JP2009239116A - Light emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a compact and thin-shaped light emitting device in which a long LED chip is mounted on a small-surface-area substrate. <P>SOLUTION: In the light emitting device 10 constituted by mounting the light emitting element (LED chip) 13 in a long shape on the package substrate 12 having electrode pads 14 and 15, and sealing the light emitting element 13 and electrode pads 14 and 15 with a sealing resin, the light emitting element 13 is arranged having its length inclined to the length of the package substrate 12 so that its side boarder has a predetermined angle to a side boarder of the package substrate, and the electrode pads 14 and 15 are arranged in a space on a package substrate surface formed by inclining the length of the light emitting element 13 to the length of the substrate. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a light emitting device, and more particularly to a semiconductor light emitting device in which a light emitting element such as an LED is mounted on a substrate and the surface thereof is resin-sealed.

  Conventionally, a light-emitting device in which a light-emitting element such as an LED is mounted on a substrate and the surface thereof is resin-sealed has been used as a light-emitting device for illumination, a backlight light source for a liquid crystal television, and the like. Discloses the structure of such a surface-mounted component (SMD component).

  FIG. 8 is a diagram for explaining the structure of the SMD type LED disclosed in Patent Document 1. FIG. 8A is a cross-sectional view showing the structure of the vertical section of the SMD type LED, and FIG. It is a top view which shows the upper surface of this SMD type LED.

  An SMD type LED 500 shown in FIG. 8 is obtained by mounting an LED element 510 on a base (insulating substrate) 520 made of an insulating material. The pedestal 520 includes through-holes 520a and 520b formed so as to penetrate the pedestal 520, and connection electrodes 530 formed from the upper surface of the pedestal 520 to the lower surface of the pedestal via the through-holes 520a and 520b. 540. Here, the LED element 510 is placed on the upper surface portion of the base 520 of one connection electrode 530, and the other connection electrode 540 and an electrode (not shown) on the surface of the LED element 510 are bonded wires. 560 is connected.

  Further, a protective member 550 made of a translucent resin is formed on the entire surface of the base 520 by molding so as to cover and protect the LED element 510 and the connection electrodes 530 and 540.

  Patent Documents 2 and 3 disclose a light emitting device similar to the light emitting device disclosed in Patent Document 1.

  The light emitting device disclosed in Patent Document 2 is formed by die-bonding a light emitting element on an insulating substrate having a lead electrode, connecting the light emitting element and the lead electrode with a gold wire, and sealing the whole with a resin. The sealing resin contains a fluorescent material that can absorb part of the light emitted from the light emitting element and emit light having a longer wavelength.

In the light emitting device disclosed in Patent Document 3, an LED element is fixed with a resin in a through opening formed in a part of a printed wiring board, and the LED element is arranged on both sides of the through opening of the printed board. In a light-emitting device in which the connection electrode and the bonding wire are connected and the upper surface is sealed with a resin, the light emitting surface of the LED element is covered with a resin having a diffuse reflection effect, and the light emitting surface is covered with a resin containing a phosphor. By covering, this can suppress the luminance variation and improve the luminance.
JP 2003-8077 A Japanese Patent Laid-Open No. 2002-50800 JP 2005-277227 A

  By the way, although SMD parts which are surface mount type parts are required to be reduced in size and thickness, the conventional techniques described in the above-mentioned patent documents have the following problems.

  In other words, in the light-emitting device disclosed in the above document, the positive electrode pad and the negative electrode pad are formed on the surface of the substrate so as to face each other along the short side of the substrate. The LED chip (light emitting element) is arranged on the substrate so that the long side of the LED chip and the long side of the electrode pad are parallel to each other. Recently, in order to reduce the size and thickness of the light emitting device, the planar shape of the LED chip has been lengthened. That is, the LED chip has a hexahedral shape such as a rectangular parallelepiped, but the planar shape of the LED chip is an elongated rectangular shape.

  In the LED chip mounting method described in such a document, when a long LED chip is mounted, there is a problem that it is difficult to reduce the size of the light emitting device. This is because the positive electrode pad and the negative electrode pad are respectively formed along the opposing short sides of the substrate, and the substrate becomes larger by the area occupied by the electrode pad on the substrate. For this reason, it is difficult to reduce the size of the light emitting device.

  The present invention has been made to solve the above-described conventional problems, and an object thereof is to provide a small and thin light emitting device on which a long LED chip is mounted.

  A light emitting device according to the present invention is a light emitting device in which a long light emitting element is placed on a substrate having an electrode pad, and the light emitting element and the electrode are sealed with a sealing resin, the light emitting element Are arranged such that the longitudinal direction of the light emitting element is inclined with respect to the longitudinal direction of the substrate so that the side of the substrate forms a predetermined angle with the side of the substrate. The light emitting element is disposed in a space formed by inclining the longitudinal direction of the light emitting element with respect to the longitudinal direction of the substrate, thereby achieving the above object.

  In the light emitting device according to the present invention, it is preferable that a positive electrode pad and a negative electrode pad are arranged on the surface of the substrate as the electrode pads so as to face each other.

  According to the present invention, in the light emitting device, the substrate is a package substrate having a substantially rectangular shape in plan, the light emitting element is an LED chip having a substantially rectangular shape in plan, and the LED chip is a length of the package substrate. The LED chip should be arranged with the longitudinal direction of the LED chip inclined with respect to the longitudinal direction of the package substrate so that the angle formed by the direction along the side and the direction along the long side of the LED chip is smaller than 90 °. preferable.

  In the light emitting device according to the aspect of the invention, the LED chip is disposed at the center of the package substrate, the positive electrode pad is disposed at one corner of the package substrate, and the negative electrode pad is It is preferable that the package substrate is disposed at a corner portion opposite to the one corner portion.

  In the light-emitting device according to the present invention, it is preferable that the positive electrode pad and the negative electrode pad disposed at opposite corners on the surface of the substrate have a substantially triangular shape in a plane.

  According to the present invention, in the light emitting device, the substrate includes an element arrangement region in which the light emitting element is to be arranged, and an electrode arrangement region in which the positive electrode pad and the negative electrode pad are to be arranged. It is preferable that the surface is positioned lower than the surface of the element arrangement region, and the positive electrode pad and the negative electrode pad are arranged on the surface of the electrode arrangement region.

  In the light-emitting device according to the present invention, it is preferable that the surface of the element arrangement region has the same height as the surfaces of the positive electrode pad and the negative electrode pad located on the electrode pad arrangement region.

  In the light emitting device according to the aspect of the invention, it is preferable that the substrate is a package substrate having a substantially rectangular shape in a plane, and the electrode arrangement region is formed at corner corners facing the package substrate.

