CN100411210C - White light LED and packaging method thereof - Google Patents
White light LED and packaging method thereof Download PDFInfo
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- CN100411210C CN100411210C CNB2006100340121A CN200610034012A CN100411210C CN 100411210 C CN100411210 C CN 100411210C CN B2006100340121 A CNB2006100340121 A CN B2006100340121A CN 200610034012 A CN200610034012 A CN 200610034012A CN 100411210 C CN100411210 C CN 100411210C
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- white light
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Abstract
The present invention discloses a white light LED and an encapsulation method thereof, which belongs to the field of LEDs. The white light LED of the present invention comprises a chip, a support, silicon gel, a fluorescent powder film and peripheral components such as lenses. The encapsulation structure is characterized in that the fluorescent powder film is separated from the chip by the silicon gel or other materials, which causes the heat of the fluorescent powder to be separated from that of the chip. The edge of the fluorescent powder film is in contact with a base plate at the bottom, which causes the heat of the fluorescent powder to be conducted to the exterior to avoid heat accumulation on the fluorescent podwer film. The chip is fixed on the support, and the silicon gel directly covers the chip. The designed and prepared fluorescent powder film covers the silicon gel, and simultaneously the fluorescent powder film is in contact with a bowl. The method improves light emitting efficiency, greatly improves photochromic stability and reduces light decay. Besides, the encapsulation method using the fluorescent powder film to form the white light provided by the present invention has simple procedure and is suitable for industrial production in large scale.
Description
Technical field
The present invention relates to a kind of method for packing of white light LEDs.
Background technology
LED is a kind of light emitting semiconductor device, is used as indicator light, display screen etc. widely.White light LEDs be described as replace fluorescent lamps and incandescent lamp the 4th generation lighting source.A kind of traditional approach that forms white light LEDs is that blue light or ultraviolet chip excite the fluorescent material that is covering on chip, and the light stimulus fluorescent material that chip sends under electricity drives produces the visible light of other wave band, and the each several part colour mixture forms white light.
Excite the led chip that forms white light synthetic by fluorescent material by III-V compound semiconductor GaN material.The backing material that wherein is used for the GaN chip has Al
2O
3And SiC, chip can send the light of blue light, ultraviolet light or other short-wave band.
The fluorescent material that is used to form white light LEDs generally has YAG fluorescent material (be used for blue chip and excite YAG fluorescent material) and RGB fluorescent material (be used for the ultraviolet chip and excite RGB fluorescent material).Wherein adopt YAG fluorescent material to excite the mode that forms white light the most general.
Typical White-light LED package structure.For the small-power white light LEDs, led chip is placed in the reflector in the support, and support had not only used as the carrier of reflector but also as electrode and electrode pin, and the passage of chip heat diffusion also is provided simultaneously.Chip is positioned over the central authorities of reflector, the difference that is provided with according to chip electrode, and coat elargol or insulating cement (for the unipolar chip in top in bowl cup bottom, the bottom is coated with the elargol of conduction, and for the chip of top bipolar electrode, the bottom is coated with insulating cement), they not only can stick and fixed chip but also can realize good Ohmic contact between chip and electrode.The electrode of chip links to each other with another electrode of support by Au line welding, thick yttrium-aluminium-garnet (YAG) the yellow fluorescence bisque of the about 100um of coating on GaN blue-light-emitting chip, entire bracket and chip epoxy sealing sealing-in at last, the centre gas of not leaving a blank.Blue light that chip sends and fluorescent material effect fully and excitated fluorescent powder sends gold-tinted makes gold-tinted mix the formation white light mutually with the sodium yellow that appears from phosphor powder layer again.
