KR20100112214A - Pcb having cooling function for led lighting apparatus - Google Patents

Abstract

PURPOSE: A printed circuit board for a light emitting diode(LED) illuminating apparatus with a light emitting function is provided to prevent the malfunction of an LED illuminating apparatus due to heat by emitting the heat from the LED and a driving circuit through a heat sink. CONSTITUTION: A resin material based disk(10) is prepared. A heat emitting line(20) including a thermal conductive unit(21) and a heat emitting unit(22) emits heat to the outside. An insulating sheet is combined with the heat emitting line in order to insulate the heat emitting line. A patterning unit(40) is formed on the insulating sheet. A coating layer(50) is formed with the pattering unit.

Description

Printed Circuit Board for LED Lighting Device with Heat Dissipation {PCB HAVING COOLING FUNCTION FOR LED LIGHTING APPARATUS}

The present invention relates to a printed circuit board for an LED lighting device having a heat dissipation function.

In detail, the present invention provides a more efficient substrate for heat generated on LEDs and driving circuits on a printed circuit board in which a plurality of LEDs and driving circuits thereof are mounted in a surface mount technology (SMT) form to manufacture a lamp. The present invention relates to a printed circuit board for an LED lighting device having a heat dissipation function to prevent a malfunction or failure of a lighting lamp by implementing a configuration to radiate heat to the outside.

In addition, the present invention by molding the heat conducting material on the printed circuit board on which the LED and the driving circuit is mounted to further improve the heat dissipation efficiency generated on the LED and the driving circuit, by minimizing the leakage current emitted on the printed circuit board The present invention relates to a printed circuit board for an LED lighting device having a heat dissipation function to improve a power supply efficiency.

The lighting device applied to the interior space of a building using LED is mainly applied to the main light of a room or office, interior lighting to provide an aesthetic sense, and a table stand, and a more advanced form of a lighting tile using a light guide plate. It can be illustrated.

Such a lighting device has a plurality of LED modules and a plurality of LED modules mounted on a printed circuit board (hereinafter referred to as PCB) to drive a plurality of LEDs and LEDs in a specific arrangement, and the LED module in the space It is constructed by installing on the ceiling or wall. In particular, the LED and the driving circuit as described above is generally mounted in the surface mount technology (SMT) form to be separately mounted on both sides of a single PCB when mounted on the PCB.

Therefore, each element of the LED and the driving circuit is mainly applied to the SMD type, for reference, SMD type LED is a well-known that the configuration of the built-in dense type in which two or more light emitting chips are connected in parallel in the device. same.

Such LED lighting devices replace lighting devices such as fluorescent lamps and halogens in consideration of various color selections of LEDs, rapid response characteristics, electrical stability, and long lifespan of the power supply.

However, such an LED lighting device generates a considerable amount of heat when driven due to the device characteristics of the LED, and this heat is adversely affected on the circuit and thus involves heat dissipation on the LED or the PCB on which the LED and the driving circuit are mounted.

Such a heat dissipation configuration is typically implemented by combining a heat sink made of metal for heat exchange with the outside atmosphere by receiving heat to one or several points of the aforementioned PCB.

Heat sink coupled to the PCB in the heat dissipation configuration of the LED lighting device as described above is a significant limitation in simplifying or reducing the product because the heat sink itself is manufactured to a considerable size, the problem that the size of the lighting device itself is exposed.

In addition, the LED lighting device has a problem that the heat conduction time is delayed because the heat must be transferred through the PCB itself when transferring heat to one or several heat sinks, and the heat conduction efficiency is very low, resulting in considerably low heat dissipation efficiency.

The present invention has been invented to solve the above problems.

Accordingly, the present invention, by combining the heat transfer member in the SMT form on the PCB mounted with the LED and the driving circuit to heat the heat generated from each device to the heat sink for performing heat exchange with the outside as fast and high conductivity as possible The purpose is to provide a printed circuit board for LED lighting device.

Another object of the present invention is to mold the thermal conductive material on the surface on which each element of the PCB is mounted so as to transfer heat generated from the LED and the driving circuit with faster and higher conductivity, and to minimize leakage current emitted on the PCB. To provide a PCB for LED lighting device.