  According to the present invention, in the light emitting device, the substrate has an element arrangement region in which the light emitting element is to be arranged, and an electrode arrangement region in which the positive electrode pad and the negative electrode pad are to be arranged. It is located on both sides of the element arrangement region, and any one of the positive electrode pad and the negative electrode pad is arranged to extend from the electrode arrangement region onto the element arrangement region, and the light emitting element is It is preferable that the positive electrode pad or the negative electrode pad is arranged on a portion extending on the element arrangement region.

  According to the present invention, in the light emitting device, the substrate is provided on the back side thereof so as to penetrate through the substrate in the thickness direction, the external connection electrode formed so as to face the element arrangement region or the vicinity thereof. A conductive layer located below the element arrangement region or a region near the element arrangement region, and is one of the positive electrode pad and the negative electrode pad, and extends from the electrode arrangement region onto the element arrangement region The electrode pad is preferably connected to the external connection electrode through the conductive layer.

  In the light-emitting device according to the present invention, the substrate includes an external connection electrode formed on the back surface side thereof, and a conductive layer provided so as to penetrate the substrate in the thickness direction. It is preferable to be connected to the external connection electrode through the conductive layer.

  In the light-emitting device according to the present invention, it is preferable that the substrate is a package substrate having a substantially rectangular shape in a plane, and the electrode pads are arranged at corners of the package substrate.

  According to the present invention, in the light emitting device, the external connection electrode is preferably formed on the back surface of the package substrate along the short side of the package substrate.

  According to the present invention, in the above light emitting device, the planar shape of the elongated light emitting element is preferably a planar shape having a longitudinal direction in which a dimension in a predetermined direction is not equal to a dimension in a direction orthogonal to the predetermined direction. .

  In the light emitting device according to the present invention, the chip substrate constituting the LED chip is preferably an insulating substrate.

  In the light emitting device according to the present invention, the LED chip is preferably an LED chip that emits light in a color range from an ultraviolet color to an infrared color.

  According to the present invention, in the light emitting device, the LED chip is preferably a blue LED chip.

  In the light-emitting device according to the present invention, it is preferable that the sealing resin is obtained by adding a phosphor.

  According to the present invention, in the light emitting device, the sealing resin is preferably a transparent sealing resin.

  In the light emitting device according to the present invention, the package substrate is preferably an insulating substrate.

  In the light emitting device according to the present invention, the package substrate is preferably a ceramic substrate or a resin substrate.

  In the light-emitting device according to the present invention, the package substrate is preferably a glass epoxy substrate.

  The operation of the present invention will be described below.

  In the present invention, in a light-emitting device in which an elongated light-emitting element is placed on a substrate having an electrode pad, and the light-emitting element and the electrode are sealed with a sealing resin, the light-emitting element is arranged on its side. The longitudinal direction of the light-emitting element is inclined with respect to the longitudinal direction of the substrate so as to form a predetermined angle with the side of the substrate, and the electrode pad is disposed on the surface of the substrate with the longitudinal direction of the light-emitting element. Since it arrange | positions in the space formed by inclining with respect to the longitudinal direction of a board | substrate, the area | region of a board | substrate surface can be utilized effectively and a light emitting element and an electrode pad can be arrange | positioned. Thus, a small and thin light emitting device in which a long light emitting element is mounted on a small area substrate can be obtained.

  In the present invention, the positive electrode pads and the negative electrode pads arranged at the opposite corners of the surface of the substrate are substantially triangular, so that the corners of the small surface area substrate can be used without waste. Thus, the electrode pads can be arranged, and the substrate surface area can be utilized more effectively. In addition, by effectively using the arrangement space of the light emitting element and the electrode pad on the substrate in this way, by providing a margin for the arrangement on the substrate, the thickness of the sealing resin covering the periphery of the light emitting element can be reduced. When the encapsulating resin includes a phosphor that performs wavelength conversion, the angle dependency of the color temperature of the light emitting element can be reduced.

  In the present invention, the substrate has an element arrangement region in which the light emitting element is to be arranged, and an electrode arrangement region in which the positive electrode pad and the negative electrode pad are to be arranged, and the surface of the electrode arrangement region is Since the structure is lower than the surface of the element arrangement region, light from the light emitting element arranged in the element arrangement region can be prevented from being blocked by the electrode pad arranged in the electrode arrangement region. The taking-out efficiency can be improved. Further, when the sealing resin contains a phosphor, the amount of the phosphor is reduced by the space area occupied by the electrode pad by arranging the electrode pad in the electrode arrangement area lower than the element arrangement area in this way. Therefore, the light emitted from the LED chip excites the phosphor more effectively. Furthermore, by arranging the surface of the electrode arrangement region where the positive electrode pad and the negative electrode pad are to be arranged at a position lower than the surface of the element arrangement region, the height of the wire loop of the bonding wire can be reduced, Furthermore, a thin LED chip can be produced.

  In addition, the electrode pad functions as a reflective layer that reflects light from the light emitting element by making the height position of the surface of the element arrangement area substantially the same as the height position of the surface of the electrode pad arranged in the electrode arrangement area. As a result, the light from the light emitting element can be taken out more effectively.

  In the present invention, any one of the positive electrode pad and the negative electrode pad on the surface of the substrate extends to the lower side of the light emitting element (LED chip), so that the lower part of the light emitting element of the electrode pad Functions as a reflective layer, whereby light emitted from the light emitting element to the substrate side can be effectively extracted to the outside. Further, the heat radiation effect is also improved in the lower part of the light emitting element of the electrode pad.

  Further, in the present invention, the substrate is provided on the back side thereof so as to pass through the substrate in the thickness direction, the external connection electrode formed so as to face the element arrangement region or the vicinity thereof, An electrode extending from the electrode arrangement region onto the element arrangement region, wherein the electrode is any one of the positive electrode pad and the negative electrode pad. Since the pad is connected to the external connection electrode via the conductive layer, the heat generated in the light emitting element arranged on the element arrangement region is located below the element arrangement region or the vicinity thereof. It is transmitted to the external connection electrode on the back side of the substrate through the conductive layer, and the heat dissipation effect from the light emitting element to the outside of the substrate can be further enhanced.

  Furthermore, since the light emitting element (LED chip) has a long shape, it can be thinned while maintaining a constant light output.

  According to the present invention, in a light emitting device in which a long light emitting element is placed on a substrate having an electrode pad, and the light emitting element and the electrode are sealed with a sealing resin, the light emitting element is arranged on its side. Is arranged such that the longitudinal direction of the light-emitting element is inclined with respect to the longitudinal direction of the substrate so that the side of the substrate forms a predetermined angle, and the electrode pad is disposed on the substrate surface in the longitudinal direction of the light-emitting element. Is disposed in a space formed by tilting the substrate with respect to the longitudinal direction of the substrate, so that the light emitting element and the electrode pad can be disposed by effectively utilizing the region of the substrate surface. Accordingly, a long light emitting element (LED chip) can be mounted on the small surface area substrate, and a small and thin light emitting device in which the long light emitting element is mounted on the small area substrate can be obtained.

