五、新型說明： 【新型所屬之技術領域】V. New description: [New technology field]
本案係屬於照明裝置之領域，特別是一種將LED -片及導電支架直接封裝於大面積的散熱載體上， 並藉由該導電支架作為電連接使用之直接導熱光源 模組。 【先前技術】 η人目刖/ft見之父通號誌燈、緊急用指示燈， 或是照明用之路燈，由過去的燈管、省電燈泡逐漸 被發光二極體（Light-emitting diode，LED)所取 代，由於LED具有省電、壽命長及亮度高等優點， 已成為將來照明領域的新寵兒。 而大部分照明燈具所使用的光源模組，請參閱 第1圖’係為一般常見光源模組的結構示意圖。如 圖中所示，該種光源模組1 〇係於一載板11之一面 設置至少一 LED發光源12 ’且該等LED發光源12 主要係由至少一 LED晶片121、一晶杯結構122及 一封裝部123所組成，復以焊接方式與該載板11上 之各個銲墊電連接。其中，該載板11係常見之 PCB電路板或是具有導熱特性的金屬材質而製成， 且該載板11可視需要而製成不同形狀、尺寸，以便 後續組裝時之電連接用途。 然’該等LED發光源12係間接組裝於該該載板 11上，致該等LED發光源12產生之熱量僅能透過 接觸邛位進行間接導熱，受到熱傳導的溫度梯度遞 減，其散熱效果自然也受到限制。再者，該光源模 1 〇係透過封裝該等LED發光源1 2，以及將該等 led發光源12焊接於該載板n等手續而製成，其 製程繁瑣而會提高製造成本。 疋以’本創作人提出了一種創新的直接導熱光 源模組結構’利用COB (Chip onboard)或是MCM(多 晶模組）封裝的方式將該等LED晶片直接封裝於〆 具有電性絕緣效果的載體上，並利用特殊設計的導 電支架與該等LED晶片電連接，其不但簡化了結構 而降低製造成本，且該等LED晶片透過大面積、# 造形的載體作散熱’也有便於安裝使用及提昇散熱 效果之功效。 【新型内容】 本創作之一目的’旨在提供一種直接導熱光源 模組的結構，其直接封裝的方式不僅能簡化結構以 降低製造成本，且能有效將熱量驅散而提昇散熱姝 率。 本創作之次一目的，旨在提供一種直接導熱光 源模組的燈罩結構，俾產生所需的照射角度，以提 高使用時的實用性。 為達上述目的’本創作之直接導熱光源模組孫 包括·一載體，其至少一面上具有一絕緣導熱層； 4 M393807This case belongs to the field of lighting devices, in particular, a direct heat conduction light source module in which an LED-plate and a conductive support are directly packaged on a large-area heat-dissipating carrier, and the conductive bracket is used as an electrical connection. [Prior Art] η人目刖/ft seeing the father's horn light, emergency indicator light, or street lamp for lighting, the light bulb is gradually illuminated by the past lamp and the power-saving bulb (Light-emitting diode, LED Replaced by LED, because of its power saving, long life and high brightness, LED has become the new darling of the future lighting field. For the light source module used in most lighting fixtures, please refer to Figure 1 for a schematic diagram of the general light source module. As shown in the figure, the light source module 1 is provided with at least one LED illumination source 12 ′ on one side of a carrier 11 , and the LED illumination sources 12 are mainly composed of at least one LED chip 121 and a crystal cup structure 122 . And a package portion 123, which is electrically connected to each of the pads on the carrier 11 by soldering. The carrier board 11 is made of a common PCB circuit board or a metal material having thermal conductivity characteristics, and the carrier board 11 can be formed into different shapes and sizes as needed for electrical connection in subsequent assembly. However, the LED light source 12 is indirectly assembled on the carrier 11, so that the heat generated by the LED light source 12 can only be indirectly thermally transmitted through the contact clamp, and the temperature gradient of heat conduction is reduced, and the heat dissipation effect is natural. Also limited. Further, the light source module 1 is manufactured by encapsulating the LED light source 12 and soldering the led light source 12 to the carrier n, and the manufacturing process is cumbersome and the manufacturing cost is increased.