recedes into the background, and therefore, can not have to blue light
The side of LED chip 11 attaches quantum dot optical film 12, to save material, simplifies the technique for preparing White-light LED chip 10, mentions
Rise production efficiency.
Below with reference to Fig. 2 shows flow chart the preparation method of White-light LED chip in the present embodiment is described in detail:
S202, quantum dot optical film is prepared using glue and at least two quantum dot light electroluminescent materials.
It should be understood that the sending of blue-light LED chip 11 is blue light, and to be obtained after attaching quantum dot optical film 12
To the White-light LED chip 10 to emit white light, therefore quantum dot optical film 12 should can issue feux rouges and green under the excitation of blue light
Both primary lights of light.And a characteristic of quantum dot light to luminescent material exactly can be allowed to sending not by regulating and controlling its partial size
It should include at least two quantum dot light photoluminescence materials in quantum dot optical film 12 in the present embodiment therefore with the light of color
Material." at least two " mentioned here can be understood as different at least two of partial size, it is understood that different for chemical formula
At least two, i.e., material it is different at least two.For the first case, because of the quantum dot light electroluminescent material of same material
The light of different colours can be issued in different-grain diameter, therefore, even if the quantum dot in quantum dot optical film 12 is photic
The material of luminescent material is identical, as long as the partial size of a portion quantum dot light electroluminescent material meets the hair when being excited
Feux rouges out, the partial size satisfaction of another part issue green light when being excited.So in order to prepare quantum dot optical film 12, this
It is can choose in embodiment by material of the same race but different two amounts point light to the luminescent material of partial size is mixed into glue.
And second situation is then to issue feux rouges in excitation respectively by the quantum dot light electroluminescent material of unlike material
And green light namely first part's material are used to issue green light under excitation for issuing feux rouges, second part material under excitation,
Wherein second part is different from the chemical formula of first part.In this case, it is applied not only to issue two classes of feux rouges and green light
The material of quantum dot light electroluminescent material is different, i.e., first part's material is different from the chemical formula of second part material, and just
The quantum dot light electroluminescent material for issuing same color light under blue light excitation at last also may include the material of a variety of unlike materials
Material.
In the present embodiment, the quantum dot light electroluminescent material being dispersed in quantum dot optical film 12 is the material of same system
Material, chemical formula can be expressed as roughly AxMyEz.Wherein, A Ba, in Ag, Na, Fe, In, Cd, Zn, Ga, Mg, Pb, Cs element
One kind, one of M S, Cl, O, As, N, P, Se, Te, Ti, Zr, Pb element, in E S, As, Se, O, Cl, Br, I element
One kind；And 1.0≤x≤2.0,1.0≤y≤3.0,0≤z≤4.0.
So the quantum dot light electroluminescent material being dispersed in quantum dot film 12 can be InP, CdSe, Cd
(S0.2Se0.8)、CsPbBr3、In2O3、BaTiO3、AgInS2, any one in GaAs, PbTe ... material, can also be with these
Any two kinds of even a variety of mixing in material.
In order to prepare quantum dot optical film 12, need at least two amounts point embedded photoluminescent material being uniformly mixed into glue
In, the glue for being then blended with quantum dot light electroluminescent material carries out coating solidification and obtains quantum dot optical film 12, ties below
Fig. 3 is closed the process for preparing quantum dot optical film is introduced:
S302, it will at least two amounts point embedded photoluminescent material be evenly mixed in glue.
Glue used in quantum dot optical film 12 is prepared in the present embodiment can be heat curing type glue, be also possible to ultraviolet
Curability glue etc..It, can will be in the thermosettings glue such as epoxies, organic silicon, polyurethanes when using heat curing type glue
It is one or more to be mixed.In addition, since quantum dot optical film 12 will not only guarantee to issue in the excitation of blue-light LED chip 11
It is white will also to guarantee that the blue light of blue-light LED chip 1 sending itself with feux rouges and green light can be mixed to get for feux rouges and green light out
Light, so, the glue that quantum dot optical film 12 is prepared in the present embodiment should be transparent.In some examples, selection
The refractive index of glue is greater than 1.4.