In addition, by effectively using the arrangement space of the light emitting element and the electrode pad on the substrate in this way, by providing a margin for the arrangement on the substrate, the thickness of the sealing resin covering the periphery of the light emitting element can be reduced. When the sealing resin contains a phosphor that performs wavelength conversion, the angle dependency of the color temperature of the light emitting element can be reduced.
In addition, any one of the positive electrode pad and the negative electrode pad on the substrate surface extends to the lower side of the light emitting element (LED chip), so that the lower part of the light emitting element of the electrode pad functions as a reflective layer. As a result, light emitted from the light emitting element to the substrate side can be effectively extracted to the outside. Further, the heat radiation effect is also improved in the lower part of the light emitting element of the electrode pad. Furthermore, the back surface of the substrate is formed through a conductive layer penetrating the substrate, wherein either one of the positive electrode pad and the negative electrode pad extending to the lower side of the element arrangement region is formed immediately below or in the vicinity of the element arrangement region. By connecting to the external connection electrode on the side, the heat radiation effect from the light emitting element to the outside of the substrate can be further enhanced.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(Embodiment 1)
FIG. 1 is a diagram for explaining a light emitting device according to Embodiment 1 of the present invention, FIG. 1 (a) is a top view showing the configuration of the main part thereof, and FIG. 1 (b) is a diagram of FIG. The structure of the AA line cross section is shown.

  The light emitting device 10 according to the first embodiment is formed by mounting an LED chip (light emitting element) 13 on a package substrate 12 and sealing the entire surface with a transparent sealing resin 17.

  Here, the LED chip 13 is a red LED chip having a main light emission peak in a red wavelength region having a wavelength of 650 nm, and its planar shape is a substantially rectangular shape. Further, as the package substrate 12, an AlN ceramic substrate having a high light reflectance with respect to visible light and a high thermal conductivity is used. The planar shape of the package substrate 12 is a substantially rectangular shape, and its thickness is set to 0.3 mm to 0.4 mm so as to facilitate cutting when the chip is cut into individual chips from the substrate member.

  In the light emitting device 10 of the first embodiment, the LED chip 13 has the longitudinal direction of the LED chip 13 in the longitudinal direction of the package substrate so that the side of the LED chip 13 forms a predetermined angle smaller than 90 ° with the side of the package substrate 12. It is arranged incline with respect to. Further, a positive electrode pad (hereinafter also simply referred to as an electrode pad) 14 and a negative electrode pad (hereinafter also simply referred to as an electrode pad) 15 are provided on the surface of the package substrate 12 so that the longitudinal direction of the LED chip 13 is the package substrate 12. Are arranged in spaces (electrode arrangement regions) 14c and 15c formed by being inclined with respect to the longitudinal direction.

  That is, the electrode pads 14 and 15 are arranged so as to oppose two opposing corners (electrode arrangement regions) 14c and 15c on the surface of the package substrate 12, respectively. The planar shape of these electrode pads 14 and 15 is a substantially triangular shape (for example, a substantially right-angled isosceles triangle shape), and the LED chip 13 includes a long side of the LED chip 13 and a long side of the electrode pads 14 and 15. Are arranged in parallel and opposite to each other. The electrodes (chip electrodes) 13 a and 13 b of the red LED chip 13 are connected to electrode pads 14 and 15 adjacent thereto by wires 16. The planar shape of the electrode pads 14 and 15 is not limited to such a substantially right-angled isosceles triangle shape, and may be another triangle shape.

  An external connection electrode 14b is formed on the back side of the package substrate 12, and the electrode pad 14 is electrically connected to the external connection electrode 14b by a conductive layer 14a provided so as to penetrate the package substrate 12 in the thickness direction. It is connected to the electrode 14b. An external connection electrode 15b is formed on the back side of the package substrate 12, and the electrode pad 15 is electrically connected to the external connection electrode 15b by a conductive layer 15a provided so as to penetrate the package substrate 12 in the thickness direction. , Connected to the electrode 15b.

  Here, GaP is used for the chip substrate constituting the LED chip 13, and an AlGaInP-based semiconductor layer is used for the semiconductor layer constituting the LED chip 13.

  The entire surface of the package substrate 12 is resin-sealed with a sealing resin 17 so as to cover the LED chip 13, the wires 16, and the electrode pads 14 and 15. A silicone-based sealing resin is used for the sealing resin 11. However, an epoxy-based sealing resin may be used for the sealing resin 17.

  The surface of the sealing resin 17 is parallel to the surface of the package substrate 12 and is a substantially flat surface. Here, the planar substantially rectangular LED chip 13 is mounted on the surface of the package substrate 12 such that each side thereof is not parallel to each side of the planar substantially rectangular package substrate 12.

  Such an arrangement of the LED chip 13 on the package substrate 12 is a suitable mounting method for mounting a long LED chip on a small surface area substrate. Here, the planar LED chip 13 having a substantially rectangular shape is The horizontal width is 0.24 mm and the vertical width is 0.5 mm.

  Furthermore, the side surface of the light emitting device 10 has a planar shape obtained by collectively cutting the sealing resin 17 and the package substrate 12 therebelow so as to be perpendicular to the surface of the package substrate 12. No. 10 has a rectangular parallelepiped shape with a small thickness and a large area in the in-plane direction. Specifically, in the light emitting device 10, for example, the thickness is 0.7 mm, the horizontal width is 1.0 mm, and the vertical width is 1.2 mm.

  Next, a method for manufacturing the light emitting device 1 of Embodiment 1 will be described in detail with reference to FIGS.

  FIG. 2 is a diagram illustrating a method of manufacturing the light emitting device 10 according to the first embodiment in the order of steps (FIGS. 2A to 2F).

  First, as shown in FIG. 2A, a substrate member 120 divided into a plurality of planar rectangular regions 12 is prepared, and LED chips 13 are die-bonded on each chip region 12 of the substrate member 120. .

  Here, the electrode pads 14 and 15 shown in FIG. 1 are arranged on the surface of the chip region 12 of the substrate member 120 so as to be positioned at the opposite corners 14 c and 15 c of the chip region 12. Further, external connection electrodes 14 b and 15 b are formed on the back side of the chip region 12. The electrode pad 14 and the external connection electrode 14b are connected via a conductive layer 14a penetrating the substrate member, and the electrode pad 15 and the external connection electrode 15b are connected via a conductive layer 15a penetrating the substrate member. Connected. Here, it is desirable that the through portion through which the conductive layer penetrates the substrate member is not a cavity. This is because if there are cavities, the air changes into moisture due to temperature changes and causes problems such as deterioration of the through-conductive layers 14a and 15a, and heat dissipation also deteriorates, reducing the reliability of the LED chip. Because it does.