For the encapsulation of power stage white light LEDs, the heat radiation and fluorescent powder coated be two key technical problems, the effect of heat dissipation technology and the quality of fluorescent powder coated technology will directly have influence on the performance of LED, and many companies have adopted heat radiation and the fluorescent powder coated problem in the new encapsulation technology desire solution large power white light LED encapsulation technology.The Luxeon LED that Lumileds company releases, it adopts thermoelectric form of separating, with flip-chip with silicon carrier directly be welded on heat sink on, and adopt new construction and new materials such as reflector, optical lens and flexible and transparent glue, improved getting optical efficiency and having improved heat dissipation characteristics of device.Treating on the fluorescent powder coated problem, Lumileds has taked the even coating method of fluorescent material (Fig. 1 (b)), preferably resolves photochromic uneven problem.Osram company releases " Golden Dragon " series LED of single-chip, and its design feature is heat sinkly directly to contact with metal circuit board, have good heat dispersion, and input power can reach 1W.And aspect fluorescent powder coated, its adopts a conventional fluorescent powder application pattern (Fig. 1 (a)) of directly filling cup bowl covering chip.
These application pattern all are to adopt fluorescent material directly to contact with chip, and chip is at the direct excitated fluorescent powder of near-end, and colour mixture forms white light then.For the mode that the nearly territory of fluorescent material excites, on the one hand, the heat of chip directly is carried on the phosphor powder layer, and it is comparatively obvious to cause the photochromic drift of LED bright dipping to be subjected to the influence of junction temperature of chip, and this makes and requires photochromic stable occasion to be not suitable at some; On the other hand, directly fill cup bowl by fluorescent material and cover the method for chip, cause LED after packaged photochromic inhomogeneous and light extraction efficiency is low because coating is inhomogeneous and explained hereafter is uncontrollable; In addition, fluorescent material near field mode of excitation makes and a part of backscattering light loss makes light extraction efficiency reduce, also can make light decay become big.
The patent US20040223315A1 of Japan Toyoda Gosei company, the patent KR2004044701-A of Korea S SAMSUNG company, the encapsulating structure of taking phosphor powder layer to separate, potting resin or other material between phosphor powder layer and the chip with chip.The mode that this fluorescent material territory far away excites has improved the part light extraction efficiency, but some structure more complicated that they propose, realization technology is difficult, and the heat that sends of phosphor powder layer can not effectively be transmitted to the outside and go, make light decay become big, the photochromic consistency of encapsulation back LED is difficult to control simultaneously.
Summary of the invention
The objective of the invention is at the heat radiation that exists in the above-mentioned existing large power white light LED encapsulation technology, light decay, photochromic and light extraction efficiency problem, a kind of method for packing of novel high-power white light LEDs is provided, its manufacture craft is simple, can improve heat dissipation environment, and significantly reduce light decay, improve photochromic, simultaneously this LED can be under big electric current steady operation.
White light LEDs of the present invention comprises chip, support, silica gel, fluorescent powder film layer and peripheral components (as lens).The difference of this encapsulating structure is to take to separate with materials such as silica gel between phosphor powder layer and the chip, makes phosphor powder layer and the hot thermal release of chip two parts heat; The fluorescent powder film layer edge contacts with bottom substrate, makes the heat of phosphor powder layer be transmitted to the outside, avoids the accumulation of phosphor powder layer heat.Chip is fixed on the support, and described silica gel directly overlays on the chip, and the fluorescent powder film layer that designs and prepare covers on the silica gel, and fluorescent powder film layer contacts with the cup bowl simultaneously.
Fluorescent powder film layer preparation and design: obtain full and uniform exciting in order to make the fluorescent material in each scope of fluorescent powder film layer, must the suitable fluorescent powder film layer shape of design.Its preparation process is: (1) fluorescent material allotment: silica gel is in harmonious proportion fluorescent material, mixes well, stir deaeration; (2) fluorescent powder film layer forms: phosphor gel is injected in the mould, put into baking box, select suitable temperature and time, take out the demoulding, for preventing that rete is difficult for taking out, often spray release agent in advance in mould.
