WO2013044601A1

WO2013044601A1 - Led dot matrix display and combined dot matrix display

Info

Publication number: WO2013044601A1
Application number: PCT/CN2012/070298
Authority: WO
Inventors: 杨东佐
Original assignee: Yang Dongzuo
Priority date: 2011-09-30
Filing date: 2012-01-12
Publication date: 2013-04-04
Also published as: CN102682671A; CN102682671B

Abstract

An LED dot matrix display and a combined dot matrix display. The dot matrix display comprises a heat dissipation submount (1), a PCB (2), LED light emitting units that are arranged uniformly, an imaging controller, a layout circuit conductive layer, and a plastic board (4). The LED light emitting units each comprise more than one LED chip (5), a wire used for electrically connecting the LED chips (5) and the layout circuit conductive layer, and a transmissive package colloid (3) used for packaging the LED chips (5). An external sidewall (13) of a closed chamber (24) for sealing the plastic board (4) and the heat dissipation submount (1) is arranged between the plastic board (4) and the heat dissipation submount (1), the plastic board (4) being used for forming the transmissive package colloid (3) that packages the LED chips. The heat dissipation submount (1), the external sidewall (13) of the closed chamber (24) and the plastic board (4) form the closed chamber, and the PCB board (2) is accommodated in the closed chamber (24). The heat dissipation submount (1), the plastic board (4), and the transmissive package colloid (3) are in direct contact with the external air. The dot matrix display constituted in this way has a simple structure, a low cost, and desirable water-proof and heat-dissipation effects.

Description

LED dot matrix display screen and combined dot matrix display screen

The present invention relates to a display screen, and more particularly to an LED dot matrix display screen and a combined dot matrix display screen.

Background technique

Compared with traditional light sources, LED light-emitting diodes are lead-free, mercury-free, stroboscopic, energy-saving and environmentally friendly.

It has been widely used in display imaging due to its long life, fast response, vibration resistance, easy maintenance, high brightness, low energy consumption, low UV radiation and environmental pollution, and high safety.

The light decay of the LED source and its lifetime are directly related to its junction temperature. LED lights, especially high-power LED light sources, concentrate heat when illuminating. If the heat generated by the LED chip is not released in time, the junction temperature is very high and the life is short. According to the Ares rule, for every 10 ° C decrease in temperature, the life expectancy is doubled. According to research, if the junction temperature can be controlled at 65 ° C, the lifetime of the LED light source can be as high as 100,000 hours. Since LEDs are electroluminescent devices, their heat cannot be dissipated by radiation. In the photoelectric conversion process, only 15-25% of the electrical energy is converted into light energy, and the rest of the electrical energy is almost converted into thermal energy, so that the temperature of the LED lamp is raised. For the LED chip integrated packaged light source, since the wafer is concentrated, the heat source area is high in heat, which makes it easy to cause the temperature of the device such as the LED chip to be too high. If a large amount of heat is not released in time, it will cause a series of problems: for example, it will accelerate the aging of LED chips and other devices, shorten the service life, and even lead to the burning of LED chips; red shift the wavelength of blue LEDs, and the color of white LEDs. Degree and color temperature have an important influence. If the wavelength shifts too much, it will deviate from the absorption peak of the phosphor, which will cause the quantum efficiency of the phosphor to decrease and affect the light extraction efficiency. The temperature also has a great influence on the radiation characteristics of the phosphor, with the temperature rising. The quantum efficiency of the phosphor is reduced, and the wavelength of the radiation is also changed. The change of the wavelength of the phosphor radiation also causes the color temperature and chromaticity of the white LED to change, and the higher temperature accelerates the aging of the phosphor. In general, the higher the power of the LED chip integrated packaged light source, the better the imaging effect; but at the same time, the heat dissipation problem is more difficult to solve. The heat dissipation problem ultimately limits the power of the LED chip integrated packaged light source.

In the utility model patent whose application number is 201020262611. 0, which is an LED integrated structure, an LED dot matrix display screen including a top cover, a transparent plate and an LED integrated structure is disclosed. The LED integrated structure includes a heat dissipating substrate, an LED chip, a lens, a plastic part of a positioning lens or a molding lens, a conductive layer electrically connecting the wires of the LED chip electrode and a layout circuit of the electrical connection wire, an imaging controller, a positioning lens or a molding lens The plastic member is provided with one or more first through holes, and a fixing column is extended on the end surface of the positioning member or the plastic member of the molded lens, and the heat dissipation base The plate is provided with a second through hole that cooperates with the fixing post, the fixing post passes through the second through hole of the heat dissipation substrate, and the end portion of the fixing column is provided with a resisting portion; the plastic piece of the positioning lens or the forming lens passes through the fixing column and resists The portion is fixed to the heat dissipation substrate; the LED chip is directly fixed on the heat dissipation substrate by the die bonding process and placed in the corresponding first through hole; the conductive layer of the layout circuit extends between the sidewall of the first through hole and the LED chip, The wire is placed in the first through hole, one end of the wire is electrically connected to the electrode of the LED chip, and the other end of the wire is electrically connected with the conductive layer of the layout circuit between the first through hole and the LED chip; the side of the heat dissipation substrate facing away from the LED chip Direct contact with heat-dissipating or heat-dissipating liquid. The patterned circuit conductive layer of each chip is separately electrically connected to the imaging controller. In the utility model, although the heat dissipation substrate is in direct contact with the outside, the sealed cavity for accommodating the PCB board is formed by the top cover, the transparent plate and the heat dissipation substrate, and the structure is complicated and the cost is high.