When at least two previously described quantum dot light electroluminescent materials are mixed into glue, can directly be mixed
It closes, can also be mixed by other substances, to reach the mesh for allowing quantum dot light electroluminescent material to be uniformly mixed into glue
's.In a kind of example of the present embodiment, the mixed of quantum dot light electroluminescent material and glue can be carried out by organic solvent
It closes: firstly, carry out suitable quantum dot light electroluminescent material and suitable organic solvent to be mixed to get mixed solution, it is then right
Mixed solution is ultrasonically treated, until quantum dot light electroluminescent material is dissolved completely in organic solvent and obtains clear solution,
Again by glue latex to the clear solution being previously obtained, and magnetic agitation is carried out, finally, mixed to what is obtained after magnetic agitation
Close solution carry out vacuum defoamation stirring, by mixed solution organic solvent extract out, only remain quantum dot light electroluminescent material with
The mixed solution of glue.
S304, the glue for being blended with quantum dot light electroluminescent material are coated to carrier surface.
It, can glue is applied to carrier surfaces after obtaining the mixed uniformly glue of quantum dot light electroluminescent material.This
In described carrier only used during preparing quantum dot optical film 12, be not one of quantum dot optical film 12
Component part.It is understood that carrier should have larger and even curface object.
S306, by the glue after solidification from the isolated quantum dot optical film of carrier surface.
Glue is applied to after carrier surface, need to allow glue curing.If heat curing type glue when the glue selected, can
Heat cure is carried out in a manner of through baking etc..And if selection is uv-curing type glue, ultraviolet light can be used
Mode solidified.
After the completion of glue curing, the glue comprising quantum dot light electroluminescent material can be divided from carrier surface
From to obtain quantum dot optical film 12 only comprising glue and quantum dot light electroluminescent material.It is understood that in this reality
It applies in some other example of example, the separation for carrying out itself and carrier again after glue is fully cured can also not had to, for example,
In glue semi-solid preparation, but quantum dot optical film 12 is just separated in molding situation, this is also feasible.
Quantum dot optical film 12 in the present embodiment can be single-layer membrane structure, be also possible to two layers or more of structure,
Single layer structure as shown in Fig. 1, thus it is subsequent introduce the still single-layer membrane structure shown in Fig. 1 for said
It is bright.Fig. 4 shows a kind of structural schematic diagram of quantum optices film.In general, the thickness of this single layer quantum dot optical film 25~
Between 680 μm.Wherein, the first quanta point material 121 and the second quanta point material 122 are evenly distributed in glue 123,
In, the first quanta point material 121 and the second quanta point material 122 are respectively used to issue feux rouges and green light under the excitation of blue light.
S204, it quantum dot optical film is attached on the light-emitting surface of blue-light LED chip obtains White-light LED chip.
It is prepared after quantum dot optical film 12, so that it may which quantum dot optical film 12 is covered on blue-light LED chip 11
Light-emitting surface on, as needed to be made White-light LED chip as shown in Figure 1, quantum dot optical film 12 only can be covered on blue light
On the positive light-emitting surface of LED chip 11.For the ease of attaching to quantum dot optical film 12, blue-light LED chip 11 is positive to shine
On face, in some examples of the present embodiment, blue-light LED chip 11 uses the chip of inverted structure.With packed LED chip phase
Than, the blue-light LED chip 11 under inverted structure in subsequent encapsulation process, can directly by chip PN junction with it is positive and negative on substrate
Pole eutectic bonding, it is not necessary to use gold thread.Not applicable gold thread, naturally can aspect on the positive light-emitting surface of blue-light LED chip 11
Attach quantum dot optical film 12.Certainly, the present embodiment does not negate the blue-ray LED core of formal dress blue-light LED chip and vertical structure
Piece prepares feasibility when White-light LED chip, but for blue LED flip chip, both LED chips are attaching
There may be complex process, the lower problems of production efficiency when quantum dot optical film.
Attach to the shape of the quantum dot optical film 12 of 11 light-emitting surface of blue-light LED chip, size preferably and blue-light LED chip
The shape of 11 light-emitting surfaces, size matching, and it is larger by the possible area of quantum dot optical film that aforementioned schemes prepare, so
Shape, size can not all may be matched with 11 light-emitting surface of blue-light LED chip.Therefore, it attaches on 11 light-emitting surface of blue-light LED chip
Quantum dot optical film 12 may be into cross reduce cutting.In the present embodiment, the large area quantum dot light that will be prepared
Learning the mode that film attaches to 11 light-emitting surface of blue-light LED chip has such two kinds:
The first, first pastes the mode for cutting reduction again.It first will be without reducing the quantum dot light cut by binder
It learns film to be pasted on the light-emitting surface of blue-light LED chip 11, then cuts out extra quantum dot optical film in addition to covering light-emitting surface
Subtract and cuts away.
