JP2012256677A - Light-emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To inexpensively and effectively prevent accumulation of snow on a light source device without using separate snow melting means such as a heater.SOLUTION: A light-emitting device includes: a mounting substrate which has a first surface and a second surface located on a rear surface side of the first surface and in which a plurality of light-emitting elements which emit light in a direction approximately vertical to the first surface are mounted on the first surface; a plurality of heat transfer members which are provided between the plurality of light-emitting elements on the first surface of the mounting substrate and formed of a metallic material; and a protective member provided so as to cover the heat transfer member and the light-emitting elements. Heat generated in the light-emitting elements is induced to the protective member via the mounting substrate and the heat transfer member.

Description

  The present invention relates to a light emitting device, and more particularly to a light emitting device used outdoors.

  In recent years, light-emitting devices that use light-emitting diodes as a light source have become widespread by taking advantage of their low power consumption and ease of maintenance and management.

  However, when a light-emitting device using a light-emitting diode, for example, a signal lamp, is used in a heavy snowfall area, the snow that has landed cannot be melted due to its low power consumption compared to a device using a light bulb, and visibility is improved. There was a problem of causing deterioration.

  In addition, when a light-emitting device using a light-emitting diode is used for a street lamp, there is a problem that illumination efficiency is reduced due to snowfall.

  As a conventional technique that addresses such a problem, there is a light-emitting device disclosed in Patent Document 1.

  In the traffic light as the light emitting device described in Patent Document 1, a heat generating element that generates heat by energization is provided on a transparent cover that covers a light emitting element in which a plurality of LEDs are arranged, and the temperature of the transparent cover is increased, so that the snow attached to the transparent cover To melt.

  However, in the prior art described in Patent Document 1, there is a problem that power consumption increases because power supply for melting snow is required separately. In addition, it is necessary to produce a special cover with a built-in heating element, and there is a problem that the cost increase is inevitable.

  As a prior art in which a separate snow melting means is excluded from the light emitting device of Patent Document 1, there is a light emitting device of Patent Document 2.

  In the illuminating lamp of Patent Document 2, the heat generated in the light emitting unit composed of a plurality of LEDs is formed of a heat conductive material covering the light emitting unit via a heat transfer support unit disposed on the back surface of the light emitting unit. By transmitting to the hood, it prevents snow on the hood.

  However, the light-emitting device of Patent Document 2 relates to a light-emitting device with a hood, and is intended to prevent snow on the hood to the last. Therefore, it does not prevent snow on the front surface of the light emitting device surrounded by the hood, that is, the light emitting surface, and there is no effect at all.

  Therefore, the present invention differs in its purpose and technical problem.

JP 2009-145952 A JP 2009-123364 A

In view of the background art as described above, the present invention effectively prevents snow on the light emitting surface of the light source device at low cost and with low power consumption without using a separate snow melting means such as a heater. The purpose is that.

  In order to solve the above-described problems and achieve the object, a light-emitting device of the present invention is a mounting substrate having a first surface and a second surface located on the back surface side of the first surface, A mounting substrate on which a plurality of light emitting elements emitting light in a direction substantially perpendicular to the first surface is mounted on one surface, and the plurality of light emitting elements on the first surface of the mounting substrate. A heat transfer member provided between the heat transfer member and a protective member provided so as to cover the heat transfer member and the light emitting element, and heat generated in the plurality of light emitting elements. It is characterized in that heat is conducted to the protective member via the mounting substrate and the heat transfer member.

  In order to solve the above-described problems and achieve the object, in the light-emitting device of the present invention, the heat transfer member has a plate shape that is substantially the same shape as the mounting substrate, and the light-emitting element corresponds to each of the plurality of light-emitting elements. It has a plurality of through-holes surrounding the element, and is disposed so as to overlap the mounting substrate.

  In order to solve the above-described problems and achieve the object, the light-emitting device of the present invention includes a first surface, a second surface located on the back surface side of the first surface, and the first surface from the first surface. A mounting substrate formed of a thermally conductive material having a plurality of through holes penetrating through the second surface, and a second so as to emit light through the through hole from the second surface side to the first surface side A plurality of light emitting elements mounted on the surface of the substrate, and a protective member provided to cover the mounting substrate and the through hole, and heat generated in the plurality of light emitting elements is transmitted through the mounting substrate. The protective member is made to conduct heat.

  In order to solve the above-described problems and achieve the object, the light-emitting device of the present invention is characterized in that a heat insulating member is provided in contact with the second surface of the mounting substrate.

  In order to solve the above-described problems and achieve the object, the light-emitting device of the present invention includes a GX53 base.