疋The 'creator has proposed an innovative direct thermal conduction light source module structure' to encapsulate the LED wafers directly in the COB (Chip onboard) or MCM (polycrystalline module) package to have electrical insulation effect. The carrier is electrically connected to the LED chip by using a specially designed conductive bracket, which not only simplifies the structure but reduces the manufacturing cost, and the LED chip transmits heat through the large-area, shaped carrier, and is also easy to install and use. Improve the effectiveness of the heat dissipation effect. [New content] One of the purposes of this creation is to provide a structure of a direct heat conduction light source module. The direct packaging method not only simplifies the structure to reduce the manufacturing cost, but also effectively dissipates the heat and improves the heat dissipation rate. The second objective of the present invention is to provide a lampshade structure for a direct heat conduction light source module that produces a desired illumination angle for improved usability. For the above purpose, the direct thermal conduction light source module of the present invention includes a carrier having an insulating and thermally conductive layer on at least one side thereof; 4 M393807
複數個LED晶片，設置於該絕緣導熱層上，且該等 LED晶片分別至少具有一正極及一負極；至少二導 電支架，圍繞設置於該等LED晶片的外部，且該等 導電支架一端部具有一接電部，另一端具有環繞該 等LED晶片的導電部，使該等UD晶片之正負極 分別與該等導電支架之導電部作電連接，且該相鄰 的導電部之間相互不導通；及—封裝部，係包覆封 裝該等LED晶片及該等導電支架之一部份。 本創作係利用COB(Chip〇nb〇ard)或以MCM(多 晶模組）封裝的方式將該等LED晶片直接封裝於一 具有電性絕緣效果㈣體上，·並利用特殊設計的導 電支架與該等LED晶片電連接，而達到簡化結構而 降低製造成本…；再者，該等LED晶片並透過 ^面積、乡㈣的龍作散熱1相提昇散熱效 果之目的。a plurality of LED chips are disposed on the insulating and thermally conductive layer, and each of the LED chips has at least one positive electrode and one negative electrode; at least two conductive supports are disposed around the outside of the LED chips, and one end of the conductive supports has An electrical connection portion having a conductive portion surrounding the LED chips, wherein the positive and negative electrodes of the UD wafer are electrically connected to the conductive portions of the conductive supports, respectively, and the adjacent conductive portions are not electrically connected to each other. And a package portion that encapsulates and encapsulates the LED chips and a portion of the conductive supports. The present invention uses COB (Chip〇nb〇ard) or MCM (polycrystalline module) package to directly package the LED chips on an electrically insulating effect (4) body, and utilizes specially designed conductive brackets. The LED chips are electrically connected to each other to achieve a simplified structure and reduce the manufacturing cost. Moreover, the LED chips are used to improve the heat dissipation effect through the heat dissipation of the area and the heat of the town.
