KR101591769B1 - Light emitting diode street lamp - Google Patents

Abstract

The present invention relates to a light emitting diode street lamp. The light emitting diode street lamp includes a light emitting diode module, a heat radiation part which has heat radiation protrusions and radiates the heat of the light emitting diode module, an accommodating part which is combined with the upper end of the heat radiation part and applies power to the light emitting diode module, and a cover part which covers the upper region of the accommodating part and the heat radiation part.

Description

LIGHT EMITTING DIODE STREET LAMP

The present invention relates to a light emitting diode (LED) streetlight, a manufacturing process thereof, a light emitting diode streetlight having improved heat dissipation and withstanding voltage characteristics, and excellent waterproofing ability and being usable in various structures and forms.

Street light is installed along the street for the safety and security of the street traffic. Various kinds of street lights are used depending on the installation places such as the highway, the main road of the city area, the commercial district road, and the residential district road.

High-pressure mercury lamps, fluorescent lamps, sodium lamps, etc. have been used as light sources for existing street lamps, and street lamps using light emitting diodes have recently been installed due to environmental pollution and long life characteristics.

Light emitting diodes (LEDs) are a sort of semiconductors that emit light when applied with electricity, and have recently been in the limelight due to their higher efficiency, longer life, and environmental friendliness than conventional incandescent lamps and fluorescent lamps.

However, the light emitting diode has the disadvantage of low deterioration and withstand voltage characteristic due to its own heat generation, and thus, it is an important research direction of the streetlight using the light emitting diode in recent years.

(Patent Document 1) Patent Registration No. 10-01280079 (Patent Document 2) Patent Registration No. 10-1221387 (Patent Document 3) Patent Registration No. 10-1396796 (Patent Document 4) Published Japanese Patent Application No. 10-2014-0126553

The present invention has been conceived to solve the above-mentioned problems, and it is an object of the present invention to provide a light emitting diode module for a streetlight which is simple in manufacturing process, minimized in heat dissipation and voltage resistance characteristics, Provide a diode streetlight.

A plurality of light emitting diodes for generating illumination light according to the present invention are mounted on a metal printed circuit pad, a heat radiating body portion having a light emitting pad portion on an upper side thereof and a through hole for applying power to the light emitting diode formed therein, A power supply unit for applying power to the light emitting pad unit through the through hole of the heat dissipating body unit, a power supply unit, and a power supply unit connected to the light emitting pad unit, And a power supply unit coupled to an upper end of the heat dissipation unit to apply power to the light emitting diode module, the power supply unit including a plurality of heat dissipation protrusions, And a cover portion covering an upper region of the heat dissipation portion and the housing portion. It provides a diode lamp.

The heat dissipating unit may include a heat dissipating body having rib-shaped heat dissipating protrusions formed of a plurality of rows and a connection body coupled to a side of the heat dissipating body.

A plurality of mounting grooves for mounting the light emitting diode module are formed on the lower end of the heat dissipating body, and inner surfaces of the mounting grooves contacting the light emitting diode mounting surface have different angles.

The light emitting pad portion includes a metal printed circuit pad having a thickness of 0.01 to 1 mm, a plurality of light emitting diodes mounted on the metal printed circuit pad, and a power connection portion provided on one side of the metal circuit pad.

Wherein the metal printed circuit pad includes a circuit pattern formed on an insulating layer, a mounting portion provided on the circuit pattern, and a protective layer for protecting the circuit pattern, wherein the insulating layer has a thickness of 50 to 200 mu m, Is 20 to 50 mu m.

The heat dissipating body includes a plate-shaped housing having a mounting surface on which the light emitting pad is mounted, a circular trench formed between the mounting surface for assembling the lens unit and the mounting surface, and a mounting surface of the housing. And a heat dissipation pattern portion provided on a side surface of the housing.

The heat dissipating body includes a housing having a mounting surface on which the light emitting pad is mounted, a lens assembly groove formed in a rectangular band shape around the mounting surface, and a boundary surface located on the outer surface of the lens assembly groove. And a heat radiating portion of the heat sink.

