TW200847476A - A light emitting diode package with two heat disspation paths - Google Patents

A light emitting diode package with two heat disspation paths Download PDF

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Publication number
TW200847476A
TW200847476A TW96119009A TW96119009A TW200847476A TW 200847476 A TW200847476 A TW 200847476A TW 96119009 A TW96119009 A TW 96119009A TW 96119009 A TW96119009 A TW 96119009A TW 200847476 A TW200847476 A TW 200847476A
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Taiwan
Prior art keywords
heat
dissipating
emitting diode
light
substrate
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TW96119009A
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Chinese (zh)
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TWI337410B (en
Inventor
Chien-Chang Pei
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Everlight Electronics Co Ltd
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Priority to TW96119009A priority Critical patent/TWI337410B/en
Priority to JP2007184245A priority patent/JP4698643B2/en
Publication of TW200847476A publication Critical patent/TW200847476A/en
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Publication of TWI337410B publication Critical patent/TWI337410B/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

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  • Led Device Packages (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A light emitting diode package with two heat dissipation paths includes a LED chip, a heat dissipating material, a plastic cover and a circuit board. The heat dissipating material has a substance for carrying the LED chip, and a extend area couple to the substance. The heat generated by the LED is delivered to the outside through the substance and the extending area. The plastic cover carries the extend area and exposes the extend area to the air. The circuit board has a sunken area for containing the plastic cover. The substance passes through the first hollow area of the circuit board and the second hollow area of the plastic cover.

Description

200847476 九、發明說明： 【發明所屬之技術領域】 本發明是有關於-種發光二極體裝置，且特別是有關 於一種發光二極體裝置之封裝結構。200847476 IX. Description of the Invention: [Technical Field] The present invention relates to a light-emitting diode device, and more particularly to a package structure for a light-emitting diode device.

W 【先前技術】 -隨著技術的進步，發光二極體(LightEmittingDiode; LED)具有玉作電壓低、耗電量小、發光效率高、反應時間 短:光色純、結構牢固、抗衝擊、耐振動、性能穩定可靠、 41¼、體積小及成本低料點，因而其應用領域也越來 越廣泛，例如：大面積圖文顯示全彩屏、狀態指示、標誌 恥明、信號顯示、液晶顯示器的背光源或車内照明。 在傳統地發光二極體裝置之中，散熱材一表面承載發 光二極體片，另一表面則穿透電路基板，以與散熱基板接 觸。發光二極體所產生之熱量，則透過散熱材，消散至散 熱基板。 _ 在此傳統的發光二極體裝置之中，發光二極體晶片所 產生的熱量，僅能透過散熱材傳導至基板。隨著發光二極 體晶片功率提高，熱量產生越來越快，此單一的熱量傳導 路徑’並無法及時地消散熱量，將造成發光二極體晶片損 -壞。 - 因此需要一種新的發光二極體裝置，能夠有效地消散 發光二極體晶片之熱量。 【發明内容】 5 200847476 因此本發明之一方面就是在提供一種雙向散熱發光二 極體裝置，增加散熱路徑來有效地消散發光二極體晶片之 熱量。 依照本發明之一實施例，雙向散熱發光二極體裝置包 括一發光一極體晶片、一散熱材、一塑膠包覆件以及一電 路基板。散熱材具有承載發光二極體晶片之一本體部，以 及與本體部耦接之一延伸部。發光二極體晶片之熱量分別 透過本體部以及延伸部消散。塑膠包覆件承載並暴露延伸 部於空氣’使發光一極體晶片之熱量透過延伸部消散至空 氣。電路基板以一凹陷容納塑膠包覆件。本體部則貫穿電 路基板之一第一鏤空區域以及塑膠包覆件之一第二鏤空區 域。 本發明之另一方面提供一種雙向散熱發光二極體裝 置，增加散熱路徑以及散熱扣件來消散發光二極體晶片之 熱量。 依照本發明之另一實施例，雙向散熱發光二極體裝置 包括散熱基板、電路基板、塑膠包覆件以及散熱材。電路 基板位於散熱基板之上，且具有一第一鏤空區域。塑膠包 覆件設置於電路基板之上，具有一第二鏤空區域。散熱材 之一圓柱狀本體貫穿第一鏤空區域以及第二鏤空區域，此 散熱材之一延伸部延伸於電路基板之上，並接觸圓柱狀本 體。