叫淑瓜、活；f苒骽，且 於該載體之周緣環設有複數 计咕 欺熟鰭片，而可利用 該等放熱鰭片增加其散熱效果。 於一實施例中，直接導埶# 导…、光源模組更具有一燈 罩，該燈罩係包覆設置於 方且古一— μ 了褒。卩上。且該燈罩下 一有一谷置槽，以供容置該 燈夏目士 » 可屐邵。再者，於該 且罩上更具有一聚光部，供以 發出的光線。或於該燈罩上更料m晶片所 擴散該等LED晶片所發出的光線。—散光部’供以 5 M393807 於-實施例中’為方便後續之組裝程序，該等 導電支架之接電部係為插針型式，且該載體上具有 至少二插孔，使該等接電部穿入該插孔而設於該載 體下方，以便後續與一外接電源作插接之接續工 作°抑或是該等導電支架之接電部係為銲墊型式， 且設置該載體側緣，以便後續與該外接電源作焊接 之接續工作。 於一實施例中，該等導電支架之導電部係半圓 形片狀結構體，組裝後而圍繞設置於該等led晶片 的外部。或是該等導電支架之導電部係、门字形片狀 結構體，組裝後而圍繞設置於該等LED晶片的外 部。抑或是於該等導電部一側具有複數個架橋結 構，供以電連接該等led晶片，而縮短各LED晶片 與該等導電支架之打線距離，以降低電連接時的阻 抗0 【實施方式】 為使貴審查委員能清楚了解本創作之内容，謹 以下列說明搭配圖式，敬請參閱。 凊參閱第2、3、4圖，係為本創作第一實施例 的立體分解圖、組裝後的剖視圖及其上視圖。如圖 中所示，本創作之直接導熱光源模組2 〇，係供直接 接電使用，或與其他外接電源電連接。該直接導熱 光源模組20係包括一載體2卜複數個LED晶片22、 6 M393807 二導電支架23及一封裝部24。 其中’該載體21係呈圓盤形結構體，且於該載 體21之頂面係塗佈設有一絕緣導熱層21丨；再者， 該載體21之周緣係環設有複數個散熱鰭片212，而 可利用該等散熱鰭片212增加其散熱效果。 該等LED晶片22係以矩陣的排列方式，或以同 心圓的輻射排列方式設置於該絕緣導熱層211上， 且該各個LED晶片22分別具有一正極221及一負極 222。 ' 該二導電支架23之一端部具有一接電部23 i， 另一端具有環繞該等LED晶片22的導電部232，該 等導電支架23之導電部232係半圓形片狀結構體， 組裝後而圍繞設置於該等LED晶片22的外部。應注 意的是，該等導電支架23之接電部231係為插針型 式’且於該載體21上具有至少二插孔213，使該等 接電部231穿入該插孔213而設於該載體21下方， 以便後續與一外接電源作插接之接續工作。而該等 LED日日片22之正極221、負極222分別與該等導電 支架23之導電部232作電連接，且該相鄰的導電部 232之間相互不導通。 該封裝部24係選用一般常見的透明膠或螢光 踢’以用來包覆封裝該等LED晶片22及該等導電支 架23之—部份，以提供對於該等LED晶片22的保 護效果。 7 M393807 本創作係先將該等LED晶片22固設於該載體21 頂面’且係經由打線之手段而與該等導電支架23完 成電連接，最後在由該封裝部24包覆封裝，此手段 係與般C0B ( Chip 〇n board)的方式相同，而使 該等LED晶片22直接封裝於該載體21上，其不但 能夠達到簡化結構而降低製造成本之目的，且該等 LED晶片22透過該載體21亦能直接作散熱，而有 助於提昇散熱效果。 另外’本創作之直接導熱光源模組2〇更具有一 燈罩25 ’請參閱第5圖，係為本創作所使用的燈罩 之結構示意圖。如圖中所示，該燈罩25係包覆設置 於該封裝部24上，且該燈罩25下方係具有一容置 槽251’以供容置該封裝部24。再如圖中所示，於 該燈罩25上更具有一類似凸透鏡結構的聚光部 252 ’供以匯聚該等LED晶片22所發出的光線。或 於該燈罩25上更具有一散光部，（圖中未顯示）供 以擴散該等LED晶片22所發出的光線。因此，本創 作更可結合各種不同形式的該燈罩25，以增加本創 作使用時的發光效果、美觀性及保護性等，其形狀、 材質亦不再贅述。 請參閱第6圖’係為第二實施例的上視圖。如 圖中所示’於第二實施例十，該直接導熱光源模組 30同樣包括了 一載體31、複數個LED晶片32、二 導電支架33及一封裝部34，且其設置方式大致相 8 M393807 同，於此不再贅述。其中，該等導電支架33之導電 部332待'门字形片I结構體，&裝後而可_ 於該等LED晶片32的外部，且該等導電支架33之 接電部331係、為銲塾型 <，且言史置該載體頂面的 側緣，以便後續與一外接電源作焊接之接續工作。It is called squash, live; f苒骽, and a plurality of 欺 bullying fins are arranged on the circumference of the carrier, and the heat-dissipating fins can be used to increase the heat dissipation effect. In an embodiment, the direct light guide and the light source module further have a light cover, and the light cover is covered and disposed on the square.卩上. And there is a trough in the bottom of the lampshade for accommodating the lamp. Furthermore, there is a concentrating portion on the cover for the emitted light. Or, on the lamp cover, the m wafer is diffused to diffuse the light emitted by the LED chips. —The astigmatism section is provided with 5 M393807 in the embodiment. In order to facilitate the subsequent assembly process, the electrical connection part of the conductive support is a pin type, and the carrier has at least two jacks for enabling the power connection. The portion is inserted into the jack and disposed under the carrier for subsequent connection with an external power source, or the power receiving portion of the conductive bracket is a pad type, and the carrier side edge is disposed so that Subsequent work with the external power supply for welding. In one embodiment, the conductive portions of the conductive supports are semi-circular sheet-like structures that are assembled and disposed around the outside of the led wafers. Or the conductive portion of the conductive holder or the gate-shaped sheet structure is assembled and disposed around the outer portion of the LED chips. Or a plurality of bridging structures on the side of the conductive portions for electrically connecting the led wafers, thereby shortening the wiring distance between the LED chips and the conductive supports to reduce the impedance when the electrical connections are made 0 [Embodiment] In order for your review board to have a clear understanding of the content of this creation, please use the following instructions to match the drawings, please see. Referring to Figures 2, 3 and 4, there is shown a perspective exploded view of the first embodiment of the present invention, a cross-sectional view after assembly, and a top view thereof. As shown in the figure, the direct heat conduction light source module 2 本 of the present invention is used for direct power connection or electrically connected with other external