Above-mentioned mould is according to the design of the mentality of designing of fluorescent powder film layer, the rete mentality of designing is to distribute according to chip light field substep and thermal field, combined with fluorescent powder scattering theory and fluorescent material transformation mechanism, utilize optical design software and thermal design software to design the shape of fluorescent powder film layer, make the fluorescent material in each scope obtain full and uniform exciting, optimize the rete design then, again according to this rete design corresponding mould.
The design of phosphor multilayer film and preparation:
Utilize ultraviolet LED to excite RGB fluorescent material to form the method for white light, need use three kinds of fluorescent material.A kind of means are that three kinds of fluorescent material are mixed according to special ratios, and the thinking according to the preparation monofilm prepares the RGB fluorescent powder membrane then.In addition, in order to realize adjustable spectral characteristic, we can adopt the mentality of designing of multilayer film to realize encapsulation.For the performance (as improving color rendering index) that improves white light LEDs, we also can take the phosphor multilayer embrane method, and used various fluorescent material are designed to the phosphor multilayer film as requested.Form each film unit of multilayer film, not only comprise fluorescent material, also comprise the scattering diluent particle, improve the SiC particle of heat radiation etc.As often in yellow YAG fluorescent material, adding a small amount of red fluorescence powder, just we can accomplish yellow YAG phosphor powder layer and red fluorescence bisque on the same film in order to improve color rendering index; In addition, in order to improve the consistency of bright dipping, often add a small amount of diffusant in fluorescent material, we also can be designed to multilayer film with this diffusant and fluorescent material.The thinking of multilayer film mentality of designing and monofilm is similar, good each rete of planning at first, and since the design of first tunic, and then to the design of second tunic, by that analogy, design bigger flexibly can be realized adjustable spectral characteristic.The preparation method prepares ground floor earlier, then preparation trilamellar membrane on the basis of second tunic.
Multicore sheet white light LEDs encapsulation:, take the mode of fluorescent material overlay film can better improve the stability of bright dipping to multi-chip LED because the influence of multi-chip LED encapsulation received heat is even more serious.
Many the integrated formation luminescent devices of single LEDs, perhaps multiple chips adopts method shown in this paper to be packaged into face battle array white light LEDs and makes new type light source.As be used in road lamp cap in the lighting field, and automobile-used headlight for vehicles, mine lamp, and in the fields such as mobile phone or LCD backlight.
The integrated encapsulation of multicore sheet that the present invention makes and single-chip forms new type light source, since photochromic stable fine under the different electric currents, so be used in the tunable optical source domain.The integrated encapsulation of multicore sheet that the present invention makes and single-chip forms new type light source, fluorescent powder membrane adopts multi-layer film structure, light characteristic because multilayer film can improve color rendering index and improve, therefore be used to some colour temperature and require field high and that colour stability requires, as medical shadowless lamp.
After adopting the fluorescent material coating technique, original carrier cup bowl formula structure also can adopt the plane formula structure.
The method for packing of white light LEDs of the present invention specifically comprises the steps:
(1) chip is fixed on the support.
(2) installing electrodes on chip connects metal wire, and is configured to electric connection.
(3) injecting glue:, silica gel is injected in the cup bowl for cup bowl type support; For the plane support, silica gel need only be dropped in chip surface.
(4) overlay film: silica gel and fluorescent material are mixed well, stir deaeration, in the injection mould, baking, the demoulding, obtain fluorescent powder film layer, the fluorescent powder film layer of making is covered the silica gel upper end, make rete be in the center of silica gel, assurance rete and silica gel are combined closely, do not produce bubble, and rete is contacted with bracket edge.
Can add a cover lens at the rete top, be used for back segment and handle and measure, guarantee not produce bubble between lens and the rete.
