CN209626253U - A kind of LED lamp bead - Google Patents
A kind of LED lamp bead Download PDFInfo
- Publication number
- CN209626253U CN209626253U CN201821832253.5U CN201821832253U CN209626253U CN 209626253 U CN209626253 U CN 209626253U CN 201821832253 U CN201821832253 U CN 201821832253U CN 209626253 U CN209626253 U CN 209626253U
- Authority
- CN
- China
- Prior art keywords
- line
- fluorescence glue
- light
- led chip
- glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The utility model provides a kind of LED lamp bead, in the LED lamp bead, going out on light upper surface for LED chip is provided with red fluorescence glue-line, green fluorescence glue-line is provided on red fluorescence glue-line, and the side in LED chip also sets up light blocking layer, the upper surface of light blocking layer is not less than the upper surface of green fluorescence glue-line.Due to LED chip go out light upper surface on from the bottom to top be disposed with red fluorescence glue-line and green fluorescence glue-line, so that successively uniformly being converted in this two layers of fluorescent adhesive layer from the light that LED chip issues, finally LED lamp bead is made to go out light more uniform, it can reduce color difference, the appearance of situations such as macula lutea, improve light efficiency, in addition, due to the side of LED chip, there are light blocking layers for the side of red fluorescence glue-line and green fluorescence glue-line, and the light that the light blocking layer can issue LED chip stops, so light-emitting angle can be reduced, apply LED lamp bead under more fields.
Description
Technical field
The utility model relates to LED (Light Emitting Diode, light emitting diode) fields, more particularly to one kind
LED lamp bead.
Background technique
With the application and development of LED, the size of LED is required smaller and smaller.Reduce wanting for LED size to meet
It asks, wafer-level package CSP (Chip Scale Package, wafer-class encapsulation) LED occurs, current CSP LED mainly has
Two kinds of structures: one is five faces to go out light CSP LED, and four side and top surfaces of this CSP LED are all light-emitting surfaces, and bottom is then
It is provided with positive and negative electrode.Another kind is that single side goes out light CSP LED, and this CSP LED only has top surface as light-emitting surface, and bottom surface is then
It is provided with positive and negative electrode.
Shown in fig. 1 is the luminous CSP LED lamp bead 1 in current five face of one of the most common type.Include in the CSP LED lamp bead 1
LED chip 11 is provided with chip electrode 12 in 11 bottom of LED chip.Meanwhile CSPLED lamp bead 1 further include by molding or
One layer of fluorescent adhesive layer 13 that the technique of pad pasting is suppressed in 11 upper surface of LED chip and side, wherein the fluorescent adhesive layer 13 is general
It is red, the mixed uniformly silica gel of green emitting phosphor.Fig. 2 shows be current one of the most common type single side shine CSP LED light
Pearl 2.Include LED chip 21 in the CSP LED lamp bead 2,21 bottom of LED chip is provided with chip electrode 22.Meanwhile CSP
LED lamp bead 2 further includes the white wall glue-line 23 for coating 21 side of LED chip, the light for stopping chip sides to issue, the CSP
LED lamp bead 2 further includes one layer of fluorescent adhesive layer 24 for being pasted onto chip upper surface and white 23 upper surface of wall glue-line, wherein the fluorescent glue
Layer 24 is typically also red, the mixed uniformly silica gel of green emitting phosphor.
It due to all there was only one layer of fluorescent adhesive layer in above two structure, and is all red, green fluorescence in the fluorescent adhesive layer
The silica gel of powder mixing, so can be existed simultaneously on the horizontal plane of the fluorescent adhesive layer apart from LED chip light extraction upper surface same distance
Red fluorescence powder and green emitting phosphor, and the launching efficiency of red fluorescence powder is lower than the launching efficiency of green emitting phosphor, so glimmering
The light that same level in optical cement layer can not just issue LED chip is uniformly converted, particularly, far from LED chip
The red fluorescence powder of upper surface is also unable to get abundant excitation, and the light that will lead to LED product sending in this way is uneven, seriously affects
The whole light efficiency of CSP LED.
