TW202132723A - Lighting apparatus - Google Patents

Lighting apparatus Download PDF

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Publication number
TW202132723A
TW202132723A TW109106322A TW109106322A TW202132723A TW 202132723 A TW202132723 A TW 202132723A TW 109106322 A TW109106322 A TW 109106322A TW 109106322 A TW109106322 A TW 109106322A TW 202132723 A TW202132723 A TW 202132723A
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Taiwan
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circuit board
lighting device
light source
light
source module
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TW109106322A
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Chinese (zh)
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高銘圳
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光寶科技股份有限公司
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Priority to TW109106322A priority Critical patent/TW202132723A/en
Publication of TW202132723A publication Critical patent/TW202132723A/en

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  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

A lighting apparatus includes a lamp structure and a mounting portion. The lamp structure includes a light source module. The mounting portion is directly connected to one surface of the light source module which is exposed.

Description

照明裝置Lighting device

本發明是有關於一種照明裝置,且特別是有關於一種可以低成本製造且輕薄化之照明裝置。The present invention relates to a lighting device, and more particularly to a lighting device that can be manufactured at low cost and is thinner and lighter.

一些較為大型的照明裝置(例如路燈)在運作時會產生高熱量,若無法將熱量排除則容易影響發光效果,甚至造成燈具損壞。一般常見的作法是藉燈具的金屬外殼以熱傳導的方式將熱源傳遞至外界,再透過空氣對流的方式散熱;倘若金屬外殼與熱源的接觸面不平整,將會影響熱傳導之效果,而必須另外設置導熱元件(例如導熱貼片或散熱膏)來提升散熱效果,然此舉將會造成製造成本及製作工時的增加,不符成本效益。Some relatively large lighting devices (such as street lights) generate high heat during operation. If the heat cannot be removed, it will easily affect the luminous effect and even cause damage to the lamps. A common method is to transfer the heat source to the outside through heat conduction through the metal shell of the lamp, and then dissipate heat through air convection; if the contact surface between the metal shell and the heat source is uneven, it will affect the heat conduction effect, and it must be installed separately Thermally conductive components (such as thermally conductive patches or thermal paste) are used to improve the heat dissipation effect. However, this will cause an increase in manufacturing costs and man-hours, which is not cost-effective.

本發明係有關於一種照明裝置,光源模組直接與安裝部相連接,能夠提供最為直接的散熱效果,同時亦可降低製造的成本。The present invention relates to a lighting device. The light source module is directly connected with the mounting part, which can provide the most direct heat dissipation effect and reduce the manufacturing cost at the same time.

根據本發明之一方面,提出一種照明裝置。照明裝置包括燈具結構以及安裝部。燈具結構包括光源模組。安裝部直接連接於光源模組的一表面,且此表面係外露於外在環境中。According to one aspect of the present invention, a lighting device is provided. The lighting device includes a lamp structure and an installation part. The lamp structure includes a light source module. The mounting part is directly connected to a surface of the light source module, and this surface is exposed to the external environment.

為了對本發明之上述及其他方面有更佳的瞭解,下文特舉實施例,並配合所附圖式詳細說明如下:In order to have a better understanding of the above and other aspects of the present invention, the following specific examples are given in conjunction with the accompanying drawings to describe in detail as follows:

以下將以圖式揭露本發明之複數個實施方式,為明確說明起見,許多實務上的細節將在以下敘述中一併說明。然而,應瞭解到,這些實務上的細節不應用以限制本發明。也就是說,在本發明部分實施方式中,這些實務上的細節是非必要的。此外,除非有其他表示,在不同圖式中相同之元件符號可視為相對應的元件。應當理解,當一元件被稱為「直接連接到」另一元件時,表示兩者具有直接接觸的物理關係,也就是說,兩元件之間並不存在中間元件。Hereinafter, a plurality of embodiments of the present invention will be disclosed in drawings. For clear description, many practical details will be described in the following description. However, it should be understood that these practical details should not be used to limit the present invention. That is to say, in some embodiments of the present invention, these practical details are unnecessary. In addition, unless otherwise indicated, the same component symbols in different drawings can be regarded as corresponding components. It should be understood that when an element is referred to as being "directly connected to" another element, it means that the two elements have a physical relationship of direct contact, that is, there is no intermediate element between the two elements.