  In order to solve the above-described problems and achieve the object, the light-emitting device of the present invention includes an AC drive circuit.

  According to the above light emitting device, heat generated when the light emitting element is turned on can be efficiently conducted to the protective member, that is, the light emitting surface on the front surface of the light emitting device. Therefore, even if this light-emitting device is installed outdoors in a heavy snowy area and snow adheres to the light-emitting surface of the light-emitting device, the snow melting action is achieved quickly, so that it is possible to effectively prevent snow accretion.

  In addition, in the present invention, since the heat generation of the light emitting diode is actively utilized, no additional snow melting means such as a heater is used, so that no additional power is required during snow melting and standby. Therefore, the power consumption of the light emitting device as a whole is not increased, and an excellent effect that it is advantageous for cost reduction can be achieved.

  Moreover, according to said light-emitting device, since the heat-transfer member is formed in one plate shape, there exists an effect that manufacture of an assembly process is simplified and cost reduction becomes more advantageous.

  Further, according to the above light emitting device, the heat generated from the light emitting element is directly conducted to the protective member through the mounting substrate of the light emitting element, so that the heat transfer efficiency is further improved and the snow melting action is more effectively performed. The effect that it can be made.

  In addition, since the path from the light emitting element to the protection member is formed of a single material, the manufacturing is simplified, and the cost reduction is further advantageous.

  Further, according to the above light emitting device, since the heat insulating member is arranged on the back surface of the mounting substrate, the heat transferred from the light emitting element to the mounting substrate is the back surface side of the mounting substrate, that is, the side opposite to the light emitting surface. Heat transfer by heat conduction, convection and heat radiation. Therefore, since heat can be efficiently conducted to the protective member, that is, the light emitting surface of the light emitting device, the effect of making snow melting more effective can be achieved.

  Further, according to the above light emitting device, since the GX53 base, which is a standard of a lighting fixture suitable for a thin lighting unit, is adopted, the device can be made small and thin, and versatility in use is also possible. The effect of increasing can be produced.

  In addition, according to the above light emitting device, since the LED driving circuit supplied with an AC commercial power supply, that is, a so-called AC driving circuit is built in, the light emitting device can be directly connected to the AC power source, Since it is not necessary to mount an additional circuit such as a DC converter, the light emitting device can be reduced in size and thickness.

It is a top view of the light-emitting device concerning Embodiment 1 of the present invention. It is sectional drawing of the light-emitting device concerning Embodiment 1 of this invention. It is a disassembled perspective view of the light-emitting device concerning Embodiment 1 of this invention. It is explanatory drawing which shows the heat conduction path | route of the light-emitting device concerning Embodiment 1 of this invention. It is sectional drawing of the light-emitting device concerning Embodiment 2 of this invention. It is sectional drawing of the light-emitting device concerning Embodiment 3 of this invention. (A) It is the socket of the light-emitting device concerning Embodiment 4 of this invention. (B) It is a back perspective view of the light-emitting device concerning Embodiment 4 of this invention. It is a circuit diagram of the light-emitting device concerning Embodiment 5 of this invention. It is a perspective view of the light-emitting device concerning Embodiment 6 of this invention. It is a back surface perspective view of the light-emitting device concerning Embodiment 6 of this invention.

  The purpose of the present invention is to efficiently transfer the heat generated from the light emitting element to the front surface of the light emitting device, that is, the light emitting surface, and to melt snow that has landed on the light emitting surface of the light emitting device. Embodiments that realize the above will be described in detail with reference to the drawings.

  In the following description, the same parts and components are denoted by the same reference numerals. Therefore, since their names and functions are also the same, detailed description thereof will not be repeated.

  Moreover, in the following drawings, the dimensional ratio of each component is exaggerated as appropriate according to the description, and does not necessarily indicate the actual dimensional ratio.

  1 is a plan view of the light emitting device 100 according to the present embodiment, FIG. 2 is a cross-sectional view taken along line AA of FIG. 1 of the light emitting device 100 according to the present embodiment, and FIG. 3 is a light emitting device 100 according to the present embodiment. FIG.

In FIG. 1, 110 is an opening in which a light emitting element is disposed, 120b is a heat conductive sheet, 130 is a protective member, and 140 is a case. Although the protective member 130 is on the entire front surface of the light emitting device 100, FIG. 1 shows a partially cutaway state so that the internal configuration can be understood.

