JP4839687B2 - Light emitting device - Google Patents

Description

  The present invention relates to a light emitting device in which a light extraction increasing member is optically coupled to an emission surface of a light emitting element chip, and light from the light emitting element chip is extracted through the light extraction increasing member.

  In recent years, it has become possible to obtain a white emission color in a light-emitting element chip such as a light-emitting diode or an organic EL, and since the luminous flux that can be extracted has increased, this type of light-emitting element chip is used for illumination and display. It is considered to be used as a light source. In addition, this type of light-emitting element chip has an advantage that it can be driven with a small size and a low voltage and has a long life.

In order to use this type of light-emitting element chip for illumination or display, it is considered to optically couple a light extraction increasing member to the emission surface of the light-emitting element chip. For example, when the light emitting element chip has a sapphire substrate and the light is extracted through the sapphire substrate into the air, which is the medium on the emission side, the critical angle that causes total reflection is reduced. By providing a light extraction increasing member having an intermediate refractive index, the critical angle is made larger than when light is extracted directly into the air, and the light emission efficiency is increased (for example, see Patent Document 1).
International Publication No. 03/100873 Pamphlet

  However, even if the light extraction increasing member is provided, a part of the light emitted from the light emitting element chip is totally reflected inside the light extraction increasing member, so that a part of the light incident on the light extraction increasing member can be used. It is not emitted as light, resulting in a loss of light energy. That is, even if the light extraction increasing member is provided to increase the emitted light from the light emitting element chip, there is a problem that high efficiency cannot be obtained because light is lost inside the light extraction increasing member.

  The present invention has been made in view of the above reasons, and an object of the present invention is to provide a light emitting device in which light emitted from a light emitting element chip is extracted without being attenuated by a light extraction increasing member and light utilization efficiency is improved. There is to do.

According to the first aspect of the present invention, there is provided a mounting substrate having a chip housing recess for housing the light emitting element chip, an incident surface on which the light emitted from the light emitting element chip is incident and the incident surface. A light extraction increasing member having an emission surface for emitting incident light, and a sealing resin for sealing the light emitting element chip and a part of the light extraction increasing member, the material of the light extraction increasing member being the emission side In all the positions on the light exit surface of the light extraction increasing member, the refractive index is higher than that of the medium, and the normal of the position is the center line and the critical angle is the angle between the center line and the generatrix. The shape of the exit surface of the light extraction increasing member is set so that the exit surface of the light emitting element chip and the opening surface of the chip housing recess are included, and the sealing resin is selected from a material with a refractive index higher than that of the light extraction increasing member. is, opening of the chip storage recess the light extraction Opposite the entrance surface of the large member, it is blocked by the light extraction increasing member, and the inner surface of the chip housing recess is reflected from the bottom surface so as to reflect the emitted light from the light emitting element chip and enter the incident surface of the light extraction increasing member. A reflecting surface that rises and inclines toward the opening is formed .

  According to this configuration, at any position on the light exit surface of the light extraction increasing member, the angle formed by the traveling direction of light incident from the incident surface with respect to the normal of the light output surface is less than the critical angle. There is virtually no total reflection on the exit surface of the member, and no attenuation or extinction of light due to multiple reflections, so light can be extracted from the light extraction increasing member, resulting in light utilization efficiency. Becomes higher. Further, since the light utilization efficiency is high, the size of the light emitting element chip can be reduced with respect to the extracted light flux.

Furthermore, according to this configuration, by providing the chip housing recess, the light emitted from the light emitting element chip to the side can be reflected by the reflecting surface and incident on the light extraction increasing member. It leads to improvement. Further, the light extraction increasing member can be placed around the opening of the chip housing recess, and as a result, the light extraction increasing member can be attached so as not to rattle.

According to a second aspect of the present invention, in the first aspect of the invention, the reflecting surface formed in the chip housing recess is a quadratic curved surface, and is set so that the focal point is located near the side surface of the light emitting element chip. It is characterized by.

  According to this configuration, the light reflected by the reflecting surface of the chip housing recess can be incident from a direction substantially orthogonal to the incident surface of the light extraction increasing member, and all the light incident on the incident surface of the light extraction increasing member can be made incident. Reflection is suppressed, and this also increases the light extraction efficiency.

According to a third aspect of the present invention, in the first or second aspect of the present invention, the chip housing recess has a bottom surface similar to the light emitting element chip.