請參照第1圖,其繪示根據本發明一實施例之照明裝置100的立體圖。照明裝置100包括燈具結構110以及安裝部120。燈具結構110用以發出照明光源,其與安裝部120互相結合。安裝部120可用於進一步連接照明裝置100的其它元件。舉例來說,當照明裝置100作為路燈使用時,照明裝置100還可包括燈桿130,安裝部120可與燈桿130相連接,例如透過第一緊固元件140,使安裝部120固定於燈桿130上。第一緊固元件140例如是螺絲,但不以此為限。Please refer to FIG. 1, which shows a perspective view of a lighting device 100 according to an embodiment of the present invention. The lighting device 100 includes a lamp structure 110 and a mounting part 120. The lamp structure 110 is used to emit an illuminating light source, and it is combined with the mounting part 120 with each other. The mounting part 120 can be used to further connect other elements of the lighting device 100. For example, when the lighting device 100 is used as a street lamp, the lighting device 100 may further include a light pole 130, and the mounting portion 120 may be connected to the light pole 130, for example, through the first fastening element 140 to fix the mounting portion 120 to the light. On the rod 130. The first fastening element 140 is, for example, a screw, but not limited to this.

請參照第2圖,其繪示第1圖之照明裝置100的分解圖。安裝部120包括本體121、蓋板122及連接件123。本體121具有一貫穿於兩側的穿孔121H,燈桿130可自本體121的一端插入於穿孔121H內。當安裝部120藉由第一緊固元件140固定於燈桿130上時,蓋板122可藉由連接件123設置於本體121的另一端,以封閉本體121的穿孔121H的另一端,並保護穿設在燈桿130內的線路。Please refer to FIG. 2, which shows an exploded view of the lighting device 100 of FIG. 1. The installation part 120 includes a body 121, a cover 122 and a connecting piece 123. The main body 121 has a through hole 121H penetrating through both sides, and the light pole 130 can be inserted into the through hole 121H from one end of the main body 121. When the mounting portion 120 is fixed to the light pole 130 by the first fastening element 140, the cover 122 can be disposed on the other end of the main body 121 by the connecting member 123 to close the other end of the through hole 121H of the main body 121 and protect Pass through the line set in the light pole 130.

在本發明中,燈具結構110包括光源模組111,且安裝部120直接連接於光源模組111的一表面。也就是說,本發明所提供的燈具結構110可進一步省略燈殼的設置,讓作為主要發熱源的光源模組111與安裝部120直接連接,此舉可解決傳統之燈具架構下燈殼與光源模組之間散熱成效不佳的問題。In the present invention, the lamp structure 110 includes a light source module 111, and the mounting portion 120 is directly connected to a surface of the light source module 111. That is to say, the lamp structure 110 provided by the present invention can further omit the arrangement of the lamp housing, allowing the light source module 111 as the main heat source to be directly connected to the mounting part 120. This can solve the problem of the traditional lamp housing and the light source. The problem of poor heat dissipation between modules.

詳細地說,光源模組111可包括電路板112及至少一發光單元113。發光單元113例如是發光二極體,其可設置於電路板112上,且光源模組111經由電路板112與安裝部120直接連接。在其它實施例中,發光單元113更可包括二次光學元件,以滿足實際照明所需的各種需求。In detail, the light source module 111 may include a circuit board 112 and at least one light emitting unit 113. The light emitting unit 113 is, for example, a light emitting diode, which can be disposed on the circuit board 112, and the light source module 111 is directly connected to the mounting portion 120 via the circuit board 112. In other embodiments, the light-emitting unit 113 may further include secondary optical elements to meet various requirements for actual lighting.

