JP2007201354A - Light-emitting module - Google Patents

Light-emitting module Download PDF

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JP2007201354A
JP2007201354A JP2006020856A JP2006020856A JP2007201354A JP 2007201354 A JP2007201354 A JP 2007201354A JP 2006020856 A JP2006020856 A JP 2006020856A JP 2006020856 A JP2006020856 A JP 2006020856A JP 2007201354 A JP2007201354 A JP 2007201354A
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light emitting
light
sealing layer
emitting module
resin
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Toshibumi Ogata
俊文 緒方
Noriyasu Tanimoto
憲保 谷本
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

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Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting module which prevents mechanical damage caused by an external force while ensuring electrical connection reliability of a light-emitting element, and also prevents cracking in a sealing layer. <P>SOLUTION: A light-emitting module (1) includes: a substrate (18) comprising a plurality of recesses (20); a plurality of light-emitting elements (8) mounted within each of the recesses (20); a first sealing layer (131) constituted of a first translucent resin covering the light-emitting elements (8) and filling the recesses (20); and a second sealing layer (132) constituted of a second translucent resin provided while covering the substrate (18) and the first sealing layer (131). A tensile strength of the first translucent resin is lower than that of the second translucent resin, and a through-hole (13b) communicating with the recesses (20) is formed on the second sealing layer (132). <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、複数の発光素子を含む発光モジュールに関する。   The present invention relates to a light emitting module including a plurality of light emitting elements.

発光ダイオード（Light Emitting Diode、以下「ＬＥＤ」と称する。）等の発光素子を含む発光モジュールは、照明装置用光源や表示装置用光源として利用されている。その一例として、特許文献１にカード型の発光モジュールが提案されている。   A light emitting module including a light emitting element such as a light emitting diode (hereinafter referred to as “LED”) is used as a light source for a lighting device or a light source for a display device. As an example, Patent Document 1 proposes a card-type light emitting module.

図２Ａは特許文献１に提案された発光モジュールの斜視図であり、図２Ｂは図２ＡのX-X線断面図である。図２Ａ，Ｂに示すように、発光モジュール１００は、基板１８と、基板１８上に設けられた複数の発光装置１２と、基板１８及び発光装置１２を覆って設けられた封止層１３とを含む。また、封止層１３には、それぞれの発光装置１２に対応する複数の凸レンズ１３ａが設けられている。   2A is a perspective view of the light emitting module proposed in Patent Document 1, and FIG. 2B is a cross-sectional view taken along line XX of FIG. 2A. 2A and 2B, the light emitting module 100 includes a substrate 18, a plurality of light emitting devices 12 provided on the substrate 18, and a sealing layer 13 provided so as to cover the substrate 18 and the light emitting devices 12. Including. The sealing layer 13 is provided with a plurality of convex lenses 13 a corresponding to the respective light emitting devices 12.

図２Ｂに示すように、基板１８は、基材１０と、基材１０上に接着層１４を介して接着された反射板１１とを含む。また、基材１０は、金属板材４と、金属板材４上に形成された電気絶縁層５と、電気絶縁層５上に形成された導体パターン６とからなる。なお、導体パターン６の端部には、外部接続端子６ａ（図２Ａ参照）が設けられている。   As shown in FIG. 2B, the substrate 18 includes a base material 10 and a reflecting plate 11 bonded on the base material 10 via an adhesive layer 14. The substrate 10 includes a metal plate material 4, an electrical insulating layer 5 formed on the metal plate material 4, and a conductor pattern 6 formed on the electrical insulating layer 5. An external connection terminal 6a (see FIG. 2A) is provided at the end of the conductor pattern 6.

反射板１１には、それぞれの発光装置１２を収容するための貫通孔１１ａが複数設けられている。そして、発光装置１２は、電気絶縁層５の主面の一部と貫通孔１１ａとからなる凹部２０のそれぞれに１つずつ収容されている。   The reflector 11 is provided with a plurality of through holes 11 a for accommodating the respective light emitting devices 12. One light emitting device 12 is accommodated in each of the recesses 20 formed of a part of the main surface of the electrical insulating layer 5 and the through hole 11a.