Summary of the invention
LED chip packaging method and LED lamp bead provided by the embodiment of the utility model, mainly solving the technical problems that:
How to solve to be mixed with the inconsistent luminescent conversion medium of a variety of launching efficiencies because being provided with one layer in LED product in the prior art
Fluorescent adhesive layer, lead to the problem of LED product uniformity of luminance difference.In order to solve the above technical problems, the utility model embodiment
There is provided a kind of LED lamp bead, comprising: LED chip, red fluorescence glue-line, green fluorescence glue-line and light blocking layer；
The red fluorescence glue-line is located on the light upper surface out of the LED chip, and the green fluorescence glue-line is located at institute
It states on red fluorescence glue-line, the light blocking layer is located at the side of the LED chip, and the upper surface of the light blocking layer is not less than
The upper surface of the green fluorescence glue-line.
In an embodiment of the present invention, the thickness of the red fluorescence glue-line is small more than or equal to 0.05 millimeter
In equal to 0.15 millimeter.
In an embodiment of the present invention, the light blocking layer coats whole sides of the LED chip.
In an embodiment of the present invention, the light blocking layer is white wall glue-line.
In an embodiment of the present invention, the white wall glue-line is the organosilicon for including titanium dioxide or barium sulfate
Glue.
In an embodiment of the present invention, the LED chip is the chip of inverted structure.
In an embodiment of the present invention, the size and the LED core of the horizontal plane of the red fluorescence glue-line
The size for going out light upper surface of piece is identical, and the light out of the size of the horizontal plane of the green fluorescence glue-line and the LED chip
The size of upper surface is identical.
In an embodiment of the present invention, the red fluorescence glue-line, the green fluorescence glue-line and the gear
Photosphere is in and state is fully cured；
The red fluorescence glue-line in the state that is fully cured in going out on light upper surface for the LED chip by being arranged
Uncured red fluorescence glue-line, and the uncured red fluorescence glue-line is carried out being cured under the first condition of cure half admittedly
It is formed after change state, then after solidifying under the second condition of cure to the red fluorescence glue-line for being in semi-cured state；
The green fluorescence glue-line in the state that is fully cured on the uncured red fluorescence glue-line by setting
Uncured green fluorescence glue-line is set, and the uncured green fluorescence glue-line is solidified under first condition of cure
To semi-cured state, then shape after solidifying under the second condition of cure to the green fluorescence glue-line for being in semi-cured state
At；
The light blocking layer in the state that is fully cured passes through in the red fluorescence glue-line and semi-solid preparation for forming semi-solid preparation
After green fluorescence glue-line, after uncured light blocking layer is arranged in the side of the LED chip, then in second condition of cure
Under the light blocking layer for being in uncured state is solidified after formed.
In an embodiment of the present invention, the red fluorescence glue-line and green in the state that is fully cured are glimmering
Optical cement layer is prepared on carrier by being arranged at least two LED chips to be packaged according to pre-set interval distance, will be set
The protection board for being equipped with aperture is placed in the LED chip to be packaged, and uncured red fluorescent glue is sprayed on the LED core
Piece goes out on light upper surface, and uncured green fluorescence glue-line is sprayed on the uncured red fluorescence glue-line it
Afterwards, the protection board is removed, and by the uncured red fluorescence glue-line and green fluorescence glue-line in first solidified bars
It is carried out under part after being cured to semi-cured state, then is in the red fluorescence of semi-cured state to this under second condition of cure
Glue-line and green fluorescence glue-line are formed after being solidified；The size of aperture and position are the same as the LED to be packaged on the protection board
The size of chip is corresponding with position, and the upper surface of the protection board is not less than the upper surface of the LED chip to be packaged；
The light blocking layer in the state that is fully cured passes through in the red fluorescence glue-line and semi-solid preparation for forming semi-solid preparation
After green fluorescence glue-line, the gap between each LED chip to be packaged is set by the mode of mode for dispensing glue or molding
After setting uncured light blocking layer, then after solidifying under second condition of cure to the light blocking layer for being in uncured state
It is formed.
In an embodiment of the present invention, the protection board is steel plate.