  2 and 3, 120 a and 120 b are heat conductive sheets, 210 is a light emitting element, 212 is solder, 214 a and b are wiring layers of an aluminum base substrate, 220 is an aluminum base substrate, 222 is a screw, and 230 is a heat transfer member. , 240 is a heat insulating member, 250 is a light emitting device drive circuit, 310 is a packing, and 330 is a lid. Moreover, the white upward arrow indicates the emission direction of the light emitted from the light emitting element.

  Referring to FIG. 2, a plurality of light emitting elements 210 are mounted on an aluminum base substrate 220, and each light emitting element 210 emits light upward in the drawing as indicated by an outline arrow. In this embodiment, the aluminum base substrate constitutes the mounting substrate.

  The aluminum base substrate is a substrate in which an aluminum metal base and a copper foil wiring layer are integrated via an insulating layer, and is a substrate having excellent thermal conductivity. The thickness of the aluminum base substrate is, for example, about 1 to 2 mm.

As the light emitting element, for example, SMD (Surface Mount) enclosed in a package.
Devices), that is, surface-mount type light emitting diodes (LEDs) can be suitably used.

  The LED package is directly fixed to the aluminum base portion of the aluminum base substrate 220 by soldering or bonding using a heat conductive adhesive. Examples of the heat conductive adhesive include epoxy-based, silicone-based adhesive, AuSn paste, and the like.

  In the case of this mounting form, a package that emphasizes heat dissipation is used, but a normal resin package may be used. The reason why the package having excellent heat dissipation is used is that the junction temperature of the LED element is not increased.

  A terminal (not shown) of the light emitting element 210 is soldered and connected to the wiring layer 214a with solder 212.

  With reference to FIGS. 2 and 3, heat transfer member 230 is provided on aluminum base substrate 220. As will be described later, the heat transfer member 230 is a member for guiding the heat generated in the light emitting element 210 and conducted through the aluminum base substrate 220 to the protection member 130.

  The thickness of the heat transfer member 230 is, for example, about 2 to 4 mm in consideration of the light distribution angle of the LED and the like.

  As shown in FIG. 3, the heat transfer member 230 is formed by providing a plurality of substantially circular openings 110 corresponding to the light emitting elements 210 on a substantially circular plate. As a material of the heat transfer member 230, a metal having excellent thermal conductivity, such as an aluminum plate, is used.

  Here, the number of openings 110 is normally the same as the number of light emitting elements 210, and one opening 110 is arranged corresponding to one light emitting element 210. However, the number of openings 110 is not limited to this. For example, it is possible to provide more than the number of light emitting elements 210, and it is possible to mount components such as a chip resistor and a chip capacitor in the vacant openings.

  In addition, by arranging a plurality of light emitting elements 210 corresponding to some openings 110, the number of openings 110 can be smaller than the number of light emitting elements 210.

  In the above description, the heat transfer member 230 has been described as a single plate-like member having an opening. However, the present invention is not limited to this, and an arbitrary shape and structure can be adopted.

  For example, a plurality of plate-like louvers may be arranged in parallel and in one direction on the aluminum base substrate 220 so as to protrude perpendicularly to the mounting surface of the aluminum base substrate 220, and the light emitting element 210 may be disposed therebetween. A light emitting element may be arranged in a region surrounded by a louver with a mesh shape. Further, the heat transfer member 230 does not need to be provided over the entire surface of the aluminum base substrate 220, and may be provided in part.

  The heat transfer member 230 has been described as a structure in which the heat conductive sheet 120a is sandwiched between the aluminum metal base of the aluminum base substrate 220, but is not limited thereto. For example, a heat conductive sheet 120a may be sandwiched between an aluminum metal base, an insulating layer, and a copper foil wiring layer of the aluminum base substrate 220.

  The aluminum base substrate 220 and the heat transfer member 230 are integrally fixed by screws 222 disposed at appropriate positions.

  The fixing of the aluminum base substrate 220 and the heat transfer member 230 is not limited to screws, and may be fixed to each other by appropriate soldering, adhesion with a heat conductive adhesive, or the like.

  Referring to FIGS. 2 and 3, a heat conductive sheet may be provided or heat conductive grease may be applied between aluminum base substrate 220 and heat transfer member 230. The heat conductive sheet reduces the thermal resistance by increasing the contact area between the aluminum base substrate 220 and the heat transfer member 230, and the heat generated in the light emitting element 210 is efficiently transferred to the heat transfer member 230 via the aluminum base substrate 220. It is a sheet to guide well. As the heat conductive sheet, a silicone rubber sheet, a sheet filled with a ceramic filler in silicone, and the like can be suitably used.