power sources. The direct heat conduction light source module 20 includes a carrier 2, a plurality of LED chips 22, a 6 M393807 second conductive support 23, and a package portion 24. The carrier 21 is a disc-shaped structure, and an insulating and thermally conductive layer 21 is coated on the top surface of the carrier 21; further, the peripheral ring of the carrier 21 is provided with a plurality of heat dissipation fins 212. The heat dissipation fins 212 can be utilized to increase the heat dissipation effect. The LED chips 22 are disposed on the insulating and thermally conductive layer 211 in a matrix arrangement or in a concentric arrangement of radiation, and each of the LED chips 22 has a positive electrode 221 and a negative electrode 222, respectively. One end of the two conductive brackets 23 has a power receiving portion 23 i, and the other end has a conductive portion 232 surrounding the LED chips 22, and the conductive portion 232 of the conductive brackets 23 is a semi-circular sheet-like structure, assembled It is then disposed around the outside of the LED chips 22. It should be noted that the power receiving portion 231 of the conductive bracket 23 is a pin type 'and has at least two sockets 213 on the carrier 21, and the power receiving portion 231 is inserted into the socket 213 and is disposed on the socket 213. The carrier 21 is below, so as to be subsequently connected to an external power supply. The positive electrode 221 and the negative electrode 222 of the LED day piece 22 are electrically connected to the conductive portions 232 of the conductive holders 23, respectively, and the adjacent conductive portions 232 are not electrically connected to each other. The encapsulating portion 24 is formed by using a generally common transparent plastic or fluorescent kick to cover the portions of the LED wafer 22 and the conductive holders 23 to provide protection for the LED chips 22. 7 M393807 The present invention firstly fixes the LED chips 22 on the top surface of the carrier 21 and electrically connects them to the conductive brackets 23 by means of wire bonding, and finally encapsulates the packages by the package portion 24. The method is the same as that of the conventional C0B (Chip 〇n board), and the LED chips 22 are directly packaged on the carrier 21, which not only achieves the purpose of simplifying the structure but also reduces the manufacturing cost, and the LED chips 22 pass through. The carrier 21 can also directly dissipate heat, which helps to improve the heat dissipation effect. In addition, the direct heat conduction light source module 2 of the present invention has a lampshade 25'. Please refer to Fig. 5, which is a schematic structural view of the lampshade used in the present invention. As shown in the figure, the lamp cover 25 is disposed on the package portion 24, and has a receiving groove 251' under the lamp cover 25 for receiving the package portion 24. Further, as shown in the figure, a concentrating portion 252' having a convex lens structure is further provided on the lamp cover 25 for condensing the light emitted from the LED chips 22. Or, the lamp cover 25 further has an astigmatism portion (not shown) for diffusing the light emitted by the LED chips 22. Therefore, the present invention can be combined with various different types of the lampshade 25 to increase the luminous effect, aesthetics and protection of the present invention, and the shape and material thereof are not described again. Please refer to Fig. 6 for a top view of the second embodiment. As shown in the figure, in the second embodiment, the direct heat conduction light source module 30 also includes a carrier 31, a plurality of LED chips 32, two conductive supports 33 and a package portion 34, and the arrangement thereof is substantially 8 M393807 is the same, and will not be described here. The conductive portion 332 of the conductive support 33 is to be a '--shaped piece I structure, and the latter can be mounted on the outside of the LED chip 32, and the electrical connection portion 331 of the conductive support 33 is Soldering type <, and the side edge of the top surface of the carrier is set to be used for subsequent welding with an external power source.