発光装置１２は、導体パターン６上にダイボンディングされたサブマウント基板７と、サブマウント基板７上にバンプ１５を介してフリップチップ実装されたＬＥＤチップ８と、ＬＥＤチップ８を覆ってサブマウント基板７上に形成された蛍光体層９とを含む。また、サブマウント基板７上に形成された電極７ａは、ワイヤ１６を介して導体パターン６と電気的に接続されている。
特開２００３−１２４５２８号公報 The light emitting device 12 includes a submount substrate 7 die-bonded on the conductor pattern 6, an LED chip 8 flip-chip mounted on the submount substrate 7 via bumps 15, and a submount substrate covering the LED chip 8. 7 and a phosphor layer 9 formed on the substrate 7. The electrode 7 a formed on the submount substrate 7 is electrically connected to the conductor pattern 6 through the wire 16.
JP 2003-124528 A

上述した発光モジュール１００の構成において、外力による機械的損傷を防止するためには、封止層１３の構成材料としてエポキシ樹脂等の高弾性樹脂を用いる必要がある。一方、ワイヤ１６へ加わる応力を緩和して発光装置１２の電気接続信頼性を確保するためには、封止層１３の構成材料としてシリコーン樹脂等の低弾性樹脂を用いる必要がある。そのため、上述した発光モジュール１００の構成では、外力による機械的損傷の防止と、発光装置１２の電気接続信頼性の確保とを両立させることが困難であった。   In the configuration of the light emitting module 100 described above, in order to prevent mechanical damage due to external force, it is necessary to use a highly elastic resin such as an epoxy resin as a constituent material of the sealing layer 13. On the other hand, in order to relieve the stress applied to the wire 16 and ensure the electrical connection reliability of the light emitting device 12, it is necessary to use a low elastic resin such as a silicone resin as a constituent material of the sealing layer 13. Therefore, in the configuration of the light emitting module 100 described above, it is difficult to achieve both prevention of mechanical damage due to external force and securing of the electrical connection reliability of the light emitting device 12.

上述した課題を解決するために、図３に示すように、発光装置１２を覆うようにして低弾性樹脂からなる第１封止層２０１を設け、この第１封止層２０１上に高弾性樹脂からなる第２封止層２０２を設けた構成とすることも考えられる。しかし、この場合、第１封止層２０１が、基板１８及び第２封止層２０２で密閉されてしまうため、第１封止層２０１に熱応力が蓄積され易くなる。その結果、発光モジュールの製造工程において、第１封止層２０１と第２封止層２０２との間の接着層（図示せず）を熱硬化させた後、常温に戻す際に、低弾性樹脂からなる第１封止層２０１の膨張・収縮の応力によって、蛍光体層９の角部９ａを起点として第１封止層２０１にクラックが発生するおそれがある。特に、第１封止層２０１を構成する材料と反射板１１を構成する材料との間において、熱膨張係数の差が大きい場合に上記問題が顕著に発生する。   In order to solve the above-described problem, as shown in FIG. 3, a first sealing layer 201 made of a low elastic resin is provided so as to cover the light emitting device 12, and a high elastic resin is formed on the first sealing layer 201. A configuration in which the second sealing layer 202 made of is provided is also conceivable. However, in this case, since the first sealing layer 201 is sealed with the substrate 18 and the second sealing layer 202, thermal stress is easily accumulated in the first sealing layer 201. As a result, in the manufacturing process of the light emitting module, the adhesive layer (not shown) between the first sealing layer 201 and the second sealing layer 202 is thermally cured, and then returned to room temperature. Due to the expansion / contraction stress of the first sealing layer 201 made of the above, cracks may occur in the first sealing layer 201 starting from the corners 9a of the phosphor layer 9. In particular, when the difference in thermal expansion coefficient between the material forming the first sealing layer 201 and the material forming the reflector 11 is large, the above problem occurs remarkably.

本発明は、上記従来の課題を解決するもので、外力による機械的損傷の防止と、発光素子の電気接続信頼性の確保とを両立させることができる上、封止層におけるクラック発生を防止できる発光モジュールを提供する。   The present invention solves the above-described conventional problems, and can both prevent mechanical damage due to external force and ensure electrical connection reliability of the light-emitting element, and can also prevent cracks in the sealing layer. A light emitting module is provided.