In the utility model patent of application number 201020620120.9, an image system LED light source module is disclosed, which comprises an outer frame of an aluminum alloy, a corner connector, an outlet block, an LED lamp bottom plate, an optical scattering plate and an LED lamp, an outer frame, The outlet blocks are assembled by a corner connector, the LED lamp is mounted on the bottom plate of the LED lamp, the bottom plate of the LED lamp is installed in the outer frame, and the optical scattering plate is mounted on the outer casing corresponding to the position of the LED lamp. The outlet block is provided with a outlet hole. The LED lamp base plate is provided with heat dissipating fins. The outer frame is provided with three mounting slots. The mounting slots are fixed mounting slots, display panel mounting slots, and operator panel mounting slots. Since the conductive layer of the layout circuit of the display and the circuit of the imaging controller are very complicated, the utility model installs the LED lamp on the bottom plate of the LED lamp without the PCB board, so that the circuit is arranged on the bottom plate, which is difficult to form. Although the LED lamp bottom plate is in direct contact with the outside world, the dense cavity of the sealing pattern circuit is formed by the outer frame and the LED lamp bottom plate being installed together, and the outer frame is required, the structure is complicated, and the cost is high.

In the utility model patent of the application No. 200720312314.0, a combined LED display screen is disclosed, which comprises a main body frame of a plastic, an LED lighting module and a display driving circuit, and a side of the main body frame is provided with a dot matrix shape matched with the LED lighting module. Inserting holes, each of which is provided with a positive electrode and a negative electrode which are insulated from each other, and the positive electrode and the negative electrode are connected with the display driving circuit; the LED light emitting module is composed of an LED light emitting tube and a plug-in body, on the cartridge body There is a contact electrode, and the LED light emitting module is inserted into the insertion hole and is in contact with the positive electrode and the negative electrode. Since the main frame is made of plastic, the heat dissipation is not good. The utility model does not disclose how to seal the circuit of the LED lighting module, so that the LED lighting module can be used outdoors.

In the utility model patent of application number 200620074254. 9, a high-density full-function LED display module is disclosed. The module uses a 2-6 layer printed circuit board as a carrier. The upper surface layer of the printed circuit board is provided with two-dimensional array points, each of which has a pad, and the array is mounted or soldered with a single color or two colors or The LED chip of the three primary colors; the outer surface of the LED chip is coated with silicone rubber or epoxy resin with diffusing agent or UV glue, which is both a surface protective glue and an exit lens of the LED; the printed circuit board is provided with a through hole having a very small aperture The through hole is filled with metallic copper or other heat conductive material; the bottom layer of the printed circuit board is provided with control driving components and connecting members. The display module directly mounts or solders a single or two-color or three-primary LED chip in a matrix of a printed circuit board, and is printed on a printed circuit board. Some of the through holes with very small apertures are filled with metal copper or other heat conductive materials for heat conduction, and the heat conduction effect is poor, and the process is complicated. The utility model also does not disclose how to seal a printed circuit board.

Summary of the invention

The first technical problem to be solved by the present invention is to provide a LED dot matrix display which directly utilizes a plastic plate and a heat dissipation substrate sealed PCB board of a light-sealing encapsulant of a packaged LED chip, has a simple structure, a good heat dissipation effect, and a good waterproof effect. Screen.

The second technical problem to be solved by the present invention is to provide a combined dot matrix which directly utilizes a plastic plate and a heat dissipation substrate sealed PCB board of a light-sealing encapsulant of a packaged LED chip, has a simple structure, a good heat dissipation effect, and a good waterproof effect. Display.

LED dot matrix display, comprising a heat sink base, a PCB board, a uniform array of LED light emitting units, an imaging controller, a layout circuit conductive layer, a packaged LED chip light transmissive encapsulant, a molded package LED chip light transmissive encapsulant The plastic plate; the conductive layer of the layout circuit is directly disposed on the PCB; the LED light-emitting unit includes more than one LED chip, electrically connecting the LED chip and the conductive layer of the layout circuit, and is used for packaging the light-transmissive encapsulant of the LED chip; The LED chips are electrically connected to the imaging controller through the conductive layer of the layout circuit; the LED chip fixing bosses are evenly arranged on the heat dissipation base, and each of the LED chip fixing bosses is fixed by a die bonding process. LED chip of LED light-emitting unit; fixed column is arranged on the surface of the plastic plate facing the PCB board; firstly, the number of positions and positions of the fixed rows of the LED chip are correspondingly arranged on the plastic plate, and the first part of the light-transmissive package colloid is formed a through hole; a second through hole that is matched with the fixing post; a third through hole that is matched with the fixing post and the LED chip is fixed on the PCB a fourth through hole that is engaged with the boss; the fixing post passes through the third through hole, and the second through hole is provided with a resisting portion at the end of the fixing post, and the plastic plate, the PCB board and the heat dissipation base are sequentially fixed together, and the fixing column is fixed And/or the resisting portion seals the second through hole; the LED chip fixing boss of the heat dissipation base extends through the fourth through hole into the first through hole, and the top surface of the LED chip fixing boss is lower than the plastic plate facing away from the PCB board The conductive layer of the layout circuit extends between the first through hole and the fixed boss, the wire is placed in the first through hole, and one end of the wire is electrically connected to the electrode of the LED chip, and the other end of the wire is connected with the first through hole and The conductive layer of the layout circuit between the LED chip fixing bosses is electrically connected; the outer side wall of the sealed cavity sealed with the plastic plate and the heat dissipation base is arranged between the plastic plate and the heat dissipation base; the heat dissipation base and the outer side wall of the sealed cavity, The plastic plate forms a closed cavity, and the PCB board is housed in the sealed cavity; the heat dissipation base, the plastic plate and the light-transmissive encapsulant directly contact the outside air directly.