Compared with prior art, the present invention has following beneficial effect: phosphor powder layer and the fluorescent material territory far away exciting method that chip separates, reduced the loss of fluorescent powder film layer back-scattering light on the one hand, and improved light extraction efficiency; Chip separates with phosphor powder layer on the other hand, and the heat of chip can not be loaded on the phosphor powder layer, makes that the colour temperature of white light LEDs and influence that color rendering index is subjected to junction temperature of chip are less, and photochromic stability is better than conventional method greatly.By designing suitable fluorescent powder film layer shape, make fluorescent powder film layer be excited uniformly everywhere, the light extraction efficiency height reduces light decay.Simultaneously, the method for packing step that fluorescent material overlay film provided by the invention forms white light is simple, is applicable to large-scale industrial production.
Description of drawings
Fig. 1 is different White-light LED package structure schematic diagrames, (a) the white-light LED structure figure that encapsulates for traditional approach; (b) be the white-light LED structure figure of the even application pattern encapsulation of Limuleds;
Fig. 2 is for adopting the large power white light LED structure chart of cup bowl formula method with plastic film encapsulation;
Fig. 3 is the coating of the fluorophor in the method for packaging white LED of the present invention flow chart;
Fig. 4 is two kinds of white-light LED structure figure that adopt the encapsulation of plane formula method with plastic film;
Fig. 5 is for adopting the Single chip white light LED structure chart of plane formula duplicature method with plastic film encapsulation;
Fig. 6 is for adopting the Single chip white light LED structure chart of plane formula trilamellar membrane method with plastic film encapsulation;
Fig. 7 is the design diagram of phosphor multilayer film;
The luminous efficiency comparison diagram that Fig. 8 excites for fluorescent material territory far away and nearly territory excites;
The radiating effect comparison diagram that Fig. 9 excites for fluorescent material territory far away and nearly territory excites;
The colour temperature that Figure 10 excites for fluorescent material territory far away and nearly territory excites changes comparison diagram;
The color rendering index that Figure 11 excites for fluorescent material territory far away and nearly territory excites changes comparison diagram;
The multicore sheet White-light LED package structure figure (positive cartridge chip) of Figure 12 for adopting the plane method with plastic film;
Figure 13 is for adopting the multicore sheet White-light LED package structure figure (flip-chip) of plane method with plastic film;
Wherein: 1 fluorescent powder film layer; 2 silica gel; 3 chips; 4 speculums; 5 supports.
Embodiment
Embodiment 1:
As shown in Figure 2, positive cartridge chip 3 is fixed on the bottom surface of cup bowl cribbing 5, and speculum 4 is laid in cup bowl cribbing 5 both sides, and silica gel 2 is filled with on positive cartridge chip 3 surfaces, and fluorescent powder film layer 1 covers and is fixed on the silica gel 2, and fluorescent powder film layer 1 edge contacts with cup bowl cribbing 5.
Elargol on cup bowl cribbing 5 mid points, its function is used for sticking together chip.With high-power Al
2O
3The positive cartridge chip 3 of GaN base blue-ray LED of substrate is put on the elargol of cup bowl cribbing 5; The peak wavelength scope of chip 3 is 460-465nm.Elargol is hardened in the thermmohardening baking.On the electrode of chip 3, connect metal wire, and be configured to electric connection, make when electric current passes through support, just can excite led chip luminous.DOW CORNING model silica gel 2 is injected cup bowl cribbing 5.The fluorescent powder film layer of making 1 is covered silica gel 2 upper ends, make fluorescent powder film layer 1 be in the center, notice that rete 1 and silica gel 2 combines closely, do not produce bubble.At this moment can put into the baking box baking hardening.Add a cover lens at rete 1 top, add a small amount of silica gel, prevent to produce bubble in the middle of lens and the rete at contact-making surface.The encapsulation flow process as shown in Figure 3.