  The heat conductive sheet 120a is provided with a hole corresponding to the opening 110 provided in the heat transfer member 230 so that the light emitted from the light emitting element 210 is not obstructed.

  The thermal conductive sheet can be replaced with thermal conductive grease or the like according to the thermal conductive design, and these sheets or grease may be omitted.

  Again referring to FIGS. 2 and 3, a protective member 130 is provided on the heat transfer member 230. As the protective member 130, it is preferable to select a material having good thermal conductivity, and glass having high thermal conductivity is suitable. In addition, since light transmission is required, a light-transmitting resin such as polycarbonate or acrylic can be used.

  The protective member 130 is provided by the aluminum base substrate 220 and the heat transfer member 230 so as to cover the opening 110 formed so as to surround the light emitting element 210, and serves to seal the opening 110 and protect the light emitting element 210 from the outside air. It plays.

  The protective member 130 may be fixed integrally with the heat transfer member 230 by a packing 310 that prevents intrusion of water or the like, or may be fixed to the heat transfer member (or to the heat conductive sheet 120b) with a heat conductive adhesive. It may be bonded and fixed.

  This protective member 130 is in direct contact with the outside air as the light emitting surface of the light emitting device 100.

With reference to FIG. 2 and FIG. 3, a heat conductive sheet 120 b is provided between the heat transfer member 230 and the protection member 130. The heat conductive sheet 120b includes the heat transfer member 230 and the protection member 13.
It improves the heat conduction with zero and lowers the thermal resistance. This is a sheet for efficiently conducting heat generated in the light emitting element 210 to the protective member 130 via the aluminum base substrate 220 and the heat transfer member 230.

  As the heat conductive sheet 120b, the same material as that of the above-described heat conductive sheet 120a can be suitably used.

  Similarly to the heat conductive sheet 120a, a hole is formed in the heat conductive sheet 120b corresponding to the opening 110 provided in the heat transfer member 230 so as not to hinder the progress of light emitted from the light emitting element 210. is there.

  The thermal conductive sheet 120b can be replaced with thermal conductive grease or the like according to the thermal conductive design, and these sheets or grease may be omitted.

  Referring to FIG. 2, light emitting device drive circuit 250 is mounted on the back surface of aluminum base substrate 220, that is, the surface opposite to the light emitting element 210 mounting surface. The light-emitting device drive circuit 250 is, for example, an LED drive circuit, so-called AC drive circuit, which is supplied with an AC power supply described later. Each component constituting the light emitting device driving circuit 250 is arranged on the wiring layer 214b. For example, a through hole (not shown) is provided in the aluminum base substrate 220, and is connected to the wiring layer 214a. Supply drive power.

  In the light emitting device of the present invention, the light emitting device driving circuit is not essential and may not be incorporated depending on the application.

  2 and 3, a heat insulating member 240 is provided on the surface of the aluminum base substrate 220 opposite to the light emitting element 210 mounting surface.

  As will be described later, the heat generated from the light emitting element 210 is laterally diffused by the aluminum base substrate 220 and guided to the heat transfer member 230. However, the heat insulating member 240 has the heat conducted to the aluminum base substrate 220. It is a member for preventing heat transfer to the opposite side of the light emitting surface in the case 140 by heat conduction, convection, and heat radiation, and enhancing heat conduction to the light emitting surface side of the light emitting device 100.

  As a material of the heat insulating member 240, a foamed plastic heat insulating material, so-called expanded polystyrene, CR (chloroprene rubber) sponge, EPDM (ethylene / propylene rubber) sponge, silicon rubber sponge, or the like can be suitably used.

  In addition, this heat insulation member 240 is additional, and may be omitted.

  2 and 3, a bowl-shaped case 140 is provided so as to cover the main body of the light emitting device 100.

  The case 140 is formed of, for example, a plastic having low thermal conductivity so that heat generated from the light emitting element 210 is not transferred to the outside through the case 140.

  The opening 110 may not be filled with anything and the inside may be an air layer, or may be sealed with a sealing resin having a high light transmittance. As the light-transmitting sealing resin, an epoxy thermosetting resin, an ultraviolet curable resin, a thermosetting silicone resin, or the like can be used.

  Next, referring to FIG. 4, the heat conduction path generated in the light emitting element 210, which is the main point of the present invention, will be described. FIG. 4 is an explanatory diagram showing a heat conduction path of the light emitting device 100.

  Since the heat generated from the light emitting element 210 is designed to reduce the thermal resistance between the light emitting element 210 and the aluminum base substrate 220 as described above, it first conducts heat downward as shown in FIG. . This is because heat is transferred upward by convection and heat radiation, but its thermal resistance is large and the upward heat flow is extremely small.