As a first improvement of the first solution, the plastic plate further includes a first protective layer disposed on the outer surface of the plastic plate, and the plastic plate directly contacts the outside through the first protective layer, and the transparent encapsulant colloid further comprises a light-transmitting encapsulant. a second protective layer on the surface, the light-transmissive encapsulant directly and externally through the second protective layer Contact with the community.

The second improvement of the first solution includes a whole ballast device, a data interface, and a power interface electrically connected to the external power source; the first accommodating cavity is disposed on the heat dissipation base, and the sealed first accommodating portion is further provided The cover of the cavity opening; the rectifying device, the data interface, and the power interface electrically connected to the external power source are installed in the first accommodating cavity; and the rectifying device is electrically connected to the conductive layer of the layout circuit, the imaging controller, and the external power interface.

As a first improvement of the third scheme, a fixing mechanism for fixing the LED display screen to the set position is protruded on the back surface of the LED display screen.

As a fourth improvement of the first scheme, each of the LED lighting units includes a single primary color or two double primary colors or three three primary colors or four three primary color LED chips.

As a first common improvement of the first to fifth embodiments, a first heat dissipation through hole sequentially passing through the heat dissipation base and a second heat dissipation through the PCB board are disposed at a center position of each of the adjacent four LED chip fixing bosses. a hole, a third heat dissipation through hole penetrating through the plastic plate, each LED light emitting unit is adjacent to the corresponding first heat dissipation through hole, the second heat dissipation through hole, and the third heat dissipation through hole, and the edge of the plastic plate facing the PCB board The outer circumference of the third heat dissipation through hole, and/or the inner side of the first heat dissipation through hole is provided on the outer surface of the first heat dissipation through hole on the surface of the heat dissipation base toward the PCB board, and the inner side wall of the sealed cavity passes through the second heat dissipation through hole, the heat dissipation base The outer wall of the closed cavity, the inner side wall of the sealed cavity, the plastic plate form a closed cavity, and the PCB board is housed in the sealed cavity; the heat dissipation base is provided with a heat dissipation fin on a side away from the PCB board, and the first heat dissipation through hole penetrates the heat dissipation Fins, adjacent heat dissipation fins are not connected; one end of the first heat dissipation through hole away from the PCB is communicated with the outside air through the gap of the heat dissipation fin, and the third heat dissipation through hole is away from the PCB board One end is directly connected to the outside air, the gap of the heat dissipation fins, the first heat dissipation through hole, the second heat dissipation through hole, and the third heat dissipation through hole which are connected in series form a convective gas heat dissipation channel.

As a second common improvement of the first to fifth embodiments, a heat dissipating fin is disposed on a side of the heat dissipation base facing away from the PCB, and adjacent heat dissipation fins are not connected, and a convection lateral heat dissipation channel is formed between the heat dissipation fins.

As a third common improvement of the first to fifth aspects, the method further includes: a flow path housing disposed on the side of the heat dissipation base facing away from the PCB board, and a flow path wall, a flow path housing, and a flow path housing between the flow path housing and the heat dissipation base; The flow path wall and the heat dissipation base form a cooling flow path; the back surface of the LED chip fixing boss is completely covered by the cooling flow path.

As a fourth common improvement of the first to fifth embodiments, the method further includes: a flow path housing disposed on a side of the heat dissipation base facing away from the LED light emitting unit, the heat dissipation through hole penetrating through the flow path housing; fixing convex in each adjacent four LED chips The central position of the table is provided with a fourth heat dissipation through hole running through the flow path casing from bottom to top, a first heat dissipation through hole penetrating the heat dissipation base, a second heat dissipation through hole penetrating the PCB board, and a penetrating through the plastic plate. Three heat dissipation through holes, each LED light emitting unit and a corresponding first heat dissipation through hole, The second heat dissipation through hole and the third heat dissipation through hole are adjacent to each other; the outer surface of the third heat dissipation through hole on the surface of the plastic plate facing the PCB, and/or the first heat dissipation through hole on the surface of the heat dissipation base facing the PCB The outer circumference is provided with a closed inner side wall, the inner side wall of the closed cavity passes through the second heat dissipation through hole, the heat dissipation base, the outer side wall of the sealed cavity, the inner side wall of the closed cavity, the plastic plate form a closed cavity, and the PCB board is accommodated in the closed cavity; An outer side wall of the flow channel is formed between the flow path housing and the heat dissipation base, and is disposed between the flow path housing and the heat dissipation base, along the outer circumference of the fourth heat dissipation through hole, and/ Or along the outer circumference of the first heat dissipation through hole, the inner side wall of the flow channel is provided, the flow path housing is fixed with the heat dissipation substrate, and the heat dissipation base, the outer side wall of the flow path, the inner side wall of the flow path, and the flow path housing are completely sealed. Cooling flow channel; the fourth heat dissipation through hole is directly connected to the end of the PCB board and is directly connected to the outside air, and the third heat dissipation through hole is directly connected to the outside end of the PCB board, and is directly connected with the outside air, and the fourth heat dissipation through hole is connected in series, first Cooling straight Hole, the second through-hole cooling, cooling through-hole formed in the third gas convection cooling passages.

As an improvement of the above solution, a connecting wall is arranged between the inner side walls of the set flow passage, or a connecting wall is provided between the inner side walls of the set flow passage, the outer side wall of the set flow passage and the inner side wall of the flow passage, and cooling The flow channel is a circulation flow channel; and a liquid inlet and a liquid outlet connected to the cooling flow channel are further disposed on the flow channel housing or the heat dissipation base.

A combined dot matrix display, the combined dot matrix display is composed of more than two dot matrix displays.