本発明の発光モジュールは、複数の凹部を有する基板と、それぞれの前記凹部内に実装された複数の発光素子とを含む発光モジュールであって、
前記発光素子を覆い、かつ前記凹部内に充填された第１透光性樹脂からなる第１封止層と、前記基板及び前記第１封止層を覆って設けられた第２透光性樹脂からなる第２封止層とを含み、
前記第１透光性樹脂の引張強度が、前記第２透光性樹脂の引張強度より低く、
前記第２封止層には、前記凹部と連通する貫通孔が形成されていることを特徴とする。 The light emitting module of the present invention is a light emitting module including a substrate having a plurality of recesses and a plurality of light emitting elements mounted in each of the recesses,
A first sealing layer made of a first light-transmitting resin that covers the light-emitting element and is filled in the recess, and a second light-transmitting resin that is provided to cover the substrate and the first sealing layer A second sealing layer consisting of
The tensile strength of the first translucent resin is lower than the tensile strength of the second translucent resin,
The second sealing layer is formed with a through hole communicating with the recess.

本発明の発光モジュールによれば、外力による機械的損傷の防止と、発光素子の電気接続信頼性の確保とを両立させることができる上、封止層におけるクラック発生を防止できる。   According to the light emitting module of the present invention, it is possible to achieve both the prevention of mechanical damage due to an external force and the securing of the electrical connection reliability of the light emitting element, and the generation of cracks in the sealing layer can be prevented.

本発明の発光モジュールは、複数の凹部を有する基板と、それぞれの前記凹部内に実装された複数の発光素子とを含む。   The light emitting module of the present invention includes a substrate having a plurality of recesses and a plurality of light emitting elements mounted in each of the recesses.

上記基板を構成する基材は特に限定されず、例えば、Ａｌ2Ｏ3、ＡｌＮ等からなるセラミック基材や、無機フィラと熱硬化性樹脂とを含むコンポジット基材等を使用できる。また、基板の放熱性を高めるために、アルミニウム等からなる金属板材上に上記コンポジット基材を貼り合せた積層基材を使用することもできる。また、本発明に使用される基板は、上記列挙した基材と、この基材上に貼り合わされた反射板とを含む基板であってもよい。この場合、基材と反射板とを貼り合わす前に、予め反射板に発光素子を収容することができる貫通孔を設けておくのが好ましい。基材と反射板とを貼り合わすことにより、上記凹部を形成することができるからである。上記反射板の構成材料としては、例えば、アルミニウム等の金属材料や、ポリフタルアミド樹脂等の樹脂材料が使用できる。上記基材と上記反射板とを含む基板を使用する場合、上記基材の厚みは、例えば０．５〜３ｍｍ程度であり、上記反射板の厚みは、例えば０．５〜５ｍｍ程度である。 Base material constituting the above substrate is not particularly limited, for example, or a ceramic substrate made of Al 2 O 3, AlN or the like, a composite substrate or the like containing an inorganic filler and a thermosetting resin can be used. Moreover, in order to improve the heat dissipation of a board | substrate, the laminated base material which bonded the said composite base material on the metal plate material which consists of aluminum etc. can also be used. Moreover, the board | substrate containing the base material enumerated above and the reflecting plate bonded together on this base material may be sufficient as the board | substrate used for this invention. In this case, it is preferable to provide a through hole that can accommodate the light emitting element in the reflection plate in advance before the base material and the reflection plate are bonded together. It is because the said recessed part can be formed by bonding a base material and a reflecting plate. As a constituent material of the reflection plate, for example, a metal material such as aluminum or a resin material such as polyphthalamide resin can be used. When using the board | substrate containing the said base material and the said reflecting plate, the thickness of the said base material is about 0.5-3 mm, for example, and the thickness of the said reflecting plate is about 0.5-5 mm, for example.

上記発光素子としては、例えば、波長が４１０ｎｍ以下の近紫外から紫外光を発する紫外ＬＥＤや、波長が４５０〜４９０ｎｍの青色光を発する青色ＬＥＤや、波長が５００〜５５０ｎｍの緑色光を発する緑色ＬＥＤや、波長が５９０〜６５０ｎｍの赤色光を発する赤色ＬＥＤ等を使用することができる。上記紫外ＬＥＤや上記青色ＬＥＤや上記緑色ＬＥＤとしては、例えばＩｎＧａＡｌＮ系材料を用いたＬＥＤが使用できる。また、上記赤色ＬＥＤとしては、例えばＡｌＩｎＧａＰ系材料を用いたＬＥＤが使用できる。   Examples of the light emitting element include an ultraviolet LED that emits ultraviolet light from near ultraviolet having a wavelength of 410 nm or less, a blue LED that emits blue light having a wavelength of 450 to 490 nm, and a green LED that emits green light having a wavelength of 500 to 550 nm. Alternatively, a red LED that emits red light having a wavelength of 590 to 650 nm can be used. As the ultraviolet LED, the blue LED, or the green LED, for example, an LED using an InGaAlN-based material can be used. Further, as the red LED, for example, an LED using an AlInGaP-based material can be used.