  The heat conducted downward is diffused laterally by the aluminum base substrate 220 having a uniform high thermal conductivity. The heat diffused in the lateral direction is guided to the heat transfer member 230 and is conducted from the lower surface to the upper surface of the heat transfer member 230 because the thermal resistance between the aluminum base substrate 220 and the heat transfer member 230 is small. .

  The heat guided upward by the heat transfer member 230 is conducted to the protection member 130, and as described above, a material having high thermal conductivity is selected for the protection member 130. Therefore, heat transfer to the protection member 130 is performed. The applied heat is diffused and the entire protection member 130 is heated.

  As apparent from the above description, according to the present light emitting device, the heat generated when the light emitting element is turned on can be efficiently conducted to the front surface of the light emitting device, that is, the light emitting surface. Therefore, even if this light-emitting device is installed outdoors in a heavy snowy area and snow adheres to the light-emitting surface of the light-emitting device, it can quickly melt snow, thus effectively preventing snow accretion. .

  In addition, since the light emitting device actively uses the heat generated by the light emitting diodes, no additional snow melting means such as a heater is used, so no additional power is required during snow melting. Therefore, the power consumption of the light emitting device as a whole is not increased, and an excellent effect that it is advantageous for cost reduction can be achieved.

  Furthermore, when a heat insulating member is disposed on the back surface of the mounting board, the heat transferred from the light emitting element to the mounting board is heat conduction, convection, heat radiation on the back side of the mounting board, that is, the side opposite to the light emitting surface. To be prevented. Therefore, it is possible to reduce transmission loss in which heat generated from the light emitting element is transferred to other than the protective member, and to more efficiently conduct heat to the light emitting surface of the protective member, that is, the light emitting device. The effect that the removal action can be performed effectively can be produced.

  FIG. 5 is a cross-sectional view of the light emitting device 400 according to the present embodiment.

  In FIG. 5, reference numeral 410 denotes an iron plate, and 420a and 420b denote printed circuit boards.

  Since other configurations are the same as those in the first embodiment, the same parts and components are denoted by the same reference numerals, and the description thereof is omitted.

  In the first embodiment, an aluminum base substrate is used as the mounting substrate, but in this embodiment, the iron plate 410 and the printed circuit boards 420a and 420b are used in combination.

  On the iron plate 410, a power supply wiring printed circuit board 420a of the light emitting element 210 is provided. The light emitting device driving circuit 250 is also mounted on the printed circuit board 420b.

  As the printed boards 420a and 420b, a glass epoxy board FR4, a flexible board, or the like can be used.

  The thickness of the iron plate 410 can be t2 mm, for example, and the thickness of the printed board can be t0.3 mm for a glass epoxy substrate, and t0.05 mm for a flexible substrate, for example.

  The LED as the light emitting element 210 is mounted on the printed circuit board 420a with the same technical idea as the first embodiment. The heat transfer member 230 is preferably disposed so as to directly contact the iron plate 410 by providing an opening in the printed circuit board 420. Of course, it is also possible to arrange the heat transfer member 230 on the wiring of the printed board without providing an opening in the printed board.

  Similarly to the first embodiment, the iron plate 410 and the printed board 420a are integrally screwed and fixed to the heat transfer member 230 with screws 222. Alternatively, the iron plate 410, the printed circuit board 420a, and the heat transfer member 230 may be fixed to each other by appropriate soldering, adhesion with a heat conductive adhesive, or the like.

  In this embodiment, compared with Example 1, since a combination of an inexpensive iron plate and a printed board is used as the mounting board, there is an effect that the manufacturing cost can be reduced.

  FIG. 6 is a cross-sectional view of the light emitting device 600 according to the present embodiment.

  In FIG. 6, reference numeral 610 denotes a mounting board, 620 denotes a printed board, and 630 denotes a heat conductive sheet.

  Since other configurations are the same as those in the first embodiment, the same parts and components are denoted by the same reference numerals, and the description thereof is omitted.

  In Example 1 or 2, the mounting substrate of the light emitting element and the heat transfer member are configured separately, but this embodiment is characterized in that these are formed integrally.

  For the mounting substrate 610, a metal having good thermal conductivity, for example, an aluminum plate is used, and the opening 110 is provided corresponding to the mounting position of the light emitting element 210 as in the heat transfer member 230 of FIG.

  On the lower surface of the mounting substrate 610, a printed circuit board 620 having an opening 110 having the same shape and arrangement as the mounting substrate 610 is disposed.