發光二極體晶片設置於散熱材之圓柱狀本體上。發光 二極體晶片之熱量逢過散熱材之圓柱狀本體以及延伸部， 消散至散熱基板以及外界。 上述實施例之雙向散熱發光二極體裝置，增加了散熱 200847476 材之政熱路徑’使發光二極體晶片所產生之熱量，能更有 效地透過散熱材消散，避免損壞發光二極體晶片。 【實施方式】 以下實施例之雙向散熱發光二極體裝置，發光二極體 晶片所產生之熱量，能夠分別透過散熱材之本體部以及延 伸部’消散至散熱基板以及外界。更可增加散熱扣件來扣 合散熱材之延伸部以及散熱基板，使發光二極體、散熱材 以及散熱基板密合，增加散熱效率。 請同時參照第1圖以及第2圖，其係分別繪示本發明 一貝她例之雙向散熱發光二極體裝置立體圖以及剖面圖。 雙向散熱發光二極體裝置包括散熱材105,以及設置於散熱 材105上的發光二極體晶片211。散熱材1〇5包括承載發光 二極體晶片211之本體部l〇5a，以及與本體部l〇5a耦接之 延伸部105b。散熱材105之材質可為金屬或陶瓷。 散熱材105之本體部l〇5a呈一圓柱狀，並具有凹陷 119。發光一極體晶片211設置於本體部i〇5a之凹陷119 上’然後由透鏡結構101包覆發光二極體晶片211以及本 體部105a。透鏡結構1〇1之材質為聚碳酸酯 (Polycarbonate)、矽樹脂（silicone)或樹脂。塑膠環117環繞 透鏡結構101，使透鏡結構1〇1呈現圓形或橢圓形。 雙向散熱發光二極體裝置更包含電路基板1〇7以及設 置於電路基板107上的塑膠包覆件1〇3。電路基板1〇7具有 凹陷123，來容納塑膠包覆件103。塑膠包覆件1〇3承載散 熱材105之延伸部i〇5b，並將延伸部i〇5b之一部份105, 200847476 暴露於空氣。散熱材105之本體部105a，貫穿塑膠包覆件 103之第二鏤空區域1〇3a以及電路基板ι〇7之第一鏤空區 域 107a 〇 由於發光二極體晶片211設置於散熱材1〇5上，發光 一極體晶片211之熱量因而可透過散熱材1 〇5之延伸部 105b消散至空氣，或是透過散熱材105之本體部l〇5a往外 界傳遞。此外，發光二極體晶片211上之電極U1則可透 過導線121耦接電路基板107上之電路1〇9。 請同時參閱第3圖以及第4圖，其係分別繪示本發明 另一實施例之雙向散熱發光二極體裝置立體圖以及剖面 圖。雙向散熱發光二極體裝置除了上述之結構以外，還可 選擇性地加入梯狀散熱扣件313以及散熱基板315。 政熱基板315承載第1圖所繪示之雙向散熱發光二極 體裝置。發光二極體晶片211之熱量透過散熱材105之本 體部105a，傳導至散熱基板315，再藉由散熱基板315消 散。散熱基板315之材質可為金屬或非金屬。亦可使用印 刷電路板、金屬核心印刷電路板（Metal Core PCB; MCPCB) 或陶瓷基板做為散熱基板315。· 梯狀散熱扣件313扣合於散熱材105之延伸部1〇5b以 及散熱基板315。除了透過本體部1〇5a傳導至散熱基板 315，發光二極體晶片211之熱量亦可透過延伸部丨〇5b以 及梯狀政熱扣件313，傳導至外界。此外，由於梯狀散熱扣 件313同時黏著於散熱材105、塑膠包覆件1〇3、電路基板 107以及散熱基板315，因而提供了下壓力使散熱材1〇5、 塑膠包覆件103、電路基板107以及散熱基板315之間密 200847476 合，發光二極體晶片之熱量能夠更有效率地傳導至散熱基 板或外界。梯狀散熱扣件313之材質為金屬或非金屬。 綜上所述’發光二極體晶片所產生之熱量，能夠分別 透過散熱材之本體部以及延伸部，消散至散熱基板以及外 界。更可增加散熱扣件來扣合於散熱材之延伸部以及散熱 基板，使發光二極體、散熱材以及散熱基板密合，增加散 熱效率。 維然本發明已以實施例揭露如上，然其並非用以限定 本發明，任何在本發明所屬技術領域中具有通常知識者， 在不脫離本發明之精神和範圍内，t可作各種之更動盘满 飾，因此本發明之保護範时視後附之申請專利範圍所界 定者為準。 【圖式簡單說明】 明之±述和其他目_、特徵、優點與實施例 如下： b更月顯易僅，所附圖式之詳細說明 體 裝置=圖圖係繪示本發明_實施例之雙向散熱發光二極 之雙向散熱發光二極體 第2圖係繪示本發明一實施例 裝置剖面圖。 二極 第3圖係緣示本發明一途^ 體裝置立體圖。 a例之雙向散熱發光 之雙向散熱發光二極 弟4圖係繪示本發明另-實施例 體裝置剖面圖。 200847476 【主要元件符號說明】 101 :透鏡結構 109 ··電路 103 :塑膠包覆件 111 :電極 103a ··第二鏤空區域 117 :塑膠環 105 :散熱材 119 :凹陷 105a :本體部 121 :導線 105b :延伸部 123 ：凹陷 105’ ··延伸部之部分 211 :發光二極體晶片 107 :電路基板 313 :梯狀散熱扣件 107a ··第一鏤空區域 315 :散熱基板 10W [Prior Art] - With the advancement of technology, Light Emitting Diode (LED) has low voltage, low power consumption, high luminous efficiency and short reaction time: pure light color, firm structure and impact resistance. Resistant to vibration, stable and reliable performance, 411⁄4, small size and low cost, so its application fields are more and more extensive, such as: large-area graphic display full color screen, status indication, logo shame, signal display, liquid crystal display Backlight or interior lighting. In the conventional light-emitting diode device, one surface of the heat dissipating material carries the light-emitting diode piece, and the other surface penetrates the circuit substrate to contact the heat-dissipating substrate. The heat generated by the light-emitting diode is dissipated to the heat-dissipating substrate through the heat-dissipating material. _ In this conventional light-emitting diode device, the heat generated by the light-emitting diode wafer can only be conducted to the substrate through the heat-dissipating material. As the power of the LED is increased, the heat generation is getting faster and faster, and this