本発明の発光モジュールは、上記構成に加え、上記発光素子を覆い、かつ上記凹部内に充填された第１透光性樹脂からなる第１封止層と、上記基板及び上記第１封止層を覆って設けられた第２透光性樹脂からなる第２封止層とを含む。そして、上記第１透光性樹脂の引張強度が、上記第２透光性樹脂の引張強度より低い。本発明の発光モジュールでは、発光素子を覆う第１封止層が、より引張強度の低い第１透光性樹脂からなるため、発光素子と基板との間の電気接続部に加わる応力を緩和することができる。よって、発光素子の電気接続信頼性の確保が可能となる。また、基板及び第１封止層が、より引張強度の高い第２透光性樹脂からなる第２封止層で覆われているため，外力による機械的損傷を防止できる。なお、本明細書における引張強度は、ＪＩＳ Ｋ７１６１〜７１６５に準拠する方法で測定できる。   In addition to the above-described structure, the light-emitting module of the present invention includes a first sealing layer made of a first translucent resin that covers the light-emitting element and is filled in the recess, the substrate, and the first sealing layer. And a second sealing layer made of a second translucent resin provided so as to cover the surface. And the tensile strength of the said 1st translucent resin is lower than the tensile strength of the said 2nd translucent resin. In the light emitting module of the present invention, the first sealing layer that covers the light emitting element is made of the first light-transmitting resin having a lower tensile strength, so that the stress applied to the electrical connection portion between the light emitting element and the substrate is relieved. be able to. Therefore, it is possible to ensure the reliability of electrical connection of the light emitting element. Moreover, since the board | substrate and the 1st sealing layer are covered with the 2nd sealing layer which consists of 2nd translucent resin with higher tensile strength, the mechanical damage by external force can be prevented. In addition, the tensile strength in this specification can be measured by the method based on JISK7161-7165.

また、上記第２封止層には、上記凹部と連通する貫通孔が形成されている。これにより、本発明の発光モジュールの製造工程、あるいは本発明の発光モジュールを繰り返し使用した場合に、第１封止層が膨張しても、第１封止層を構成する第１透光性樹脂の一部が上記貫通孔に流れ込むため、第１封止層に熱応力が蓄積され難くなる。よって、第１封止層におけるクラック発生を防止することができる。上記効果を確実に発揮させるには、上記凹部の総容積をＶ（ｍｍ3）とし、上記貫通孔の開口の総面積をＳ（ｍｍ2）としたときに、Ｓ／Ｖの値が０．０２５〜０．３となるように設計することが好ましい。上記貫通孔は、パンチングやレーザー加工によって形成してもよいし、上記貫通孔を模った金型を用いて第２封止層の外形加工と同時に形成してもよい。なお、上記第２封止層は、上記発光素子から発せられる光を集光するためのレンズとしての機能を有していてもよい。 The second sealing layer is formed with a through hole communicating with the recess. Thereby, when the light emitting module of the present invention is manufactured or the light emitting module of the present invention is repeatedly used, even if the first sealing layer expands, the first translucent resin constituting the first sealing layer Since a part of flows into the through hole, thermal stress is hardly accumulated in the first sealing layer. Therefore, crack generation in the first sealing layer can be prevented. In order to exert the above-mentioned effect reliably, when the total volume of the recesses is V (mm 3 ) and the total area of the through holes is S (mm 2 ), the value of S / V is 0. It is preferable to design so that it may become 025-0.3. The through hole may be formed by punching or laser processing, or may be formed at the same time as the outer shape processing of the second sealing layer by using a mold simulating the through hole. Note that the second sealing layer may have a function as a lens for condensing light emitted from the light emitting element.