舉例來說,製成電路板112的材質一般可以是金屬或金屬合金,例如為鋁基板(Metal Core PCB, MCPCB),其為金屬基覆銅板,具有良好的導熱性、電氣絕緣性能和機械強度高、加工性能佳等特性。在一實施例中,電路板112的厚度可大於5mm,例如是5~10mm,本發明不對此加以限制,電路板112的厚度可視電路板112的整體面積大小而定。因此,電路板112不但可作為傳遞熱的媒介,還具備承載燈具結構110的用途。For example, the material made of the circuit board 112 can generally be metal or metal alloy, such as an aluminum substrate (Metal Core PCB, MCPCB), which is a metal-based copper clad laminate with good thermal conductivity, electrical insulation properties, and mechanical strength. High, good processing performance and other characteristics. In one embodiment, the thickness of the circuit board 112 may be greater than 5 mm, for example, 5-10 mm. The present invention does not impose a limitation on this. The thickness of the circuit board 112 may be determined by the overall area of the circuit board 112. Therefore, the circuit board 112 not only serves as a heat transfer medium, but also has the purpose of carrying the lamp structure 110.

電路板112包括相對的第一表面112a及第二表面112b,發光單元113設置於電路板112的第二表面112b,安裝部120直接連接於電路板112的第一表面112a。例如,可藉由第二緊固元件150,使安裝部120固定於電路板112的第一表面112a上。第二緊固元件150例如是螺絲,但不以此為限。The circuit board 112 includes a first surface 112 a and a second surface 112 b opposite to each other. The light emitting unit 113 is disposed on the second surface 112 b of the circuit board 112, and the mounting portion 120 is directly connected to the first surface 112 a of the circuit board 112. For example, the second fastening element 150 can be used to fix the mounting portion 120 on the first surface 112 a of the circuit board 112. The second fastening element 150 is, for example, a screw, but not limited to this.

在本發明中,光源模組111與安裝部120直接連接的表面係外露的。例如,在本實施例中,在電路板112的第一表面112a之一側,除了與安裝部120連接的部分之外的其它部分可直接暴露於外在環境,增加與外在環境(例如外部空氣)直接接觸的面積。如此一來,由光源模組111所產生的熱可在電路板112的第一表面112a透過對流的方式散熱,在不須設置額外導熱元件的情況下即能夠達到最為直接的散熱效果。In the present invention, the surface directly connected to the light source module 111 and the mounting portion 120 is exposed. For example, in this embodiment, on one side of the first surface 112a of the circuit board 112, other parts except the part connected with the mounting portion 120 can be directly exposed to the external environment, increasing the connection with the external environment (such as external Air) the area in direct contact. In this way, the heat generated by the light source module 111 can be dissipated by convection on the first surface 112a of the circuit board 112, and the most direct heat dissipation effect can be achieved without additional heat conducting elements.

另一方面,本實施例中,在電路板112的第二表面112b之一側設置有一燈罩114。燈罩114覆蓋電路板112的第二表面112b上的發光單元113,且具有能夠使光線透射、並具有防水之作用。在一實施例中,燈罩114可透過鎖固的方式固定於電路板112的第二表面112b,但本發明不以此為限。在另一實施例中,燈罩114可透過黏合的方式固定於電路板112的第二表面112b;或者,在其它實施例中,燈罩114可與光源模組111以模組化的方式形成為單件結構,例如注塑成型,也就是將光源模組111與做為燈罩114的光學塑料用注塑成型方式結合為一體,以省去螺絲鎖附。而且,燈罩114與光源模組111之間更可填充一膠體,以進一步提升防水的效果。On the other hand, in this embodiment, a lampshade 114 is provided on one side of the second surface 112b of the circuit board 112. The lampshade 114 covers the light-emitting unit 113 on the second surface 112b of the circuit board 112, and has the function of being able to transmit light and being waterproof. In one embodiment, the lampshade 114 can be fixed to the second surface 112b of the circuit board 112 through a locking method, but the invention is not limited to this. In another embodiment, the lampshade 114 can be fixed to the second surface 112b of the circuit board 112 by bonding; or, in other embodiments, the lampshade 114 and the light source module 111 can be formed as a single module in a modular manner. The component structure, for example, injection molding, that is, the light source module 111 and the optical plastic used as the lamp cover 114 are combined into one body by injection molding, so as to eliminate the need for screw locking. Moreover, a glue can be filled between the lampshade 114 and the light source module 111 to further enhance the waterproof effect.