  Further, the planar shape of the electrode pads 14 and 15 formed on the surface of each chip region 12 of the substrate member 120 is a substantially right-angled isosceles triangle shape as described above. These electrode pads 14 and 15 are connected to the corresponding anode-side and cathode-side external connection electrodes 14b and 15b through the through conductive layers 14a and 15a, respectively.

  In the region of the chip region 12 between the electrode pads 14 and 15, the LED chip 13 is die-bonded so that the long side thereof is parallel to the long side (oblique side) of the electrode pads 14 and 15. The upper electrodes (chip electrodes) 13 a and 13 b are connected to the electrode pads 14 and 15 by bonding wires 16.

  Next, as shown in FIG. 2B, the substrate member 120 on which the LED chip 13 is mounted in each chip region 12 is installed in a press machine (not shown) provided with a heating plate, and the periphery of the substrate member 120 A pair of spacer jigs 21 are arranged to face each other, and then a liquid silicone resin is poured into the surface of the substrate member 120 as the sealing resin layer 17a (FIG. 2C).

  Further, in order to ensure a constant resin thickness on the chip region, as shown in FIG. 2D, a flat upper mold 22 is pressed against the surface of the sealing resin layer 17a and pressed.

  Subsequently, as shown in FIG. 2 (e), after the sealing resin layer 17a is cured by heating, the sealing resin layer on which the substrate member 120 is formed as shown in FIG. 2 (f). Dicing with 17a forms individual light emitting devices 10 in the form of chips.

  As described above, in the light emitting device 10 of the first embodiment, the LED chip 13 is placed on the package substrate 12, and the longitudinal direction of the LED chip 13 is packaged so that the side of the LED chip 13 forms a predetermined angle with the side of the package substrate 12. A space formed by tilting the longitudinal direction of the substrate 12 and forming the electrode pads 14 and 15 by tilting the longitudinal direction of the LED chip 13 with respect to the longitudinal direction of the package substrate 12 on the surface of the package substrate. Since they are arranged at 14a and 15a, the longitudinal dimension of the package substrate 12 can be reduced while ensuring a certain distance between the electrode pads 14 and 15 and the LED chip 13.

  In addition, since a certain distance is secured between the electrode pads 14 and 15 and the LED chip 13, the height of the wire loop can be lowered, and a thin layer can be realized.

That is, when the distance between the bonding position on the LED chip 13 (1st bonding position) and the bonding position on the electrode pad (2nd bonding position) becomes short, the wire is prevented from being cut at the neck portion of the bonding wire. Therefore, it is necessary to increase the height of the wire loop. For this reason, the height of the sealing resin is increased and the entire thickness is increased. On the other hand, in the first embodiment, a certain distance can be secured between the 1st bonding position and the 2nd bonding position by inclining the longitudinal direction of the LED chip with respect to the longitudinal direction of the package substrate. Can reduce the height of the wire loop and enables a thin layer. As a result, a small and thin red light emitting device can be obtained. Furthermore, since the light emitting element (LED chip) has a long shape, it is possible to reduce the thickness while maintaining a constant light output.
(Embodiment 2)
FIG. 3 is a diagram for explaining a light emitting device according to Embodiment 2 of the present invention, FIG. 3 (a) is a top view showing the configuration of the main part, and FIG. 3 (b) is a diagram of FIG. 3 (a). The structure of the BB line cross section of is shown.

  The light emitting device 20 according to the second embodiment is formed by mounting an LED chip (light emitting element) 23 on a package substrate 12 and sealing the entire surface with a sealing resin 27. Here, the LED chip 23 is a blue LED chip having a main light emission peak in a blue wavelength region having a wavelength of 400 nm or more and 530 nm or less, and its planar shape is a substantially rectangular shape. The sealing resin 27 is obtained by adding a phosphor that converts the wavelength of light from the blue LED chip 23 to a silicon-based sealing resin, and other configurations are the same as those of the first embodiment.

  More specifically, in the second embodiment, an AlN ceramic substrate with high visible light reflectivity and high thermal conductivity is used as the package substrate 12 as in the first embodiment. The thickness is set to 0.3 mm to 0.4 mm. Further, on the surface of the package substrate 12, electrode pads 14 and 15 are formed at opposite corners 14c and 15c of the substantially rectangular package substrate 12, and the shape of the electrode pads 14 and 15 is as follows. Similar to the first embodiment, it has a substantially right-angled isosceles triangle shape.

  On the package substrate 12, the blue LED chip 23 is mounted so that the long side (oblique side) of the electrode pad and the long side of the LED chip 3 are substantially parallel. Adjacent electrode pads 14 and 15 and upper electrodes (chip electrodes) 23 a and 23 b of the blue LED chip 23 are connected by a bonding wire 16. Further, external connection electrodes 14b and 15b are formed on the back surface side of the package substrate 12, and the electrode pads 14 and 15 are respectively connected through conductive layers 14a and 15a provided so as to penetrate the package substrate 12 in the thickness direction. The external connection electrodes 14b and 15b are electrically connected to these electrodes.

Further, the entire surface of the package substrate 12 is sealed with resin so that the periphery of the LED chip 23 is covered with sealing resin. A phosphor that emits fluorescence by converting the wavelength of light from the blue LED chip 23 is added to the sealing resin 27. In the second embodiment, a yellow phosphor having high luminous efficiency such as BOSE (europium activated silicate phosphor, (Ba · Sr) ₂ SiO ₄ : Eu) is used as the phosphor. This yellow phosphor absorbs blue light emitted from the blue LED chip 23 and emits yellow fluorescence having an emission peak in a wavelength region of 550 nm to 600 nm.

  The surface of the sealing resin 27 is a substantially flat surface parallel to the surface of the package substrate 12 as in the light emitting device 10 of the first embodiment. Here, the planar substantially rectangular LED chip 23 is mounted on the surface of the package substrate 12 such that each side thereof is not parallel to each side of the substantially rectangular planar package substrate 12.

  Such an arrangement of the LED chip 23 on the package substrate 12 is a mounting method suitable for mounting a long LED chip on a small surface area substrate. Here, the planar LED chip 23 having a substantially rectangular shape is The horizontal width is 0.24 mm and the vertical width is 0.5 mm.