上記発光素子は、上記基板上に直接実装されていてもよいし、サブマウント基板を介して上記基板上に実装されていてもよい。上記発光素子の実装方式についても特に限定されず、例えばワイヤボンディング実装であってもよいし、フリップチップ実装であってもよい。   The light emitting element may be directly mounted on the substrate, or may be mounted on the substrate via a submount substrate. The mounting method of the light emitting element is not particularly limited, and may be, for example, wire bonding mounting or flip chip mounting.

本発明の発光モジュールは、上記発光素子と上記第１封止層との間に介在する蛍光体層を更に含んでいてもよい。本発明の発光モジュールを白色光源として使用することができるからである。上記蛍光体層の形成方法は特に限定されないが、例えば、上記発光素子から発せられた光を吸収し蛍光を発する蛍光体をシリコーン樹脂等に分散させて蛍光体ペーストを形成し、それぞれの上記発光素子上に上記蛍光体ペーストを塗布して上記蛍光体層を形成すればよい。上記蛍光体としては、例えば、アルミン酸塩系ＢａＭｇＡｌ10Ｏ17：Ｅｕ2+、シリケート系Ｂａ3ＭｇＳｉ2Ｏ8：Ｅｕ2+等の青色光を発する蛍光体や、ガーネット構造系Ｙ3（Ａｌ，Ｇａ）5Ｏ12:Ｃｅ3+、シリケート系（Ｂａ，Ｓｒ）2ＳｉＯ4:Ｅｕ2+等の緑色光を発する蛍光体や、サイアロン系Ｃａ-Ａｌ-Ｓｉ-Ｏ-Ｎ:Ｅｕ2+、シリケート系（Ｓｒ，Ｃａ）2ＳｉＯ4:Ｅｕ2+、ガーネット構造系（Ｙ，Ｇｄ）3Ａｌ5Ｏ12:Ｃｅ3+等の黄色光を発する蛍光体や、ニトリドシリケート系Ｓｒ2Ｓｉ5Ｎ8:Ｅｕ2+、ニトリドアルミノシリケート系ＣａＡｌＳｉＮ3:Ｅｕ2+、オクソニトリドアルミノシリケート系Ｓｒ2Ｓｉ4ＡｌＯＮ7:Ｅｕ2+、硫化物系ＣａＳ:Ｅｕ2+等の赤色光を発する蛍光体等が使用できる。 The light emitting module of the present invention may further include a phosphor layer interposed between the light emitting element and the first sealing layer. This is because the light emitting module of the present invention can be used as a white light source. The method for forming the phosphor layer is not particularly limited. For example, a phosphor paste that absorbs light emitted from the light emitting element and emits fluorescence is dispersed in a silicone resin to form a phosphor paste. The phosphor layer may be formed by applying the phosphor paste on the element. Examples of the phosphor include phosphors emitting blue light such as aluminate BaMgAl 10 O 17 : Eu 2+ , silicate Ba 3 MgSi 2 O 8 : Eu 2+ , and garnet structure Y 3 (Al , Ga) 5 O 12 : Ce 3+ , silicate-based (Ba, Sr) 2 SiO 4 : Eu 2+ and other phosphors emitting green light, and sialon-based Ca—Al—Si—O—N: Eu 2+ , Phosphors emitting yellow light, such as silicate (Sr, Ca) 2 SiO 4 : Eu 2+ , garnet structure (Y, Gd) 3 Al 5 O 12 : Ce 3+ , and nitridosilicate Sr 2 Si 5 N 8 : Eu 2+ , nitridoaluminosilicate CaAlSiN 3 : Eu 2+ , oxonitridoaluminosilicate Sr 2 Si 4 AlON 7 : Eu 2+ , sulfide CaS: Eu 2+ A phosphor that emits light can be used.

本発明の発光モジュールが上記蛍光体層を含む場合は、上記蛍光体層の角部が円弧状に形成されていることが好ましい。クラック発生の起点を低減できるため、クラック発生をより効果的に防止できるからである。この場合、上記蛍光体層の角部の曲率半径は、例えば２０〜５０μｍ程度であればよい。また、上記蛍光体層が、半球状に形成されていても上述と同様の効果を発揮させることができる。なお、上記蛍光体層の角部を円弧状に形成する場合や、上記蛍光体層を半球状に形成する場合は、上記蛍光体層を構成する蛍光体ペーストを、例えばインクジェット印刷法やポッティング法により塗布すればよい。   When the light emitting module of the present invention includes the phosphor layer, it is preferable that corners of the phosphor layer are formed in an arc shape. This is because the starting point of crack generation can be reduced, and crack generation can be prevented more effectively. In this case, the radius of curvature of the corner of the phosphor layer may be about 20 to 50 μm, for example. Moreover, even if the phosphor layer is formed in a hemispherical shape, the same effect as described above can be exhibited. In addition, when forming the corner | angular part of the said fluorescent substance layer in circular arc shape, or when forming the said fluorescent substance layer in a hemispherical shape, the fluorescent substance paste which comprises the said fluorescent substance layer is used for the inkjet printing method or the potting method, for example May be applied.