上述實施例,可藉由電路板112的第一表面112a直接外露,熱源可直接透過對流的方式散熱,故可以降低燈罩114內的溫度,而提升產品可靠度以及延長產品壽命。In the above embodiment, the first surface 112a of the circuit board 112 can be directly exposed, and the heat source can be directly dissipated by convection. Therefore, the temperature in the lampshade 114 can be reduced, thereby improving product reliability and prolonging product life.

請參照第3圖,其繪示根據本發明另一實施例之照明裝置200的立體圖。照明裝置200與第1圖之實施例所提供的照明裝置100的主要不同之處在於燈具結構210,其餘相同或相似之處不再贅述。Please refer to FIG. 3, which is a perspective view of a lighting device 200 according to another embodiment of the present invention. The main difference between the illuminating device 200 and the illuminating device 100 provided in the embodiment in FIG. 1 is the lamp structure 210, and the rest of the same or similarities will not be repeated.

在本實施例中,燈具結構210除了光源模組111之外,還包括防水膜層214。防水膜層214例如是透過噴塗、浸泡或包膜等方式包覆於電路板112的第二表面112b及發光單元113。在其它實施例中,防水膜層214可進一步包覆光源模組111的其它表面。透過防水膜層214的設置,可省略燈罩114,且因而可以省去螺絲鎖附,以及大幅地減少燈具結構210的厚度,如此得以進一步縮減熱的傳導距離,有效地提升散熱效率。In this embodiment, the lamp structure 210 includes a waterproof membrane layer 214 in addition to the light source module 111. The waterproof film layer 214 is coated on the second surface 112b of the circuit board 112 and the light-emitting unit 113, for example, by spraying, dipping, or coating. In other embodiments, the waterproof film layer 214 may further cover other surfaces of the light source module 111. Through the provision of the waterproof membrane layer 214, the lamp cover 114 can be omitted, and therefore the screw attachment can be omitted, and the thickness of the lamp structure 210 can be greatly reduced, so that the heat conduction distance can be further reduced, and the heat dissipation efficiency can be effectively improved.

綜上所述,本發明所提供的照明裝置,安裝部直接連接於光源模組的一表面,且此表面係外露於外部環境的,此結構設計不但可降低元件數量,且可以提供最為直接的散熱效果。同時,本發明所提供的照明裝置可省略傳統燈具結構中燈殼及導熱元件的設置,且不需要進行平整化等額外的加工,降低製造的成本。In summary, in the lighting device provided by the present invention, the mounting portion is directly connected to a surface of the light source module, and this surface is exposed to the external environment. This structural design can not only reduce the number of components, but also provide the most direct heat radiation. At the same time, the lighting device provided by the present invention can omit the arrangement of the lamp housing and the heat-conducting element in the traditional lamp structure, and does not require additional processing such as leveling, thereby reducing the manufacturing cost.

雖然本發明已以實施例揭露如上,然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾。因此,本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Those with ordinary knowledge in the technical field to which the present invention belongs can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to those defined by the attached patent application scope.

100,200:照明裝置 110,210:燈具結構 111:光源模組 112:電路板 112a:第一表面 112b:第二表面 113:發光單元 114:燈罩 120:安裝部 121:本體 121H:穿孔 122:蓋板 123:連接件 130:燈桿 140:第一緊固元件 150:第二緊固元件 214:防水膜層100,200: lighting installation 110,210: Lamp structure 111: light source module 112: circuit board 112a: first surface 112b: second surface 113: light-emitting unit 114: Lampshade 120: Installation Department 121: body 121H: Piercing 122: cover 123: connector 130: light pole 140: The first fastening element 150: second fastening element 214: Waterproof membrane layer

第1圖繪示根據本發明一實施例之照明裝置的立體圖。 第2圖繪示第1圖之照明裝置的分解圖。 第3圖繪示根據本發明另一實施例之照明裝置的立體圖。Figure 1 is a perspective view of a lighting device according to an embodiment of the invention. Fig. 2 shows an exploded view of the lighting device of Fig. 1. Figure 3 is a perspective view of a lighting device according to another embodiment of the invention.