The beneficial effects of the utility model are:
According to LED lamp bead provided by the embodiment of the utility model, going out on light upper surface for LED chip is provided with red fluorescence
Glue-line is provided with green fluorescence glue-line on red fluorescence glue-line, and the side in LED chip also sets up light blocking layer, light blocking layer
Upper surface be not less than green fluorescence glue-line upper surface.Successively setting from the bottom to top on light upper surface due to LED chip
It is equipped with red fluorescence glue-line and green fluorescence glue-line, it is possible to so that the light issued from LED chip is in this two layers of fluorescent adhesive layer
In successively uniformly converted, going out LED lamp bead, light is more uniform, and situations such as can reduce color difference, macula lutea goes out
It is existing, light efficiency is improved, in addition, there are light-blocking for the side of red fluorescence glue-line and green fluorescence glue-line due to the side of LED chip
Layer, and the light that the light blocking layer can issue LED chip stop, it is possible to light-emitting angle is reduced, makes LED lamp bead can be with
It applies under more fields.
Other features of the utility model and corresponding beneficial effect are described in the aft section of specification, and are answered
Work as understanding, at least partly beneficial effect is apparent from from the record in the utility model specification.
Detailed description of the invention
Fig. 1 is the wafer-class encapsulation LED lamp bead schematic diagram that a kind of existing five face goes out light；
Fig. 2 is the wafer-class encapsulation LED lamp bead schematic diagram that a kind of existing single side goes out light；
Fig. 3 is the structural schematic diagram of the first LED lamp bead provided by the embodiment of the utility model；
Fig. 4 is the structural schematic diagram of second of LED lamp bead provided by the embodiment of the utility model；
Fig. 5 is the structural schematic diagram of the third LED lamp bead provided by the embodiment of the utility model；
Wherein, in Fig. 11 be CSP LED lamp bead, 11 be LED chip, and 12 be chip electrode, and 13 be fluorescent adhesive layer；2 in Fig. 2
It is LED chip for CSP LED lamp bead, 21,22 be chip electrode, and 23 be white wall glue-line, and 24 be fluorescent adhesive layer；31 be LED in Fig. 3
Chip, 32 be red fluorescence glue-line, and 33 be green fluorescence glue-line, and 34 be light blocking layer；41 be LED chip in Fig. 4, and 42 be red glimmering
Optical cement layer, 43 be green fluorescence glue-line, and 44 be light blocking layer；51 be inverted structure LED chip in Fig. 5, and 52 be chip electrode, and 53 are
Red fluorescence glue-line, 54 be green fluorescence glue-line, and 55 be light blocking layer.
Specific embodiment
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below by specific embodiment party
Formula combination attached drawing is described in further detail the utility model embodiment.It should be appreciated that specific embodiment described herein
It is only used to explain the utility model, is not used to limit the utility model.
In order to solve to be mixed with the inconsistent luminescent conversion of a variety of launching efficiencies because being provided in LED product in the prior art
The fluorescent adhesive layer of medium leads to the problem of LED product uniformity of luminance difference, and the present embodiment provides a kind of new LED lamp beads, please join
As shown in Figure 3, LED lamp bead provided in this embodiment includes LED chip 31, red fluorescence glue-line 32, green fluorescence glue-line 33 with
And light blocking layer 34, wherein red fluorescence glue-line 32 is located on the light upper surface out of LED chip 31, and green fluorescence glue-line 33 is located at
On red fluorescence glue-line 32, light blocking layer 34 is located at the side of LED chip 31, and the upper surface of light blocking layer 34 is not less than the second hair
The upper surface of photosphere.The size of the horizontal plane of red fluorescence glue-line 32 in LED lamp bead shown in Fig. 3 and going out for LED chip 31
The size of light upper surface is identical, and the size of the horizontal plane of green fluorescence glue-line 33 and LED chip 31 go out the size of light upper surface
Identical, the output optical zone domain of such 31 upper surface of LED chip can be fully utilized, and the light blocking layer 34 and green in Fig. 3 are glimmering
Optical cement layer 33 is flush, it should be noted that in the LED lamp bead product being actually made into, the horizontal plane of light blocking layer 34 can be with
The slightly above horizontal plane of green fluorescence glue-line 33.Certainly, in other some embodiments, red fluorescence glue-line 32 and green are glimmering
The position of optical cement layer 33 can also exchange, it is preferable that, it should be arranged below color section wavelength is biggish, namely should will
The lower section of green fluorescence glue-line 33 is arranged in red fluorescence glue-line 32, in this way, the light that red fluorescence glue-line 32 generates would not
Secondary excitation is caused to green fluorescence glue-line 33 and reduces the external quantum efficiency of green fluorescence glue-line 33.It can be adopted in the present embodiment
With nitride red fluorescent adhesive layer 32 and nitrifier green fluorescent adhesive layer 33, or the fluorescent glue of sulfide systems can also be used
The fluorescent adhesive layer of layer or silicate systems.It is understood that can also be with including quantum in other some embodiments
Point embedded photoluminescent material colloid or other can realize that the luminescent conversion glue of luminescent conversion replaces above-mentioned red fluorescence glue-line
32 and/or green fluorescence glue-line 33.