The design of fluorescent powder film layer 1: the bright dipping of measuring bare chip 3 by experiment obtains chip 3 optical field distribution on every side.With support 5, chip 3, each parameter input optical design software TracePro of optical field distribution, set up model.The lower surface of choosing phosphor powder layer 1 is as the plane of reference, considers the reflection loss of light when silica gel 2 incident fluorescence powder retes 1, excites more fully simultaneously, makes the plane of reference perpendicular to incident ray, just the plane of reference will be as far as possible near the constant energy surface of chip outgoing light field.The plane of reference is designed to continuous cambered surface.
Optics software TracePro simulates bright dipping, designs an other plane of reference according to plane of reference light intensity everywhere.Utilize the Monte-Carlo ray tracing to simulate and design the another one plane of reference, do following consideration: the first step, light from the short wavelength of LED outgoing is lost a part by fluorescent material scattering medium layer, and the short-wavelength light of running out from phosphor powder layer distributes to simulate and obtains; Second one, consider that fluorescent material is subjected to short-wavelength light to excite the light that produces the long wavelength, ray tracing can be weighed by transformation efficiency (transformation efficiency of the quantum efficiency of fluorescent material and Stokes displacement) for the second time, and long wavelength's light field of outgoing for the second time also can obtain.Like this we can the given plane of reference and parameters under the spectral characteristic of light field.Change the plane of reference and parameters, obtain required rete shape.Part between two plane of references is our required phosphor powder layer.
Guarantee the continuous and rete edge contact heat-radiating substrate of fluorescent powder film layer, the certain heat that produces in the time of fluorescent powder membrane can being excited is like this derived and is gone.According to the corresponding mould of fluorescent powder film layer 1 shaped design.With DOW CORNING model silica gel and YAG fluorescent material, mix well, stir deaeration; The phosphor gel of having mixed silica gel is injected in the mould (spraying release agent in advance), put into baking box, select 180 ℃ of temperature, take out after 30 minutes, the demoulding obtains fluorescent powder film layer 1.
Under the input current of 350mA, test white light LEDs of the present invention and existing white light LEDs, the present invention is that fluorescence territory far away excites, existing white light LEDs is that nearly territory excites.As can be seen from Figure 8, the fluorescent material far field excitation excites than the near field has higher luminous efficiency, and this is because fluorescent material territory far away excites the loss that has reduced back-scattering light.Fig. 9 has shown the well-illuminated change curve with electric current of white light LEDs light, and the present invention is that fluorescent material territory far away excites, and existing white light LEDs is that nearly territory excites.For the LED of formal dress Chip Packaging, electric current increases, and light is well-illuminated along with increase.Under the big electric current, the significantly unsaturated or decline of the luminous flux of the LED of far field excitation shows that the LED heat dispersion is good.And as can be seen from Figure 9, take the fluorescent material far field excitation to excite and have higher radiating effect than the near field.Figure 10 is the situation of change of colour temperature under the different driving electric current, the present invention is that fluorescent material territory far away excites, existing white light LEDs is that nearly territory excites, and the colour temperature that is added to 1000mA from lowest drive current 50mA changes as can be seen, and fluorescent material territory far away has excited better photochromic stability.Figure 11 is the situation of change of color rendering index under the different driving electric current, the present invention is that fluorescent material territory far away excites, existing white light LEDs is that nearly territory excites, be added to from lowest drive current 50mA 1000mA color rendering index variation as can be seen, fluorescent material territory far away has excited better photochromic stability.
Embodiment 2:
Take plane formula method with plastic film encapsulation white light LEDs, two kinds of white-light LED structure figure of gained as shown in Figure 4, other are identical with embodiment 1.The gained white light LEDs has more excellent photochromic stability than existing white light LEDs, better radiating effect and light extraction efficiency.
Embodiment 3:
Take plane formula method with plastic film encapsulation white light LEDs, and adopt double-deck fluorescent powder membrane structure, gained white-light LED structure figure as shown in Figure 5, other are identical with embodiment 1.The gained white light LEDs has more excellent photochromic stability than existing white light LEDs, better radiating effect and light extraction efficiency.And the multilayer fluorescent powder coating method can make color easily control, and can improve color rendering index.