An adhesive having a heat dissipating property is used for attaching the light emitting pad portion to the mounting surface, wherein the thickness of the adhesive layer is 20 to 80 탆.

The lens unit may include a lens positioned above the heat dissipating body, a lens fixed to the heat dissipating body through fixing means, and a waterproof gasket positioned between the lens assembly grooves.

As described above, the present invention can simplify the manufacturing process of the street lamp using the light emitting diode module through the manufacturing method that minimizes the use of the substrate, and improve the heat dissipation and the withstand voltage characteristics.

1 is an exploded perspective view of a light emitting diode streetlight according to an embodiment of the present invention;
2 is a rear view of a light emitting diode streetlight according to an embodiment;
3 is a side view of a light emitting diode streetlight according to one embodiment.
4 to 6 are rear views of a light emitting diode street lamp according to a modification of the embodiment.
7 is an exploded perspective view of a light emitting diode module of a light emitting diode streetlight according to an embodiment.
8 is a perspective view of a light emitting diode module according to an embodiment.
9 is a conceptual diagram for explaining a metal printed circuit pattern according to an embodiment;
10 is a schematic cross-sectional view illustrating a waterproof portion according to an embodiment.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. It will be apparent to those skilled in the art that the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, It is provided to let you know. Wherein like reference numerals refer to like elements throughout.

It is to be clarified that the division of components in this specification is merely a division by main function which each component is responsible for. That is, two or more constituent parts to be described below may be combined into one constituent part, or one constituent part may be divided into two or more functions according to functions that are more subdivided. In addition, each of the constituent units described below may additionally perform some or all of the functions of other constituent units in addition to the main functions of the constituent units themselves, and that some of the main functions, And may be carried out in a dedicated manner. Accordingly, the presence or absence of each component described in this specification should be interpreted as a function. For this reason, it is clarified that the light-emitting diode street lamp of the present invention can be different within the scope of achieving the object of the present invention.

1 is an exploded perspective view of a light emitting diode street lamp according to an embodiment of the present invention. 2 is a rear view of a light emitting diode street lamp according to an embodiment. 3 is a side view of a light emitting diode streetlight according to one embodiment. 4 to 6 are rear views of a light emitting diode street lamp according to a modification of the embodiment. 7 is an exploded perspective view of a light emitting diode module of a light emitting diode streetlight according to an embodiment. 8 is a perspective view of a light emitting diode module according to an embodiment. FIG. 9 is a conceptual view for explaining a metal printed circuit pattern according to an embodiment, and FIG. 10 is a schematic cross-sectional view for explaining a waterproof portion according to an embodiment.

1 to 10, the LED streetlight according to the present embodiment includes a light emitting diode module 200 that emits illumination light, a heat dissipating unit 200 having a plurality of heat dissipation protrusions and emitting heat of the light emitting diode module 200, And a power supply unit 500 coupled to an upper end of the heat dissipation unit 100 to supply power to the light emitting diode module 200. The heat dissipation unit 100 and the storage unit 300 And a cover portion 400 covering an upper area of the cover portion 400.

The heat dissipating unit 100 according to the present embodiment includes a heat dissipating body 110 having a plurality of heat dissipating protrusions 111 formed in a plurality of ribs and forming a plurality of rows of heat dissipating protrusions 111, It is effective to include a connection body 120 to be mounted on the base body 120. [

The heat dissipating body 110 is formed with a plurality of heat dissipating protrusions 111 in an inner space surrounded by a rim.

The plurality of heat dissipating protrusions 111 are arranged to form a plurality of rows, and they are formed in an upright plate shape.

The heat dissipating body 110 is made of aluminum to increase heat dissipation efficiency and reduce its own weight.

The connection body 120 is formed to protrude from one end of the heat dissipating body 110. The connection body 120 is fixedly installed on a rope of a bar. Preferably, holes are formed in both side walls of the connection body 120, and fastening bolts (not shown) are inserted into the holes and fixed to the rods.