Shown in Figure 4, Fig. 4 is the schematic diagram of second of LED lamp bead provided in this embodiment, and in Fig. 4, green is glimmering
The horizontal plane size of optical cement layer 43 is equal to the horizontal plane size of red fluorescence glue-line 42, and on the light out of both less than LED chip 41
The side of the size on surface, red fluorescence glue-line 42, green fluorescence glue-line 43 and LED chip 41 is coated with light blocking layer 44, Fig. 4
Shown in LED lamp bead for LED lamp bead shown in Fig. 3, go out the identical situation of light upper surface size in LED chip 41
Under, the output optical zone domain of LED lamp bead is less than the output optical zone domain of LED lamp bead in Fig. 3 in Fig. 4.
Optionally, the thickness of the red fluorescence glue-line in the present embodiment can be more than or equal to 0.05 millimeter, be less than or equal to
0.15 millimeter, in the red fluorescence glue-line in this thickness value section, the red fluorescence powder far from LED chip upper surface swashs
Hair efficiency and the launching efficiency of the red fluorescence powder close to LED chip upper surface are not much different, therefore in red fluorescence glue-line
The available uniform excitation of red fluorescence powder, likewise, optionally, the thickness of the green fluorescence glue-line in the present embodiment can also
To be more than or equal to 0.05 millimeter, it is less than or equal to 0.15 millimeter, if LED lamp bead is required to generate white light, the LED in the present embodiment
Chip can select blue chip, and the light that blue chip issues is by red fluorescence glue-line and then in green fluorescence glue
White light will be generated under the action of layer.By red fluorescence glue-line and the layering of green fluorescence glue-line are arranged in this present embodiment, institute
All be with the luminescent conversion substance apart from LED chip light extraction upper surface same distance it is identical, in this way, LED chip issue light
It can be obtained by uniform conversion, so that LED lamp bead shines uniformly, improve the light efficiency of LED product.
It should be noted that the red fluorescence glue-line in the present embodiment can be the mixing of red fluorescence powder and transparent silica gel
Object, likewise, green fluorescence glue-line is also possible to the mixture of green emitting phosphor and transparent silica gel.Certainly, in the present embodiment
It can also only include red fluorescence powder in red fluorescence glue-line, green fluorescence glue-line can also only include green emitting phosphor.
Light blocking layer in the present embodiment can be white wall glue-line, may include titanium dioxide or barium sulfate in white wall glue-line
Silica gel, in this way, white wall glue-line can effectively stop LED chip from the light that side issues.It specifically, can be with
The degree that LED chip side is coated according to specific application scenarios flexible setting light blocking layer, for example, light blocking layer can be by LED core
The side of piece coats completely, and the LED lamp bead formed in this way is that single side goes out light lamp bead, and certainly, light blocking layer can also only coat LED
A part of chip sides, such as three sides of cladding LED chip, the LED lamp bead formed in this way is that two sides goes out light lamp bead.
Shown in Figure 5, in the present embodiment, LED chip can be the LED chip of inverted structure, in inverted structure
In LED chip 51, opposite bottom is provided with chip electrode 52, including positive electrode with top surface light-emitting surface (namely light upper surface out)
And negative electrode, it can be realized LED chip and be electrically connected with external.51 upper surface of inverted structure LED chip is disposed with red
Fluorescent adhesive layer 53, green fluorescence glue-line 54,51 side of inverted structure LED chip are provided with light blocking layer 55.Certainly, in addition to upside-down mounting knot
It, can also be using the LED chip of positive assembling structure and the LED of vertical structure in other examples of the present embodiment other than the LED chip of structure
Chip.But in the LED chip of positive assembling structure, electrode is arranged in LED chip top surface, and need by gold thread connection electrode with
Substrate, accordingly, it is possible to lead to the situation for occurring that luminescent conversion layer inconvenience is arranged in encapsulation process, it is preferred, therefore, that, the present embodiment
In LED chip be inverted structure chip.