single heat conduction path does not dissipate heat in time, which will cause damage to the LED film. - There is therefore a need for a new light emitting diode device that effectively dissipates the heat of the light emitting diode chip. SUMMARY OF THE INVENTION 5 200847476 It is therefore an aspect of the present invention to provide a two-way heat-dissipating light-emitting diode device that increases the heat dissipation path to effectively dissipate heat from the light-emitting diode chip. According to an embodiment of the invention, the bidirectional heat-dissipating light-emitting diode device comprises a light-emitting monopole wafer, a heat dissipating material, a plastic covering member and a circuit substrate. The heat dissipating material has a body portion carrying the LED chip and an extension portion coupled to the body portion. The heat of the light-emitting diode chip is dissipated through the body portion and the extension portion, respectively. The plastic cover carries and exposes the extension to the air' to dissipate heat from the illuminating monopole wafer through the extension to the air. The circuit substrate receives the plastic covering member in a recess. The body portion extends through one of the first hollow regions of the circuit substrate and a second hollow region of the plastic cover. Another aspect of the present invention provides a bidirectional heat-dissipating light-emitting diode device that increases heat dissipation paths and heat-dissipating fasteners to dissipate heat from the light-emitting diode chip. According to another embodiment of the present invention, a two-way heat-dissipating light-emitting diode device includes a heat-dissipating substrate, a circuit substrate, a plastic covering member, and a heat dissipating material. The circuit substrate is located above the heat dissipation substrate and has a first hollow region. The plastic wrapper is disposed on the circuit substrate and has a second hollowed out area. One of the heat dissipating materials penetrates the first hollow region and the second hollow region, and one of the heat dissipating portions extends over the circuit substrate and contacts the cylindrical body. The light emitting diode chip is disposed on the cylindrical body of the heat dissipation material. The heat of the light-emitting diode chip is dissipated to the heat-dissipating substrate and the outside by the cylindrical body and the extension of the heat-dissipating material. The two-way heat-dissipating light-emitting diode device of the above embodiment increases the heat dissipation of the material of the light-emitting diode. The heat generated by the light-emitting diode chip can be more effectively dissipated through the heat-dissipating material to avoid damage to the light-emitting diode chip. [Embodiment] In the two-way heat-dissipating diode device of the following embodiment, the heat generated by the light-emitting diode chip can be dissipated to the heat-dissipating substrate and the outside through the main body portion and the extending portion of the heat-dissipating material. Moreover, the heat dissipation fastener can be added to fasten the extension portion of the heat dissipation material and the heat