  In the present embodiment, as the light emitting element 210, an LED enclosed in a package, and an SMD type LED in which the light emitting surface and the soldering mounting surface are configured on the same surface can be preferably used. That is, it arrange | positions so that light may radiate | emit to the front surface, ie, the protection member 130 direction, through the opening of a printed circuit board and a mounting board.

  By configuring as in the present embodiment, the heat generated from the light emitting element 210 is thermally conducted to the mounting substrate 610, directly conducted to the protection member 130, and diffused within the surface of the protection member 130.

  As in the first embodiment, the combination of the mounting board 610 and the printed board 620 can be replaced with an aluminum base board, and the heat conductive sheet 630 may be omitted.

  The effect of the heat insulating member 240 is the same as that of the first embodiment, and this may be omitted.

  In Example 1 or 2, since the mounting substrate of the light emitting element and the heat transfer member are configured separately, there is a small amount of thermal resistance at the connection portion, and thus the light emitting element 210 to the protection member 130. The induction of heat was slightly inhibited.

  In the present embodiment, by removing those factors, heat can be more efficiently guided to the protective member 130, so that an effect of further enhancing the snow melting effect can be achieved.

  Furthermore, according to the present embodiment, since the path from the light emitting element to the protective member is formed of a single material, the manufacturing can be simplified, and the effect of further cost reduction can be achieved. .

  The present embodiment is intended to employ a GX53 base for the light emitting device.

  7A is a socket 750 that fits into the light emitting device 700 according to the present embodiment, and FIG. 7B is a rear perspective view of the light emitting device 700 according to the present embodiment.

  7A, reference numeral 760 is a socket body, 770 is a power terminal insertion hole, 780 is a fitting recess, 750 is a GX53 base, 720 is a convex part, 730 is a power terminal, 732 Is an engagement holding receiver, and 740 is a case.

  Inside the case 750, the light emitting device main body described in the first to third embodiments is accommodated.

  GX53 is a lighting device standard defined as 7004-1142-1 in the IEC (International Electrotechnical Commission) for the purpose of thinning, and in Japan, it is defined as JIS (Japanese Industrial Standard) C7709-1. ing. Hereinafter, an example in which the standard is applied to the light emitting device will be described.

  Referring to FIG. 7B, a GX53 base 710 having a convex portion 720 is provided on the back surface of the light emitting device. The protrusion 720 is formed with a circular upper surface and lower surface, and is relatively thin with a thickness of about 20 mm. A light emitting device driving circuit (the light emitting device driving circuit 250 in FIG. 2 corresponds to this) is disposed inside. It is the composition to do. For this reason, it is not necessary to provide a power supply circuit on the illuminating device main body side as in the past (that is, in this standard, only the commercial power supply is directly connected to the illuminating device main body side, and the LED drive circuit emits light. It is easy to realize thinning because the whole is flat.

  The power supply terminal 730 is a power supply terminal for supplying power to the light emitting device 700, and is connected to the light emitting device main body through an appropriate wiring system.

  The engagement holding receiving portion 732 is formed around the convex portion 720 so as to be recessed in an L shape.

  On the other hand, the socket 750 shown in FIG. 7A is usually fixed by being fitted with an opening in the ceiling or wall. The socket 750 is provided with a power terminal insertion hole 770 and a fitting recess 780 so that the power terminal 730 and the projection 720 of the light emitting device main body are fitted.

The power terminal insertion hole 770 is a so-called harpoon hole, and after being inserted, the light emitting device side is rotated to support the power terminal 730 so as not to come off. In the socket 750,
A contact fitting connected to a commercial power source (not shown) is provided, and the commercial power is supplied to the light emitting device 700 when the power terminal 730 comes into contact with the contact fitting.

  In addition, the socket 750 is provided with an engagement holding portion (not shown), and the projection 720 is engaged with the insertion recess 780 so that the socket 750 can be engaged with and disengaged from the engagement holding receiving portion 732 of the light emitting device 700. In addition, the light source device 700 is held in the socket 750.

  As described above, according to the light emitting device according to the present embodiment, since the GX53 base that is a standard of the lighting fixture is adopted, the device can be reduced in size and thickness, and other general lighting devices can be used. Can also be used in combination, so that the versatility in use can be increased.

  The present embodiment relates to a light-emitting device incorporating an LED drive circuit supplied with AC commercial power, that is, an AC drive circuit.

  FIG. 8 is a circuit diagram of the light emitting device 800 according to the present embodiment. Reference numeral 810 denotes a light emitting element group, and 820 denotes a light emitting element, for example, a light emitting diode. Reference numeral 830 denotes an AC drive circuit, which includes a diode bridge 850, a smoothing capacitor 860, and a limiting resistor 870. Reference numeral 840 represents an AC power source.