It should be noted that the red fluorescence glue-line and green fluorescence glue-line and light blocking layer in above-mentioned LED lamp bead structure are answered
When in the state that is fully cured, it should be noted that the red fluorescence glue-line of the present embodiment can be pasted onto LED chip it
On, it is formed by curing after being also possible to be sprayed on LED chip, for the latter, in order to form the LED light of such structure
Pearl, during the preparation process, red fluorescence glue-line, the change process of green fluorescence glue-line and light blocking layer existence.Specifically,
Red fluorescence glue-line in the state that is fully cured can be uncured red by being arranged on the light upper surface out of LED chip
Color fluorescent adhesive layer, and the uncured red fluorescence glue-line is carried out under the first condition of cure after being cured to semi-cured state,
It is formed after solidifying under the second condition of cure to the red fluorescence glue-line for being in semi-cured state again；Likewise, place
It can be in the green fluorescence glue-line for the state that is fully cured uncured green by being arranged on uncured red fluorescence glue-line
Color fluorescent adhesive layer, and the uncured green fluorescence glue-line is carried out under the first condition of cure after being cured to semi-cured state,
It is formed after solidifying under the second condition of cure to the green fluorescence glue-line for being in semi-cured state again；And in complete
The light blocking layer of solid state can be by formed semi-solid preparation red fluorescence glue-line and semi-solid preparation green fluorescence glue-line it
Afterwards, after uncured light blocking layer is arranged in the side of LED chip, then under the second condition of cure uncured state is in this
Light blocking layer is formed after being solidified.
After being solidified in the present embodiment by the first condition of cure, red fluorescence glue-line and green fluorescence glue-line will reach
To semi-cured state, semi-solid preparation (is not fully cured) state also referred to as and had referred to red fluorescence glue-line and green fluorescence glue-line both
It is not nor for the state that is fully cured, but to be in liquid for liquid flow regime and be fully cured between state
One state.First condition of cure specifically can be according to the material property of red fluorescence glue-line and green fluorescence glue-line, material quantity
Deng flexible setting.Such as in a kind of example, the first condition of cure includes: that 20 minutes are toasted in the environment of temperature is 80 DEG C extremely
30 minutes.
It should be understood that the semi-solid preparation mode of red fluorescence glue-line and green fluorescence glue-line and unlimited in the present embodiment
Ultra-violet curing mode can also be used, i.e., using ultraviolet light to red fluorescent glue in addition to baking-curing in the mode of above-mentioned baking
Layer and green fluorescence glue-line are irradiated, and realize semi-solid preparation.Other than both semi-solid preparation schemes, other can also be used
Meaning can control the mode of red fluorescence glue-line and green fluorescence curable adhesive layer degree.
In the present embodiment, after being solidified by the second condition of cure, light blocking layer, red fluorescence glue-line and green are glimmering
It will be completely combined and be fully cured between this three of optical cement layer.The second condition of cure in the present embodiment can be according to red fluorescence
Material property, material quantity of glue-line, green fluorescence glue-line and light blocking layer etc. are flexibly set.Such as in a kind of example, second is solid
Change condition includes: to toast 150 minutes to 200 minutes in the environment of temperature is 150 DEG C, it should be noted that specific baking
Temperature and baking time can flexibly be set according to concrete application scene.
It should be understood that red fluorescence glue-line, green fluorescence glue-line and light blocking layer are fully cured in the present embodiment
Mode is not limited to the mode of above-mentioned baking, in addition to baking-curing, can also use ultra-violet curing mode, that is, use ultraviolet light pair
Red fluorescence glue-line, green fluorescence glue-line and light blocking layer are irradiated, and realization is fully cured.In addition to both solidification schemes with
Outside, any other curing mode can also be used.