An arm fixing member 121 is fixed to the lower end of the connection body 120.

The arm fixing member 121 is formed so as to surround the outer circumference of an arm (not shown) of the case, and is fixed to the inner side of the connecting body 120 through a bolt-like means (not shown).

Therefore, due to the coupling between the connecting body 120 and the arm fixing member 121, the heat dissipating unit 100 can be fixedly installed on the rods.

The arm fixing member 121 is a fixing base for connecting a lamp of the back light and a street lamp, and the fixing base can be appropriately adjusted at the installation site by using a 0 ° fixed type and a 15 ° adjusted type fixing base (not shown) . ≪ / RTI >

The light emitting diode module 200 according to the present embodiment includes a light emitting pad portion 2100 in which a plurality of light emitting diodes 2120 are mounted on a metal circuit pad 2110 and a light emitting pad portion 2100 A heat dissipating body portion 2200 formed with a through hole 2220 for applying power to the light emitting diode 2120 and a light emitting pad portion 2100 formed on the heat dissipating body portion 2200 to protect the light emitting pad portion 2100, A power supply part 2400 for applying power to the light emitting pad part 2100 through the through hole 2220 of the heat dissipating body part 2200, a power supply part 2400 And the waterproof portion 2500 positioned between the through hole 2220 and the through hole 2220.

The light emitting pad portion 2100 includes a metal printed circuit pad 2110 having a thickness of 0.01 to 1 mm and a plurality of light emitting diodes 2120 mounted on the metal printed circuit pad 2110, (2130).

In this example, the metal printed circuit pads 2110 are formed in a circle in which one side region is cut. Then, a power connection portion 2130 is provided in the cut region. Of course, the metal printed circuit pads 2110 can be manufactured in various shapes.

The metal printed circuit pad 2110 includes a circuit pattern 2112 formed on the insulating layer 2111 and a mounting portion 2113 provided on the circuit pattern 2112 and a protective layer 2114 protecting the circuit pattern 2112. [ . When the thickness of the entire metal printed circuit pads 2110 is thicker than 1 mm, the heat dissipation characteristics are lowered and the adhesion process becomes complicated. On the other hand, when the thickness is smaller than 0.01 mm, the processing is very difficult. Preferably, the thickness of the insulating layer 2111 is 50 to 200 mu m. When the thickness is smaller than this thickness, there is a disadvantage in that the insulation characteristic is low, and when it is thicker than this thickness, the heat generation characteristic is deteriorated. The circuit pattern is preferably made using copper, and the thickness of the circuit pattern is preferably 20 to 50 mu m.

Since the light emitting pad portion 2100 having such a thin thickness is used, the bonding thickness with the heat dissipating body portion 2200 can be minimized, and the heat dissipation property can be improved, and the stability of the withstand voltage, the weight reduction of the product, It is possible to reduce raw materials.

The heat dissipating body portion 2200 includes a mounting surface 2211 for mounting the light emitting pad portion 2100, an assembling surface 2212 for assembling the lens portion 2300 and a mounting surface 2212 between the mounting surface 2211 and the mounting surface 2212 A through hole 2220 formed in the mounting surface region of the housing 2210 and through which the power supply unit 2400 penetrates and a side wall 2220 formed on the side surface of the housing 2210. The housing 2210 has a circular trench 2213 formed in the housing 2210, And a heat dissipation pattern portion 2230 provided in the heat dissipation portion 2230. It is effective that the heat sink is located at the lower end of the heat dissipating body portion 2200.

In this embodiment, a circular plate-shaped housing 2210 is used. However, the present invention is not limited thereto, and a housing 2210 having various shapes can be used.