According to this configuration, since the light emitting element chip and the bottom surface of the chip housing recess are similar, the distance between the light emitting element chip and the reflecting surface can be reduced, and the emitted light from the side surface of the light emitting element chip can be reduced. Can be reflected by the reflecting surface without being reflected by the bottom surface of the chip housing recess, and most of the light can be extracted from the chip housing recess by a single reflection. As a result, the utilization efficiency of light emitted from the light emitting device chip may turn high.

According to the configuration of the present invention, since there is substantially no total reflection on the exit surface of the light extraction increasing member, light can be extracted from the light extraction increasing member without causing attenuation or extinction of light due to multiple reflection. As a result, there is an advantage that the light utilization efficiency is increased. In addition, by providing the chip housing recess, the light emitted laterally from the light emitting element chip can be reflected by the reflecting surface and incident on the light extraction increasing member, resulting in improved efficiency. Further, the light extraction increasing member can be placed around the opening of the chip housing recess, and as a result, the light extraction increasing member can be attached so as not to rattle.

(Embodiment 1)
In the present embodiment, as shown in FIG. 1, a light-emitting element chip 2 made of a light-emitting diode is optically coupled to a package 1 that also serves as a mounting substrate, and an emission surface of the light-emitting element chip 2. The light extraction increasing member 3 that increases the extraction amount and controls the light distribution using refraction is housed. An accommodation recess 11 for accommodating the light emitting element chip 2 is opened on one surface of the package 1, and the opening surface of the accommodation recess 11 is covered with the wavelength conversion member 4.

  A wiring pattern by a thin film forming technique or a thick film forming technique is formed on the bottom surface of the storage recess 11, and the light emitting element chip 2 is flip-chip mounted on the wiring pattern. The inner surface of the storage recess 11 has a tapered shape that rises and inclines from the bottom surface of the storage recess 11 toward the opening surface, and the light emitted from the light emitting element chip 2 is not simply refracted by the light extraction increasing member 3. The light distribution is also controlled by being reflected on the inner surface of the storage recess 11.

  The light emitting element chip 2 is a light emitting diode chip in which a semiconductor layer made of GaN is stacked on a sapphire substrate, which is an insulating substrate, and takes out light through the sapphire substrate. Here, the emission surface, which is one surface of the sapphire substrate, is formed in a square shape.

  The light extraction increasing member 3 has the shape of a plano-convex lens in which the incident surface 3a that is in close contact with the emission surface of the light emitting element chip 2 is a flat surface, and the emission surface 3b that extracts light is a convex curved surface. Since the sapphire substrate used for the light-emitting element chip 2 has a relatively large refractive index and a small critical angle, when light is directly extracted from the light-emitting element chip 2 into the air, the emission efficiency decreases due to total reflection in the sapphire substrate. To do. Therefore, the light extraction increasing member 3 is arranged, and by selecting a material having an intermediate refractive index between the sapphire substrate and air as the light extraction increasing member 3, the critical angle in the sapphire substrate is increased and emitted. Increases efficiency. In the present embodiment, the light extraction increasing member 3 is made of a transparent silicon resin having a refractive index of 1.41. The incident surface 3a of the light extraction increasing member 3 is circular, and the diameter φ of the incident surface 3a of the light extraction increasing member 3 is 1.5 times the diagonal dimension 2L of the emission surface of the light emitting element chip 2. (Φ = 3L). Here, the center C1 of the emission surface of the light emitting element chip 2 and the center C2 of the incident surface 3a of the light extraction increasing member 3 are matched.

  The wavelength conversion member 4 is obtained by dispersing a fluorescent material in a silicon resin sheet, converts the wavelength of light emitted from the light emitting element chip 2 with the fluorescent material, and the emission color of the light emitting element chip 2 and the wavelength conversion member. 4 is provided for extracting mixed-color light with the light having the wavelength converted in step 4. For example, white light can be extracted by using a light emitting diode having a blue emission color as the light emitting element chip 2 and using a yellow fluorescent material for the wavelength conversion member 4. Here, a gap is formed between the light extraction increasing member 3 and the wavelength conversion member 4 so that the emission surface 3b of the light extraction member 3 is in contact with air over substantially the entire surface.