Embodiment 4:
Take plane formula method with plastic film encapsulation white light LEDs, and adopt three layers of fluorescent powder membrane structure, gained white-light LED structure figure as shown in Figure 6, other are identical with embodiment 1.The gained white light LEDs has more excellent photochromic stability than existing white light LEDs, better radiating effect and light extraction efficiency.And the multilayer fluorescent powder coating method can make color easily control, and can improve color rendering index.Multilayer fluorescent powder film layer design diagram as shown in Figure 7.
Claims (6)
1. the method for packing of a white light LEDs is characterized in that comprising the steps: that (1) is fixed on chip on the support; (2) installing electrodes lead-in wire on chip and is configured to electric connection; (3) injecting glue; (4) silica gel and fluorescent material are mixed well, stirred deaeration, inject in the mould, baking, the demoulding obtains fluorescent powder film layer, and covers the colloid top, and rete is contacted with bracket edge.
2. the method for packing of LED according to claim 1, it is characterized in that described: the Mould design step is:
1. select support and chip type; 2. measure and obtain optical field distribution; 3. set up model; 4. choose the plane of reference; 5. another plane of reference is obtained in optics software simulation bright dipping; 6. obtain the rete shape; 7. rete optimization; 8. designing mould shape.
3. the method for packing of LED according to claim 1 is characterized in that: in step (4), inject the preceding release agent that sprays in the mould at silica gel and fluorescent material.
4. the method for packing of LED according to claim 1 is characterized in that: the shape of fluorescent powder film layer is according to chip light field and thermal field design.
5. the method for packing of LED according to claim 1, it is characterized in that: described fluorescent powder film layer is monofilm or multilayer film.
6. the method for packing of LED according to claim 1, it is characterized in that: described chip is made up of one or more chip.
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| CNB2006100340121A CN100411210C (en) | 2006-03-03 | 2006-03-03 | White light LED and packaging method thereof |
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Cited By (1)
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|---|---|---|---|---|
| US8063411B2 (en) | 2008-06-19 | 2011-11-22 | Silitek Electronic (Guangzhou) Co., Ltd. | Photoelectric semiconductor device capable of generating uniform compound lights |
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| CN101442087B (en) * | 2007-11-22 | 2013-01-02 | 广州市鸿利光电股份有限公司 | Low power low light loss white light LED |
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| CN101697654B (en) * | 2009-10-30 | 2013-02-27 | 中山大学 | Correlated color temperature and color rendering index self-calibration circuit of LED light source consisting of light of multiple colors |
| CN101699638A (en) * | 2009-10-30 | 2010-04-28 | 中山大学 | Phosphor powder film making method and obtained phosphor powder film encapsulating method |
| CN101950788A (en) * | 2010-08-13 | 2011-01-19 | 重庆大学 | Power type white LED based on fluorescence lens |
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| CN104505451A (en) * | 2015-01-15 | 2015-04-08 | 佛山市香港科技大学Led-Fpd工程技术研究开发中心 | Multilayer long-distance fluorescent powder coated LED packaging unit, die and manufacturing method |
| CN106033789A (en) * | 2015-03-18 | 2016-10-19 | 比亚迪股份有限公司 | Phosphor powder substrate and manufacturing method thereof, and composite luminescence LED and manufacturing method thereof |
| CN105304802A (en) * | 2015-10-12 | 2016-02-03 | 深圳万城节能股份有限公司 | Method for manufacturing light emitting device |
| CN107425096A (en) * | 2017-07-21 | 2017-12-01 | 中山市华南理工大学现代产业技术研究院 | A kind of long-range coating phosphor sheet and preparation method thereof |
| CN107255229A (en) * | 2017-07-24 | 2017-10-17 | 中山市华南理工大学现代产业技术研究院 | A kind of new integrated lamp just assembled and its manufacture method |
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