The beneficial effects of the invention are -

1) The top surface of the LED chip fixing boss is lower than the surface of the first through hole facing away from the PCB board. After the LED chip is packaged by the transparent package, the lens is not required, and the structure is simple. An outer side wall sealed with the plastic plate and the heat dissipation base is disposed between the plastic plate and the heat dissipation base, and the fixing post and/or the resisting portion seal the second through hole, so that the PCB board is accommodated in the heat dissipation base, the outer side wall, and the plastic plate In the closed cavity formed, on the one hand, avoiding the unclean air with moisture and harmful chemicals on the outside, causing contamination of the LED light-emitting unit, the conductive layer of the wire and the layout circuit, improving the thermal resistance, causing degradation of the phosphor and the silicone material, and improving the LED On the other hand, the LED display can be used outdoors to prevent water from entering the closed cavity, and the waterproof effect is good; the structure is simple, the cost is low, and the heat dissipation substrate is directly in contact with the outside, and the heat dissipation effect is good.

2) Due to the plastic plate, the conductive layer of the layout circuit can be inserted into the plastic plate. On the one hand, the wire can be directly connected to the conductive layer of the layout circuit, and the conductive layer of the wire and the layout circuit is no longer needed through the conductive metal bracket. Connected or connected through the wiring pin from the heat sink base away from the LED chip to the conductive layer of the layout circuit, simplifying the structure and minimizing the thermal resistance of the intermediate link, and the heat dissipation effect is good; on the other hand, the metal is no longer needed The bracket or the wiring pin is electrically connected to the conductive layer of the layout circuit, and does not require reflow soldering or wave crest, so the encapsulant can be made of resin or silica gel; and the LED chip, the electrical connecting wire and the two soldering ends thereof are not ensured. Will be exposed to the air, which is beneficial to the long life of use. And When reflow soldering or wave soldering is required, since the temperature of the reflow or crest is generally 250C or 280C, the encapsulant cannot be used. Since the price of the silica gel is much higher than that of the resin, and the light transmittance is inferior to that of the resin, the present invention can further save costs and improve the optical performance of the LED chip. The advantage of this COB package design is that the electrodes of each LED chip directly form an ohmic contact with the conductive layer of the layout circuit through the bonding wires, and the formation of the multi-channel LED chip array is an electrical connection device between the heat dissipation base and the LED chip. By realizing electrical interconnection, the series and parallel connection of LED chips can be realized, and the reliability and production yield of the products can be improved.

3) A plurality of chip fixing chip fixing bosses integrally formed with the heat dissipation base are disposed on the heat dissipation base, and the area of the heat dissipation base is much larger than the area of the top of the chip fixing boss, and the LED chip is directly fixed by the die bonding method. The chip is fixed on the boss. In this way, on the one hand, the heat generated by the LED chip is greatly reduced in the intermediate path distance of the heat dissipating gas, that is, the air, and the contact area with the heat dissipating gas is greatly increased, the heat accumulation effect is greatly reduced, the heat dissipation efficiency is greatly improved, and the chip is kept at a suitable level. The operating temperature, thus maintaining the long life of the chip and effective luminous efficiency. The chip fixing boss and the heat sink base are integrally formed, so the heat generated by the chip is directly emitted into the air through the heat sink base, so the heat resistance is small, the heat dissipation speed is fast, and the heat dissipation is not required by the other heat sink, and the heat dissipation effect is Quite good. Due to the chip fixing boss, the electrical connection wire minimizes the shadow of the light emitted by the LED chip, which is advantageous for optical secondary optimization! The existing LED bracket is omitted, that is, the heat dissipation in the LED bracket is omitted. The multi-layer intermediate part of the metal piece and the electrode metal foot thereof particularly reduces the high thermal resistance generated between the heat dissipating metal piece and the two parts of the heat dissipating base, so the thermal resistance is small, the heat conduction fast heat dissipation effect is good, and the structure is simple and reliable. In particular, the integral formation of the chip fixing boss and the heat dissipation base is more advantageous for the design and assembly process of the light source, and the cost is saved. Therefore, the structure of the invention is simple and reliable, has few parts, is thin, and is easy to assemble, and is particularly suitable for occasions requiring high power for the light source.

4) The first protective layer and the second protective layer generally spray a protective layer on the plastic plate and the light-transmissive encapsulant once after the LED chip is packaged in the transparent encapsulant to achieve better waterproof effect and protection effect.

5) Since each of the four adjacent LED lighting units is provided with a heat dissipation through hole, each LED lighting unit is adjacent to the heat dissipation through hole, thereby reducing the dense arrangement of the LED lighting units to produce a high junction. On the other hand, the heat generated by each LED light-emitting unit can be directly radiated through the adjacent heat-dissipating through-holes, so that the heat-dissipating path of each LED light-emitting unit is as short as possible, and the heat-dissipating path of each LED light-emitting unit is equal or substantially Equal, to ensure that the heat dissipation effect of each LED lighting unit is very good, further reducing the high junction temperature of the LED lighting unit. The heat dissipation through hole penetrates the heat dissipation base, and both ends of the heat dissipation through hole communicate with the outside air to form a convective gas dispersion. The hot aisle is very conducive to air convection. The heat generated by the LED light source during operation is conducted to the susceptor, which becomes a hot conductor and carrier. The susceptor with a large amount of heat will be discharged from the hot air in the through hole of the heat dissipation through hole, and the cold air from the outside will be continuously replenished into the heat dissipation through hole to form a continuous flow of gas to continuously absorb heat from the hole wall of the heat dissipation through hole. The susceptor is cooled and thus circulated, so that the heat in the susceptor is quickly taken away, so that a large amount of heat is not accumulated in the susceptor, which affects the service life of the LED light source and has high heat dissipation efficiency. The processing of the heat-dissipating through-hole is very convenient and fast, saving manpower, material resources and financial resources, and the cost of the heat-dissipating device and even the LED dot matrix display having the heat-dissipating device can be greatly reduced. When the LED dot matrix display is fixed on the wall, a fixing mechanism for fixing the LED display screen at the set position is protruded from a side of the flow path housing facing away from the PCB board, thereby ensuring direct contact between the heat dissipation substrate and the outside air.