  The bottom of the storage recess 11 is filled with a sealing resin 5 so that the light emitting element chip 2 and a part of the light extraction increasing member 3 are sealed. A material having a refractive index equal to or higher than the refractive index of the light extraction increasing member 3 is selected for the sealing resin 5.

Next, the shape of the emission surface 3b of the light extraction increasing member 3 in this embodiment will be described. The emission surface 3 b of the light extraction increasing member 3 is designed so that the light emitted from the light emitting element chip 2 does not cause total reflection on the inner surface of the light extraction increasing member 3. Here, since the light extraction increasing member 3 is made of silicon resin having a refractive index of 1.41, if the refractive index of air is 1, the critical angle is about 45 ° (≈sin ⁻¹ (1/1). .41)). Therefore, in the present embodiment, the angle of the light emitting element chip 2 in all the parts of the light emitting surface 3b is within the critical angle (that is, 45 °) range with respect to the normal to the position. The shape is set.

  That is, as shown in FIG. 2, the incident angle of light incident from the light emitting element chip 2 with respect to an arbitrary point P on the emission surface 3b of the light extraction increasing member 3 (the light is incident on the normal line set at the point P). If the incident angle is smaller than the critical angle θ, the light can be extracted outside the light extraction increasing member 3. Therefore, a cone having an angle θ formed by the center line and the generatrix is set with the normal line N standing at the point P as the center line, and the emission surface 3b is designed so that the light emitting element chip 2 is located in the cone. ing. That is, the necessary condition for the emission surface 3b is that the relationship between the angle α at which the point P is viewed from both ends of the diagonal line of the light emitting element chip 2 and the critical angle θ is α <2θ.

  A case where the emission surface 3b of the light extraction increasing member 3 is a spherical surface will be described with reference to FIG. Since the center C1 of the light emitting element chip 2 and the center C2 of the incident surface 3a of the light extraction increasing member 3 coincide with each other, when the exit surface 3b is a spherical surface and the center C2 of the incident surface 3a is the center of the spherical surface. The normal line N standing at an arbitrary point P on the exit surface 3b passes through the center C1 of the light emitting element chip 2 (center C2 of the entrance surface 3a). Therefore, an xy plane is considered in which the extension direction of the diagonal line of the emission surface of the light emitting element chip 2 is the x-axis direction, and the normal direction standing at the center C1 of the emission surface of the light emitting element chip 2 is the y-axis direction.

A straight line passing through an arbitrary point P on the exit surface 3b and the center C1 in the xy plane is set as a center line, and a cone whose angle formed by the center line and the generatrix is a critical angle θ is set. The points at which the cone bus intersects the incident surface 3a of the light extraction increasing member 3 are defined as Q1 and Q2 (Q2 cannot be obtained in the example of FIG. 3). If the x-coordinates of the points Q1 and Q2 are x1 and x2, the condition that the light emitting element chip 2 is included in the set cone is | x1 |> L and | x2 |> L. Now, if the angle formed by the straight line (that is, the normal line N) from the point P and the x axis is ρ, the coordinate of the point P is (1.5L · cos ρ, 1.5L Sin ρ). On the other hand, since the slope of the straight line connecting the point P and the point Q1 is (ρ + θ) and the slope of the straight line connecting the point P and the point Q2 is (ρ−θ), the straight line connecting the point P and the point Q1. And a straight line connecting the point P and the point Q2 are respectively expressed by the following expressions.
y− (1.5 L · sin ρ) = (θ + ρ) {x− (1.5 L · cos ρ)}
y− (1.5 L · sin ρ) = (θ−ρ) {x− (1.5 L · cos ρ)}
Since the x-coordinate is necessary for the points Q1 and Q2, if y = 0, x1 and x2 are expressed as follows.
x1 = (1.5 L · cos ρ) − (1.5 L · sin ρ) / (θ + ρ)
x2 = (1.5 L · cos ρ) − (1.5 L · sin ρ) / (θ−ρ)
Under this condition, the relationship between the angle ρ and the coordinates x1 and x2 is as shown in Tables 1 and 2, respectively.

  That is, since the absolute values of the coordinates x1 and x2 are larger than L for all angles ρ, the light emitted from the light emitting element chip 2 and incident on the light extraction increasing member 3 is totally reflected on the emission surface 3b of the light extraction increasing member 3. It can be taken out without doing. In obtaining the coordinate x2, since the coordinate x2 cannot be obtained in the range of ρ ≦ θ with respect to the angle ρ, the coordinate x2 may be obtained in the range of 90 ° ≧ ρ> θ in the positional relationship of FIG. .

