CN117153995A - LED packaging film layer and LED packaging structure - Google Patents
LED packaging film layer and LED packaging structure Download PDFInfo
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- CN117153995A CN117153995A CN202311413412.3A CN202311413412A CN117153995A CN 117153995 A CN117153995 A CN 117153995A CN 202311413412 A CN202311413412 A CN 202311413412A CN 117153995 A CN117153995 A CN 117153995A
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- gear
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- light guide
- transparent light
- led
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- 229920006280 packaging film Polymers 0.000 title abstract description 10
- 239000012785 packaging film Substances 0.000 title abstract description 10
- 238000004806 packaging method and process Methods 0.000 title abstract description 10
- 238000007789 sealing Methods 0.000 claims abstract description 35
- 239000000463 material Substances 0.000 claims description 13
- 239000000843 powder Substances 0.000 claims description 7
- 238000005538 encapsulation Methods 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 230000032683 aging Effects 0.000 abstract description 5
- 229920005989 resin Polymers 0.000 abstract description 5
- 239000011347 resin Substances 0.000 abstract description 5
- 229910010293 ceramic material Inorganic materials 0.000 abstract description 4
- 238000011160 research Methods 0.000 abstract description 2
- 238000013329 compounding Methods 0.000 abstract 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 11
- 239000002245 particle Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000741 silica gel Substances 0.000 description 3
- 229910002027 silica gel Inorganic materials 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229910002601 GaN Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
Abstract
The application provides an LED packaging film layer and an LED packaging structure, which are used for compounding a transparent light guide body and a sealing layer, can prevent color deviation caused by ageing of sealing resin, can ensure that a high-brightness area for light emission is wider, and can prevent dark areas between adjacent LED chips. In particular, the transparent light guide body is a double-layer transparent ceramic material, the upper layer and the lower layer of the transparent light guide body have different sizes, and I particularly research on the special relation between the number of saw teeth and the radius of the upper layer and the lower layer, and find that when the value range of n 1/n2=A.R1/R2, A is 0.8-1.4, better white light emitting uniformity can be realized, and the light emitting brightness is more uniform.
Description
Technical Field
The application relates to the field of photoelectric conversion packaging layers and light-emitting diode manufacturing packaging, in particular to an LED packaging film layer and an LED packaging structure.
Background
The blue LED chip is matched with a yellow-green fluorescent material to realize a white light color development scheme, and the current LED lamp beads are mostly formed by directly doping fluorescent powder into silica gel to form sealant or a sealing molding sheet, and then the blue LED chip is sealed to realize a white LED packaging structure. However, this kind of packaging structure easily leads to the outgoing of light to concentrate in the intermediate region, causes the position that keeps away from the chip intermediate region to appear that luminous intensity is weaker, causes the play light homogeneity insufficient, and in long-term use, silica gel easily ages metamorphism, and this metamorphic silica gel can appear yellow, and the light after this can be mixed light appears color distortion.
Disclosure of Invention
One of the purposes of the present application is to overcome the drawbacks described in the prior art, and thus provide a Light Emitting Diode (LED) packaging film which is not prone to aging, can prevent color distortion, and can achieve sufficient light mixing, so that the light intensity of the light emitting region is uniform and the light emitting area is large.
In order to achieve the above object, the present application provides the following technical solutions:
an LED encapsulation film, comprising:
the transparent light guide body is of a planar structure and comprises a first layer and a second layer which are overlapped up and down in sequence and are integrally formed, wherein the first layer is a first gear, the second layer is a second gear, the first gear and the second gear are coaxially arranged, and the size of the first gear is smaller than that of the second gear;
a sealing layer coating the bottom and side surfaces of the transparent light guide body, but the top surface of the sealing layer is flush with the top surface of the transparent light guide body;
the first gear is provided with n1 sawteeth and a first circumscribed circle, the radius of the first circumscribed circle is R1, the second gear is provided with n2 sawteeth and a second circumscribed circle, the radius of the second circumscribed circle is R2, and the value range of n1/n2 = A.R1/R2, and A is 0.8-1.4.
As an alternative embodiment of the present application, wherein n1 is not less than 6 and R1 is not less than 200. Mu.m.
As an alternative embodiment of the present application, the saw teeth of the first gear and the second gear are both in a chamfer structure.
As an alternative embodiment of the application, the teeth of the first gear have a first length H1 and the teeth of the second gear have a second length H2, wherein H2 is greater than H1.
As an alternative embodiment of the present application, the transparent light guide body has a fluorescent material therein, and/or the sealing layer has a fluorescent material therein.
As an alternative embodiment of the present application, the fluorescent material is a yellow-green fluorescent powder.