  As shown in the figure, the AC drive circuit 830 includes a diode bridge 850, and after full-wave rectification of the AC voltage of the AC power source 840 by this diode bridge, the rectified voltage is controlled by a limiting resistor 870 to generate a light emitting element group. 810 is supplied.

  In FIG. 8, the light emitting element group 810 is illustrated in which one row of light emitting elements 820 is connected in series, but the configuration of the light emitting element group is not limited to this, and an arbitrary number of light emitting elements 820 are connected in series. Further, an appropriate configuration such as connecting an arbitrary number of them in parallel is possible.

  If the number of light emitting elements connected in series is appropriately set so that the sum of the forward voltages (Vf) of the light emitting element group 810 does not exceed the rectified voltage supplied, a drive circuit with reduced power loss due to the limiting resistor can be realized. it can.

  According to the present light emitting device, the present light emitting device can be directly connected to an AC power source, and there is no need to mount an additional circuit such as an AC / DC converter in particular. The effect that it can be made can be produced.

  In the present embodiment, an example in which the present invention is applied to a traffic signal lamp will be described as an example in which the snow melting effect according to the present invention is exhibited.

  FIG. 9 is a perspective view of a traffic signal lamp 900 according to a sixth embodiment of the present invention.

  In FIG. 9, 910B, 910Y, and 910R are light emitting portions, 920 is a bag, 930 is a lid, 940 is a screw, and 950 is a housing.

  Referring to FIG. 9, the light emitting units 910B, 910Y, and 910R can incorporate any form of the light emitting device of each of the above-described embodiments. Here, the GX53 base type of Example 4 is used. A case where the above is adopted will be described as an example.

  In addition, here, a horizontal traffic signal lamp is illustrated, but it goes without saying that it can be similarly applied to a vertical type that is common in heavy snowfall areas.

  Referring again to FIG. 9, the light emitting units 910B, 910Y, and 910R emit light in blue green, orange, and red, respectively, and can be configured by using known LEDs corresponding to the respective colors.

  The housing 950 is formed by aluminum die casting or the like, and three light emitting portions are fixed integrally.

  庇 920 prevents the light emitting units 910B, 910Y, and 910R from being difficult to identify when the light emitting units 910B, 910Y, and 910R are directly irradiated with sunlight from above, and prevents rain or snow. It is also used for protection.

  The lid 930 fixes the light emitting units 910B, 910Y, and 910R, and the screw 940 is a screw for opening the lid. That is, by loosening and removing the screw 940, the lid 930 is opened in the direction indicated by the black arrow in FIG. 9 around the hinge 1020 (FIG. 10) disposed above the lid.

  FIG. 10 shows a state where the lid 930 is opened. FIG. 10 is a rear perspective view of the traffic signal lamp 900 according to the sixth embodiment of the present invention.

  Referring to FIG. 10, the back surface of the light emitting unit 910 </ b> B fixed to the lid 930 is illustrated, and reference numeral 1030 indicates a GX53 base.

  Reference numeral 1040 denotes a socket that fits into the GX53 base, and a power line 1010 for supplying commercial power is connected to the socket. In the traffic signal lamp 900, when any one of the light emitting units 910B, 910Y, and 910R is replaced, the socket 1040 is removed, and the light emitting unit fixed to the lid is removed and replaced, so that maintenance is easy.

  In the present embodiment, since the GX53 base is adopted, it is possible to make the thickness of the entire traffic signal lamp 900 as thin as about 60 mm.

  Hereinafter, the snow melting effect of this embodiment will be described.

  Since the size of the display surface of the light emitting unit is determined by the standard, for example, about 300 mmφ, in consideration of the size and the light emission luminance of the light emitting unit, etc., an appropriate number of LEDs will be arranged in the light emitting unit. For example, about 200 LED packages with 0.05 W can be provided. The type of LED is not particularly limited.

  When the light emitting unit is configured as described above, the power supplied to the LED including the drive circuit is about 10 to 20 W per color. According to the present invention, this thermal energy can be efficiently conducted to the protective member (the protective member 130 in FIG. 2) constituting the light emitting surface.

  According to the knowledge of the inventors, the temperature of the protective member is expected to rise to about 10 ° C. to 15 ° C. with respect to the air temperature due to the above-described configuration. For example, if the temperature is −10 ° C., the temperature of the protective member is about 0 ° C. to + 5 ° C. If the temperature of the protective member constituting the light emitting surface rises to this extent, the snow that has snowed can be melted, so that it is possible to effectively prevent the snow from accumulating on the light emitting surface. .