  Furthermore, the side surface of the light emitting device 20 has a planar shape obtained by cutting the sealing resin 27 and the package substrate 12 therebelow in a lump so as to be perpendicular to the surface of the package substrate 12. No. 20 has a rectangular parallelepiped shape with a small thickness and a large area in the in-plane direction. Specifically, in the light emitting device 20, for example, the thickness is 0.7 mm, the horizontal width is 1.0 mm, and the vertical width is 1.2 mm.

  The blue LED chip 23 is mounted on the package substrate 12 so that the long sides of the electrode pads 14 and 15 and the long side of the LED chip 23 are substantially parallel. For this reason, the optical path length (distance from the LED chip end face to the sealing resin end face) of the light emitted from the LED chip 23 can be made substantially equal around the LED chip 23, that is, on the side surface side and the upper surface side.

  Next, a method for manufacturing the light emitting device 2 of Embodiment 2 will be described in detail with reference to FIGS.

  FIG. 4 is a diagram illustrating a method of manufacturing the light emitting device 20 according to the second embodiment in the order of processes (FIGS. 4A to 4F).

  First, as shown in FIG. 4A, as in the first embodiment, a substrate member 120 divided into a plurality of planar regions having a substantially rectangular shape is prepared, and the substrate member 120 is provided on each chip region 12. The LED chip 23 is die-bonded.

  Here, the electrode pads 14 and 15 shown in FIG. 3 are arranged on the surface of the chip region 12 of the substrate member 120 so as to be positioned at the opposite corners 14 a and 15 a of the chip region 12. Further, external connection electrodes 14 b and 15 b are formed on the back side of the chip region 12. The electrode pads 14 and 15 are connected to the external connection electrodes 14b and 15b through conductive layers 14a and 15a penetrating the substrate member, respectively.

  In the region between the electrode pads 14 and 15 in the chip region 12, the LED chip 23 is die-bonded so that its long side is parallel to the long side (slanted side) of the electrode pads 14 and 15. The upper electrodes 23 a and 23 b are connected to the electrode pads 14 and 15 by wires 16.

  Next, as shown in FIG. 4B, the board member 120 on which the LED chip 23 is mounted in each chip area 12 is placed in a press machine (not shown) provided with a heating plate, and the periphery of the board member 120 A pair of spacer jigs 21 are arranged so as to surround each other, and a liquid silicone resin added with a phosphor is poured so that a sealing resin layer 27a is formed on the surface of the substrate member 120 (FIG. 4C). )).

  Further, in order to ensure a constant resin thickness on the chip region, as shown in FIG. 4D, a flat upper die 22 is pressed against the surface of the sealing resin layer 27a and pressed.

  Subsequently, as shown in FIG. 4E, after the sealing resin layer 27a is cured by heating, as shown in FIG. 4F, the sealing resin layer having the substrate member 120 formed thereon is formed. Dicing together with 27 a forms individual chip-like light emitting devices 20.

  Thus, in the second embodiment, as in the first embodiment, the blue LED chip 23 is placed on the package substrate 12, and the side of the LED chip 23 is formed at a predetermined angle with the side of the package substrate 12. The longitudinal direction is inclined with respect to the longitudinal direction of the package substrate 12, and the electrode pads 14 and 15 are inclined with respect to the longitudinal direction of the LED substrate 23 on the surface of the package substrate 12. Therefore, the longitudinal dimension of the package substrate 12 can be reduced while securing a certain distance between the electrode pads 14 and 15 and the LED chip 23. . For this reason, at the time of wire bonding, the distance between the 1st bonding position on the chip and the 2nd bonding position on the electrode pad can be secured to suppress the wire loop height, and the wire accompanying the size reduction in the longitudinal direction of the package substrate 12 It is possible to reduce the thickness by suppressing an increase in the loop height.

  In addition, electrode pads 14 and 15 are formed on the surface of the package substrate 12 at opposite corners thereof, and the blue LED chip 23 is substantially parallel to the long sides of these electrode pads and the long sides of the LED chip 23. Therefore, the thickness of the sealing resin around the blue LED chip 23 can be made more uniform, thereby reducing the angle dependency of the color temperature.

In the second embodiment, an AlN ceramic substrate is used as the package substrate 12. However, the package substrate may be an insulating substrate such as a glass epoxy substrate depending on required reliability and characteristics. Such a resin substrate may be used.
(Embodiment 3)
FIG. 5 is a diagram for explaining a light-emitting device according to Embodiment 3 of the present invention. FIG. 5 (a) is a top view showing the configuration of the main part, and FIG. 5 (b) is a diagram of FIG. The structure of the CC line cross section is shown.

  The light emitting device 30 according to the third embodiment is obtained by mounting an LED chip (light emitting element) 23 on a package substrate 32 and sealing the entire surface with a sealing resin 27.

  Here, the LED chip 23 is a blue LED chip having a main light emission peak in a blue wavelength region having a wavelength of 400 nm or more and 530 nm or less, as in the second embodiment, and its planar shape is a substantially rectangular shape. The stop resin 27 is obtained by adding a phosphor that converts the wavelength of light from the blue LED chip 23 to a silicon-based sealing resin.

  In the third embodiment, an AlN ceramic substrate having a high light reflectance for visible light and a high thermal conductivity is used as the package substrate 32. The thickness of the package substrate 32 is 0.3 mm to 0.4 mm. It is said.

  Further, on the surface of the package substrate 32, an element arrangement region 32a in which the LED chip (light emitting element) 23 is arranged, and an electrode arrangement region in which the positive electrode pad and the negative electrode pad are arranged (hereinafter also referred to as an electrode pad forming portion). 34a and 35a, and a step is provided between the element arrangement region 32a and the electrode arrangement regions 34a and 35a, and the surface of the electrode arrangement regions 34a and 35a is more than the surface of the element arrangement region 32a. Located in a low position. The electrode arrangement regions 34 a and 35 a have a substantially right-angled isosceles triangle shape formed at the opposite corners of the package substrate 32. Positive electrode pads 14 and negative electrode pads 15 are arranged on the surfaces of these electrode arrangement regions 34a and 35a, respectively. Here, the electrode pads 14 and 15 have a substantially triangular shape (for example, a right isosceles triangular shape). The blue LED chip 23 is mounted in the element arrangement region 32a so that the long sides of the electrode pads located in the electrode pad forming portions 34a and 35a are substantially parallel to the long sides of the LED chip 23. Further, the upper electrodes (chip electrodes) 23 a and 23 b of the blue LED chip 23 are connected to the electrode pads 14 and 15 adjacent thereto by wires 16. An external connection electrode 14b is formed on the back side of the package substrate 32, and the electrode pad 14 is connected to the external connection electrode 14b through a conductive layer 14a provided so as to penetrate the package substrate 32 in the thickness direction. ing. An external connection electrode 15b is formed on the back side of the package substrate 32, and the electrode pad 15 is connected to the external connection electrode 15b through a conductive layer 15a provided so as to penetrate the package substrate 32 in the thickness direction. ing.