dissipation substrate, so that the light emitting diode, the heat dissipation material and the heat dissipation substrate are closely adhered to increase the heat dissipation efficiency. Please refer to FIG. 1 and FIG. 2 simultaneously, which are respectively a perspective view and a cross-sectional view of a two-way heat-dissipating light-emitting diode device of the present invention. The two-way heat-dissipating light-emitting diode device includes a heat-dissipating material 105, and a light-emitting diode wafer 211 disposed on the heat-dissipating material 105. The heat dissipating material 1〇5 includes a body portion 10a carrying a light-emitting diode wafer 211, and an extension portion 105b coupled to the body portion 10a. The material of the heat dissipation material 105 may be metal or ceramic. The body portion 10a of the heat dissipating material 105 has a cylindrical shape and has a recess 119. The light-emitting diode wafer 211 is disposed on the recess 119 of the body portion i〇5a' and then the light-emitting diode wafer 211 and the body portion 105a are covered by the lens structure 101. The material of the lens structure 1〇1 is polycarbonate, silicone or resin. The plastic ring 117 surrounds the lens structure 101 such that the lens structure 1〇1 is circular or elliptical. The two-way heat-dissipating light-emitting diode device further includes a circuit substrate 1〇7 and a plastic covering member 1〇3 disposed on the circuit substrate 107. The circuit substrate 1?7 has a recess 123 for accommodating the plastic covering member 103. The plastic covering member 1〇3 carries the extension i〇5b of the heat radiating material 105 and exposes a portion 105, 200847476 of the extending portion i〇5b to the air. The main body portion 105a of the heat dissipating material 105 passes through the second hollow region 1〇3a of the plastic covering member 103 and the first hollow region 107a of the circuit substrate 〇7. The light emitting diode wafer 211 is disposed on the heat dissipating material 1〇5. The heat of the light-emitting one-pole wafer 211 can be dissipated to the air through the extending portion 105b of the heat-dissipating material 1 〇5 or transmitted to the outside through the body portion 10b of the heat-dissipating material 105. In addition, the electrode U1 on the LED chip 211 can be coupled to the circuit 1〇9 on the circuit substrate 107 via the wire 121. Please refer to FIG. 3 and FIG. 4 simultaneously, which are respectively a perspective view and a cross-sectional view of a two-way heat-dissipating light-emitting diode device according to another embodiment of the present invention. In addition to the above structure, the two-way heat-dissipating light-emitting diode device can selectively incorporate the ladder-shaped heat-dissipating fastener 313 and the heat-dissipating substrate 315. The thermal substrate 315 carries the two-way heat-dissipating diode device shown in FIG. The heat of the light-emitting diode wafer 211 is transmitted to the heat dissipation substrate 315 through the body portion 105a of the heat dissipation material 105, and is dissipated by the heat dissipation substrate 315. The material of the heat dissipation substrate 315 may be metal or non-metal. A printed