It is effective that the mounting surface 2211 of the housing 2210 is formed in the same shape as the shape of the light emitting pad portion 2100. And a through hole 2220 passing through the housing 2210 is formed on one side of the mounting surface 2211. [ The light emitting pad portion 2100 is attached to the mounting surface 2211 to improve the withstand voltage characteristic of the light emitting pad portion 2100 and to increase the heat dissipation characteristic. For this purpose, it is effective to use an adhesive having heat dissipation properties for attaching the light emitting pad portion 2100 to the mounting surface 2211. At this time, it is effective to adhere the adhesive layer with a thickness of 20 to 80 탆. When the thickness is thinner than this thickness, there is a disadvantage that the adhesive force is low. When the thickness is thicker than this thickness, there is a disadvantage that the heat dissipation effect is similar to that of the conventional thermal pad. Therefore, it is effective to form the adhesive layer of the above thickness in order to minimize the thermal resistance.

For this, an experimental example in which the metal printed circuit pad 2110 of this embodiment is attached to the mounting surface 2211 of the housing 2210 and a heating characteristic of the light emitting module of the comparative example in which the metal PCB is mounted on the mounting surface of the housing, The results of the experiment are as follows.

As described above, the temperature of the metal printed circuit pad 2110 can be lowered by using the metal PCB than with the metal PCB.

The withstand voltage characteristics were measured under the conditions of the above experimental example. The withstand voltage characteristics were tested without a converter, and the failures were investigated by upwards of 200 Kv.

In Examples 1 and 3, a crack occurred at 3000 Kv, and in Example 2, a crack occurred at 2800 Kv. On the other hand, in each of Comparative Examples 1 and 2, a crack occurred at 1600 Kv.

Therefore, it can be seen that the thermal resistance and the withstanding voltage characteristics can be improved when the metal printed circuit pad 2110 is mounted on the housing 2210 as in the present embodiment.

It is effective that a plurality of assembly holes are formed on the assembly surface 2212. And the lens portion 2300 is assembled and fixed through this assembling hole.

In this embodiment, it is preferable that a ring-shaped trench 2213 is formed between the mounting surface 2212 and the mounting surface 2211. A packing member is disposed inside the trench 2213 to protect the light emitting pad portion 2100.

The lens unit 2300 of the present embodiment includes a lens 2310 located on the upper side of the light emitting pad unit 2100 and a mounting body 2310 for positioning the lens 2310 in the center and mounting the lens 2310 on the heat dissipating body unit 2200. [ A lens fixing portion 2330 for fixing the mounting body 2320 of the lens 2310 to the heat dissipating body portion 2200 and a mounting body 2320 of the lens 2310 to the light emitting pad portion 2320. [ And a lens packing portion 2340 for tightly adhering to the lens 2100 and preventing external moisture penetration.

It is effective to fabricate the lens 2310 in a circular shape similar to the mounting surface 2211 of the housing 2210 mentioned above. As the lens 2310, a plate-shaped lens, a convex lens, and a concave lens are possible. Further, the shape of the lens may be made different for each light emitting diode region. In this embodiment, a circular plate-shaped lens 2310 is used. It is effective that the lens 2310 protrudes so as to form a space in the region of the power connection portion 2130 of the light emitting pad portion 2100 as shown in the figure.

The mounting body 2320 is formed in the shape of a circular band in which the lens 2310 is positioned at the center thereof. The mounting body 2320 is provided with an elongated body extending downward and the elongated body is inserted into the trench 2213 of the housing 2210 so that the lens 2310 is inserted into the luminescent pad portion 2100, And the lens portion 2300 can be prevented from being shaken even in an external impact. In addition, when the elongated body is inserted into the trench region of the housing 2210 by using the packing member with the lower elongated body, moisture from the outside can be prevented from flowing into the mounting scene region.

The lens fixing portion 2330 may be fixed to the heat dissipating body portion 2200 through fixing means to closely fix the mounting body to the heat dissipating body portion 2200. The lens fixing part 2330 is formed in the shape of a ring having an empty center, and a plurality of fixing holes for fixing the fixing part to the heat dissipating body 2200 are provided at an edge area thereof. The fixing member such as a screw is fixed to the assembly hole of the heat dissipating body portion 2200 through the fixing hole, so that the lens fixing portion 2330 can be firmly fixed to the heat dissipating body portion 2200.