Further, the entire surface of the package substrate 32 is resin-sealed so that the LED chip 32 is covered with a sealing resin 27. A phosphor that emits fluorescence by converting the wavelength of light from the blue LED chip 23 is added to the sealing resin 27. In Embodiment 3, a yellow phosphor having high luminous efficiency such as BOSE (europium activated silicate phosphor, (Ba · Sr) ₂ SiO ₄ : Eu) is used as the phosphor. This yellow phosphor absorbs blue light emitted from the blue LED chip 23 and emits yellow fluorescence having an emission peak in a wavelength region of 550 nm to 600 nm.

  Similar to the second embodiment, the surface of the sealing resin 27 is parallel to the surface of the package substrate 32 and is a substantially flat surface.

  Here, the planar substantially rectangular LED chip 23 is mounted on the surface of the package substrate 32 such that each side thereof is not parallel to each side of the substantially rectangular planar package substrate 32.

  Such an arrangement of the LED chip 23 on the package substrate 32 is a suitable mounting method for mounting a long LED chip on a small surface area substrate. Here, the planar LED chip 23 having a substantially rectangular shape is The horizontal width is 0.24 mm and the vertical width is 0.5 mm.

  Further, the side surface of the light emitting device 30 has a planar shape obtained by cutting the sealing resin 27 and the package substrate 12 therebelow in a lump so as to be perpendicular to the surface of the package substrate 12. 30 has a rectangular parallelepiped shape with a small thickness and a large area in the in-plane direction. Specifically, in the light emitting device 30, for example, the thickness is 0.7 mm, the horizontal width is 1.0 mm, and the vertical width is 1.2 mm.

  In the third embodiment having such a configuration, as in the second embodiment, the blue LED chip 23 is placed on the package substrate 32, and the LED chip is formed so that the side thereof forms a predetermined angle with the side of the package substrate 32. The space formed by tilting the longitudinal direction of the LED chip 23 with respect to the longitudinal direction of the package substrate 32 (the electrode pads 14 and 15 are disposed with the longitudinal direction of the package 23 inclined with respect to the longitudinal direction of the package substrate). Since it is arranged at the corner portions 34a and 35a, the longitudinal dimension of the package substrate 32 can be reduced while ensuring a certain distance between the electrode pads 14 and 15 and the LED chip 23. For this reason, at the time of wire bonding, the distance between the 1st bonding position on the LED chip 23 and the 2nd bonding position on the electrode pads 14 and 15 can be secured, and the height of the wire loop can be suppressed. It is possible to reduce the thickness by suppressing an increase in the height of the wire loop accompanying the size reduction.

  Further, since the blue LED chip 23 is mounted so that the long side of the electrode pad and the long side of the LED chip 23 are substantially parallel, the optical path length of light emitted from the side surface of the LED chip 23 (from the end face of the LED chip) The distance to the sealing resin end face) can be made substantially equal around the LED chip 23, that is, on the side surface side and the upper surface side.

In addition, the LED chip 23 is arranged in the element arrangement region in the center of the package substrate 32, and the electrode pads 14 and 15 are formed on both side portions (electrode arrangement regions) 34a and 35a lower than the element arrangement region. By arranging so that the height is the same as the height of the surface of the element arrangement region, when the light emitted from the LED chip 23 passes on the electrode pad, it is reflected by this electrode pad, The light extraction efficiency is improved. Further, in the light emitting device 30 of the third embodiment, there is no electrode pad in a direction perpendicular to the long side end face of the LED chip 23, and therefore, light emitted from the LED chip 23 is irradiated to the phosphor. The amount will increase, and the light from the light emitting element can be taken out more effectively.
(Embodiment 4)
FIG. 6 is a diagram for explaining a light emitting device according to Embodiment 4 of the present invention, FIG. 6 (a) is a top view showing the configuration of the main part, and FIG. 6 (b) is a diagram of FIG. 6 (a). The structure of the DD line | wire cross section is shown.

  As in the second embodiment, the light emitting device 40 according to the fourth embodiment has an LED chip (light emitting element) 23 mounted on the package substrate 12 and is entirely sealed with a sealing resin 27. The light emitting device 30 according to the fourth embodiment includes an electrode pad 44 that replaces the electrode pad 14 according to the second embodiment. The electrode pad 44 is made of silver and is formed from the corners of the rectangular package substrate 12. The LED chip 23 is arranged on a portion (extension portion) 44 b extending in the center of the electrode pad 44. In the fourth embodiment, as the light emitting element 40, an electrode pad 44 having a structure extending from the electrode arrangement region to the element arrangement region is shown instead of the electrode pad 14 of the first embodiment. The light emitting element 40 of the fourth embodiment may have a structure in which the other electrode pad 15 of the second embodiment extends from the electrode arrangement area onto the element arrangement area.

  Here, the LED chip 23 is a blue LED chip having a main light emission peak in a blue wavelength region having a wavelength of 400 nm or more and 530 nm or less, as in the second embodiment, and its planar shape is a substantially rectangular shape. The stop resin 27 is obtained by adding a phosphor that converts the wavelength of light from the blue LED chip 23 to a silicon-based sealing resin. The corners 44 a of the electrode pads 44 and the electrode pads 15 are arranged at the corners of the package substrate 12.

  Here, the thickness of the package substrate 12 is set to 0.3 mm to 0.4 mm. In addition, on the surface of the package substrate 12, an electrode pad 15 is formed at one corner of the planar substantially rectangular package substrate 12. The shape of the electrode pad 15 is substantially the same as in the second embodiment. It is a right-angled isosceles triangle. In addition, the electrode pad 44 is disposed in a region other than the electrode pad 15 on the surface of the package substrate 12, and the electrode pad 44 is composed of a corner portion 44a and an extending portion 44b having a substantially right-angled triangular shape. ing.

  Further, on such a package substrate 12, the blue LED chip 23 is provided with the long side (oblique side) of the electrode pad 15 and the long side (oblique side) of the corner 44 a of the electrode pad 44 and the long side of the LED chip 23. It is mounted so that and are almost parallel. Adjacent electrode pads 44 and 15 and upper electrodes (chip electrodes) 23 a and 23 b of the blue LED chip 23 are connected by a bonding wire 16. Further, external connection electrodes 14b and 15b are formed on the back surface side of the package substrate 12, and the electrode pads 44 and 15 are respectively interposed through conductive layers 14a and 15a provided so as to penetrate the package substrate 12 in the thickness direction. The external connection electrodes 14b and 15b are electrically connected to these electrodes.