·. 請參閱f 7圖’係為第三實施例的上視圖。如 圖中所示，其直接導熱發光模組4〇的結構係與第一 實施例相同，同樣具有一載體4卜複數個多晶型lED 晶片42、六個導電支架43及一封裝部44，所使用 的該等導電支架43之數量及形狀略有不同為配合 該等多晶型LED晶片42，該等導電支架43之導電 部432成1/6圓弧形結構體，並於該導電部432之 一端具有一接電部431，以使該等多晶型lED晶片 42設於該載體41中央，且該等導電支架43係圍繞 設於該等多晶型LED晶片42外部，而將該等多晶型 LED晶片42分別與該等導電支架43之導電部432 電連接’該等導電支架43之接電部431再與一外接 電源電連接後，以控制該多晶型LEI)晶片42的明 滅、顏色或亮度調整。 再請參閱第8圓，係為本創作第四實施例的上 視圖。如圖中所示，其係包括一對導電支架53，且 該導電支架53之一端係具有一接電部531，另一端 具有半圓弧形的導電部532’且該等導電部532 — 側具有複數個架橋結構533，以使該成對設置的導 9 M393807 電部532之架橋結構533相互交又排列，且將複數 個LED晶片52並列設置於該等架橋結構533内並 使之分別與該等架橋結# 533電連#，達到縮短打 線距離之目的’且能有效降低電連接時的阻抗。 唯以上所者，冑為本創作《較佳實施例而 已，並非用以限定本創作實施之範圍，其他如：該 載體的形狀、尺寸及材質選用等，或該等LED晶片 =大小’又或者是導電支架的形狀等，故該所 屬技術領域中具有诵 你㈣ T具有通常知識者’又或熟習此技術所 所作之^變化者，在不脫離本創作之精神與範圍下 =Γ 化與修飾’皆應涵蓋於本創作之專利 m 10 M393807 【圖式簡單說明】 第1圖，為一般常見光源模組的結構示意圖。 第2圖，為本創作第一實施例的立體分解圖。 第3圖，為本創作第一實施例組裝後的剖視圖。 第4圖，為本創作第一實施例組裝後的上視圖。 第5圖，為本創作第一實施例所使用的燈罩之結構 不意圖。 第6圖，為本創作第二實施例的上視圖。 第7圖，為本創作第三實施例的上視圖。 第8圖，為本創作第四實施例的上視圖。 【主要元件符號說明】 【習知】 10 光源模組 11 載板 111 銲墊Please refer to the figure f7 as a top view of the third embodiment. As shown in the figure, the structure of the direct thermal conduction light-emitting module 4 is the same as that of the first embodiment, and has a carrier 4, a plurality of polycrystalline lED wafers 42, six conductive supports 43, and a package portion 44. The number and shape of the conductive holders 43 used are slightly different to match the polycrystalline LED chips 42. The conductive portions 432 of the conductive holders 43 are formed into a 1/6 circular arc structure, and the conductive portions are One end of the 432 has a power receiving portion 431, so that the polycrystalline lED wafers 42 are disposed in the center of the carrier 41, and the conductive brackets 43 are disposed around the polycrystalline LED chips 42. The polycrystalline LED chips 42 are electrically connected to the conductive portions 432 of the conductive holders 43. The electrical connection portions 431 of the conductive holders 43 are electrically connected to an external power source to control the polycrystalline LEI wafer 42. Brightness, color or brightness adjustment. Referring again to the eighth circle, it is a top view of the fourth embodiment of the present creation. As shown in the figure, it comprises a pair of conductive brackets 53, and one end of the conductive bracket 53 has a power receiving portion 531, and the other end has a semi-circular arc-shaped conductive portion 532' and the conductive portions 532 have sides A plurality of bridging structures 533 are arranged such that the bridge structures 533 of the pair of 9 M393807 electrical portions 532 are arranged and arranged one another, and a plurality of LED chips 52 are juxtaposed in the bridging structures 533 and respectively Waiting for the bridge