The lens packing portion 2340 is made of a belt-like material having elasticity to prevent the lens 2310 and the mounting body 2320 from being damaged by the excessive fixing force of the lens fixing portion 2330, 2330 and the mounting body 2320. In this case,

It is effective for the power supply unit 2400 of this embodiment to use an electric wire that applies power applied from the outside to the light emitting pad unit 2100. [

The waterproof portion 2500 is located between the through hole 2220 of the heat dissipating body portion 2200 and the power supply portion 2400. The waterproofing part 2500 includes a waterproof body 2510 having a through hole through which the power supply part 2400 passes, a plurality of ring-shaped waterproof protrusions 2520 provided on the inner and outer sides of the waterproofing body 2510, (2530) for fixing the heat sink body (2510) to the heat dissipating body portion (2200).

The waterproof body 2510 is made of an elastic material. The waterproofing part 2500 of the present embodiment can closely contact the power supply part 2400 and the through hole by a plurality of waterproof protrusions 2520 provided inside and outside the waterproofing body 2510, (2220), thereby preventing moisture from penetrating from the outside. That is, the waterproof portion 2500 is inserted into the through hole 2220 in a fitting manner by the waterproof protrusion 2520, and the power supply portion 2400 is also inserted into the waterproof body 2510 in a fitting manner. The protrusion fixing part 2530 is positioned in the through hole 2220 of the heat dissipating body 2200 to prevent the waterproofing part 2500 from rotating or being separated.

Of course, the light emitting diode module 200 is not limited thereto, and various modifications are possible according to the structure of the heat dissipation unit and the streetlight to be mounted.

The cover unit 400 according to the present embodiment is coupled to the upper end of the heat dissipating body 110.

The cover part 400 is composed of a cover plate 410 formed to be convex upward, and it is effective that the cover part 400 is made of an aluminum material. In some cases, a plurality of vent holes (not shown) may be formed in the cover portion to reduce its own weight.

The cover part 400 and the heat radiating part 100 may be made of an aluminum material to increase the heat radiation efficiency and significantly reduce the self weight.

A plurality of light emitting diode modules 200 are installed on the bottom surface of the heat dissipating body 110. Each light emitting diode module 210 is installed in each of the installation recesses 112 formed on the bottom surface of the heat dissipating body 110. The angles of the inner surfaces of the installation recesses 112 are different from each other. Therefore, since the one surface of the light emitting diode module 210 is fitted in contact with the inner surface of the mounting groove 112, the light incident angle can be variably controlled by changing the installation position of each light emitting diode module 210.

A storage unit 300 is disposed on the side of the heat dissipating body 110 and the storage unit 300 is coupled to the connection body 120.

The storage unit 300 includes a storage container 310 disposed at one side of the cover plate 410 and coupled to an upper end of the connection body 120 and having a storage space for storing the power supply device 500, And a cap 320 detachably coupled to the upper end of the storage container 310.

The power supply apparatus 500 is an SMPS (Switching Mode Power Supply), which is accommodated in a storage space of the storage container 310.

A connector board case 600 in which a connector board 610 for electrically connecting the power supply unit 500 and the LED module 210 is received is disposed between the heat dissipating body 110 and the cover plate 410 Respectively.

The power supply unit 500 and the connector board 610 are connected to each other by a power line, and the connector board 610 is connected to each light emitting diode module 210 by electric wires.

The storage unit 300 is designed to be waterproofed and detachable according to the requirements of the purchaser. The material of the storage part 300 may be a glass fiber-containing nylon material and a flame retardant material may be used together to reduce the weight effectively.

The lighting device for a street light of the present invention having the above-described structure can maximize heat dissipation surface area, facilitate heat flow, and facilitate heat conduction and convection.

In addition, a thin aluminum plate is used instead of a heavy cover of conventional die-casting and plastic for weight reduction.