Second, first the mode pasted again is reduced in cutting.First, in accordance with the dimensions pair of 11 light-emitting surface of blue-light LED chip
The quantum dot optical film being prepared, which reduce cutting, obtains the corresponding quantum dot optical film 12 of blue-light LED chip, and will cut out
Subtract the resulting quantum dot optical film 12 of cutting to be pasted by binder on the light-emitting surface of blue-light LED chip 11.As Fig. 5, Fig. 5 show
Out be the quantum dot optical film in Fig. 4 is carried out reduce cutting cutting line schematic diagram.
In this example, to quantum dot optical film cutting can by the way of machine cuts or laser cutting into
Row, the quantum dot optical film 12 cut are attached to the light-emitting surface of blue-light LED chip 11 by binder, and example is attached to as shown in figure 1
On the positive light-emitting surface of blue-light LED chip 11.Binder can be the thermosettings glue such as epoxies, organic silicon, polyurethanes,
It can be uv-curing type glue.In some examples of the present embodiment, the transmitting photopeak of selected blue-light LED chip 11
It is worth wavelength usually between 400~480nm.Quantum dot light electroluminescent material in quantum dot optical film 12 is 400~480nm's
Under blue light excitation, the visible light of 480~680nm can be launched, the photoreactivation that the visible light and blue-light LED chip 11 are launched
Available white light.
It is understood that the White-light LED chip in the present embodiment can also use it in addition to preparing using foregoing schemes
His process flow.For example, being first dissolved in glue by the luminescent material of at least two amounts point light and forming quantum dot colloidal sol, then
Quantum dot colloidal sol is coated using modes such as coating, sprayings directly on the light-emitting surface of blue-light LED chip, is solidified in quantum dot colloidal sol
Or quantum dot optical film is formed at the same time after semi-solid preparation, White-light LED chip is also formed.
White-light LED chip provided in an embodiment of the present invention and the method for preparing the White-light LED chip, by advance by quantum
Quantum dot optical film is made in point embedded photoluminescent material, then which is attached to the light-emitting surface of blue-light LED chip
On, so that the LED chip for emitting white light can be obtained before being packaged to LED chip, and then abandons and sealed
The dress stage could be avoided by the way of phosphor material powder or quantum dot light electroluminescent material acquisition white light in encapsulation glue
The problem of bad influence LED lamp bead of packaging effect issues quality white light, improves the LED lamp bead quality based on White-light LED chip,
It ensure that production efficiency.
On the other hand, tradition and conventional fluorescent powder material are replaced using the luminescent material of quantum dot light, LED product can be made
Color gamut value be promoted to NTSC100% or more, bring better visual experience for user.
Embodiment two:
The present embodiment continues that the White-light LED chip in previous embodiment is introduced, the white light provided in the present embodiment
The structure of LED chip is as shown in Figure 6:
White-light LED chip 60 includes blue-light LED chip 61, quantum dot optical film 62.Wherein quantum dot optical film 62 passes through
Binder is attached on the positive light-emitting surface of blue-light LED chip 61, and quantum dot optical film 62 is same as single layer knot in embodiment one
The quantum dot optical film of structure comprising the first film layer 621 and the second film layer 622, wherein the first film layer 621 is adjacent to blue-ray LED core
The setting of 61 front light-emitting surface of piece, and the second film layer 622 is then covered in the first film layer 621.