100:照明裝置100: lighting device

110:燈具結構110: Lamp structure

111:光源模組111: light source module

112:電路板112: circuit board

112a:第一表面112a: first surface

112b:第二表面112b: second surface

113:發光單元113: light-emitting unit

114:燈罩114: Lampshade

120:安裝部120: Installation Department

121:本體121: body

121H:穿孔121H: Piercing

122:蓋板122: cover

123:連接件123: connector

130:燈桿130: light pole

140:第一緊固元件140: The first fastening element

150:第二緊固元件150: second fastening element

Claims (10)

一種照明裝置,包括: 一燈具結構,包括一光源模組;以及 一安裝部,該安裝部直接連接於該光源模組的一表面,且該表面係外露於外在環境中。A lighting device includes: A lamp structure including a light source module; and A mounting part is directly connected to a surface of the light source module, and the surface is exposed to the external environment. 如申請專利範圍第1項所述之照明裝置,更包括一燈桿,其中該安裝部與該燈桿相連接。The lighting device described in item 1 of the scope of patent application further includes a light pole, wherein the mounting part is connected with the light pole. 如申請專利範圍第2項所述之照明裝置,更包括一第一緊固元件,該第一緊固元件配置成用於將該安裝部固定於該燈桿上。The lighting device described in item 2 of the scope of patent application further includes a first fastening element configured to fix the mounting portion on the light pole. 如申請專利範圍第1項所述之照明裝置,其中該光源模組包括: 一電路板;以及 至少一發光單元,設置於該電路板上,其中該光源模組係經由該電路板與該安裝部直接連接。For the lighting device described in item 1 of the scope of patent application, the light source module includes: A circuit board; and At least one light-emitting unit is arranged on the circuit board, wherein the light source module is directly connected to the mounting portion via the circuit board. 如申請專利範圍第4項所述之照明裝置,其中該電路板包括相對的一第一表面及一第二表面,該至少一發光單元設置於該電路板的該第二表面,且該電路板的該第一表面為該光源模組的該表面。The lighting device according to claim 4, wherein the circuit board includes a first surface and a second surface opposite to each other, the at least one light-emitting unit is disposed on the second surface of the circuit board, and the circuit board The first surface is the surface of the light source module. 如申請專利範圍第5項所述之照明裝置,更包括一第二緊固元件,該第二緊固元件配置成用於將該安裝部固定於該電路板的該第一表面上。The lighting device described in item 5 of the scope of patent application further includes a second fastening element configured to fix the mounting portion on the first surface of the circuit board. 如申請專利範圍第5項所述之照明裝置,其中該燈具結構更包括一燈罩,該燈罩設置於該電路板的該第二表面上,以覆蓋於該至少一發光單元。According to the lighting device described in item 5 of the scope of patent application, the lamp structure further includes a lampshade, and the lampshade is arranged on the second surface of the circuit board to cover the at least one light-emitting unit. 如申請專利範圍第7項所述之照明裝置,其中該燈罩透過鎖固的方式固定於該電路板的該第二表面。The lighting device described in item 7 of the scope of patent application, wherein the lampshade is fixed to the second surface of the circuit board by a locking method. 如申請專利範圍第7項所述之照明裝置,其中該燈罩與該光源模組以模組化的方式形成為單件結構。In the lighting device described in item 7 of the scope of patent application, the lampshade and the light source module are formed as a single piece structure in a modular manner. 如申請專利範圍第5項所述之照明裝置,其中該燈具結構更包括一防水膜層,該防水膜層包覆於該電路板的該第二表面及該至少一發光單元。According to the lighting device described in item 5 of the scope of patent application, the lamp structure further includes a waterproof film layer covering the second surface of the circuit board and the at least one light-emitting unit.
TW109106322A 2020-02-26 2020-02-26 Lighting apparatus TW202132723A (en)

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