The power supply device 500 can be designed to be separated and coupled to the exterior and the built-in type according to the requirements of the purchaser, thereby minimizing the weight according to the purpose.

The heat dissipation unit 100 is designed to increase the light efficiency by minimizing the light loss that must be generated on the optical lens by using the angle of the heat dissipation protrusions 111 which are heat dissipation plates on which the light emitting diode module 200 as a light source is mounted And the heat radiating protrusions 111 are designed to have nine angles so as to maximize the light distribution efficiency and nine light emitting diode modules each having nine sphere-optimized spherical shapes are used. The nine light emitting diode modules each have a different lens And the lens is designed to achieve the most effective light distribution at each position.

Therefore, it is possible to achieve a high road lighting grade with low power consumption (w).

By adjusting the light distribution by appropriately combining the lenses of the nine light emitting diode modules, it is possible to control the concentration and diffusion of the light, thereby satisfying all the different light distribution requirements in each country.

Also, as shown in FIGS. 4 to 6, various types of light emitting diode modules can be used, and the heat dissipation part, the housing part, and the cover plate can be modified in various forms.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the following claims.

100: heat dissipating unit 200: light emitting diode module
2100: light emitting pad portion 2200: heat dissipating body portion
2300: lens part 2400: power supply part
2500: waterproof part 300: storage part
400: cover part 500: power supply device

Claims (9)

A heat emitting body portion having a light emitting pad portion having a plurality of light emitting diodes for emitting illumination light and mounted on a metal printed circuit pad, a light emitting pad portion on an upper side thereof, and a through hole for applying power to the light emitting diode, A power supply part for applying power to the light emitting pad part through the through hole of the heat dissipating body part, and a power supply part for supplying power to the light emitting pad part, which is located between the power supply part and the through hole A light emitting diode module including a waterproof portion;
A heat dissipation unit having a plurality of heat dissipation protrusions and emitting heat of the light emitting diode module;
A receiving unit coupled to an upper end of the heat dissipating unit to receive a power supply for applying power to the light emitting diode module; And
And a cover portion covering an upper region of the heat radiating portion and the accommodating portion. The method according to claim 1,
Wherein the heat dissipation unit includes a heat dissipation body having a rib-shaped heat dissipation protrusion formed of a plurality of rows and a connection body coupled to a side of the heat dissipation body. 3. The method of claim 2,
Wherein a plurality of mounting grooves are formed at a lower end of the heat dissipating body to mount the light emitting diode module, and inner surfaces of the mounting grooves contacting the mounting surface of the light emitting diode have different angles. The method according to claim 1,
Wherein the light emitting pad portion includes a metal printed circuit pad having a thickness of 0.01 to 1 mm, a plurality of light emitting diodes mounted on the metal printed circuit pad, and a power connection portion provided on one side of the metal circuit pad. 5. The method of claim 4,
Wherein the metal printed circuit pad includes a circuit pattern formed on the insulating layer, a mounting portion provided on the circuit pattern, and a protective layer for protecting the circuit pattern. The method according to claim 1,
The heat dissipating body includes a plate-shaped housing having a mounting surface on which the light emitting pad is mounted, a circular trench formed between the mounting surface for assembling the lens unit and the mounting surface, and a mounting surface of the housing. And a heat dissipation pattern portion provided on a side surface of the housing. The method according to claim 1,
The heat dissipating body includes a housing having a mounting surface on which the light emitting pad is mounted, a lens assembly groove formed in a rectangular band shape around the mounting surface, and a boundary surface located on the outer surface of the lens assembly groove. And a heat radiating portion of the light emitting diode. 8. The method according to claim 6 or 7,
Wherein an adhesive having heat dissipation properties is used for attaching the light emitting pad portion to the mounting surface, wherein the thickness of the adhesive layer is 20 to 80 占 퐉. The method of claim 7, wherein
Wherein the lens unit includes a lens positioned above the heat dissipating body, a lens fixed to the heat dissipating body through the fixing unit, and a waterproof gasket positioned between the lens assembly groove.

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