6) With heat sink fins and heat sinks to increase heat dissipation area and improve heat dissipation. The convection side heat dissipation channel is formed between the heat dissipation fins, and the heat on the substrate in the middle of the heat dissipation base and the heat on the heat dissipation fins are dissipated through the gap of the heat dissipation fins to improve the heat dissipation effect. Especially when the display screen is fixed to the wall, the convection side heat dissipation passage is necessary because the wall blocks heat from being radiated in the direction of the vertical heat sink base.

7) Set the cooling flow path to further improve the heat dissipation effect. Generally, the cooling water is filled in the cooling flow channel. Since the specific heat of the water is high, the heat of the LED light source can be quickly dissipated into the water by the convection heat, and the temperature of the water heated by the higher temperature and the temperature of the heat-dissipating terminal contacting the air is heated. The lower water forms convection, and the heat is exchanged to the lower temperature contact air. The heat dissipation terminal is quickly dissipated into the air through the heat dissipation terminal, which dissipates heat quickly and effectively reduces the junction temperature. Also, since the maximum temperature of water is 100 ° C, the junction temperature at the LED light source can be avoided to exceed 100 ° C. For outdoor dot matrix LED displays with large temperature difference, the quenching and heating of the LED dot matrix display can be reduced. Improve the operating temperature environment of the LED dot matrix display.

8) By providing connecting walls between the inner side walls of some flow channels, there are no connecting walls between the inner side walls of some flow paths, so that the cooling flow channels form a circulation flow channel, and the outer cooling liquid is input into the cooling flow channels through the liquid inlet port, The liquid in the cooling flow channel is output through the liquid outlet, which facilitates the rapid convection movement of the cooling medium, and the heat dissipation effect is better. By providing a connecting wall between the inner side walls of the set flow passage, the outer side wall of the set flow passage and the inner side wall of the flow passage, the first circulating cooling flow passage completely surrounds the inner side wall of the flow passage without dead angle, and there is no cold cooling. The heat sink unit covered by the flow channel has better heat dissipation and more uniformity.

DRAWINGS

1 is a perspective view of Embodiment 1 of the present invention;

Figure 2 is a cross-sectional view taken along line A-A of Figure 1.

Figure 3 is a perspective exploded view of Embodiment 1 of the present invention. 4 is a perspective exploded view showing the projection of the embodiment 1 of the present invention from another direction.

Figure 5 is a perspective exploded view of Embodiment 2 of the present invention.

Fig. 6 is a perspective exploded perspective view showing projection 2 of another embodiment of the present invention.

Figure 7 is a front elevational view of Embodiment 2 of the present invention

Figure 8 is a cross-sectional view taken along line B-B of Figure 7.

Figure 9 is a perspective exploded view of Embodiment 3 of the present invention.

Figure 10 is a perspective exploded view of Embodiment 4 of the present invention.

Fig. 11 is an enlarged schematic view showing a portion I of Fig. 10.

Figure 12 is a perspective exploded view of Embodiment 5 of the present invention.

Figure 13 is an enlarged schematic view of a portion II of Figure 12.

Figure 14 is a perspective exploded view of Embodiment 6 of the present invention.

Figure 15 is an enlarged schematic view of a portion III of Figure 14.

Figure 16 is a perspective view of a cymbal according to an embodiment of the present invention.

Figure Π is a perspective view of Embodiment 8 of the present invention.

Figure 18 is a perspective exploded view of Embodiment 8 of the present invention.

detailed description

Example 1

As shown in FIG. 1 to FIG. 4 , an LED dot matrix display screen comprises a heat dissipation base 1 , a PCB board 2 , a light transmissive encapsulant 3 encapsulating the LED chip, and a plastic plate 4 of the transparent package encapsulation 3 of the packaged LED chip. , a uniform array of single primary color LED lighting units, an imaging controller, a layout circuit conductive layer (not shown); a layout circuit conductive layer directly disposed on the PCB board 2, the imaging controller is directly disposed on the PCB board back 2 The surface of the conductive layer of the layout circuit.

The LED light-emitting unit comprises a single-primary LED chip 5 electrically connected to the LED chip 5 and the gold wire 6 of the conductive layer of the layout circuit for packaging the light-transmitting encapsulant 3 of the LED chip 5; each LED chip 5 is patterned The circuit conductive layer is electrically connected to the imaging controller separately.