circuit board, a metal core printed circuit board (MCPCB) or a ceramic substrate can also be used as the heat dissipation substrate 315. The ladder-shaped heat dissipation member 313 is fastened to the extending portion 1〇5b of the heat dissipation member 105 and the heat dissipation substrate 315. In addition to being conducted to the heat dissipation substrate 315 through the body portion 1a, the heat of the LED chip 211 can be conducted to the outside through the extension portion b5b and the ladder-shaped heat-retaining fastener 313. In addition, since the ladder-shaped heat dissipation member 313 is simultaneously adhered to the heat dissipation material 105, the plastic cover member 1〇3, the circuit substrate 107, and the heat dissipation substrate 315, a downward pressure is provided to cause the heat dissipation material 1〇5, the plastic cover member 103, The circuit board 107 and the heat dissipation substrate 315 are densely connected to each other, and the heat of the light-emitting diode chip can be more efficiently conducted to the heat dissipation substrate or the outside. The material of the ladder heat dissipation member 313 is metal or non-metal. In summary, the heat generated by the light-emitting diode wafer can be dissipated to the heat-dissipating substrate and the outer space through the body portion and the extending portion of the heat-dissipating material, respectively. Moreover, the heat dissipation fastener can be added to be fastened to the extension portion of the heat dissipation material and the heat dissipation substrate, so that the light emitting diode, the heat dissipation material and the heat dissipation substrate are closely adhered to increase the heat dissipation efficiency. The present invention has been disclosed in the above embodiments, but it is not intended to limit the present invention. Any one of ordinary skill in the art to which the present invention pertains can be variously modified without departing from the spirit and scope of the present invention. The disk is full, and therefore the protection of the present invention is defined by the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS The following is a description of the invention and the other aspects, features, advantages, and implementations. For example, the following is a detailed description of the present invention. The two-way heat-dissipating two-pole two-way heat-dissipating light-emitting diode is a cross-sectional view showing an apparatus according to an embodiment of the present invention. The two-pole diagram is a perspective view of a device according to the present invention. The two-way heat-dissipating light-emitting diode of the two-phase heat-dissipating light is a cross-sectional view of another embodiment of the present invention. 200847476 [Description of main component symbols] 101: Lens structure 109 · Circuit 103: Plastic covering member 111: Electrode 103a · Second hollow region 117: Plastic ring 105: Heat dissipating material 119: Recessed 105a: Main body portion 121: Conductor 105b : extension portion 123 : recess 105 ′ · portion 211 of extension portion : light-emitting diode wafer 107 : circuit substrate 313 : ladder-shaped heat dissipation fastener 107 a · first hollow region 315 : heat dissipation substrate 10