In order to achieve the above object, the present invention has the following configuration.

The present invention provides a printed circuit board (PCB) in which electrical and electronic devices constituting an LED and a driving circuit are mounted on both surfaces thereof, including: a disc formed of a resin material; A heat dissipation line coupled to face the surface of the disc to have a heat conduction function, and dissipating heat to the outside at one point or several points of the outer periphery; An insulating sheet coupled to the heat dissipation line to insulate the heat dissipation line; And a pattern portion formed on the insulating sheet to form a circuit connection when the LED and the device are mounted.

At this time, the heat dissipation line, the heat conducting member is coupled to face to the surface of the disc to transfer the heat generated from the LED and the device mounted; And a heat dissipation end portion protruding from one or more points of the outer circumference of the heat conductive member to dissipate heat transferred by the heat conductive member to the outside.

In addition, the heat dissipation line may include a heat conduction pin mounted through both sides of the PCB to transfer the heat of each element including the LED to the heat conduction member. Herein, the heat conductive fins are formed by molding carbon, CNT, and graphite alone, or by mixing and molding any two or more of carbon, CNT, and graphite.

On the other hand, the heat conducting member is applied to the copper plate, it is preferable that the heat conducting member is applied to the thickness of 35um ~ 140um with respect to 0.1t ~ 3.2t of the original plate of commercial FR4.

In order to achieve the above another object, the present invention has the following configuration.

In the present invention, a thermally conductive material layer is formed on a surface of the PCB on which the device is mounted. In this case, the thermally conductive material layer is formed by applying a composition having a thermal conductivity function by adding and mixing any one or more materials of carbon, CNT, and graphite to the synthetic resin. In particular, the thermally conductive material layer is preferably configured to maintain a thermal conductivity of 0.001W / m.k ~ 30W / m.k.

As described above, according to the present invention, the heat generated from the LEDs and the elements of the driving circuit is rapidly and efficiently transferred by the heat conduction lines formed by the heat conduction members of the PCB and radiated through heat sinks, thereby causing the LED lighting to be generated by heat. The effect of preventing the malfunction and failure of the device is obtained.

In addition, the present invention transmits the heat generated from the LED and the driving circuit with a faster and higher conductivity by the thermal conductive material molded on the PCB surface, and in particular, minimizes the leakage current emitted on the PCB to supply power to the LED and the driving circuit. The efficiency is improved.

Embodiments of the present invention as described above will be described in detail with reference to the accompanying drawings.

1 is a perspective view of a PCB according to the present invention is applied to a tubular module, Figure 2 is a perspective view of a PCB according to the present invention is applied to a lamp module, Figure 3 is a cross-sectional view of the PCB according to the present invention, Figure 4 is a PCB according to the present invention 5 is an enlarged cross-sectional view in which a heat conductive pin is applied to a PCB according to the present invention.

Referring to the drawings, in the PCB (P) according to the present invention, the LED (L) is mounted on one surface, the various elements (C) for driving the LED (L) is mounted on the back surface. Thus, in order to use both sides of the PCB (P), the LED (L) and the device (C) is mounted in the form of Surface Mount Technology (SMT), correspondingly the PCB (P) to each surface A pattern for constituting a circuit connection is formed in the.

More specifically, the PCB (P) is made of a disk 10, the heat dissipation line 20, the insulating sheet 30, the pattern portion 40, the coating layer 50. At this time, the heat dissipation line 20, the insulating sheet 30, the pattern portion 40, the coating layer 50 is configured to be laminated on both sides of the disc 10, respectively.

The disc 10 is a base for constructing the PCB (P), but can be made of a variety of materials, FR4 which is produced by stacking a plurality of glass fibers impregnated with epoxy resin to meet most electrical and physical properties Mainly applied. For reference, the FR4 is as well known that it is possible to implement a double-sided PCB (P).

The heat dissipation line 20 is coupled to face contact with both sides of the disc 10. The heat dissipation line 20 is formed in a plate shape corresponding to the shape and area of the original plate 10 and is formed by selecting a metal, particularly copper, in order to obtain high thermal conductivity.