An LED chip fixing boss 7 is uniformly arranged on the heat dissipation base 1, and one LED chip 5 is fixed on each of the LED chip fixing bosses 7 by a die bonding process. A fixing post 8 is extended on a surface of the plastic plate 4 facing the PCB board 2. A first through hole 9 for forming the light transmitting encapsulant 3 is formed on the plastic plate 4 in a one-to-one correspondence with the number and position of the LED chip fixing bosses 7. The first through hole 9 is a tapered hole having a large upper and a lower diameter. A second through hole 10 that cooperates with the fixing post 8 is provided on the heat dissipation base 1. A third through hole 11 that cooperates with the fixing post 8 and a fourth through hole 12 that cooperates with the LED chip fixing boss 7 are provided on the PCB board 2. A sealing cavity outer side wall 13 is extended on a surface of the plastic plate 4 facing the heat dissipation substrate 1, and the heat dissipation base 1. The outer side wall 13 of the sealed cavity and the plastic plate 4 form a closed cavity 24, and the PCB board 2 is housed in the closed cavity 24. The fixing post 8 passes through the third through hole 1 1 and the second through hole 10 and forms a resisting portion 14 at the end of the fixing post 8 to fix the plastic plate 4, the PCB board 2, and the heat dissipation base 1 in sequence, and the resisting portion 14 seals the second through hole 10. The LED chip fixing boss 7 of the heat dissipation base 1 extends through the fourth through hole 12 into the first through hole 9, and the top surface of the LED chip fixing boss 7 is lower than the surface of the plastic plate 4 facing away from the PCB board 2. A conductive layer (not shown) of the layout circuit extends between the first through hole 9 and the chip fixing boss, the gold wire 6 is placed in the first through hole 9, and the electrode of the gold wire 6-end and the LED chip 5 is electrically connected. The other end of the gold wire 6 is electrically connected to a patterned circuit conductive layer (not shown) between the first through hole 9 and the LED chip fixing boss 7. A flow path wall extending from a surface of the heat dissipation base 1 facing away from the PCB board 2, and a flow path cover 15 disposed on a side of the heat dissipation base 1 facing away from the PCB board 2, the heat dissipation base 1 facing away from the PCB board 2 The outer side wall 16 of the flow channel and the mounting post 18 are extended on the surface, and the side wall 17 of the accommodating cavity extends from the surface of the plastic plate 4 facing away from the PCB board 2, the flow path cover 15, the outer side wall of the flow path 16, and the heat dissipation base The seat 1 forms a cooling flow passage 19, and the flow path cover 15, the accommodating chamber side wall 17, and the heat dissipation base 1 form a relatively closed accommodating chamber 20. An electronic control unit 21 and a data interface 22 are provided in the accommodating chamber 20. The back surface of the LED chip fixing boss 7 is completely covered by the cooling flow path 17. A mounting step through hole 23 is formed in the mounting post 18 through the heat dissipation base. The heat dissipation base 1, the plastic plate 4, the light transmitting encapsulant 3, and the flow path cover 15 are in direct contact with the outside air. Example 2

As shown in FIG. 5 to FIG. 8, an LED dot matrix display screen is different from the first embodiment in that a third portion penetrating the plastic plate 51 is disposed at a center position of each adjacent four chip fixing bosses 50. a heat dissipation through hole 52, a second heat dissipation through hole 54 penetrating the PCB board 53, a first heat dissipation through hole 56 penetrating the heat dissipation base 55, and a fourth heat dissipation through hole 58 penetrating the flow path cover 57, each chip fixing boss 50 is adjacent to the first heat dissipation through hole 56. The imaging controller is placed directly on the side of the PCB 2 that faces away from the conductive layer of the layout circuit. The uniform array of LED lighting units is a dual primary color.

A sealed cavity outer side wall 59 is formed on a surface of the heat dissipation base 55 facing the PCB board 53, and a sealed cavity outer side wall 60 is formed on a surface of the plastic board 51 facing the PCB board 53. The outer side wall 59 of the closed cavity extends into the outer side wall 60 of the closed cavity, and the outer side of the outer side wall 59 of the closed cavity is fitted to the inner side of the outer side wall 60 of the closed cavity. A closed cavity inner side wall 61 is disposed on the outer surface of the third heat dissipation through hole 52 on the surface of the plastic plate 51 facing the PCB board 53, and is disposed along the outer circumference of the first heat dissipation through hole 56 on the surface of the heat dissipation base 55 facing the PCB board 53. There is a closed cavity inner side wall 62, and the closed cavity inner side wall 62 passes through the second heat dissipation through hole 54. The inner side wall 61 of the closed cavity extends into the inner side wall 62 of the closed cavity, and the outer side surface of the inner side wall 61 of the closed cavity is fitted to the inner side surface of the inner side wall 62 of the closed cavity. The heat dissipation base 55, the outer cavity side wall 59, the outer cavity side wall 60 of the sealing cavity, the inner side wall 61 of the sealing cavity, the inner side wall 62 of the sealing cavity, and the plastic plate 51 form a closed cavity 63, and the PCB board 53 It is housed in the closed cavity 63.

A flow path outer side wall 64 surrounding the first heat dissipation through hole 56 extends on a surface of the heat dissipation base 55 facing away from the PCB board 53, and extends along a periphery of the first heat dissipation through hole 56 on a surface of the heat dissipation base 55 facing away from the PCB board 53. A flow channel inner side wall 65 is provided. The heat sink base 55, the outer flow side wall 64, the inner side wall 65 of the flow path, and the flow path cover 57 form a cooling flow path 67.

The third heat-dissipating through-hole 52 is directly connected to the outside of the PCB 53 and communicates with the outside air. The fourth heat-dissipating through-hole 58 is located away from the PCB 53 and is directly communicated with the outside air through the lateral gap of the fixing post 68. The fourth heat dissipation through hole 58 , the first heat dissipation through hole 56 , the second heat dissipation through hole 54 , and the third heat dissipation through hole 52 which are connected in series form a convective gas heat dissipation channel.

Example 3

As shown in FIG. 9, unlike Embodiment 2, lateral heat dissipation fins 82 and vertical heat dissipation fins 83 are provided on the side of the heat dissipation base 80 facing away from the PCB board 81. The heat radiating fins 82 are parallel to each other, and the heat radiating fins 83 are parallel to each other. The heat dissipation fins 82, the heat dissipation fins 83, the first heat dissipation through holes 84, the second heat dissipation through holes 86, and the third heat dissipation through holes 85 form a convective gas heat dissipation channel. The first heat dissipation through hole 84 penetrates through the heat dissipation fins 82 and the heat dissipation fins 83, and the adjacent heat dissipation fins are not connected. One end of the first heat dissipation through hole 84 away from the PCB board 81 communicates with the outside air through the gap between the heat dissipation fins 82 and the heat dissipation fins 83, and the end of the third heat dissipation through hole 85 away from the PCB board 81 is directly in communication with the outside air. This embodiment does not provide a cooling flow path, and mainly dissipates heat through the fins. The uniform array of LED lighting units is three primary colors.