Claims (1)

200847476 十、申請專利範圍： 1·一種雙向散熱發光二極體裝置，包含： 一發光二極體晶片； 放熱材’具有承載該發光二極體晶片之一本體部， 以及與該本體部搞接之一延伸部，該發光二極體晶片之熱 里分別透過該本體部以及該延伸部消散； 一塑膠包覆件，承載並暴露該延伸部於空氣，使該發 光一極體晶片之熱量透過該延伸部消散至空氣；以及 一電路基板，以一凹陷容納該塑膠包覆件，該本體部 則貝牙該i路基板之—第_鏤^區域以及該塑膠包覆件之 一第二鏤空區域。 2·如申請專利範圍第1 裝置，更包含一透鏡結構， 及該本體部。 項所述之雙向散熱發光二極體 藉以包覆該發光二極體晶片以 3·如申請專利範圍第2 裝置，其中該透鏡結構之材 石夕樹脂（silicone)或樹脂。 項所述之雙向散熱發光二極體 貝為聚碳酸酯（Polycarbonate)、 塑膠環以環燒該透鏡 4·如申請專利範圍第2 裝置，更包含 $所述之雙向散熱發光二極體 結構 5·如申請專利範圍第i ^戶斤述之雙向散熱發光二極體 200847476 裝置，其中該本體部呈一圓柱狀，並具有一凹陷，該發光 一極體晶片則設置於該本體部之該凹陷上。 6·如申請專利範圍第1項所述之雙向散熱發光二極體 、裝置，其中該發光二極體晶片之複數個電極係透過複數條 - ‘線笔性連接該電路基板上之電路。 # 7·如申請專利範圍第1項所述之雙向散熱發光二極體 衣置，其中該散熱材之材質為金屬或陶瓷。 8· 一種雙向散熱發光二極體裝置，包含： 一散熱基板； 一電路基板，位於該散熱基板之上，且具有一第一鏤 空區域； 一塑膠包覆件，設置於該電路基板之上，具有一第二 縷空區域； IP 一散熱材，該散熱材之一圓柱狀本體貫穿該第一鏤空 區域以及該第二鏤空區域，該散熱材之一延伸部延伸於該 塑膠包覆件之上，並接觸該圓柱狀本體；以及 發光一極體晶片，設置於該散熱材之該圓柱狀本體 上’該發光二極體晶片之熱量，透過該散熱材之圓柱狀本 體以及該延伸部，消散至該散熱基板以及外界。 9·如申請專利範圍第8項所述之雙向散熱發光二極體 裝置，更包含一梯狀散熱扣件，扣合於該散熱材之該延伸 12 200847476 部以及該散熱基板，該發光二極體之熱量透過該延伸部以 及該梯狀散熱扣件消散至該散熱基板以及外界。 10·如申請專利範圍第9項所述之雙向散熱發光二極體 裝置’其中該散熱基板以及該梯狀散熱扣件之材質為金屬 或非金屬。 11·如申請專利範圍第8項所述之雙向散熱發光二極體 裝置，其中該散熱基板為印刷電路板、金屬核心印刷電路 板（Metal Core PCB ; MCPCB )或陶瓷基板。 12.如申請專利範圍第8項所述之雙向散熱發光二極體 裝置’更包含一透鏡結構，設置於該散熱材之上，並包覆 該發光二極體晶片以及該圓柱狀本體。 13·如申請專利範圍第12項所述之雙向散熱發光二極 體裝置，其中該透鏡結構之材質為聚碳g曼酯 (Polycarbonate)、石夕樹脂（siiic〇ne)或樹脂。 14·如申請專利範圍第12項所述之雙向散熱發光二極 體裝置’更包含一塑膠環，設置於該散熱材之上以環繞該 透鏡結構。 15·如申請專利範圍第8項所述之雙向散熱發光二極體 裝置’其中該發光二極體晶片設置於該圓柱狀本體之一凹 13 200847476 陷上。 16·如申請專利範圍第8項所述之雙向散熱發光二極體 & i H該發光二極體晶片之複數個電極係透過複數條 ‘線電性連接該電路基板上之電路。 17·如申請專利範圍第8項所述之雙向散熱發光二極體 Φ 衣置’其中該散熱材之材質為金屬或陶瓷。200847476 X. Patent application scope: 1. A two-way heat-dissipating light-emitting diode device comprising: a light-emitting diode wafer; a heat-dissipating material having a body portion carrying the light-emitting diode chip, and engaging with the body portion An extension portion, wherein the heat of the LED chip is dissipated through the body portion and the extension portion; a plastic covering member that carries and exposes the extension portion to the air to transmit heat of the light emitting diode chip The extension portion is dissipated to the air; and a circuit substrate receives the plastic covering member in a recess, the body portion is a second region of the i-way substrate and the second hollow of the plastic covering member region. 2. The device of claim 1, further comprising a lens structure and the body portion. The two-way heat-dissipating light-emitting diode of the present invention is used to coat the light-emitting diode chip to a device according to the second aspect of the patent application, wherein the lens structure is made of silicon or resin. The two-way heat-dissipating diode of the present invention is a polycarbonate (Polycarbonate), a plastic ring to anneal the lens 4, as in the second device of the patent application, and further comprises the two-way heat-dissipating diode structure 5 The apparatus of claim 2, wherein the body portion has a cylindrical shape and has a recess, and the light-emitting one-pole wafer is disposed in the recess of the body portion. on. 6. The two-way heat-dissipating light-emitting diode according to claim 1, wherein the plurality of electrodes of the light-emitting diode chip pass through a plurality of wires - the circuit is electrically connected to the circuit board. #7· The two-way heat-dissipating light-emitting diode device according to claim 1, wherein the heat-dissipating material is made of metal or ceramic. A two-way heat-dissipating light-emitting diode device, comprising: a heat-dissipating substrate; a circuit substrate disposed on the heat-dissipating substrate and having a first hollow region; a plastic covering member disposed on the circuit substrate Having a second hollow region; an IP heat dissipating material, a cylindrical body of the heat dissipating material penetrating the first hollow region and the second hollow region, and an extension portion of the heat dissipating material extends over the plastic covering member And contacting the cylindrical body; and emitting a polar body wafer, the heat of the light emitting diode chip disposed on the cylindrical body of the heat dissipating material, passing through the cylindrical body of the heat dissipating material and the extending portion, dissipating To the heat sink substrate and the outside world. 9. The two-way heat-dissipating light-emitting diode device of claim 8, further comprising a ladder-shaped heat-dissipating fastener, which is fastened to the extension 12 200847476 of the heat-dissipating material and the heat-dissipating substrate, the light-emitting diode The heat of the body is dissipated to the heat dissipation substrate and the outside through the extension portion and the ladder heat dissipation member. 10. The two-way heat-dissipating diode device of claim 9, wherein the heat-dissipating substrate and the ladder-shaped heat-dissipating member are made of metal or non-metal. 11. The two-way heat-dissipating diode device according to claim 8, wherein the heat-dissipating substrate is a printed circuit board, a metal core printed circuit board (MCPCB) or a ceramic substrate. 12. The bidirectional heat-dissipating light-emitting diode device of claim 8 further comprising a lens structure disposed on the heat-dissipating material and covering the light-emitting diode wafer and the cylindrical body. The two-way heat-dissipating light-emitting diode device according to claim 12, wherein the lens structure is made of polycarbonate, siiic resin or resin. 14. The two-way heat-dissipating diode device of claim 12 further comprising a plastic ring disposed over the heat sink to surround the lens structure. The two-way heat-dissipating diode device as described in claim 8, wherein the light-emitting diode chip is disposed on a recess 13 200847476 of the cylindrical body. 16. The two-way heat-dissipating light-emitting diode according to claim 8 of the invention, wherein the plurality of electrodes of the light-emitting diode chip are electrically connected to the circuit on the circuit substrate through a plurality of wires. 17. The two-way heat-dissipating light-emitting diode Φ according to claim 8 of the patent application, wherein the heat-dissipating material is made of metal or ceramic.
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EP2942825A1 (en) 2014-05-08 2015-11-11 Guan-Jie Luo White light emitting diode, manufacturing method and packaging material thereof

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