One in first film layer 621 and the second film layer 622 is used to issue feux rouges under the excitation of blue light, another is used for
Green light is issued under the excitation of blue light.The first film layer 621 be can be for issuing feux rouges under blue light excitation, be also possible to second
Film layer 622 issues feux rouges under blue light excitation.It should be understood that in preparing quantum dot optical film 62 when single film layer, institute
Corresponding preparation flow may refer to the introduction that single layer quantum dot optical film is prepared in embodiment one, only prepares and is used to form list
When the glue of tunic, the material and being slightly different in embodiment one that are blended in glue: because of quantum dot light in embodiment one
Learning film is single layer structure, therefore only needs to prepare a kind of quantum dot colloidal sol for being used to prepare quantum dot optical film, and the quantum dot
It also include that can be excited in blue light just both comprising the quantum dot light electroluminescent material that can be glowed under blue light excitation in colloidal sol
The quantum dot light electroluminescent material of emitted green light.But in the present embodiment, because one in the first film layer and the second film layer can
It glows under blue light excitation, and another can excite emitted green light in blue light, therefore, the two film layers should incite somebody to action in the preparation
The quantum dot light electroluminescent material that can be glowed under excitation, which is mixed into a glue, obtains the first quantum dot colloidal sol, and
Will the quantum dot light electroluminescent material of green light be mixed into another glue and obtain second of quantum dot colloidal sol.Certainly,
The material species number of quantum dot light electroluminescent material can be greater than in the first quantum dot colloidal sol and second of quantum dot colloidal sol
Equal to 1.
When preparing quantum dot film 62, the first film layer 621 and the second film layer 622 can be individually prepared, then again will
Two film layers constitute quantum dot optical film 62 altogether.Any one in two film layers can also be first prepared, when the film layer is solid
When change or semi-solid preparation, then the glue for being used to prepare another film layer is coated on the surface of this film layer, in this way
It enables to the first film layer 621 and the second film layer 622 preferably to fit together, avoids passing through first way and make to obtain two
After a monofilm in conjunction with scheme in the combination that is easy to appear it is not tight enough, the problems such as there are bubbles.
In the present embodiment, it is prepared after quantum dot optical film 62, it is necessary to attach to quantum dot optical film 62
On the positive light-emitting surface of blue-light LED chip.In view of industrially when producing LED chip, usually mass is generated, such energy
Enough improving production efficiencies.So in the present embodiment, White-light LED chip can also be prepared in batches: the area prepared is larger
The tiling of quantum dot optical film 62 on a carrier, bonding is then coated on the positive light-emitting surface of multiple blue-light LED chips 61
It is pasted on quantum dot optical film 62 after agent according to certain arrangement rule, as shown in Figure 7.To be bonded dose of slightly solidification or complete
After all solidstate, cutting reduction is carried out to quantum dot optical film.It is of course also possible to first by multiple blue-light LED chips 61 according to certain
The arrangement of arrangement rule to a carrier surface, each blue-light LED chip 61 it is face-up, then each blue-light LED chip 61 just
The thermosettings glue such as epoxies, organic silicon, polyurethanes are coated on the light-emitting surface in face, then by the quantum dot optical film of large area
62 cover on blue-light LED chip 61, until being cut out after blue-light LED chip 61 and quantum dot optical film 62 are bonded together
Subtract cutting, obtain single White-light LED chip, and removes quantum dot optical film extra on each White-light LED chip.
White-light LED chip provided in this embodiment forms quantum by two or even more than two single-layer membrane structures
Point optical film, then attaches to the quantum dot optical film on the light-emitting surface of blue-light LED chip, so that without going through LED
Chip package can obtain the LED chip for emitting white light, and avoid influence of the packaging effect to LED lamp bead light-out effect.Separately
On the one hand, a kind of method that batch prepares White-light LED chip is present embodiments provided, so that the preparation efficiency of White-light LED chip
It gets a promotion.
It, can be directly in blue-light LED chip 61 in some examples of the present embodiment other than above-mentioned preparation method
Light-emitting surface on prepare quantum dot optical film 62, i.e., using spraying, coating etc. modes the first quantum dot colloidal sol is sprayed into indigo plant
On the light-emitting surface of light LED chip 61, the first film layer 621 is formed after the solidification of the first quantum dot colloidal sol or semi-solid preparation.Then again
It is sprayed in the first film layer 621 or coats second of quantum dot colloidal sol, and be formed by curing the second model.Work as in this preparation method
In, it can not have to bond using other glue between quantum dot optical film 62 and blue-light LED chip 61, save white light LEDs core
The preparation cost of piece 60 simplifies its preparation process.