Example 4

As shown in FIG. 10 and FIG. 11, different from Embodiment 2, each LED lighting unit includes two LED chips 100 and LED chips 101 of two primary colors, that is, two fixed on each chip fixing boss 102. LED chips 100 and LED chips 101 of different colors.

Example 5

As shown in FIG. 12 and FIG. 13, different from the second embodiment, each of the LED lighting units includes three LED chips 110 of three primary colors, an LED chip 111, and an LED chip 112, that is, on each of the chip fixing bosses 113. Three different color LED chips are fixed.

Example 6

As shown in FIG. 14 and FIG. 15 , different from the embodiment 2, each of the LED lighting units includes four LED chips 120 of three primary colors, an LED chip 121 , an LED chip 122 , and an LED chip 123 , wherein the LED chip 120 and the LED are included. The color of the chip 121 is the same, that is, four or three different color LED chips 120, LED chips 121, and LED chips 122 are fixed on each chip fixing boss 124. LED chip 123.

Example Ί

As shown in FIG. 16, a combined dot matrix display screen is composed of four dot matrix display screens 140, a dot matrix display screen 141, a dot matrix display screen 142, and a dot matrix display screen 143. The dot matrix display 140, the dot matrix display screen 141, the dot matrix display screen 142, and the dot matrix display screen 143 differ from the third embodiment in that a fixed column 144 is provided only at one corner position of the dot matrix display screen, in the lattice array. The surface on which the display screen is fitted is provided with a fixing portion (not shown) for fixing the adjacent two dot matrix display screens together.

Example 8

As shown in Figs. 17, 18, unlike the third embodiment, the lateral connecting walls 151 are connected between the outer side walls 150 of the outermost one side of the flow path, and the inner side walls 152 of the flow paths are vertically arranged at intervals. There is a first vertical connecting wall 153; between the inner side walls 154 of the flow path which are separated from the vertically arranged flow channel inner side wall 152 to which the first vertical connecting wall 153 is connected, and which are not connected to the lateral connecting wall 151, A second vertical connecting wall 156 is disposed between the inner side wall 154 of the flow path and the outer side wall 155 of the flow path; the inner side wall 152 of the flow path, the first vertical connecting wall 153, the inner side wall 150 of the flow path, the transverse connecting wall 151, and the inner side of the flow path The wall 154, the outer flow side wall 155, the second vertical connecting wall 156 form a circulation passage 157, and the cooling flow passage provided with the circulation passage is a circulation flow passage completely surrounding the inner side wall of the flow passage without a dead angle; The liquid inlet 159 and the liquid outlet 160 are provided, and the liquid inlet 159 and the liquid outlet 160 are connected to the water reservoir 162 through the water pipe 161.

Claims

Claim

1. A LED dot matrix display, comprising a heat sink base, a PCB board, a uniform array of LED light emitting units, an imaging controller, a layout circuit conductive layer, a packaged LED chip light transmissive encapsulant, and a molded package LED chip light transmissive package a plastic plate of the colloid; the conductive layer of the layout circuit is directly disposed on the PCB; the LED lighting unit includes more than one LED chip, and electrically connects the LED chip and the conductive layer of the layout circuit to encapsulate the LED chip. Light encapsulation colloid; each LED chip is electrically connected to the imaging controller through a conductive layer of the layout circuit; a LED chip fixing boss is evenly arranged on the heat dissipation base, and is fixed on each LED chip fixing boss The crystal process is fixed with an LED chip of the LED light-emitting unit; a fixed column is extended on a surface of the plastic plate facing the PCB board; and a number of positions and positions of the fixed rows of the LED chip are respectively arranged on the plastic plate, Forming a first through hole of the light transmissive encapsulant; providing a second through hole on the heat dissipation base that is matched with the fixing post; and having a third matching with the fixing post on the PCB board a through hole and a fourth through hole that cooperates with the LED chip fixing boss. The fixing post passes through the third through hole, and the second through hole is provided with a resisting portion at the end of the fixing post, and the plastic plate, the PCB board, and the heat dissipation base are disposed. The sockets are sequentially fixed together, and the fixing post and/or the resisting portion seals the second through hole; the LED chip fixing boss of the heat dissipation base extends through the fourth through hole into the first through hole, and the LED chip fixes the top surface of the boss Lower than the surface of the plastic plate facing away from the PCB; the conductive layer of the layout circuit extends between the first through hole and the fixed boss, the wire is placed in the first through hole, and one end of the wire is electrically connected to the electrode of the LED chip, and the wire is electrically connected The other end is electrically connected to the conductive layer of the layout circuit between the first through hole and the LED chip fixing boss; and the utility model is characterized in that: a sealed cavity sealed with the plastic plate and the heat dissipation base is arranged between the plastic plate and the heat dissipation base The outer side wall; the heat dissipation base, the outer side wall of the sealed cavity, the plastic plate form a closed cavity, and the PCB board is housed in the sealed cavity; the heat dissipation base, the plastic plate and the transparent package colloid directly contact the outside air directly.

2. The LED dot matrix display screen according to claim 1, wherein: the plastic plate further comprises a first protective layer disposed on an outer surface of the plastic plate, and the plastic plate directly contacts the outside through the first protective layer. The light encapsulating colloid further includes a second protective layer disposed on the outer surface of the transparent encapsulant, and the transparent encapsulant directly contacts the outside through the second protective layer.