上記第１透光性樹脂は、引張強度が０．５ＭＰａ以下であることが好ましい。発光素子の電気接続信頼性の確保がより容易となるからである。このような樹脂として、例えばシリコーン樹脂、フッ素樹脂等が例示できる。これらの樹脂は、耐熱性や耐光性が高いため、第１封止層の劣化を防止できる。   The first translucent resin preferably has a tensile strength of 0.5 MPa or less. This is because it is easier to ensure the reliability of electrical connection of the light emitting element. Examples of such a resin include a silicone resin and a fluororesin. Since these resins have high heat resistance and light resistance, deterioration of the first sealing layer can be prevented.

上記第２透光性樹脂は、引張強度が１〜５００ＭＰａであることが好ましい。外力による機械的損傷をより確実に防止できるからである。このような樹脂として、例えばエポキシ樹脂、ポリオレフィン樹脂、ポリカーボネート樹脂等が例示できる。これらの樹脂は、光透過性が高いため、光取り出し効率を向上させることができる。   The second translucent resin preferably has a tensile strength of 1 to 500 MPa. This is because mechanical damage due to external force can be prevented more reliably. Examples of such a resin include an epoxy resin, a polyolefin resin, and a polycarbonate resin. Since these resins have high light transmittance, the light extraction efficiency can be improved.

以下、本発明の一実施形態について図面を参照しながら説明する。参照する図１Ａは、本発明の一実施形態に係る発光モジュールの斜視図であり、参照する図１Ｂは、図１ＡのI-I線断面図である。なお、図１Ａ，Ｂにおいては、上述の背景技術で説明した発光モジュール１００（図２Ａ，Ｂ参照）と実質的に同一の機能を有する構成要素を同一の符号で示し、重複する説明を省略する場合がある。   Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1A to be referred to is a perspective view of a light emitting module according to an embodiment of the present invention, and FIG. 1B to be referred to is a cross-sectional view taken along the line II of FIG. 1A. 1A and 1B, components having substantially the same functions as those of the light emitting module 100 (see FIGS. 2A and 2B) described in the background art are denoted by the same reference numerals, and redundant description is omitted. There is a case.

図１Ａ，Ｂに示すように、発光モジュール１は、背景技術で説明した発光モジュール１００（図２Ａ，Ｂ参照）に対し、封止層１３のみが異なる。発光モジュール１の封止層１３は、発光装置１２を覆い、かつ凹部２０内に充填された第１透光性樹脂からなる第１封止層１３１と、基板１８及び第１封止層１３１を覆って設けられた第２透光性樹脂からなる第２封止層１３２とを含む。そして、第１封止層１３１を構成する第１透光性樹脂の引張強度が、第２封止層１３２を構成する第２透光性樹脂の引張強度より低い。このように、発光モジュール１では、発光装置１２を覆う第１封止層１３１が、より引張強度の低い第１透光性樹脂からなるため、発光装置１２と基板１８との間の電気接続部に加わる応力を緩和することができる。よって、発光装置１２の電気接続信頼性の確保が可能となる。また、基板１８及び第１封止層１３１が、より引張強度の高い第２透光性樹脂からなる第２封止層１３２で覆われているため，外力による機械的損傷を防止できる。   As shown in FIGS. 1A and B, the light emitting module 1 is different from the light emitting module 100 described in the background art (see FIGS. 2A and B) only in the sealing layer 13. The sealing layer 13 of the light emitting module 1 includes a first sealing layer 131 made of a first light-transmitting resin that covers the light emitting device 12 and is filled in the recess 20, and the substrate 18 and the first sealing layer 131. And a second sealing layer 132 made of a second translucent resin provided so as to cover it. The tensile strength of the first translucent resin that constitutes the first sealing layer 131 is lower than the tensile strength of the second translucent resin that constitutes the second sealing layer 132. As described above, in the light emitting module 1, the first sealing layer 131 covering the light emitting device 12 is made of the first translucent resin having a lower tensile strength, and thus the electrical connection portion between the light emitting device 12 and the substrate 18. The stress applied to can be relaxed. Therefore, it is possible to ensure the reliability of electrical connection of the light emitting device 12. Moreover, since the board | substrate 18 and the 1st sealing layer 131 are covered with the 2nd sealing layer 132 which consists of 2nd translucent resin with higher tensile strength, the mechanical damage by external force can be prevented.