Above-mentioned red fluorescence glue-line and green fluorescence glue-line in the state that is fully cured was solidified twice in experience
It is formed after journey, it should be noted that in some embodiments, red fluorescence glue-line and green in the state that is fully cured are glimmering
Optical cement layer can just be formed after undergoing one-step solidification process, specifically: uncured red fluorescence glue-line is arranged in LED core
Piece goes out on light upper surface, then uncured green fluorescence glue-line is arranged on red fluorescence glue-line, then in LED chip
Uncured light blocking layer is arranged in side, then to the light blocking layer for being in uncured state under preset condition of cure, in not
The red fluorescence glue-line of solid state and the green fluorescence glue-line in uncured state are solidified, directly by above-mentioned three by
Uncured state is converted into solid state.Here default condition of cure can be to be toasted in the environment of 150 DEG C to 180 DEG C
220 minutes, it should be noted that baking temperature and baking time can be according to red fluorescence glue-line, green fluorescence glue-line and gears
The specific material of photosphere carrys out flexible setting.
In one embodiment, in order to guarantee to be arranged in LED chip side light blocking layer purity, also in order to guaranteeing to keep off
Undope other impurities in photosphere, such as red fluorescence powder or green emitting phosphor, so as to preferably to LED chip from side
The light of sending is stopped, further, the red fluorescence glue-line and green fluorescence in the state that is fully cured in the present embodiment
Glue-line can be to be prepared on carrier by being arranged at least two LED chips to be packaged according to pre-set interval distance,
The protection board for being provided with aperture is placed in LED chip to be packaged, the size of aperture and position are the same as LED to be packaged on protection board
The size of chip is corresponding with position, and the upper surface of protection board is not less than the upper surface of LED chip to be packaged, will be uncured red
Color fluorescent glue is sprayed on the light upper surface out of LED chip, and uncured green fluorescence glue-line is sprayed on uncured red
After on fluorescent adhesive layer, protection board is removed, and removes the fluorescent adhesive layer on the non-open area on protection board, and this is not solid
The red fluorescence glue-line and green fluorescence glue-line of change are carried out under the first condition of cure after being cured to semi-cured state, then second
Under condition of cure to this be in semi-cured state red fluorescence glue-line and green fluorescence glue-line solidify after formed, due to
It placed protection board in LED chip before spraying red fluorescence glue-line and green fluorescence glue-line, it is possible to effective anti-
Only red fluorescence powder and green emitting phosphor fall to the gap between LED chip, in this case, in state is fully cured
Light blocking layer be then by formed semi-solid preparation red fluorescence glue-line and semi-solid preparation green fluorescence glue-line after, each to be packaged
After uncured light blocking layer is arranged by the mode of mode for dispensing glue or molding in gap between LED chip, then in the second solidification
Under the conditions of the light blocking layer for being in uncured state is solidified after formed.
It should be noted that the aperture for the LED lamp bead in above-mentioned Fig. 3, on protection board used in preparation process
Size and position of opening are exactly matched with the position of the size of LED chip upper surface and LED chip upper surface respectively, namely protection
The aperture size of plate is identical as the size of LED chip upper surface, at this point, the upper surface of protection board and LED chip to be packaged is upper
Surface flushes.For the LED lamp bead in above-mentioned Fig. 4, each aperture on protection board equally has its corresponding LED chip,
Through the aperture, so that it may be arranged fluorescent adhesive layer on the upper surface of LED chip, the corresponding aperture size of each aperture is less than should
The upper surface of the corresponding LED chip of aperture, the upper surface of protection board can be slightly above the upper surface of LED chip at this time, this height
Difference is equal to the thickness of protection board, and in the LED lamp bead formed in this way, the size of the upper surface of LED chip will be greater than fluorescent adhesive layer
The size of horizontal plane that is to say structure shown in Fig. 4.
Region on protection board in addition to opening area all has insulating effect, to be packaged for preventing fluorescent powder from falling into
Gap between LED chip is also possible to reality so the region in addition to opening area on protection board can be reticular structure
Core structure, it is accordingly required in particular to which explanation, when there are reticular structure, such as when this protection board is steel mesh, grid therein is empty
Lattice should be sufficiently small, and the gap between LED chip can not be fallen into from the grid as long as meeting the material of luminescent conversion layer.
It should be understood that should include at least one LED chip in LED lamp bead, so being prepared on carrier when being placed on
LED chip quantity be greater than required LED lamp bead in should include LED chip quantity when, it is necessary to LED chip
Between light blocking layer cut, then removal prepares carrier, specifically, can be along being spaced between adjacent LED chip in
Heart wire cutting can not prepare carrier cutting to bottom when cutting, and cutting thickness should be not more than, preferably equal to LED core is high
The sum of degree, the thickness of red fluorescence glue-line and thickness three of green fluorescence glue-line are convenient for subsequent disposable removal system in this way
Standby carrier.Certainly, in some examples of the present embodiment, the carrier for preparing of LED chip bottom can also be cut, is cut
Cut the rear or cutting of single progress light blocking layer again in the subsequent use process.