  In the equation for obtaining the coordinates x1 and x2, 1.5L is an unknown, and when the condition that the absolute values of the coordinates x1 and x2 are greater than L at all angles ρ is obtained, it is 1.415L. Therefore, it can be said that the diameter of the incident surface 3a of the light extraction increasing member 3 may be 1.42L or more.

  In the above-described example, the incident surface 3a of the light extraction increasing member 3 and the emission surface of the light emitting element chip 2 are both in close contact with each other as a flat surface, but the sealing resin 5 may be used even if the incident surface 3a of the light extraction increasing member 3 is not flat. If a material having a refractive index equal to that of the light extraction increasing member 3 is selected, the sealing resin 5 is filled in the gap between the incident surface 3a of the light extraction increasing member 3 and the emission surface of the light emitting element chip 2. Works the same as the configuration.

(Embodiment 2)
In the first embodiment, an example in which the emission surface 3b of the light extraction increasing member 3 is a spherical surface is shown. However, in the present embodiment, as shown in FIG. In the normal direction standing on the center line of the exit surface 2, the cross section perpendicular to the center line is formed in a circle having the same diameter within a specified distance range from the exit surface of the light emitting element chip 2. . That is, a part of the light extraction increasing member 3 is a columnar shape, and the remaining part is a part of a sphere. In other words, it has an emission surface 3b having a shape obtained by cutting a part of a spherical surface forming a hemisphere with a cylinder. Below, the part which is a part of spherical surface among the output surfaces 3b is called the main surface 3c, and the cylindrical part is called the auxiliary surface 3d.

  As for the range of the auxiliary surface 3d, an angle λ formed by a straight line connecting the boundary between the main surface 3c and the auxiliary surface 3d and the vertex of the emission surface of the light emitting element chip 2 (that is, one end of the diagonal line) with respect to the incident surface 3a is critical. Set it to be less than the corner. Therefore, if the length of the diagonal line of the emission surface of the light emitting element chip 2 is 2L and the diameter of the incident surface 3a of the light extraction increasing member 3 is 2.88L, In the direction, the distance between the boundary between the main surface 3c and the auxiliary surface 3d and the incident surface 3a is 0.44L. In other words, the auxiliary surface 3d is formed at a portion within a specified distance range from the incident surface 3a on the emission surface 3b.

  Under the conditions described above, since all the emitted light from the light emitting element chip 2 is incident from the light emitting element chip 2 side with respect to the normal line standing on the auxiliary surface 3d, the light emitted from the emission surface 3d is normal. Refracts in a direction away from the light emitting element chip 2. In addition, since the light incident on the auxiliary surface 3d from the light emitting element chip 2 is always below the critical angle, the light incident on the auxiliary surface 3d from the light emitting element chip 2 can be prevented as well as the loss due to total reflection can be prevented. Compared to the case where a spherical surface is used instead of the auxiliary surface 3d, the incident angle is close to the critical angle, and as a result, the angle difference from the normal direction on the exit surface of the light emitting element chip 2 can be reduced. In addition, since the size of the incident surface 3a is smaller than when the auxiliary surface 3d is not provided, this also leads to miniaturization.

  In other words, in the region near the incident surface 3a in the light extraction increasing member 3, the incident angle of the light incident from the light emitting element chip 2 to the output surface 3b is small, so that the angle margin with respect to the critical angle is large. On the other hand, if the incident angle is reduced, the emission angle is also close to the normal direction, so that the light is reflected not in front of the light emitting element chip 2 but in the direction toward the inner surface of the housing recess 11. On the other hand, if the configuration of the present embodiment is adopted, the amount of light directed toward the front of the light emitting element chip 2 is increased, and the light flux reflected on the inner surface of the storage recess 11 is reduced, so that the reflection loss is reduced. The amount of light extracted from the package 1 can be increased. That is, the opening area of the storage recess 11 provided in the package 1 can be reduced, and as a result, the package 1 can be expected to be downsized. Moreover, since the opening area of the storage recess 11 is reduced, the size of the wavelength conversion member 4 can also be reduced.