According to the LED packaging film layer, the transparent light guide body and the sealing resin material are compounded, color deviation caused by aging of the sealing resin can be prevented, the high-brightness area for light emission is wider, and dark areas between adjacent LED chips can be prevented. In particular, the transparent light guide body is a double-layer transparent ceramic material, the upper layer and the lower layer of the transparent light guide body have different sizes, and I particularly research on the special relation between the number of saw teeth and the radius of the upper layer and the lower layer, and find that when the value range of n 1/n2=A.R1/R2, A is 0.8-1.4, better white light emitting uniformity can be realized, and the light emitting brightness is more uniform.
The application also provides an LED packaging structure which comprises an LED chip and the LED packaging film layer, wherein the LED chip is embedded in the sealing layer, is positioned right below the transparent light guide body, and is closer to the second gear than the first gear.
As an alternative embodiment of the application, the LED chip has electrodes exposed from the bottom layer of the sealing layer.
As an alternative embodiment of the present application, the distance between the top surface of the LED chip and the bottom surface of the transparent light guide is h1, where h1 is greater than or equal to 300 micrometers, and h1 is less than or equal to 1200 micrometers.
By adopting the LED packaging structure of the packaging film layer, the light mixing of the blue LED can be realized through the sealing layer or the fluorescent powder of the transparent light guide body, and the white light emitting can be realized. And in particular, the distance from the top surface of the LED chip to the bottom surface of the transparent light guide body is h1, h1 is 300 micrometers or more, and h1 is 1200 micrometers or less. Therefore, the light of the blue LED chip can be mixed by the fluorescent powder to the greatest extent, and the light-transmitting transparent light guide body can diffuse the light to realize the uniformity of the light.
Drawings
In order to more clearly illustrate the embodiments of the application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a cross-sectional view of an LED package film;
FIG. 2 is a cross-sectional view of a transparent light guide;
FIG. 3 is a top view of a transparent light guide;
FIG. 4 is a cross-sectional view of an LED package structure of the present application;
fig. 5 is a top view of a transparent light guide (including an inscribed circle and an circumscribed circle).
Reference numerals illustrate:
10. a sealing layer; 11. a top surface; 12. a bottom surface; 20. a transparent light guide; 21. a second gear; 22. a first gear; 23. a light-emitting surface; 24. a light incident surface; 25. a second serration; 26. a first serration; r, chamfer structure.
Description of the embodiments
The following will describe embodiments of the present application in detail with reference to the drawings and examples, thereby solving the technical problems by applying technical means to the present application, and realizing the corresponding technical effects can be fully understood and implemented accordingly. The embodiment of the application and the characteristics in the embodiment can be mutually combined on the premise of no conflict, and the formed technical scheme is within the protection scope of the application. In the drawings, the size of layers and regions, as well as the relative sizes, may be exaggerated for clarity. Like numbers refer to like elements throughout.
It will be understood that, although the terms "first," "second," "third," etc. may be used to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present application.
It will be understood that spatially relative terms, such as "above," "located above," "below," "located below," and the like, may be used herein for convenience of description to describe one element or feature as illustrated in the figures as connected with another element or feature. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use and operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements or features described as "below" other elements would then be oriented "on" the other elements or features. Thus, the exemplary terms "below" and "under" may include both an upper and a lower orientation. The device may be otherwise oriented (rotated 90 degrees or other orientations) and the spatially relative descriptors used herein interpreted accordingly.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. As used herein, the term "and/or" includes any and all combinations of the associated listed items.
Embodiments of the present application are described herein with reference to cross-sectional illustrations that are schematic illustrations of idealized embodiments (and intermediate structures) of the present application. In this way, variations from the illustrated shape due to, for example, manufacturing techniques and/or tolerances, are to be expected. Thus, embodiments of the present application should not be limited to the particular shapes of the regions illustrated herein, but include deviations in shapes that result, for example, from manufacturing.
In the following description, for the purpose of providing a thorough understanding of the present application, detailed structures and steps are presented in order to illustrate the technical solution presented by the present application. Preferred embodiments of the present application are described in detail below, however, the present application may have other embodiments in addition to these detailed descriptions.
The LED package film layer of the present application includes a transparent light guide 20 and a sealing layer 10, referring to fig. 1, the sealing layer 10 is a thermoplastic resin material, for example, a modified epoxy resin material or a modified polyurethane material, which wraps the bottom and side surfaces of the transparent light guide 20. Also, the top surface 11 of the sealing layer 10 is preferably flush with the top surface of the transparent light guide 20, and the bottom surface 12 of the sealing layer 10 is spaced apart from the bottom surface of the transparent light guide 20 to prevent the sealing layer 10 from being deformed and accommodating the LED chip when laminated.
The specific structure of the transparent light guide 20 can be seen in fig. 2, 3 and 5, which includes two layers stacked one above the other and integrally formed, wherein the first layer and the second layer are both gear structures, the first layer is a first gear 22, the second layer is a second gear 21, the top surface 23 of the first gear 22 is configured as the top surface of the transparent light guide 20, and the bottom surface 24 of the second gear 21 is configured as the bottom surface of the transparent light guide 20. The sealing layer 10 is flush with said top surface 23.
The body of the transparent light guide 20 is a transparent ceramic material, inside which phosphor particles, which are YAG phosphor, can be dispersed uniformly, are yellow-green phosphor material. Wherein the weight percentage of the fluorescent powder is not more than 15% of the total weight of the transparent light guide 20.
The sealing layer 10 is a semi-cured resin having thermoplasticity when heated, whereby sealing of the LED chip by hot pressing can be achieved. Alternatively, the sealing layer 10 may have phosphor particles uniformly dispersed therein, and the phosphor particles are YAG phosphor, which is a yellowish green phosphor material. However, the sealing layer 10 may not have phosphor particles, but may have phosphor particles only in the transparent light guide 20 due to the problem of easy aging of the sealing layer 10.
In addition, it is also possible to have only phosphor particles in the sealing layer 10, but not have phosphor particles in the transparent light guide 20, except that the encapsulation effect is not optimal, but it also serves the purpose of ensuring the light-emitting area and the light-emitting uniformity.
The transparent light guide 20 has a thickness of not more than 500 μm, wherein the first gear 22 has a thickness ranging from 0.1 to 0.3mm and the second gear 21 has a thickness ranging from 0.2 to 0.4mm. As an example, the first gear 22 has a thickness of 0.1mm, 0.2mm, 0.3mm, and the second gear 21 has a thickness of 0.2mm, 0.3mm, 0.4mm.
In the preparation process, the sealing layer 10 is previously wrapped around the transparent light guide 20, and then is heat-cured, and heat-crosslinked so that the sealing layer 10 becomes a prepreg. In preparation, a mold is placed against the top surface of transparent light guide 20 to achieve coplanarity of encapsulant layer 10 and transparent light guide 20.
Referring to fig. 5, the size of the first gear 22 is smaller than that of the second gear 21, and the first gear 22 has a first inscribed circle C1 and a first circumscribed circle C2, the second gear 21 has a second inscribed circle C3 and a second circumscribed circle C4, and the radius of the first circumscribed circle C2 is R1 and the radius of the second circumscribed circle C4 is R2. It is clear that R2 is greater than R1.
In particular, the first gear 22 has n1 teeth and the second gear 21 has n2 teeth, in the present application, n1, n2, R1, R2 satisfy the formula n 1/n2=a·r1/R2, and the value of a ranges from 0.8 to 1.4. The numerical range of A is a numerical value fitted by multiple test tests, in the range, the light emergent is most uniform, the light emergent efficiency is higher, the uniformity of the light emergent is ensured, and a better white light mixing effect is realized.
In the present embodiment, n1 is smaller than n2, the number n2 of the fewer second gears 21 can ensure sufficient emission of edge light, and is also disposed on a part of the gears to enhance the light mixing effect, while the number n1 of the more first gears 22 can ensure that light is refracted or scattered only in the edge region, partially weakening the light intensity of the middle region, and compensating the light intensity of the edge, so as to achieve the purpose of uniform light emission.
Taking a gearless two-layer structure as an example, the range of R1/R2 is preferably between 0.4 and 0.6, and the gear number ratio n1/n2 of the optimal light-emitting uniformity tested is between 0.3 and 0.85, so that the value range of a is between 0.8 and 1.4 through final measurement, wherein n1/n 2=a·r1/R2.
As a preferred embodiment, n1 is 6, n2 is 12, R1 is 200 microns, and R2 is 400 microns; alternatively, n1 is 6, n2 is 15, R1 is 200 microns, and R2 is 400 microns; alternatively, n1 is 8, n2 is 16, R1 is 300 microns, and R2 is 800 microns; and the like, the effect is better.
In particular, the distance between the first inscribed circle C1 and the first circumscribed circle C2 is configured as the length H1 of the serration of the first gear 22, and the distance between the second inscribed circle C3 and the second circumscribed circle C4 is configured as the length H2 of the serration of the second gear 21, wherein H2 is greater than H1. Preferably, the H2 is 50 microns, 60 microns, 70 microns, 80 microns, 90 microns, 100 microns, with the corresponding H2 being 80 microns, 90 microns, 100 microns, 110 microns, 130 microns, 150 microns in order.
In particular, the teeth of the first gear 22 and the teeth of the second gear 21 have a chamfer structure r, see fig. 3. The chamfer structure r can optimize light mixing and prevent highlight areas and shadow areas.
By adopting the above-mentioned LED packaging film layer, the transparent light guide body 20 and the sealing layer 10 are compounded, color deviation caused by aging of the sealing resin can be prevented, and the high brightness area of the light can be made wider, which can prevent dark areas between adjacent LED chips. In particular, the transparent light guide 20 is a double-layered transparent ceramic material, the upper and lower layers thereof have different sizes, and my study particularly about the special relationship between the number of saw teeth and the radius of the upper and lower layers thereof has found that when the value of n 1/n2=a·r1/R2, the range of a is 0.8 to 1.4, a better white light emitting uniformity can be achieved, and the light emitting brightness is more uniform.
Further, referring to fig. 4, the present application further provides a white light LED package structure, which specifically includes the above-mentioned packaging film layer and the LED chip 30. The LED chip 30 is embedded in the sealing layer 10, and the LED chip 30 is located directly under the transparent light guide 20, and the upper surface of the LED chip 30 is closer to the second gear 21 than the first gear 22.
The LED chip 30 is a blue LED chip, which is a gallium nitride-based LED chip, and the LED chip 30 has an electrode 31, and the electrode 31 is exposed from the bottom surface 12 of the sealing layer 10 and is flush with the bottom surface 12.
As a specific design, after the LED chip 30 is laminated or heat-pressed and packaged, the distance from the top surface of the LED chip 30 to the bottom surface of the transparent light guide 20 is h1, h1 is 300 micrometers or more, and h1 is 1200 micrometers or less. Therefore, the light of the blue LED chip can be mixed by the fluorescent powder to the greatest extent, and the light-transmitting transparent light guide body can diffuse the light to realize the uniformity of the light.
The foregoing is merely illustrative of the present application, and the present application is not limited thereto, and any changes or substitutions easily contemplated by those skilled in the art within the scope of the present application should be included in the scope of the present application. Therefore, the protection scope of the application is subject to the protection scope of the claims.
Claims (9)
1. An LED encapsulation film, comprising:
the transparent light guide body is of a planar structure and comprises a first layer and a second layer which are overlapped up and down in sequence and are integrally formed, wherein the first layer is a first gear, the second layer is a second gear, the first gear and the second gear are coaxially arranged, and the size of the first gear is smaller than that of the second gear;
a sealing layer coating the bottom and side surfaces of the transparent light guide body, but the top surface of the sealing layer is flush with the top surface of the transparent light guide body;
the gear is characterized in that the first gear is provided with n1 saw teeth and is provided with a first circumscribed circle, the radius of the first circumscribed circle is R1, the second gear is provided with n2 saw teeth and is provided with a second circumscribed circle, the radius of the second circumscribed circle is R2, wherein n1/n2 = A.R1/R2, and the value range of A is 0.8-1.4.
2. The LED package film of claim 1,
wherein n1 is more than or equal to 6, and R1 is more than or equal to 200 micrometers.
3. The LED package film of claim 1,
the saw teeth of the first gear and the second gear are of chamfer structures.
4. The LED package film of claim 1,
the serrations of the first gear have a first length H1 and the serrations of the second gear have a second length H2, wherein H2 is greater than H1.
5. The LED package film of claim 1,
the transparent light guide body is internally provided with fluorescent materials, and/or the sealing layer is internally provided with fluorescent materials.
6. The LED package film of claim 5,
the fluorescent material is yellow-green fluorescent powder.
7. An LED package structure comprising an LED chip and the LED package film of any one of claims 1-6, wherein the LED chip is embedded in the sealing layer and the LED chip is located directly below the transparent light guide and the upper surface of the LED chip is closer to the second gear than the first gear.
8. The LED package structure of claim 7, wherein,
the LED chip has electrodes exposed from a bottom layer of the sealing layer.
9. The LED package structure of claim 7, wherein,
the distance between the top surface of the LED chip and the bottom surface of the transparent light guide body is h1, wherein h1 is more than or equal to 300 micrometers, and h1 is less than or equal to 1200 micrometers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311413412.3A CN117153995A (en) | 2023-10-30 | 2023-10-30 | LED packaging film layer and LED packaging structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311413412.3A CN117153995A (en) | 2023-10-30 | 2023-10-30 | LED packaging film layer and LED packaging structure |
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| CN117153995A true CN117153995A (en) | 2023-12-01 |
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| CN202311413412.3A Pending CN117153995A (en) | 2023-10-30 | 2023-10-30 | LED packaging film layer and LED packaging structure |
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