Finally, it should be noted that the red fluorescence glue-line and green fluorescence glue-line in the present embodiment are also possible to by such as
What under type was formed；Directly one layer of blending agent luminescent conversion layer, the blending agent are set in going out for LED chip on light upper surface
Include red fluorescence powder and green emitting phosphor in luminescent conversion layer, this red fluorescence powder and green are then made using physical sedimentation method
Fluorescent powder layering, to form above-mentioned red fluorescence glue-line and green fluorescence glue-line.
In LED lamp bead provided in this embodiment, set gradually from the bottom to top in the light upper surface out of LED chip red glimmering
Optical cement layer and green fluorescence glue-line, the light that LED chip can be made to issue is successively uniform in this two layers of fluorescent adhesive layer to carry out
Color conversion ensure that the luminous uniformity of LED lamp bead, the light efficiency of LED lamp bead be improved, in addition, LED provided in this embodiment
The side of LED chip in lamp bead is also wrapped on light blocking layer, and making LED lamp bead, only top surface goes out light and becomes possibility, and this single side goes out
The LED lamp bead of light can be applied in some special fields, for example can apply in directly-down liquid crystal display, LCD TV etc.
Field of backlights.
It can be applied to various illumination fields by the LED that above-mentioned encapsulation obtains, such as it can be fabricated to backlight module
Applied to display backlight field (backlight module that can be the terminals such as TV, display, mobile phone).It can be applied at this time
In backlight module, such as a kind of backlight module, including light guide plate and the LED component for being set to light guide plate side, the LED component is just
LED lamp bead composition above can be used.Other than it can be applied to display backlight field, applies also for key-press backlight field, claps
Take the photograph field, home lighting field, lighting for medical use field, furnishing fields, automotive field, field of traffic etc..Applied to key-press backlight
When field, the key-press backlight light source that mobile phone, calculator, keyboard etc. have press key equipment can be used as；When applied to shooting field,
The flash lamp of camera can be fabricated to；When applied to home lighting field, floor lamp, desk lamp, headlamp, suction can be fabricated to
Ceiling light, downlight, projecting lamp etc.；When applied to lighting for medical use field, operating lamp, low electromagnetism headlamp etc. can be fabricated to；Using
Various ornament lamps, such as various color lamps, landscape spotlight, advertising lamp can be fabricated to when furnishing fields；It is led applied to automobile
When domain, automobile lamp, automobile indicator etc. can be fabricated to；When applied to field of traffic, various traffic lights can be made, it can also
Various street lamps are made.Above-mentioned application is only several applications exemplified by the present embodiment, it should be appreciated that the application of LED is simultaneously
It is not limited to several fields of above-mentioned example.
Obviously, those skilled in the art should be understood that each module of above-mentioned the utility model embodiment or each step can
To be realized with general computing device, they be can be concentrated on a single computing device, or be distributed in multiple calculating dresses
On network composed by setting, optionally, they can be realized with the program code that computing device can perform, it is thus possible to will
They are stored in computer storage medium (ROM/RAM, magnetic disk, CD) and are performed by computing device, and in certain situations
Under, it can be with the steps shown or described are performed in an order that is different from the one herein, or they are fabricated to each integrated
Circuit module, or single integrated circuit module is maked multiple modules or steps in them to realize.So this is practical
It is novel to be not limited to any specific hardware and software combination.
The above content is combining specific embodiment to be further described to made by the utility model embodiment, no
It can assert that the specific implementation of the utility model is only limited to these instructions.For the common skill of the utility model technical field
For art personnel, without departing from the concept of the premise utility, a number of simple deductions or replacements can also be made, all should
It is considered as belonging to the protection scope of the utility model.
Claims (7)
1. a kind of LED lamp bead characterized by comprising LED chip, red fluorescence glue-line, green fluorescence glue-line and light-blocking
Layer；
The red fluorescence glue-line is located on the light upper surface out of the LED chip, and the green fluorescence glue-line is located at described red
On color fluorescent adhesive layer, the light blocking layer is located at the side of the LED chip, and the upper surface of the light blocking layer is not less than described
The upper surface of green fluorescence glue-line.