Embodiment three:
White light LEDs lamp bead provided by the invention and the method for preparing the white light LEDs lamp bead will be introduced in the present embodiment,
Specifically, referring to Fig. 8:
White light LEDs lamp bead 8 provided in this embodiment includes White-light LED chip 80 and substrate 81.It should be understood that in order to
White light LEDs lamp bead 8 is prepared, so white light LEDs should should be first prepared before being packaged to White-light LED chip 80
Chip.The preparation method of White-light LED chip 80 may refer to the introduction in previous embodiment, and which is not described herein again.
In the present embodiment, the material of substrate 81 is one of ceramics, glass, graphite, glass, metal or a variety of answers
Condensation material, and it has at least one component side 811, on substrate 81, has circuit structure.The setting of White-light LED chip 80 exists
On substrate 81, certainly, White-light LED chip 80 should be with 81 electrical communication of substrate.Continue in the present embodiment to form white light LEDs core
For the blue-light LED chip of piece 80 is inverted structure, since blue-light LED chip is inverted structure, so its white light LEDs for being formed
Chip 80 is also inverted structure.This means that the chip electrode of White-light LED chip 80 and front light-emitting surface are in opposite two
On face, so, when White-light LED chip 80 is positive to be fixed on substrate 81, chip electrode then with the component side 811 of substrate 81
It touches together.In the present embodiment, the electrode material of White-light LED chip 80 is in Au, Pd, Pt, Sn, Cu, Al, Ag, Ni
The alloy of one or more compositions.Chip electrode can pass through one in several electroconductive binders such as gold-tin alloy, tin cream, elargol
Kind or a variety of and substrate 81 are fixed and realize route electrical communication.It should be understood that on the electrode of some White-light LED chips 80
Natively there is gold-tin alloy, then in such a case, it is possible to carry out White-light LED chip 80 in substrate 81 using only scaling powder
On welding solidification.After White-light LED chip 80 is fixed on substrate 81 by electroconductive binder, substrate 81 can be put into
It is toasted into reflow ovens by 80~350 DEG C of baking temperature, so that electroconductive binder solidifies.It is understood that white
Light LED chip 80 and the specific circuit connection structure of substrate 81, Fig. 8 are not showed that in the middle.
By being directly to be packaged to obtain white light LEDs lamp bead 8 to White-light LED chip 80 in this present embodiment, therefore, encapsulation
Process is not to obtain a necessary process of white light, because before encapsulation, electrically connecting if White-light LED chip 80 is in
White light just can be issued in logical situation, so in the present embodiment, the main purpose of encapsulation is to realize White-light LED chip
Electrical communication.And in the prior art, blue-light LED chip encapsulation is carried out, is on the one hand to realize the electrical of chip and substrate
On the other hand connection is to coat fluorescent material or quanta point material on blue-light LED chip light-emitting surface by encapsulating glue.
So gluing process is essential in existing encapsulation scheme.Namely in existing white light LEDs lamp bead, glue is encapsulated
Layer is essential.But, in the present embodiment, although encapsulation glue layer is not necessary, but if in white light LEDs lamp bead
It is provided with encapsulation glue layer in 8, then preferably white light LED lamp bead 8 can be protected.
Another white light LEDs lamp bead provided in this embodiment is introduced below, refers to the white light shown in Fig. 9
The structural schematic diagram of LED lamp bead 9:
White light LEDs lamp bead 9 includes White-light LED chip 90, substrate 91 and encapsulation glue-line 92 and white reflection glue-line 93.Wherein
Encapsulation glue-line 92 is provided only on the positive light-emitting surface of White-light LED chip 90, and white reflection glue-line 93 is then arranged in white light LEDs core
The surrounding of piece 90.It is introduced below with reference to encapsulation process of the Figure 10 to White-light LED chip 90:
S102, at least one White-light LED chip is fixed to substrate corresponding position, and White-light LED chip and substrate is electric
Gas connection；
S104, coating encapsulation glue forms encapsulation glue-line on the light-emitting surface of White-light LED chip；
S106, when encapsulating glue curing or after semi-solid preparation, form white reflection glue-line in White-light LED chip surrounding, be made white
Light LED lamp bead.
In the introduction for Fig. 8, describes in detail and how White-light LED chip to be fixed on substrate and be realized
Electrical communication, the process are equally applicable to fixation of the White-light LED chip 90 on substrate 91, so which is not described herein again white light
Fixation, that is, electrical connection process between LED chip 90 and substrate 91.It should be understood that can once be prepared in the present embodiment
A white light LEDs lamp bead 9 is only made in the process, it can also be with batch making.So when needing that two are made during producing once
When a or more white light LEDs lamp bead, first at least two White-light LED chips 90 can be fixed on substrate 91, such as Figure 11 institute
Show.