  The auxiliary surface 3d does not have to be a surface orthogonal to the incident surface 3a of the light extraction increasing member 3, and the cross-sectional area of the cross section perpendicular to the normal direction on the emission surface of the light emitting element chip 2 is closer to the incident surface 3a. The shape may be small. In this case, the change rate of the cross-sectional area may be constant (that is, a shape that is a straight line in the cross-section including the normal line on the emission surface of the light emitting element chip 2), or the change rate is not constant but a convex curved surface. It may be a shape.

  In the first and second embodiments, the center of the spherical surface that is the exit surface 3b of the light extraction increasing member 3 is made to coincide with the center of the entrance surface 3a, but this condition is not essential. For example, the distance between the entrance surface 3a and the exit surface 3b in the normal direction of the exit surface of the light emitting element chip 2 may be set to be equal to or less than the radius of the spherical surface.

(Embodiment 3)
In the present embodiment, as shown in FIG. 5, a chip housing recess 12 is formed on the bottom surface of the housing recess 11, and the light emitting element chip 2 is arranged in the chip housing recess 12. The chip housing recess 12 has a bottom surface and an opening surface that are similar to the emission surface of the light emitting element chip 2 (see FIG. 5B). In particular, the bottom surface of the chip housing recess 12 is formed to have a size substantially equal to the emission surface of the light emitting element chip 2. The chip storage recess 12 opens in a square shape. The maximum dimension of the opening surface of the chip receiving recess 12 is smaller than the diameter of the incident surface 3 a of the light extraction increasing member 3. Therefore, the light emitting element chip 2 is housed in the chip housing recess 12 together with the sealing resin 5, but the light extraction increasing member 3 is disposed so as to close the opening of the chip housing recess 12. Here, when the maximum width of the opening surface of the chip housing recess 12 is 2L, the dimensional relationship is set so that the diameter of the incident surface 3a of the light extraction increasing member 3 is 3L. Therefore, the light emitting element chip 2 of the present embodiment is smaller than the light emitting element chips 2 of the first and second embodiments.

  The chip receiving recess 12 has an inner surface formed in a taper shape like the storing recess 11. That is, the inner side surface of the chip storage recess 12 rises and inclines from the bottom surface toward the opening. The inner surface is a reflecting surface 12a, and light emitted from other than the emitting surface in the light emitting element chip 2 can be redirected forward by the reflecting surface 12a. In this configuration, the opening surface of the chip receiving recess 12 is a substantial light emitting surface, and the incident surface 3a of the light extraction increasing member 3 is in close contact with the light emitting surface as in the first and second embodiments. is there. By considering the opening surface of the chip housing recess 12 as the light emitting surface (that is, the light emitting surface), the chip housing recess 12 functions substantially the same as in the first and second embodiments.

  In the present embodiment, since light emitted from other than the emission surface in the light emitting element chip 2 is also input to the light extraction increasing member 3, the light use efficiency is higher than those in the first and second embodiments. In addition, it is possible to reduce the size of the light emitting element chip 2 as compared with the configurations of the first and second embodiments. Other configurations and operations are the same as those of the above-described embodiment.

  The shape of the reflecting surface 12a, which is the inner side surface of the chip receiving recess 12, is a shape that is linear in a cross section including a direction orthogonal to the opening surface of the chip storing recess 12 as shown in FIG. In addition, a concave curved surface (part of a paraboloid), a hyperboloid, a spherical surface, an elliptical surface, or the like can be employed as shown in FIG. In the shape of FIG. 6, since the reflecting surface 12a forms a part of the paraboloid, the light emitted from the light emitting element chip 2 can be redirected in substantially the same direction, and the light is emitted more than when the conical surface is used. The extraction efficiency can be increased. In short, by adopting a shape that can change the emitted light from the side surface of the light emitting element chip 2 in a direction substantially orthogonal to the incident surface 3 a of the light extraction increasing member 3, light to the light extraction increasing member 3 is obtained. The incident efficiency can be increased. When a quadratic curved surface such as a parabolic surface or an elliptical surface is adopted as the reflecting surface 12a, the side surface of the light emitting element chip 2 is designed to be near the focal position.