junction # 533 electric connection #, to achieve the purpose of shortening the wire distance 'and can effectively reduce the impedance of the electrical connection. The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, such as: the shape, size and material selection of the carrier, or the LED chip = size 'or It is the shape of the conductive support, etc., so that there is a change in the technical field of the person who has the usual knowledge, or who is familiar with the technology, without departing from the spirit and scope of the creation. 'All should be covered by the patent of this creation m 10 M393807 [Simple description of the figure] Figure 1 is a schematic diagram of the structure of a common light source module. Fig. 2 is an exploded perspective view showing the first embodiment of the creation. Fig. 3 is a cross-sectional view showing the assembled first embodiment of the creation. Fig. 4 is a top plan view showing the assembled first embodiment of the creation. Fig. 5 is a view showing the structure of the lampshade used in the first embodiment of the present invention. Figure 6 is a top view of the second embodiment of the creation. Fig. 7 is a top view of the third embodiment of the creation. Figure 8 is a top view of the fourth embodiment of the creation. [Main component symbol description] [Practical] 10 Light source module 11 Carrier board 111 Pad
12 LED發光源 121 LED晶片 122 晶杯結構 123 封裝部 【第一實施例】 20 直接導熱光源模組 21 載體 211 絕緣導熱層 11 M393807 212 散熱鰭片 213 插孔 22 LED晶片 221 正極 222 負極 23 導電支架 231 接電部 232 導電部 24 封裝部 25 燈罩 251 容置槽 252 聚光部 【第二實施例】 30 直接導熱光源模組 31 載體 32 LED晶片 33 導電支架 331 接電部 332 導電部 34 封裝部 【第三實施例】 40 直接導熱光源模組 41 載體 42 多晶型LED晶片 12 M393807 43 導電支架 431 接電部 432 導電部 44 封裝部 【第四實施例】 52 L E D晶片 53 導電支架 531 接電部 532 導電部 533 架橋結構12 LED light source 121 LED chip 122 crystal cup structure 123 package part [first embodiment] 20 direct heat conduction light source module 21 carrier 211 insulating heat conduction layer 11 M393807 212 heat sink fin 213 jack 22 LED chip 221 positive electrode 222 negative electrode 23 conductive Bracket 231 Electrical connection part 232 Conductive part 24 Encapsulation part 25 Lamp cover 251 accommodating groove 252 Condensing part [Second embodiment] 30 Direct heat conduction light source module 31 Carrier 32 LED chip 33 Conductive support 331 Electrical connection part 332 Conductive part 34 Package [Third Embodiment] 40 Direct heat conduction light source module 41 Carrier 42 Polycrystalline LED wafer 12 M393807 43 Conductive bracket 431 Power supply portion 432 Conductive portion 44 Package portion [Fourth embodiment] 52 LED chip 53 Conductive bracket 531 Electrical part 532 conductive part 533 bridging structure
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