After White-light LED chip 90 is fixed on substrate, envelope can be coated on 90 front light-emitting surface of White-light LED chip
Glue is filled, encapsulation glue-line 92 is formed.For the situation of batch preparation, can individually be sealed for each White-light LED chip 90
Glue coating is filled, but efficiency in this way is obviously not high enough, so, it, can be using molding in a kind of example of the present embodiment
Mode is simultaneously to the positive light-emitting surface coating encapsulation glue of multiple White-light LED chips, to form encapsulation glue-line.In the present embodiment
In, encapsulation glue is the liquid state organics of transparence, and viscosity range is 350~150000mPas.If encapsulating heat when glue
Curable type glue can be toasted 0.5~12 hour then after moulded package glue using 45~240 DEG C of temperature, so that
Glue rapid curing is encapsulated, if the encapsulation glue selected certainly is not heat curing type glue, accelerates cured mode should
It changes correspondingly.
It should be understood that for multiple White-light LED chips 90 fixed on one piece of substrate 91, although can be formed simultaneously
Glue-line is encapsulated, still, since there are gaps 94 between a White-light LED chip and another White-light LED chip, so, in mould
When swaging is at encapsulation glue-line 92, encapsulation glue is dropped onto for a moment in gap 94.And the four of each White-light LED chip 90
Week white reflection glue-line 93 is all needed to form, therefore, it is necessary to remove white light LEDs after encapsulation glue curing or semi-solid preparation
The extra encapsulation glue of 90 surrounding of chip, the encapsulation glue-line 92 being only remained on 90 front light-emitting surface of White-light LED chip.
After removing extra encapsulation glue, can by way of secondary mould pressing around each White-light LED chip shape
At white reflection glue-line.White reflection glue is alternatively referred to as white wall glue, is mixed by organic glue and TiO2.Wherein organic glue can be with
It is organic thermosetting glue.It, can be small in 85~320 DEG C of at a temperature of baking 1~16 after secondary mould pressing heat curing type white reflection glue
When, so that white reflection curable adhesive layer forms white reflection glue-line 93.Surrounding in the present embodiment in each White-light LED chip 90 forms white
Glue-line 93 is reflected, the blue light for being on the one hand to that blue-light LED chip is avoided to issue is appeared from side, certainly, if white preparing
When light LED chip 90, side is also pasted with quantum dot optical film, then regardless of whether forming white reflection glue-line 93, this problem is all
It is not present.On the other hand, the white reflection glue-line 93 of formation, can be to the White-light LED chip that white reflection glue-line 93 wraps up from side
It is protected, promotes the reliability of White-light LED chip.
Certainly, if it is the situation for preparing white light LEDs lamp bead in batches, after the solidification of white reflection glue-line 93, need according to
The arrangement of each White-light LED chip 90 carries out cutting reduction, to obtain single white light LEDs lamp bead 9.It should be understood that in order to
Each white light LEDs lamp bead is allowed to include the white reflection glue-line 93 with protective effect, so, in the present embodiment, cut
When, it needs to be cut among white reflection glue-line 93, as shown in figure 12.
It only include single White-light LED chip, but beyond all doubt, this reality in each white light LEDs lamp bead in foregoing description
In the white light LEDs lamp bead that example offer is provided, at least two White-light LED chips also can be set.As shown at 13, the one of the present embodiment
Include 7 White-light LED chips 131 in white light LEDs lamp bead 130 in kind of example, wherein 6 White-light LED chips be distributed in it is equilateral
On 6 vertex of hexagon, and an other White-light LED chip is arranged in the center of gravity of equilateral hexagon.
In another example of the present embodiment, referring to Figure 14, it include 4 white light LEDs in white light LEDs lamp bead 140
Chip 141, wherein three White-light LED chips are distributed on three vertex of equilateral triangle, it is another can White-light LED chip deployment
In the center of gravity of equilateral triangle.Although giving the arrangement example of White-light LED chip in multi-chip white light LEDs lamp bead here,
But it is understood that this is not the only two kinds of arrangement modes of White-light LED chip, therefore, foregoing description is not used to limit
The specific arrangement of White-light LED chip in ding white ware light LED lamp bead.