また、第２封止層１３２には、凹部２０と連通する貫通孔１３ｂが形成されている。これにより、発光モジュール１の製造工程、あるいは発光モジュール１を繰り返し使用した場合に、第１封止層１３１が膨張しても、第１封止層１３１を構成する第１透光性樹脂の一部１３１ａ（図１Ｂ参照）が貫通孔１３ｂに流れ込むため、第１封止層１３１に熱応力が蓄積され難くなる。よって、第１封止層１３１におけるクラック発生を防止することができる。上記効果を確実に発揮させるには、凹部２０の総容積をＶ（ｍｍ3）とし、貫通孔１３ｂの開口１３ｃ（図１Ｂ参照）の総面積をＳ（ｍｍ2）としたときに、Ｓ／Ｖの値が０．０２５〜０．３となるように設計することが好ましい。 The second sealing layer 132 is formed with a through hole 13 b that communicates with the recess 20. As a result, even if the first sealing layer 131 expands when the light emitting module 1 is manufactured or the light emitting module 1 is used repeatedly, the first light-transmitting resin constituting the first sealing layer 131 can be Since the portion 131a (see FIG. 1B) flows into the through hole 13b, thermal stress is unlikely to be accumulated in the first sealing layer 131. Therefore, generation of cracks in the first sealing layer 131 can be prevented. In order to exert the above-described effect reliably, when the total volume of the recess 20 is V (mm 3 ) and the total area of the opening 13c (see FIG. 1B) of the through hole 13b is S (mm 2 ), S / It is preferable to design so that the value of V is 0.025 to 0.3.

発光モジュール１においては、蛍光体層９の角部９ａ（図１Ｂ参照）が円弧状に形成されていることが好ましい。クラック発生の起点を低減できるため、クラック発生をより効果的に防止できるからである。また、蛍光体層９が、半球状に形成されていても上述と同様の効果を発揮させることができる。   In the light emitting module 1, it is preferable that the corner | angular part 9a (refer FIG. 1B) of the fluorescent substance layer 9 is formed in circular arc shape. This is because the starting point of crack generation can be reduced, and crack generation can be prevented more effectively. Moreover, even if the phosphor layer 9 is formed in a hemispherical shape, the same effects as described above can be exhibited.

以上、本発明の一実施形態に係る発光モジュールについて説明したが、本発明は上記実施形態には限定されない。例えば、上記実施形態では、基材と反射板とを貼り合せた基板を用いたが、基材と反射板とが同一の材料から一体的に形成された基板を用いてもよい。   The light emitting module according to one embodiment of the present invention has been described above, but the present invention is not limited to the above embodiment. For example, in the said embodiment, although the board | substrate which bonded the base material and the reflecting plate was used, you may use the board | substrate with which the base material and the reflecting plate were integrally formed from the same material.

本発明の発光モジュールは、例えば、一般照明、演出照明（サイン灯等）、バックライト、ヘッドランプ、イルミネーションランプ、ディスプレイ等に有用である。   The light emitting module of the present invention is useful for, for example, general illumination, effect illumination (sign lamp, etc.), backlight, head lamp, illumination lamp, display, and the like.

Ａは本発明の一実施形態に係る発光モジュールの斜視図であり、ＢはＡのI-I線断面図である。1A is a perspective view of a light emitting module according to an embodiment of the present invention, and B is a cross-sectional view taken along line II of A. FIG. Ａは従来の発光モジュールの斜視図であり、ＢはＡのX-X線断面図である。A is a perspective view of a conventional light emitting module, and B is a cross-sectional view taken along line XX of A. FIG. 図２の発光モジュールの変形例を示す断面図である。It is sectional drawing which shows the modification of the light emitting module of FIG.