  In the configuration of the present embodiment, the opening surface of the chip housing recess 12 is formed in a shape similar to the emission surface of the light emitting element chip 2, and also in each part in the depth direction of the chip housing recess 12. A parallel cross section is formed in a shape similar to the emission surface of the light emitting element chip 2. Therefore, since the distance between the light emitting element chip 2 and the reflecting surface 12a can be reduced, multiple reflections in the chip housing recess 12 can be prevented, and the light emitting element chip 2 to the chip housing recess 12 can be prevented. Since the light emitted to the light is only reflected once by the reflecting surface 12a and introduced into the light extraction increasing member 3, it is possible to prevent light loss due to repeated reflection. In addition, since the size of the chip storage recess 12 can be made close to the size of the light emitting element chip 2, the chip storage recess 12 can be reduced, resulting in a reduction in the size of the package 1.

(Embodiment 4)
In each of the above-described embodiments, an example in which the light-emitting element chip 2 is flip-chip mounted has been shown. However, in the present embodiment, as shown in FIG. A face-up mounting is performed in which a sapphire substrate is fixed to the bottom surface of the chip housing recess 12 and electrically connected to a wiring pattern (not shown) using a bonding wire 13. The depth of the chip storage recess 12 is set so that the bonding wire 13 does not protrude from the opening surface of the chip storage recess 12. The light emitted from the light emitting element chip 2 is introduced into the incident surface 3 a of the light extraction increasing member 3 through the sealing resin 5 filled in the chip housing recess 12. That is, the opening surface of the chip housing recess 12 has substantially the same function as the light emitting surface of the light emitting element chip 2 in the first embodiment. Other configurations and operations are the same as those of the other embodiments described above.

(Embodiment 5)
In each of the above-described embodiments, one light extraction increasing member 3 is associated with one light emitting element chip 2, but in this embodiment, one light extraction increasing member 3 is used as shown in FIG. A plurality of light emitting element chips 2 are arranged with respect to the above. In the illustrated example, nine light emitting element chips 2 are arranged in three rows vertically and horizontally. However, the dimensional relationship is the same as in the first embodiment, and when the diameter of the incident surface 3a of the light extraction increasing member 3 is 3L, the length of the diagonal line of the square region in which the light emitting element chips 2 are arranged is 2L. . In short, this corresponds to dividing the emission surface of the light emitting element chip 2 in Embodiment 1 into nine. Note that the number of the light emitting element chips 2 is not limited to nine, and the area where the light emitting element chips 2 are arranged may be other than a square. Other configurations and operations are the same as those of the other embodiments described above.

(A) is sectional drawing which shows Embodiment 1, (b) is a principal part top view same as the above. It is operation | movement explanatory drawing same as the above. It is operation | movement explanatory drawing same as the above. FIG. 6 is a cross-sectional view of a main part showing Embodiment 2. (A) is sectional drawing which shows Embodiment 3, (b) is a top view same as the above. It is sectional drawing which shows the other structural example same as the above. FIG. 6 is a cross-sectional view showing a fourth embodiment. (A) is sectional drawing which shows Embodiment 5, (b) is a principal part top view same as the above.

Explanation of symbols

1 Package (Mounting board)
2 Light-Emitting Element Chip 3 Light Extraction Increasing Member 3a Incident Surface 3b Outgoing Surface 3c Main Surface 3d Auxiliary Surface 12 Chip Storage Recess 12a Reflecting Surface

Claims (3)

A mounting substrate having a chip housing recess for storing a light emitting element chip, an incident surface that is optically coupled to an emission surface of the light emitting element chip, and an incident surface on which light emitted from the light emitting element chip is incident, and an emission that emits light incident from the incident surface And a sealing resin for sealing the light emitting element chip and a part of the light extraction increasing member, and the material of the light extraction increasing member is higher in refractive index than the medium on the output side. a is, at every position on the exit surface of the light extraction increasing element, the exit surface of the light-emitting element chips in a cone to the angle between the center line and the bus a critical angle to the center line normal of the position and The shape of the exit surface of the light extraction increasing member is set so that the opening surface of the chip storage recess is included, and the sealing resin is selected from a material having a refractive index higher than that of the light extraction increasing member . The aperture surface faces the incident surface of the light extraction increasing member The inner surface of the chip housing recess reflects the light emitted from the light emitting element chip so as to be incident on the incident surface of the light extraction increasing member. emitting apparatus characterized by forming the surface. 2. The light emitting device according to claim 1, wherein the reflecting surface formed in the chip housing recess is a quadratic curved surface, and is set so that a focal point is located near a side surface of the light emitting element chip . It said chip receiving recess claim 1 or claim 2 emission equipment in, wherein the bottom surface is similar in shape to the light emitting device chip.

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