The entire surface of the package substrate 12 is resin-sealed so as to cover the periphery of the LED chip 23. A phosphor that emits fluorescence by converting the wavelength of light from the blue LED chip 23 is added to the sealing resin 27. In the fourth embodiment, as in the second embodiment, a yellow phosphor having high luminous efficiency such as BOSE (europium activated silicate phosphor, (Ba · Sr) ₂ SiO ₄ : Eu) is used as the phosphor. Is used. This yellow phosphor absorbs blue light emitted from the blue LED chip 23 and emits yellow fluorescence having an emission peak in a wavelength region of 550 nm to 600 nm.

  Similar to the light emitting device 20 of the second embodiment, the surface of the sealing resin 27 is parallel to the surface of the package substrate 12 and is a substantially flat surface. Here, the planar substantially rectangular LED chip 23 is mounted on the surface of the package substrate 12 such that each side thereof is not parallel to each side of the substantially rectangular planar package substrate 12.

  Such an arrangement of the LED chip 23 on the package substrate 12 is a mounting method suitable for mounting a long LED chip on a small surface area substrate. Here, the planar LED chip 23 having a substantially rectangular shape is The horizontal width is 0.24 mm and the vertical width is 0.5 mm.

  Furthermore, the side surface of the light emitting device 40 has a planar shape obtained by cutting the sealing resin 27 and the package substrate 12 therebelow in a lump so as to be perpendicular to the surface of the package substrate 12. 40 has a rectangular parallelepiped shape with a small thickness and a large area in the in-plane direction. Specifically, in the light emitting device 40, for example, the thickness is 0.7 mm, the horizontal width is 1.0 mm, and the vertical width is 1.2 mm.

  In the fourth embodiment having such a configuration, as in the second embodiment, the blue LED chip 23 is placed on the package substrate 12, and the LED chip is formed so that the side thereof forms a predetermined angle with the side of the package substrate 12. The longitudinal direction of the LED chip 23 is inclined with respect to the longitudinal direction of the package substrate. The substantially triangular corners 44a of the electrode pads 44 and the substantially triangular electrode pad 15 are disposed. Since it is arranged in a space formed by being inclined with respect to the longitudinal direction, the longitudinal direction of the package substrate 12 is secured while ensuring a certain distance between the corners of the electrode pads 44 and 15 and the LED chip 23. Can be reduced in size. For this reason, at the time of wire bonding, the distance between the 1st bonding position on the LED chip 23 and the 2nd bonding position on the electrode pads 44 and 15 can be secured, and the height of the wire loop can be suppressed. It is possible to reduce the thickness by suppressing an increase in the height of the wire loop accompanying the size reduction.

  Further, since the blue LED chip 23 is mounted so that the corner 44a of the electrode pad 44 and the long side of the electrode pad 15 and the long side of the LED chip 23 are substantially parallel, the light emitted from the LED chip 23 The optical path length (distance from the LED chip end face to the sealing resin end face) can be made substantially equal.

  In the fourth embodiment, since the extending portion 44b of the electrode pad 44 made of silver is formed immediately below the LED chip 23, the light emitted from the LED chip 23 toward the substrate side of the electrode pad 44 made of silver Reflected by the extending portion 44b, the light extraction efficiency upward is improved. That is, since the extending portion 44b of the electrode pad 44 functions as a reflective layer, the luminance of the light emitting device 30 can be improved.

  In the fourth embodiment, the conductive layer 14a penetrating the package substrate 12 in the thickness direction is arranged below the corner 44a of the electrode pad 44 having a structure extending from the electrode arrangement region to the element arrangement region. The conductive layer 14a may be arranged directly under the element arrangement region or immediately below the region.

  Hereinafter, the light emitting element having such a configuration will be briefly described as a modification of the fourth embodiment.

  FIG. 7 is a view for explaining a light emitting device 40a according to a modification of the fourth embodiment of the present invention. FIG. 7 (a) is a top view showing the configuration of the main part, and FIG. The structure of the EE line cross section of 7 (a) is shown.

The light emitting element 40a according to the modified example of the fourth embodiment has, instead of the external connection electrode 14b in the light emitting element 40 of the fourth embodiment, a region facing the corner portion 44a of the electrode pad 44 on the back surface side of the substrate 12. The external connection electrode 14b1 extending to a region facing the extending portion 44b located on the element arrangement region is provided. Further, instead of the conductive layer 14a in the light emitting element 40 of the fourth embodiment, the substrate is directly below the element arrangement region. The extending portion 44b of the electrode pad 44 is connected to the external connection electrode 14b1 through the conductive layer 14a1. Here, the number of such conductive layers 14a1 is not limited to one, and a plurality of conductive layers 14a1 may be provided. The remaining configuration of the light emitting element of the modification of the fourth embodiment is the same as that of the light emitting element of the fourth embodiment.
In the light emitting element 40a according to the modification of the fourth embodiment having such a configuration, in addition to the configuration of the fourth embodiment, the substrate 12 is formed on the back side thereof so as to face the element arrangement region and the vicinity thereof. The external connection electrode 14b1 and the conductive layer 14a1 that is provided so as to penetrate the substrate in the thickness direction and are located on the lower side of the element arrangement region are provided. In addition to the effects of the fourth embodiment, the heat generated in the light emitting element arranged on the element arrangement region is electrically connected to the lower side of the element arrangement region. It is transmitted to the external connection electrode 14b1 on the back surface side of the substrate via the layer 14a1, and an effect of further enhancing the heat radiation effect from the light emitting element to the outside of the substrate can be obtained.

  As mentioned above, although this invention has been illustrated using preferable embodiment of this invention, this invention should not be limited and limited to this embodiment. It is understood that the scope of the present invention should be construed only by the claims. It is understood that those skilled in the art can implement an equivalent range from the description of specific preferred embodiments of the present invention based on the description of the present invention and common general technical knowledge. It is understood that the patent documents cited in the present specification should be incorporated by reference into the present specification in the same manner as the content itself is specifically described in the present specification.

  In the field of a light emitting device in which a light emitting element such as an LED is mounted on a package substrate and this is sealed with a resin, a long LED chip can be mounted on a package substrate with a small surface area. A light emitting device having a small size can be provided, and the light emitting device of the present invention can be used as a light source such as a lighting device or a backlight for a liquid crystal television.