The present embodiment provides a kind of white light LEDs lamp bead and the preparation methods of the white light LEDs lamp bead, due to white LED lamp
White-light LED chip inside pearl has use to include quantum dot light electroluminescent material, therefore greatly improves the color of LED backlight lamp bead
Thresholding, so that the color gamut value of white light LEDs lamp bead is up to 105% or more NTSC.
Meanwhile by carrying out the mixing of quantum dot light electroluminescent material and glue in advance and forming optical film, avoid a little
The reunion failure phenomenon of quantum dot light electroluminescent material, significantly improves the quality of white light LEDs lamp bead during glue.Further
Ground when due to being packaged to White-light LED chip, does not need doping fluorescent powder material or the photic hair of quantum dot in encapsulation glue
Luminescent material greatly reduces the encapsulation glue viscosity in production process, ensure that the acceptance rate of white light LEDs lamp bead product, is suitble to
Large-scale industrial production.
It is unambiguously that White-light LED chip provided in foregoing embodiments and white light LEDs lamp bead can be applied to
Various illumination fields, such as it can be fabricated to backlight module and (can be TV, display, hand applied to display backlight field
The backlight module of the terminals such as machine).Backlight module can be applied at this time.Other than it can be applied to display backlight field, also
It can be applied to key-press backlight field, shooting field, home lighting field, lighting for medical use field, furnishing fields, automotive field, friendship
Logical field etc..When applied to key-press backlight field, it can be used as mobile phone, calculator, keyboard etc. and carried on the back with the key of press key equipment
Radiant；When applied to shooting field, the flash lamp of camera can be fabricated to；When applied to home lighting field, it can make
It is made floor lamp, desk lamp, headlamp, ceiling lamp, downlight, projecting lamp etc.；When applied to lighting for medical use field, hand can be fabricated to
Art lamp, low electromagnetism headlamp etc.；Various ornament lamps can be fabricated to when applied to furnishing fields, such as various color lamps, landscape shine
Bright lamp, advertising lamp；When applied to automotive field, automobile lamp, automobile indicator etc. can be fabricated to；Applied to field of traffic
When, various traffic lights can be made, various street lamps can also be made.Above-mentioned application is only several exemplified by the present embodiment answers
With, it should be appreciated that application several fields that it is not limited to the above example of the LED in the present embodiment.
Obviously, those skilled in the art should be understood that each module of the embodiments of the present invention or each step can be used
General computing device realizes that they can be concentrated on a single computing device, or be distributed in multiple computing device institutes
On the network of composition, optionally, they can be realized with the program code that computing device can perform, it is thus possible to by them
It is stored in computer storage medium (ROM/RAM, magnetic disk, CD) and is performed by computing device, and in some cases, it can
With the steps shown or described are performed in an order that is different from the one herein, or they are fabricated to each integrated circuit dies
Block, or single integrated circuit module is maked multiple modules or steps in them to realize.So the present invention does not limit
It is combined in any specific hardware and software.
The above content is combining specific embodiment to be further described to made by the embodiment of the present invention, cannot recognize
Fixed specific implementation of the invention is only limited to these instructions.For those of ordinary skill in the art to which the present invention belongs,
Without departing from the inventive concept of the premise, a number of simple deductions or replacements can also be made, all shall be regarded as belonging to the present invention
Protection scope.
Claims (10)
1. a kind of White-light LED chip preparation method characterized by comprising
Quantum dot optical film, at least two quantum dot light are prepared using glue and at least two quantum dot light electroluminescent materials
A part in electroluminescent material issues feux rouges under the excitation of blue light, and another part issues green light under the excitation of blue light；
The quantum dot optical film is attached on the light-emitting surface of blue-light LED chip and obtains White-light LED chip.
2. White-light LED chip preparation method as described in claim 1, which is characterized in that described to utilize glue and at least two
Quanta point material prepares quantum dot optical film
At least two quantum dot lights electroluminescent material is evenly mixed in the glue；
The glue for being blended with quantum dot light electroluminescent material is coated to carrier surface；
By the glue after solidification from the isolated quantum dot optical film of the carrier surface.