符号の説明Explanation of symbols

１ 発光モジュール
４ 金属板材
５ 電気絶縁層
６ 導体パターン
６ａ 外部接続端子
７ サブマウント基板
７ａ 電極
８ ＬＥＤチップ（発光素子）
９ 蛍光体層
９ａ 角部
１０ 基材
１１ 反射板
１１ａ 貫通孔
１２ 発光装置
１３ 封止層
１３ａ 凸レンズ
１３ｂ 貫通孔
１３ｃ 開口
１４ 接着層
１５ バンプ
１６ ワイヤ
１８ 基板
２０ 凹部
１３１ 第１封止層
１３２ 第２封止層

DESCRIPTION OF SYMBOLS 1 Light emitting module 4 Metal plate material 5 Electrical insulation layer 6 Conductive pattern 6a External connection terminal 7 Submount substrate 7a Electrode 8 LED chip (light emitting element)
9 Phosphor layer 9a Corner 10 Base 11 Reflector 11a Through hole 12 Light emitting device 13 Sealing layer 13a Convex lens 13b Through hole 13c Opening 14 Adhesive layer 15 Bump 16 Wire 18 Substrate 20 Recess 131 First sealing layer 132 Second Sealing layer

Claims (9)

複数の凹部を有する基板と、それぞれの前記凹部内に実装された複数の発光素子とを含む発光モジュールであって、
前記発光素子を覆い、かつ前記凹部内に充填された第１透光性樹脂からなる第１封止層と、前記基板及び前記第１封止層を覆って設けられた第２透光性樹脂からなる第２封止層とを含み、
前記第１透光性樹脂の引張強度が、前記第２透光性樹脂の引張強度より低く、
前記第２封止層には、前記凹部と連通する貫通孔が形成されていることを特徴とする発光モジュール。 A light-emitting module including a substrate having a plurality of recesses and a plurality of light-emitting elements mounted in each of the recesses,
A first sealing layer made of a first light-transmitting resin that covers the light-emitting element and is filled in the recess, and a second light-transmitting resin that is provided to cover the substrate and the first sealing layer A second sealing layer consisting of
The tensile strength of the first translucent resin is lower than the tensile strength of the second translucent resin,
The second sealing layer is formed with a through hole communicating with the recess. 前記発光素子と前記第１封止層との間に介在する蛍光体層を更に含む請求項１に記載の発光モジュール。   The light emitting module according to claim 1, further comprising a phosphor layer interposed between the light emitting element and the first sealing layer. 前記蛍光体層は、角部が円弧状に形成されている請求項２に記載の発光モジュール。   The light emitting module according to claim 2, wherein the phosphor layer has a corner formed in an arc shape. 前記蛍光体層は、半球状に形成されている請求項２に記載の発光モジュール。   The light emitting module according to claim 2, wherein the phosphor layer is formed in a hemispherical shape. 前記第１透光性樹脂は、引張強度が０．５ＭＰａ以下である請求項１に記載の発光モジュール。   The light emitting module according to claim 1, wherein the first translucent resin has a tensile strength of 0.5 MPa or less. 前記第１透光性樹脂は、シリコーン樹脂及びフッ素樹脂から選ばれる少なくとも１つである請求項１又は５に記載の発光モジュール。   The light emitting module according to claim 1, wherein the first light transmissive resin is at least one selected from a silicone resin and a fluororesin. 前記第２透光性樹脂は、引張強度が１〜５００ＭＰａである請求項１に記載の発光モジュール。   The light emitting module according to claim 1, wherein the second translucent resin has a tensile strength of 1 to 500 MPa. 前記第２透光性樹脂は、エポキシ樹脂、ポリオレフィン樹脂及びポリカーボネート樹脂から選ばれる少なくとも１つである請求項１又は７に記載の発光モジュール。   The light emitting module according to claim 1 or 7, wherein the second translucent resin is at least one selected from an epoxy resin, a polyolefin resin, and a polycarbonate resin. 前記凹部の総容積をＶ（ｍｍ3）とし、前記貫通孔の開口の総面積をＳ（ｍｍ2）としたときに、Ｓ／Ｖの値が０．０２５〜０．３である請求項１に記載の発光モジュール。

The value of S / V is 0.025 to 0.3 when the total volume of the recesses is V (mm 3 ) and the total area of the openings of the through holes is S (mm 2 ). The light emitting module according to 1.

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