FIG. 1 is a view for explaining a light emitting device 10 according to Embodiment 1 of the present invention, FIG. 1 (a) is a top view showing the configuration of the main part thereof, and FIG. 1 (b) is a diagram of FIG. ) Shows a cross-sectional structure taken along line AA. FIG. 2 is a diagram illustrating a method of manufacturing the light emitting device 10 according to the first embodiment in the order of steps (FIGS. 2A to 2F). 3A and 3B are diagrams for explaining the light emitting device 20 according to Embodiment 2 of the present invention. FIG. 3A is a top view showing the configuration of the main part, and FIG. ) Shows a cross-sectional structure taken along line BB. FIG. 4 is a diagram illustrating a method of manufacturing the light emitting device 20 according to the second embodiment in the order of processes (FIGS. 4A to 4F). 5A and 5B are diagrams for explaining a light emitting device 30 according to Embodiment 3 of the present invention. FIG. 5A is a top view showing the configuration of the main part, and FIG. ) Shows a cross-sectional structure taken along the line CC of FIG. FIG. 6 is a view for explaining a light emitting device 40 according to Embodiment 4 of the present invention, FIG. 6 (a) is a top view showing the configuration of the main part, and FIG. 6 (b) is FIG. The structure of the DD line | wire cross section of) is shown. FIG. 7 is a view for explaining a light emitting device 40a according to a modification of the fourth embodiment of the present invention. FIG. 7 (a) is a top view showing the configuration of the main part, and FIG. The structure of the EE line cross section of 7 (a) is shown. FIG. 8 is a diagram for explaining the structure of the SMD type LED disclosed in Patent Document 1. FIG. 8A is a cross-sectional view showing the structure of the vertical section of the SMD type LED, and FIG. It is a top view which shows the upper surface of this SMD type LED.

Explanation of symbols

10, 20, 30, 40, 40a Light emitting device 12, 32 Package substrate 13, 23 LED chip 13a, 13b, 23a, 23b Chip electrode 14, 14a1, 15, 44 Electrode pad 44a Electrode pad corner,
44b Electrode pad extending portion 14a, 15a Conductive layer 14b, 14b1, 15b External connection electrode 14c, 15c, 34a, 35a Electrode arrangement region (electrode pad forming portion)
17, 27 Sealing resin portion 17a, 27a Sealing resin material 32 Element placement region

Claims (22)

A light emitting device in which a long light emitting element is placed on a substrate having an electrode pad, and the light emitting element and the electrode are sealed with a sealing resin,
The light emitting element is disposed such that the longitudinal direction of the light emitting element is inclined with respect to the longitudinal direction of the substrate so that the side of the light emitting element forms a predetermined angle with the side of the substrate.
The electrode pad is a light emitting device arranged in a space formed by inclining the longitudinal direction of the light emitting element with respect to the longitudinal direction of the substrate on the surface of the substrate.   The light emitting device according to claim 1, wherein a positive electrode pad and a negative electrode pad are disposed on the surface of the substrate as the electrode pads so as to face each other. The substrate is a package substrate having a substantially rectangular shape in plan view,
The light emitting element is a LED chip having a substantially rectangular shape in plan view,
In the LED chip, the longitudinal direction of the LED chip is set to the longitudinal direction of the package substrate so that the angle formed between the direction along the long side of the package substrate and the direction along the long side of the LED chip is smaller than 90 °. The light-emitting device according to claim 2, wherein the light-emitting device is arranged to be inclined with respect to. The LED chip is disposed in the center of the package substrate,
The positive electrode pad is disposed at one corner of the package substrate,
The light-emitting device according to claim 3, wherein the negative electrode pad is disposed at a corner portion of the package substrate facing the one corner portion.   The light emitting device according to claim 2, wherein the positive electrode pad and the negative electrode pad arranged at opposite corners of the surface of the substrate have a substantially triangular shape in a plane. The substrate has an element arrangement area in which the light emitting element is to be arranged, and an electrode arrangement area in which the positive electrode pad and the negative electrode pad are to be arranged, and a surface of the electrode arrangement area is more than a surface of the element arrangement area Located in a low position,
The light emitting device according to claim 2, wherein the positive electrode pad and the negative electrode pad are arranged on a surface of the electrode arrangement region.   The light emitting device according to claim 6, wherein a surface height of the element arrangement region is the same as a surface of the positive electrode pad and the negative electrode pad located on the electrode pad arrangement region. The substrate is a package substrate having a substantially rectangular shape in plan view,
The light emitting device according to claim 7, wherein the electrode arrangement region is formed at opposite corners of the package substrate. The substrate has an element arrangement area in which the light emitting element is to be arranged, and an electrode arrangement area in which the positive electrode pad and the negative electrode pad are to be arranged, and the electrode arrangement area is located on both sides of the element arrangement area. And
Any one of the positive electrode pad and the negative electrode pad is arranged to extend from the electrode arrangement region onto the element arrangement region,
The light emitting device according to claim 2, wherein the light emitting element is arranged on a portion of the positive electrode pad or the negative electrode pad that extends on the element arrangement region. The substrate is provided on the back side thereof so that the external connection electrode formed so as to face the element arrangement region or the vicinity thereof, and to penetrate the substrate in the thickness direction, the element arrangement region or the vicinity thereof And a conductive layer located on the lower side,
The electrode pad that is one of the positive electrode pad and the negative electrode pad and extends from the electrode arrangement region onto the element arrangement region is connected to the external connection electrode through the conductive layer. The light emitting device according to 1.   The substrate has an external connection electrode formed on the back surface thereof and a conductive layer provided so as to penetrate the substrate in the thickness direction, and the electrode pad is connected to the external connection via the conductive layer. The light emitting device according to claim 1 connected to an electrode. The substrate is a package substrate having a substantially rectangular shape in plan view,
The light emitting device according to claim 11, wherein the electrode pads are arranged at corners of the package substrate.   The light emitting device according to claim 12, wherein the external connection electrode is formed on a back surface of the package substrate along a short side of the package substrate.   2. The light emitting device according to claim 1, wherein the planar shape of the elongated light emitting element is a planar shape having a longitudinal direction in which a dimension in a predetermined direction is not equal to a dimension in a direction orthogonal to the predetermined direction.   The light emitting device according to claim 3, wherein a chip substrate constituting the LED chip is an insulating substrate.   The light emitting device according to claim 3, wherein the LED chip is an LED chip that emits light in a color range from an ultraviolet color to an infrared color.   The light emitting device according to claim 3, wherein the LED chip is a blue LED chip.   The light emitting device according to claim 1, wherein the sealing resin is obtained by adding a phosphor.   The light emitting device according to claim 1, wherein the sealing resin is a transparent sealing resin.   The light emitting device according to claim 1, wherein the package substrate is an insulating substrate.   The light emitting device according to claim 20, wherein the package substrate is a ceramic substrate or a resin substrate.   The light emitting device according to claim 21, wherein the package substrate is a glass epoxy substrate.

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