3. White-light LED chip preparation method as claimed in claim 1 or 2, which is characterized in that described by the quantum dot optics
Film, which is attached on the light-emitting surface of blue-light LED chip, obtains White-light LED chip are as follows:
The quantum dot optical film is attached on the positive light-emitting surface of the blue-light LED chip and obtains White-light LED chip.
4. a kind of white light LEDs lamp bead preparation method characterized by comprising
White-light LED chip is prepared according to White-light LED chip preparation method as described in any one of claims 1-3；
It is disposed on the substrate at least one described White-light LED chip to obtain white light LEDs lamp bead.
5. white light LEDs lamp bead preparation method as claimed in claim 4, which is characterized in that described by least one white light
LED chip is disposed on the substrate to obtain white light LEDs lamp bead
By at least one described White-light LED chip be fixed to the substrate corresponding position, and by the White-light LED chip with it is described
Substrate electrical communication；
Coating encapsulation glue forms encapsulation glue-line on the light-emitting surface of the White-light LED chip；
After the encapsulation glue curing or semi-solid preparation, white reflection glue-line is formed in the White-light LED chip surrounding, white light is made
LED lamp bead.
6. white light LEDs lamp bead preparation method as claimed in claim 5, which is characterized in that described by least one white light
It includes: that at least two White-light LED chips are fixed on the substrate that LED chip, which is fixed to the substrate corresponding position,；
Coating encapsulation glue includes: by way of molding to the substrate on the light-emitting surface to the White-light LED chip
Be provided with the one side coating encapsulation glue of White-light LED chip, and remove after the encapsulation glue curing or semi-solid preparation it is extra
Glue is encapsulated, the extra encapsulation glue is the encapsulation glue other than each white light LEDs front light-emitting surface；
Described to form white reflection glue-line in the White-light LED chip surrounding, it includes: to pass through secondary mould pressing that white light LEDs lamp bead, which is made,
Mode white reflection glue-line is formed around each White-light LED chip；
The white reflection glue-line and the substrate are cut according to the arrangement of each White-light LED chip on the substrate
Single white light LEDs lamp bead is obtained, includes at least one White-light LED chip in the single white light LEDs lamp bead.
7. a kind of White-light LED chip, which is characterized in that the White-light LED chip includes blue-light LED chip and is attached at the indigo plant
Quantum dot optical film on the light-emitting surface of light LED chip, the quantum dot optical film utilize glue and at least two quantum dot lights
Electroluminescent material is prepared, and a part in at least two quantum dot lights electroluminescent material issues under the excitation of blue light
Feux rouges, another part issue green light under the excitation of blue light.
8. White-light LED chip as claimed in claim 7, which is characterized in that the quantum dot light electroluminescent material is AxMyEzMaterial
Material, the A are one of Ba, Ag, Na, Fe, In, Cd, Zn, Ga, Mg, Pb, Cs element, the M is S, Cl, O, As, N, P,
One of Se, Te, Ti, Zr, Pb element, the E are one of S, As, Se, O, Cl, Br, I element；And 1.0≤x≤
2.0,1.0≤y≤3.0,0≤z≤4.0；The glue is transparent and heat curing type glue of the refractive index greater than 1.4；The amount
Son point optical film with a thickness of 25~680 μm.
9. White-light LED chip as claimed in claim 7 or 8, which is characterized in that the quantum dot optical film includes the first film layer
With the second film layer being covered in first film layer, one in first film layer and second film layer excites in blue light
Lower sending feux rouges, another issues green light under blue light excitation.
10. a kind of white light LEDs lamp bead, which is characterized in that the white light LEDs lamp bead includes substrate and such as claim 7-9 appoints
White-light LED chip described in one, the White-light LED chip setting is on the substrate.
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| CN110767791A (en) * | 2019-09-10 | 2020-02-07 | 江西省晶能半导体有限公司 | LED lamp bead preparation method |
| CN112666750A (en) * | 2020-12-25 | 2021-04-16 | 舟山扑浪实业有限公司 | Quantum dot display panel and preparation method thereof |
| CN112820812A (en) * | 2021-02-04 | 2021-05-18 | 谷麦光电科技股份有限公司 | Manufacturing process of side light leakage prevention LED and LED obtained by same |
| CN115469484A (en) * | 2022-10-21 | 2022-12-13 | 惠科股份有限公司 | Backlight module, display module and display device |
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