In addition, the heat dissipation line 20 has a protruding configuration to discharge the heat to the outside at one point or several points of the outer circumference. To this end, the heat dissipation line 20 includes a heat conduction member 21 and a heat dissipation end 22.

The heat conducting member 21 is formed in the form of a copper plate as described above is coupled to face contact with one or both surfaces of the original plate (10). The heat conduction member 21 is a configuration for transferring heat generated from the LED (L) and the device (C) mounted on the PCB (P) after completion of the PCB (P) to the heat dissipation end (22).

The heat dissipation end 22 is formed to protrude at one or several outer circumferences of the heat conductive member 21. The heat dissipation end 22 as described above is configured to dissipate heat transferred by the heat conductive member 21 to the outside. In particular, the heat dissipation end 22 may be configured to extend and protrude further from the outer circumference of the heat conducting member 21 formed of a copper plate, in addition to the heat sink made of aluminum to expand the heat dissipation area It can include a configuration.

In addition, the heat dissipation line 20 is configured by adding a thermal conductive pin 23 mounted through both sides of the PCB (P). The heat conduction pins 23 are configured to transfer the heat of each element C including the LED L to the heat conduction member 21, and face the PCB P of the LED L or several elements C. One end is in contact with the surface to be made, the other end is configured to be located on the back side of the PCB (P). At this time, the heat conduction pin 23 is configured to allow the heat generated from the LED (L) and the element (C) to be forcibly transmitted to the heat conduction member 21 by penetrating through the above-described heat conduction member 21.

The heat conduction fins 23 are preferably formed by molding carbon, CNT, and graphite alone, or by mixing and molding any two or more of carbon, CNT, and graphite.

The insulating sheet 30 is coupled to the surface of the heat dissipation line 20, that is, the heat conductive member 21, to insulate the heat dissipation line 20. For reference, the insulating sheet 30 applies a prepreg manufactured in the form of a thin film by infiltrating the thermosetting resin into the glass fiber.

The pattern portion 40 is a circuit connection configuration formed on the insulating sheet 30. The pattern portion 40 is a plated thin film for performing a circuit connection when the LED (L) and the element (C) is mounted, in particular, the pattern portion 40 is a pattern of the desired shape for copper foil (Copper Foil) It is formed.

The coating layer 50 is formed on the top surface of the insulating sheet 30 together with the plated pattern portion 40, and the coating layer 50 is formed of a printed or painted layer, collectively referred to as "RPS".

PCB (P) manufactured by the above configuration, the heat conducting member 21 is 35um ~ 140um for the original plate 10t 0.1t ~ 3.2t applied to FR4 in consideration of the thickness of up to 3.5t to be implemented as a lighting device Applied in thickness.

At this time, when the thermal conductive member 21 is less than 35um, the conduction efficiency of heat generated from the LED (L) and the device (C) is drastically lowered, and when it exceeds 140um, the maximum thickness of the disc 10 is 3.2t. Considering the thickness of the insulating sheet 30, the pattern portion 40, and the like, which will be described later, the weight of the PCB (P) itself is considerably weighted in consideration of the thickness of more than necessary and 70 um of the thermal conductive member 21, which is copper. Let's go.

In addition, with respect to the thickness of the disc 10 and the heat conductive member 21, the insulating sheet 30 is suitable for the thickness of the insulating sheet 60um ~ 400um, the pattern portion 40 is preferably maintained to a thickness of 25um ~ 70um. In addition, the coating layer 50 is preferably formed to a thickness of approximately 20um ~ 35um.

Additional Examples

6 is a perspective view of a further embodiment of a PCB according to the present invention, and FIG. 7 is a cross-sectional view of a further embodiment of a PCB according to the present invention.

Referring to the drawings, a further embodiment of the PCB (P) proposes a configuration for maximizing the heat dissipation efficiency by conducting heat applied to the PCB (P) generated in the LED (L) and each device (C). To this end, the PCB (P) is composed of a thermally conductive material layer 60 is formed on the surface on which the device (C) is mounted.