  The light emitting device of the present invention is not limited to the above configuration, and various modifications and application examples are possible.

  For example, in each of the embodiments described above, the circular shape is exemplified as the main body shape of the light emitting device, but any shape such as a rectangle can be adopted.

  Moreover, although GX53 was illustrated and demonstrated as a nozzle | cap | die, conventionally, a nozzle | cap | die conventionally common, such as E26, can also be applied.

  In the present embodiment, a rectifier circuit using a diode bridge has been described as an example of the drive circuit, but a switching type AC / DC converter or the like can also be applied.

  In each of the above-described embodiments, the mounting substrate and the heat transfer member are separately described as examples. However, the mounting substrate and the heat transfer member may be integrally formed by cutting or extrusion molding to form a single component. is there. In this case, for example, a heat transfer member is formed radially from the center of the light emitting device, and a printed circuit board on which LEDs are mounted is disposed between the heat transfer members. Wiring to the back surface is performed by providing an opening in the mounting substrate, and is connected to, for example, a drive circuit disposed on the back surface.

  In each of the above embodiments, a light emitting diode (LED) has been described as an example of a light emitting element. However, other semiconductor light emitting elements such as a semiconductor laser and an organic LED can be applied.

  Further, in each of the above-described embodiments, the mounting by the package-enclosed type LED has been illustrated and described as the mounting of the light emitting element. Application is also possible.

  Furthermore, in the present embodiment, a traffic signal lamp is illustrated and described as an example of a light emitting device that exerts a snow melting effect, but in addition, road lighting, street lights, indicator lights, road signs, electric bulletin boards, road information boards, The present invention can be applied to all types of light emitting devices used outdoors such as exterior entrance lights, outdoor security lights, and headlights.

DESCRIPTION OF SYMBOLS 100 Light-emitting device 110 Opening 120a, 120b Thermal conductive sheet 130 Protective member 140 Case 210 Light-emitting element 212 Solder 214a, b Wiring layer 220 Aluminum base substrate 222 Screw 230 Heat-transfer member 240 Heat-insulating member 250 Light-emitting device drive circuit 310 Packing 330 Lid 400 Light emission Device 410 Iron plate 420a, b Printed circuit board 600 Light emitting device 610 Mounting substrate 620 Printed circuit board 630 Heat conduction sheet 700 Light source device 710 GX53 base 720 Projection 730 Power supply terminal 732 Engagement holding receiving part 740 Case 750 Socket 760 Socket body 770 Power supply terminal insertion Hole 780 Insertion recess 800 Light emitting device 810 Light emitting element group 820 Light emitting element 830 AC drive circuit 840 AC power source 850 Diode bridge 860 Smooth Capacitor 870 limiting resistor 900 traffic signal lamp device 910B, 910Y, 910R emitting portion 920 eaves 930 lid 940 screw 950 housing 1010 power supply line 1020 hinge 1030 GX53 cap 1040 socket

Claims (6)

A mounting substrate having a first surface and a second surface located on a back surface side of the first surface, wherein light is emitted on the first surface in a direction substantially perpendicular to the first surface. A mounting board on which a plurality of light emitting elements to emit are mounted;
A heat transfer member provided between the plurality of light emitting elements on the first surface of the mounting substrate and formed of a metal material;
A protective member provided to cover the heat transfer member and the plurality of light emitting elements,
A light emitting device characterized in that heat generated in the plurality of light emitting elements is conducted to the protective member through the mounting substrate and the heat transfer member.   The heat transfer member has a plate shape substantially the same shape as the mounting substrate, has a plurality of through holes surrounding the light emitting element corresponding to each of the plurality of light emitting elements, and is disposed so as to overlap the mounting substrate. The light-emitting device according to claim 1. Formed of a thermally conductive material having a first surface and a second surface located on the back side of the first surface, and a plurality of through holes penetrating from the first surface to the second surface. A mounting board;
A plurality of light emitting elements mounted on the second surface so as to emit light through the through hole from the second surface side to the first surface side;
A protective member provided to cover the mounting substrate and the through hole,
A light emitting device characterized in that heat generated in the plurality of light emitting elements is conducted to the protective member through the mounting substrate.   The light-emitting device according to claim 1, wherein a heat insulating member is disposed in contact with the second surface of the mounting substrate.   The light emitting device according to any one of claims 1 to 4, wherein a GX53 base is provided as the base. The light emitting device according to claim 1, further comprising an AC driving circuit.

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