3. The LED dot matrix display of claim 1 further comprising: a ballast device, a data interface, a power interface electrically connected to the external power source; and a first on the heat sink base The accommodating cavity is further provided with a cover plate for sealing the opening of the first accommodating cavity; the rectifying device, the data interface, the power interface electrically connected to the external power source are installed in the first accommodating cavity; the rectifying device and the conductive layer of the layout circuit , the imaging controller, and the external power interface are electrically connected.

4. An LED dot matrix display screen according to claim 1, wherein: said LED A fixing mechanism for fixing the LED display screen to a set position is protruded from the back surface of the display screen.

5. An LED dot matrix display screen according to claim 1, wherein: each of the LED lighting units comprises a single primary color or two double primary colors or three three primary colors or four three primary color LED chips.

The LED dot matrix display screen according to any one of claims 1 to 5, characterized in that: a central position of each of the four adjacent LED chip fixing bosses is sequentially provided through the heat dissipation base a first heat dissipation through hole, a second heat dissipation through hole penetrating through the PCB board, and a third heat dissipation through hole penetrating through the plastic plate, each LED light emitting unit is corresponding to the corresponding first heat dissipation through hole and the second heat dissipation through hole The third heat dissipation through hole is adjacent to each other; and the outer periphery of the third heat dissipation through hole on the surface of the plastic plate facing the PCB board, and/or the outer periphery of the first heat dissipation through hole on the surface of the heat dissipation base facing the PCB board is provided with a closed cavity The inner side wall, the inner side wall of the closed cavity passes through the second heat dissipation through hole, the heat dissipation base, the outer side wall of the sealed cavity, the inner side wall of the closed cavity, and the plastic plate form the closed cavity, and the PCB board is received in the sealed cavity; A heat dissipating fin is disposed on a side of the heat dissipation base away from the PCB board, the first heat dissipation through hole penetrates the heat dissipation fin, and the adjacent heat dissipation fins are not connected; the first heat dissipation through hole is away from the end of the PCB board through the heat dissipation fin The gap is in communication with the outside air, and the third heat-dissipating through-hole is directly connected to the outside air of the PCB. The gap between the heat-dissipating fins, the first heat-dissipating through-holes, the second heat-dissipating through-holes, and the third heat-dissipating The through holes form a convective gas heat dissipation channel.

The LED dot matrix display screen according to any one of claims 1 to 5, wherein: the heat dissipation base is provided with a heat dissipation fin on a side away from the PCB board, and the adjacent heat dissipation fins are not A lateral heat dissipation channel is formed between the connection and the heat dissipation fins to form a convection.

The LED dot matrix display screen according to any one of claims 1 to 5, further comprising: a flow path housing disposed on a side of the heat dissipation base facing away from the PCB board, in the flow path housing and A flow channel wall is disposed between the heat dissipation bases, and the flow path housing, the flow path wall, and the heat dissipation base form a cooling flow passage; the back surface of the LED chip fixing boss is completely covered by the cooling flow path.

The LED dot matrix display screen according to any one of claims 1 to 5, further comprising: a flow channel housing disposed on a side of the heat dissipation base facing away from the LED light emitting unit, and the heat dissipation through hole running through a fourth heat dissipation through hole extending through the flow path housing from the bottom to the top, and a first heat dissipation through hole penetrating through the heat dissipation base, at a central position of each of the adjacent four LED chip fixing bosses, a second heat dissipation through hole penetrating through the PCB board, and a third heat dissipation through hole penetrating through the plastic plate, each LED light emitting unit is adjacent to the corresponding first heat dissipation through hole, the second heat dissipation through hole, and the third heat dissipation through hole; Providing a closed cavity inner side wall along the outer circumference of the third heat dissipation through hole on the surface of the plastic plate facing the PCB board, and/or the outer circumference of the first heat dissipation through hole on the surface of the heat dissipation base facing the PCB board, the inner side wall of the sealed cavity Passing through the second heat dissipation through hole, the heat dissipation base, the outer side wall of the closed cavity, the inner side wall of the closed cavity, Forming the sealed cavity in the plastic plate, the PCB board is received in the sealed cavity; and an outer side wall of the flow channel is formed between the flow path housing and the heat dissipation base and is sealed with the flow path housing and the heat dissipation base. Between the flow path housing and the heat dissipation base, along the outer circumference of the fourth heat dissipation through hole, and/or along the outer circumference of the first heat dissipation through hole, the inner side wall of the flow path is provided, and the flow path housing and the heat dissipation substrate are fixed together. The heat dissipation base, the outer side wall of the flow passage, the inner side wall of the flow passage, and the flow passage housing form a completely sealed cooling flow passage; the fourth heat dissipation through hole is directly connected to the end of the PCB and directly communicates with the outside air, and the third heat dissipation through hole is away from the PCB. One end is directly connected to the outside air, and the fourth heat dissipation through hole, the first heat dissipation through hole, the second heat dissipation through hole, and the third heat dissipation through hole which are connected in series form a convective gas heat dissipation channel.

10 . The LED dot matrix display screen according to claim 9 , wherein: a connecting wall is arranged between the sidewalls of the set flow channel, or a set flow is arranged between the sidewalls of the set flow channel. A connecting wall is disposed between the outer side wall of the outer channel and the inner side wall of the flow channel, and the cooling flow channel is a circulating flow channel; and a liquid inlet port and a liquid outlet port communicating with the cooling flow channel are further disposed on the flow channel housing or the heat dissipation base.

11. A combined dot matrix display comprising the LED dot matrix display of any one of claims 1 to 5, wherein: the combined dot matrix display is displayed by more than two of said dot matrix The screen is combined.