2. LED lamp bead as described in claim 1, which is characterized in that the thickness of the red fluorescence glue-line is more than or equal to 0.05
Millimeter is less than or equal to 0.15 millimeter.
3. LED lamp bead as described in claim 1, which is characterized in that the light blocking layer coats whole sides of the LED chip
Face.
4. LED lamp bead as described in claim 1, which is characterized in that the light blocking layer is white wall glue-line.
5. LED lamp bead as claimed in claim 4, which is characterized in that the white wall glue-line be include titanium dioxide or barium sulfate
Organic silica gel.
6. LED lamp bead as described in claim 1, which is characterized in that the LED chip is the chip of inverted structure.
7. LED lamp bead as described in claim 1, which is characterized in that the size of the horizontal plane of the red fluorescence glue-line and institute
The size for going out light upper surface for stating LED chip is identical, and the size of the horizontal plane of the green fluorescence glue-line and the LED chip
Go out light upper surface size it is identical.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821832253.5U CN209626253U (en) | 2018-11-07 | 2018-11-07 | A kind of LED lamp bead |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821832253.5U CN209626253U (en) | 2018-11-07 | 2018-11-07 | A kind of LED lamp bead |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209626253U true CN209626253U (en) | 2019-11-12 |
Family
ID=68443560
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821832253.5U Active CN209626253U (en) | 2018-11-07 | 2018-11-07 | A kind of LED lamp bead |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209626253U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117153995A (en) * | 2023-10-30 | 2023-12-01 | 罗化芯显示科技开发(江苏)有限公司 | LED packaging film layer and LED packaging structure |
-
2018
- 2018-11-07 CN CN201821832253.5U patent/CN209626253U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117153995A (en) * | 2023-10-30 | 2023-12-01 | 罗化芯显示科技开发(江苏)有限公司 | LED packaging film layer and LED packaging structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100411210C (en) | White light LED and packaging method thereof | |
| JP7218950B2 (en) | Light-emitting device manufacturing process and light-emitting device | |
| CN109904301A (en) | Wafer-level package multifaceted light-emitting LED and its packaging method, backlight module | |
| CN105097999A (en) | LED light-emitting device and manufacturing method thereof | |
| CN103165797A (en) | Preformed phosphor thin film for white light-emitting diode (LED) thin film packaging and preparation method for thin film | |
| WO2009140829A1 (en) | A led lighting device with low attenuation and high luminous efficiency and manufacturing method thereof | |
| CN107819063A (en) | A kind of straight-down negative microspur LED encapsulation structure and straight-down negative microspur LED light mixing devices | |
| CN209626253U (en) | A kind of LED lamp bead | |
| CN204632756U (en) | A kind of photoflash lamp | |
| CN102856473A (en) | Packaging adjustment method of LED (light-emitting diode) light source | |
| CN109713112A (en) | White-light LED chip, lamp bead and White-light LED chip, lamp bead preparation method | |
| CN109713110A (en) | Wafer-level package LED and preparation method thereof | |
| CN203273541U (en) | Ultrathin direct type backlight module without lens | |
| CN105810800A (en) | LED (Light Emitting Diode) integrated light emitting device and manufacturing method thereof | |
| CN103258936B (en) | A kind of LED package substrate and the method for shape-preserving coating | |
| CN109950379A (en) | Wafer-level package LED of multifaceted light-emitting and preparation method thereof, backlight module | |
| CN111785710B (en) | LED lamp bead and preparation method thereof | |
| JP2010206208A (en) | Light emitting diode package structure and manufacturing method therefor | |
| CN203205458U (en) | LED package substrate | |
| CN209626254U (en) | A kind of LED lamp bead | |
| CN111162156A (en) | LED chip packaging method and LED lamp bead | |
| CN206386707U (en) | LED/light source module | |
| CN111933759A (en) | Method for preparing surface light source COB by adopting two-color CSP chip and surface light source COB | |
| CN207424458U (en) | Direct-light-type backlight based on dual chip LED lamp bead | |
| CN209045604U (en) | A kind of novel instruction type LED light sources encapsulating structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |