CN114914345A - Packaging method of LED lamp beads - Google Patents
Packaging method of LED lamp beads Download PDFInfo
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- CN114914345A CN114914345A CN202210321712.8A CN202210321712A CN114914345A CN 114914345 A CN114914345 A CN 114914345A CN 202210321712 A CN202210321712 A CN 202210321712A CN 114914345 A CN114914345 A CN 114914345A
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- silica gel
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- transparent silica
- led lamp
- lamp bead
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- 239000011324 bead Substances 0.000 title claims abstract description 56
- 238000000034 method Methods 0.000 title claims abstract description 36
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 26
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 196
- 239000000741 silica gel Substances 0.000 claims abstract description 144
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 144
- 239000003292 glue Substances 0.000 claims abstract description 107
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 238000005520 cutting process Methods 0.000 claims abstract description 21
- 238000003825 pressing Methods 0.000 claims abstract description 15
- 238000001035 drying Methods 0.000 claims abstract description 7
- 239000010410 layer Substances 0.000 claims description 126
- 239000000843 powder Substances 0.000 claims description 29
- 238000005507 spraying Methods 0.000 claims description 27
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 26
- 239000011858 nanopowder Substances 0.000 claims description 26
- 239000000377 silicon dioxide Substances 0.000 claims description 26
- 235000012239 silicon dioxide Nutrition 0.000 claims description 23
- 239000007788 liquid Substances 0.000 claims description 22
- 239000012790 adhesive layer Substances 0.000 claims description 20
- 239000003085 diluting agent Substances 0.000 claims description 19
- 239000000243 solution Substances 0.000 claims description 19
- MCMNRKCIXSYSNV-UHFFFAOYSA-N ZrO2 Inorganic materials O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 15
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 15
- 229920005989 resin Polymers 0.000 claims description 15
- 239000011347 resin Substances 0.000 claims description 15
- 239000004408 titanium dioxide Substances 0.000 claims description 13
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 10
- 239000011259 mixed solution Substances 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 230000005496 eutectics Effects 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 229910003460 diamond Inorganic materials 0.000 claims description 2
- 239000010432 diamond Substances 0.000 claims description 2
- 230000004907 flux Effects 0.000 claims description 2
- 238000000227 grinding Methods 0.000 claims description 2
- 229920002050 silicone resin Polymers 0.000 claims 1
- 238000003756 stirring Methods 0.000 description 10
- 238000002360 preparation method Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000001795 light effect Effects 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package
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- Microelectronics & Electronic Packaging (AREA)
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- Computer Hardware Design (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The invention provides a packaging method of an LED lamp bead, which comprises the following steps: fixing the LED chip on the substrate; forming a first transparent silica gel layer, a fluorescent glue layer and a second transparent silica gel layer on the outer side of the LED chip in sequence; then placing the substrate sprayed with the second transparent silica gel layer on a platform of a dispenser, dispensing white glue in a dispensing and line drawing manner, and drying the white glue to form a white glue layer; the white glue layer is positioned in the area which is not covered by the LED chip, the first transparent silica gel layer, the fluorescent glue layer and the second transparent silica gel layer, and the upper surface of the white glue layer is flush with the upper surface of the second transparent silica gel layer; placing the substrate filled with the white glue layer into a film pressing machine to mold a silica gel lens; the silica gel lens is positioned on the upper surfaces of the second transparent silica gel layer and the white glue layer; and cutting the LED lamp bead formed by pressing the film to form an independent LED lamp bead. The packaging method of the LED lamp bead reduces the heat attenuation of the fluorescent glue layer, increases the utilization rate of side light of the LED chip, improves the brightness of the LED and has the advantage of higher central light intensity.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a packaging method of an LED lamp bead.
Background
LEDs are fully known as semiconductor light emitting diodes and can convert electrical energy into light energy. The light emitting diode is composed of a PN junction as common diodes, and also has unidirectional conductivity. When a forward voltage is applied to the light emitting diode, holes injected from the P region to the N region and electrons injected from the N region to the P region recombine with the electrons in the N region and the holes in the P region within a few micrometers near the PN junction, respectively, and spontaneous emission fluorescence is generated. Electrons and holes are in different energy states in different semiconductor materials. The more energy is released, the shorter the wavelength of light emitted, the more energy is released. Diodes emitting red, green or yellow light are commonly used. Compared with the traditional luminous source, the LED is used as a novel luminous source, and has been increasingly and widely applied to the fields of indication, display, decoration, backlight source, general illumination, urban night scene and the like.
The prior art LED lamp bead generally comprises a light emitting chip at the center, white glue surrounding the light emitting chip, and a fluorescent layer, as described in CN 107546301. The manufacturing method of the LED lamp bead is that light-emitting chips are arranged on a substrate, fluorescent layers are covered above and around the light-emitting chips, and white glue is filled in gaps among the chips. However, the white glue in the LED lamp bead structure obtained by the preparation method can block the side light emission of the light emitting chip and the fluorescent layer, so that the brightness of the light source is reduced. Meanwhile, the white glue blocks the light from the side surface, so that the light is reflected and refracted for multiple times and is converted into heat in the process, the heat productivity is greatly increased, and the safety and the service life of the LED lamp bead are reduced.
Disclosure of Invention
In view of the above, a need exists to provide a method for packaging an LED lamp bead, so as to improve the brightness of the LED lamp bead.
In order to achieve the purpose, the invention adopts the following technical scheme:
a packaging method of an LED lamp bead comprises the following steps:
step 1: fixing the LED chip on the substrate;
step 2: spraying transparent silica gel liquid on the outer side of the LED chip to form a first transparent silica gel layer wrapping five surfaces of the LED chip;
and step 3: spraying a fluorescent powder solution on the outer side of the first transparent silica gel layer to form a fluorescent adhesive layer wrapping five surfaces of the first transparent silica gel layer;
and 4, step 4: spraying transparent silica gel liquid on the outer side of the fluorescent glue layer to form a second transparent silica gel layer wrapping five surfaces of the fluorescent glue layer;
and 5: placing the substrate sprayed with the second transparent silica gel layer on a platform of a dispenser, dispensing white glue in a dispensing and line drawing manner, and drying the white glue to form a white glue layer; the white adhesive layer is positioned in an area which is not covered by the LED chip, the first transparent silica gel layer, the fluorescent adhesive layer and the second transparent silica gel layer, and the upper surface of the white adhesive layer is flush with the upper surface of the second transparent silica gel layer;
step 6: placing the substrate filled with the white glue layer into a film pressing machine to mold a silica gel lens; the silica gel lens is positioned on the upper surfaces of the second transparent silica gel layer and the white glue layer;
and 7: and cutting the LED lamp bead formed by pressing the film to form an independent LED lamp bead.
Further, the fixing method for fixing the LED chip on the substrate in step 1 includes, but is not limited to, a silver paste die bonding technique, an insulating paste die bonding technique, a flux eutectic technique, or a eutectic machine bonding technique.
Further, a spraying machine is adopted in the spraying mode, and the temperature of a platform of the spraying machine is controlled to be 120-150 ℃;
further, the transparent silica gel liquid is silica gel and a diluent in a mass ratio of 2: 1, stirring uniformly after the preparation, wherein the stirring parameter is 5-10 minutes at 2000-3000 r/min.
Further, in the step 3, the fluorescent powder solution is a mixed solution of fluorescent powder, silica gel, a diluent and silicon dioxide.
Preferably, the mixing ratio of the fluorescent powder, the silica gel, the diluent and the silicon dioxide in the fluorescent powder solution is (100-200): 50-100): 200-250): 1. When the fluorescent powder solution provided by the invention is sprayed, the fluorescent powder solution can be instantly dried by the heat of a clamp of a spraying machine, so that a very thin fluorescent glue layer with high density is obtained.
Further, the white glue in the step 5 comprises resin silica gel and nano powder; according to mass ratio, nano powder: the resin silica gel is (0.01-0.6): 1; the nano powder comprises titanium dioxide, silicon dioxide, zirconium dioxide and nano aluminum oxide; the nano powder comprises 41-99.7% of titanium dioxide, 0.1-20% of silicon dioxide, 0.1-20% of zirconium dioxide and 0.1-58.8% of nano-scale aluminum oxide by mass percent.
Further, the silicone lens includes, but is not limited to, a surface spiral vertical line corner cut lens, a plane lens or a surface frosted lens.
Further, the cutting manner includes, but is not limited to, grinding wheel water cutting, water knife cutting, diamond blade cutting, splitting cutting or laser scribing splitting cutting.
The beneficial effects of the invention are as follows:
in the packaging method of the LED lamp bead provided by the invention, the fluorescent glue layer is not directly contacted with the light-emitting chip, so that the fluorescent powder is less influenced by heat compared with a white glue LED packaging mode in the prior art, the heat attenuation of the fluorescent glue layer can be reduced, the fluorescent glue layer can achieve better working performance, the brightness of an LED is improved, and the service life of the whole lamp bead is prolonged.
In the packaging method of the LED lamp bead, the second transparent silica gel layer is arranged between the fluorescent glue layer and the white glue layer, so that the side light emitting of the fluorescent glue layer is not directly blocked by the white glue layer, but can be reflected or refracted out by the white glue layer after a certain distance, the utilization rate of the side light emitting is increased, the brightness of the packaged LED lamp bead is greatly increased, and the LED lamp bead has the advantage of higher central light intensity. Meanwhile, the problem that in the prior art, side light is reflected and refracted for multiple times in the interior and is converted into heat is solved, and the safety and the service life of the lamp bead are improved.
And thirdly, in the packaging method of the LED lamp bead provided by the invention, the used white glue components comprise resin silica gel, titanium dioxide, silicon dioxide, zirconium dioxide and nanoscale aluminum oxide. According to the invention, the heat dissipation capability of the white glue is improved by adding the nano-alumina, so that the heat emitted by the chip can be conducted out through the bottom substrate, and a part of the heat can be conducted out through the white glue layer; the zirconium dioxide is also added into the white glue component, so that the silver coating can be more stable at high temperature, and the oxidation of the silver coating on the surface of the substrate is avoided. In addition, as the zirconium dioxide is a substance with metallic luster, the addition of the zirconium dioxide can enable the white glue to have a stronger light reflection effect, so that more light emitted by the chip is emitted from the light-emitting device rather than being absorbed by an internal structure, and the light-emitting brightness is improved; according to the invention, the silica powder is added into the white glue, so that granular objects and silica gel in the white glue can be better mixed, and the white glue has an anti-precipitation effect; and silica still has the effect of increasing the smooth finish of white glue surface material, makes white glue surface more smooth and exquisite, has strengthened the reflectance of white glue to the light, makes the light that the chip sent can launch from luminescent device more, thereby promotes the luminance of whole device. Therefore, the white glue has high reflectivity due to the synergistic effect of various components, and the brightness of the LED lamp bead is greatly improved.
Drawings
FIG. 1 is a schematic view of an LED chip mounted on a substrate;
FIG. 2 is a schematic view of the first transparent silicone layer after spraying;
FIG. 3 is a schematic view of the sprayed phosphor layer;
FIG. 4 is a schematic view of the second transparent silicone layer after spraying;
FIG. 5 is a schematic view of the filled white glue layer;
FIG. 6 is a schematic view of a pressed film silica gel lens;
fig. 7 is a schematic diagram of individual LED lamp beads formed after cutting.
Reference numerals: the LED chip comprises a substrate 1, an LED chip 2, a first transparent silica gel layer 3, a fluorescent glue layer 4, a second transparent silica gel layer 5, a white glue layer 6 and a silica gel lens 7.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be further clearly and completely described below with reference to the embodiments of the present invention. It should be noted that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
The silica gel, diluent and resin silica gel used in the examples of the present invention are commercially available and conventional brands, and the present invention is not particularly limited.
Example 1
A packaging method of an LED lamp bead comprises the following steps:
step 1: as shown in fig. 1, an LED chip 2 is fixed on a substrate 1;
step 2: as shown in fig. 2, transparent silica gel liquid is sprayed on the outer side of the LED chip 2 to form a first transparent silica gel layer 3 wrapping five surfaces of the LED chip;
and step 3: as shown in fig. 3, a fluorescent powder solution is sprayed on the outer side of the first transparent silica gel layer 3; forming a fluorescent glue layer 4 wrapped on five surfaces of the first transparent silica gel layer;
and 4, step 4: as shown in fig. 4, transparent silica gel liquid is sprayed on the outer side of the fluorescent glue layer 4 to form a second transparent silica gel layer 5 wrapping the five surfaces of the fluorescent glue layer;
and 5: as shown in fig. 5, the substrate sprayed with the second transparent silica gel layer 5 is placed on a platform of a dispenser, white glue is dispensed in a dispensing and line drawing manner, and a white glue layer 6 is formed after the white glue is dried; the white adhesive layer 6 is positioned in an area which is not covered by the LED chip, the first transparent silica gel layer, the fluorescent adhesive layer and the second transparent silica gel layer, and the upper surface of the white adhesive layer 6 is flush with the upper surface of the second transparent silica gel layer 5;
step 6: as shown in fig. 6, the substrate filled with the white glue layer is placed into a film pressing machine to mold the silica gel lens; the silica gel lens 7 is positioned on the upper surfaces of the second transparent silica gel layer and the white glue layer;
and 7: and cutting the LED lamp beads formed by pressing the films to form the independent LED lamp beads, as shown in figure 7.
Example 2
A packaging method of an LED lamp bead comprises the following steps:
step 1: fixing the LED chip on the substrate;
step 2: spraying transparent silica gel liquid on the outer side of the LED chip to form a first transparent silica gel layer wrapping the five surfaces of the LED chip; the transparent silica gel liquid contains silica gel and a diluent according to the mass ratio of 2: 1, uniformly stirring after preparation, wherein the stirring parameter is 5 minutes at 2500 rpm;
and step 3: spraying a fluorescent powder solution on the outer side of the first transparent silica gel layer; forming a fluorescent glue layer wrapped on five surfaces of the first transparent silica gel layer; the fluorescent powder solution is a mixed solution of fluorescent powder, silica gel, a diluent and silicon dioxide, and the ratio of the fluorescent powder, the silica gel, the diluent and the silicon dioxide is 120:60:210:1 according to the mass mixing ratio;
and 4, step 4: spraying transparent silica gel liquid on the outer side of the fluorescent glue layer to form a second transparent silica gel layer wrapping the five surfaces of the fluorescent glue layer; the transparent silica gel liquid is the same as the step 2;
and 5: placing the substrate sprayed with the second transparent silica gel layer on a platform of a dispensing machine, dispensing white glue in a dispensing and line drawing manner, and drying the white glue to form a white glue layer; the white adhesive layer is positioned in an area which is not covered by the LED chip, the first transparent silica gel layer, the fluorescent adhesive layer and the second transparent silica gel layer, and the upper surface of the white adhesive layer is flush with the upper surface of the second transparent silica gel layer; the white glue component comprises resin silica gel and nano powder; according to mass ratio, nano powder: resin silica gel 0.6: 1; the nano powder comprises titanium dioxide, silicon dioxide, zirconium dioxide and nano-scale aluminum oxide. Wherein the nano powder comprises 50% of titanium dioxide, 5% of silicon dioxide, 5% of zirconium dioxide and 40% of nano-grade aluminum oxide in percentage by mass;
step 6: placing the substrate filled with the white glue layer into a film pressing machine to mold a silica gel lens; the silica gel lens is positioned on the upper surfaces of the second transparent silica gel layer and the white glue layer;
and 7: and cutting the LED lamp bead formed by pressing the film to form an independent LED lamp bead.
Example 3
A packaging method of an LED lamp bead comprises the following steps:
step 1: fixing the LED chip on the substrate;
step 2: spraying transparent silica gel liquid on the outer side of the LED chip to form a first transparent silica gel layer wrapping the five surfaces of the LED chip; the transparent silica gel liquid contains silica gel and a diluent according to the mass ratio of 2: 1, uniformly stirring after preparation, wherein the stirring parameter is 2800 r/min for 6 minutes;
and step 3: spraying a fluorescent powder solution on the outer side of the first transparent silica gel layer; forming a fluorescent glue layer wrapping five surfaces of the first transparent silica gel layer; the fluorescent powder solution is a mixed solution of fluorescent powder, silica gel, a diluent and silicon dioxide, and the ratio of the fluorescent powder, the silica gel, the diluent and the silicon dioxide is 150:50:225:1 according to the mass mixing ratio;
and 4, step 4: spraying transparent silica gel liquid on the outer side of the fluorescent glue layer to form a second transparent silica gel layer wrapping the five surfaces of the fluorescent glue layer; the transparent silica gel liquid is the same as the step 2;
and 5: placing the substrate sprayed with the second transparent silica gel layer on a platform of a dispenser, dispensing white glue in a dispensing and line drawing manner, and drying the white glue to form a white glue layer; the white adhesive layer is positioned in an area which is not covered by the LED chip, the first transparent silica gel layer, the fluorescent adhesive layer and the second transparent silica gel layer, and the upper surface of the white adhesive layer is flush with the second transparent silica gel layer; the white glue component comprises resin silica gel and nano powder; according to mass ratio, nano powder: resin silica gel 0.4: 1; the nanopowder includes titanium dioxide, silicon dioxide, zirconium dioxide and aluminum oxide. Wherein the nano powder comprises 70% of titanium dioxide, 10% of silicon dioxide, 10% of zirconium dioxide and 10% of nano-grade aluminum oxide in percentage by mass;
and 6: placing the substrate filled with the white glue layer into a film pressing machine to mold a silica gel lens; the silica gel lens is positioned on the upper surfaces of the second transparent silica gel layer and the white glue layer;
and 7: and cutting the LED lamp bead formed by pressing the film to form an independent LED lamp bead.
Example 4
A packaging method of an LED lamp bead comprises the following steps:
step 1: fixing the LED chip on the substrate;
step 2: spraying transparent silica gel liquid on the outer side of the LED chip to form a first transparent silica gel layer wrapping the five surfaces of the LED chip; the transparent silica gel liquid is silica gel and a diluent according to the mass ratio of 2: 1, uniformly stirring after preparation, wherein the stirring parameter is 2200 revolutions per minute for 8 minutes;
and 3, step 3: spraying a fluorescent powder solution on the outer side of the first transparent silica gel layer; forming a fluorescent glue layer wrapped on five surfaces of the first transparent silica gel layer; the fluorescent powder solution is a mixed solution of fluorescent powder, silica gel, a diluent and silicon dioxide, and the ratio of the fluorescent powder, the silica gel, the diluent and the silicon dioxide is 180:80:200:1 according to the mass mixing ratio;
and 4, step 4: spraying transparent silica gel liquid on the outer side of the fluorescent glue layer to form a second transparent silica gel layer wrapping the five surfaces of the fluorescent glue layer; the transparent silica gel liquid is the same as the step 2;
and 5: placing the substrate sprayed with the second transparent silica gel layer on a platform of a dispenser, dispensing white glue in a dispensing and line drawing manner, and drying the white glue to form a white glue layer; the white adhesive layer is positioned in an area which is not covered by the LED chip, the first transparent silica gel layer, the fluorescent adhesive layer and the second transparent silica gel layer, and the upper surface of the white adhesive layer is flush with the upper surface of the second transparent silica gel layer; the white glue component comprises resin silica gel and nano powder; according to mass ratio, nano powder: resin silica gel 0.4: 1; the nanopowder includes titanium dioxide, silicon dioxide, zirconium dioxide and aluminum oxide. Wherein the nano powder comprises 60% of titanium dioxide, 20% of silicon dioxide, 10% of zirconium dioxide and 10% of aluminum oxide by mass percentage;
and 6: placing the substrate filled with the white glue layer into a film pressing machine to mold a silica gel lens; the silica gel lens is positioned on the upper surfaces of the second transparent silica gel layer and the white glue layer;
and 7: and cutting the LED lamp bead formed by pressing the film to form an independent LED lamp bead.
Comparative example 1
A packaging method of an LED lamp bead comprises the following steps:
step 1: fixing the LED chip on the substrate;
and 2, step: spraying transparent silica gel liquid on the outer side of the LED chip to form a first transparent silica gel layer wrapping the five surfaces of the LED chip; the transparent silica gel liquid is silica gel and a diluent according to the mass ratio of 2: 1, uniformly stirring after preparation, wherein the stirring parameter is 5 minutes at 2500 rpm;
and step 3: spraying a fluorescent powder solution on the outer side of the first transparent silica gel layer; forming a fluorescent glue layer wrapped on five surfaces of the first transparent silica gel layer; the fluorescent powder solution is a mixed solution of fluorescent powder, silica gel, a diluent and silicon dioxide, wherein the ratio of the fluorescent powder to the silica gel to the diluent to the silicon dioxide is 120:70:200: 1;
and 4, step 4: placing the substrate sprayed with the fluorescent glue layer on a platform of a dispenser, dispensing white glue in a dispensing and line drawing manner, and drying the white glue at low temperature after the white glue is leveled to form a white glue layer; the white glue layer is positioned in an area which is not covered by the LED chip, the first transparent silica gel layer and the fluorescent glue layer, and the upper surface of the white glue layer is flush with the upper surface of the fluorescent glue layer; the white glue component comprises resin silica gel and nano powder; according to mass ratio, nano powder: resin silica gel 0.6: 1; the nanopowder includes titanium dioxide, silicon dioxide, zirconium dioxide and aluminum oxide.
And 5: placing the substrate filled with the white glue layer into a film pressing machine to mold a silica gel lens; the silica gel lens is positioned on the upper surfaces of the fluorescent glue layer and the white glue layer;
and 6: and cutting the LED lamp beads formed by the pressed film to form independent LED lamp beads.
In comparative example 1, because there is not the second transparent silica gel layer of spraying for the light-emitting of fluorescence glue film side can receive the white glue layer to hinder, leads to lamp pearl luminance to be lower. Under the condition that the color temperature is 4000K and the display finger is 70, the luminous efficiency of the comparative example 1 is about 185lm/w, and the luminous efficiency of the lamp bead manufactured by the embodiment 1 can reach about 200 lm/w.
Comparative example 2
The LED lamp bead packaging method is different from the embodiment 2 in that the white glue component comprises resin silica gel and nano powder; according to the mass ratio, the nano powder: resin silica gel 0.6: 1; the nano powder is titanium dioxide. The rest steps are the same.
Because the heat dissipation is not good, the light effect of the lamp bead prepared in the comparative example 2 is about 170-180 lm/w under the conditions of the color temperature 4000K and the display index 70, and the brightness of the lamp bead prepared in the embodiment 2 can reach about 200 lm/w.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. The packaging method of the LED lamp bead is characterized by comprising the following steps:
step 1: fixing the LED chip on the substrate;
step 2: spraying transparent silica gel liquid on the outer side of the LED chip to form a first transparent silica gel layer wrapping five surfaces of the LED chip;
and step 3: spraying a fluorescent powder solution on the outer side of the first transparent silica gel layer to form a fluorescent adhesive layer wrapping five surfaces of the first transparent silica gel layer;
and 4, step 4: spraying transparent silica gel liquid on the outer side of the fluorescent glue layer to form a second transparent silica gel layer wrapping five surfaces of the fluorescent glue layer;
and 5: placing the substrate sprayed with the second transparent silica gel layer on a platform of a dispenser, dispensing white glue in a dispensing and line drawing manner, and drying the white glue to form a white glue layer; the white adhesive layer is positioned in an area which is not covered by the LED chip, the first transparent silica gel layer, the fluorescent adhesive layer and the second transparent silica gel layer, and the upper surface of the white adhesive layer is flush with the upper surface of the second transparent silica gel layer;
step 6: placing the substrate filled with the white glue layer into a film pressing machine to mold a silica gel lens; the silica gel lens is positioned on the upper surfaces of the second transparent silica gel layer and the white glue layer;
and 7: and cutting the LED lamp bead formed by pressing the film to form an independent LED lamp bead.
2. The method for packaging an LED lamp bead according to claim 1, wherein the fixing manner of the LED chip on the substrate in step 1 includes, but is not limited to, a silver paste die bonding technique, an insulating paste die bonding technique, a flux eutectic technique or a eutectic machine bonding technique.
3. The packaging method of the LED lamp bead according to claim 1, wherein the spraying mode is a spraying machine, and the temperature of a platform of the spraying machine is controlled to be 100-150 ℃.
4. The packaging method of the LED lamp bead according to claim 1, wherein the transparent silica gel liquid is silica gel and a diluent in a mass ratio of 2: 1 is configured.
5. The method for packaging an LED lamp bead according to claim 1, wherein the phosphor solution in step 3 is a mixed solution of phosphor, silica gel, diluent and silica.
6. The method for encapsulating the LED lamp bead according to claim 5, wherein the mixing ratio of the fluorescent powder, the silica gel, the diluent and the silicon dioxide in the fluorescent powder solution is (100-200): 50-100): 200-250): 1.
7. The method for packaging an LED lamp bead according to claim 1, wherein the white glue in the step 5 comprises silicone resin and nano powder; according to the mass ratio, the nano powder: the resin silica gel is (0.01-0.6): 1.
8. the packaging method of the LED lamp bead according to claim 7, wherein the nanopowder comprises titanium dioxide, silicon dioxide, zirconium dioxide and nanoscale aluminum oxide; the nano powder comprises, by mass, 41-99.7% of titanium dioxide, 0.1-20% of silicon dioxide, 0.1-20% of zirconium dioxide and 0.1-58.8% of nano-alumina.
9. The method for packaging an LED lamp bead according to claim 1, wherein the silicone lens includes but is not limited to a surface spiral vertical-line corner cut lens, a planar lens or a surface frosted lens.
10. The method for packaging the LED lamp bead according to claim 1, wherein the cutting manner includes but is not limited to grinding wheel water cutting, water knife cutting, diamond blade cutting, splitting cutting or laser scribing splitting cutting.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117153995A (en) * | 2023-10-30 | 2023-12-01 | 罗化芯显示科技开发(江苏)有限公司 | LED packaging film layer and LED packaging structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117153995A (en) * | 2023-10-30 | 2023-12-01 | 罗化芯显示科技开发(江苏)有限公司 | LED packaging film layer and LED packaging structure |
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