The thermally conductive material layer 60 is formed by coating a composition having a thermal conductivity function by adding and mixing any one or more materials of carbon, carbon nanotubes (CNTs), and graphite (graphite) to a synthetic resin. At this time, the synthetic resin by selecting a resin such as PMMA (Poly methy methacrylate: polymethyl methacrylate), epoxy, silicone, which can perform the unit operation of the thermal conductivity according to the addition of the carbon, CNT, graphite Apply. Application of the mixed composition of the synthetic resin and carbon, CNT, graphite is appropriately selected in consideration of product specifications.

At this time, the thermal conductive material layer 60 is to maintain the thermal conductivity of 0.001W / mk ~ 30W / mk in consideration of the number of mounting of the above-described LED (L) and the amount of heat emitted from each device (C). desirable.

1 is a perspective view of a tubular lighting module to which the PCB according to the present invention is applied.

Figure 2 is a perspective view of a lamp-type lighting module to which the PCB according to the present invention is applied.

Figure 3 is a cross-sectional view of the lighting module applied PCB according to the present invention.

Figure 4 is a perspective view of the heat conduction pin is applied to the PCB according to the present invention.

Figure 5 is an enlarged cross-sectional view of the heat conduction pin is applied to the PCB according to the present invention.

Figure 6 is a perspective view of a further embodiment of a PCB according to the present invention.

7 is a cross-sectional view of a further embodiment of a PCB according to the present invention.

<Explanation of symbols for the main parts of the drawings>

10: disc 20: heat dissipation line

21: heat conductive member 22: heat dissipation end

30: heat dissipation sheet 40: pattern portion

50: coating layer

Claims (8)

In the PCB in which the electrical and electronic elements (C) constituting the LED (L) and the driving circuit are mounted on both sides, A disc 10 formed of a resin material; A heat dissipation line 20 coupled to face the surface of the disc 10 so as to have a heat conduction function, and dissipating heat to the outside at one point or several points of the outer periphery; An insulating sheet 30 coupled to the heat dissipation line 20 to insulate the heat dissipation line 20; The LED lighting device PCB having a heat dissipation function comprising a; formed on the insulating sheet 30 and the LED (L) and the device (C) is mounted to form a circuit portion 40 when the circuit connection. The method of claim 1, wherein the heat dissipation line 20 A heat conductive member 21 coupled to face to the surface of the disc 10 to transfer the heat generated by the LED L and the element C; LEDs having a heat dissipation function comprising a; heat dissipation end portion 22 protruding from one or more outer circumferences of the heat conductive member 21 to dissipate heat transferred by the heat conductive member 21 to the outside. PCB for lighting equipment. The method of claim 2, wherein the heat dissipation line 20 Heat conduction fins (23) mounted through both sides of the PCB (P) to transfer the heat of each element (C) including the LED (L) to the heat conducting member (21); PCB for LED lighting device. The method of claim 3, wherein the heat conductive pin 23 PCB for LED lighting apparatus having a heat dissipation function, characterized in that formed by molding each of carbon, CNT, graphite alone, or by mixing and molding any two or more of carbon, CNT, graphite. The method according to any one of claims 2 to 4, The heat conducting member 21 is applied to the copper plate, the heat conducting member 21 is an LED lighting device having a heat dissipation function, characterized in that applied to the thickness of 35um ~ 140um with respect to 0.1t ~ 3.2t of the original disc FR4 PCB. The method according to any one of claims 1 to 4, PCB for LED lighting device having a heat dissipation function, characterized in that the thermal conductive material layer 60 is formed on the surface on which the device (C) of the PCB (P) is mounted. The method of claim 6, The thermally conductive material layer 60 PCB for LED lighting device having a heat dissipation function, characterized in that formed by coating a composition having a thermal conductivity function by adding and mixing any one or more materials of carbon, CNT, graphite to the synthetic resin. The method of claim 6 or 7, wherein the thermally conductive material layer 60 PCB for LED lighting device having a heat dissipation function, characterized in that the thermal conductivity is maintained at 0.001W / m.k ~ 30W / m.k.

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