WO2006108339A1 - Led white light source based on metal wiring board - Google Patents

Led white light source based on metal wiring board Download PDF

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Publication number
WO2006108339A1
WO2006108339A1 PCT/CN2006/000488 CN2006000488W WO2006108339A1 WO 2006108339 A1 WO2006108339 A1 WO 2006108339A1 CN 2006000488 W CN2006000488 W CN 2006000488W WO 2006108339 A1 WO2006108339 A1 WO 2006108339A1
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WO
WIPO (PCT)
Prior art keywords
light
circuit board
light source
metal circuit
led
Prior art date
Application number
PCT/CN2006/000488
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French (fr)
Chinese (zh)
Inventor
Bing-Wen Liang
Nai-Tao Liu
Ze-Shan Gao
Original Assignee
Nanjing Handson Co., Ltd
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Filing date
Publication date
Application filed by Nanjing Handson Co., Ltd filed Critical Nanjing Handson Co., Ltd
Publication of WO2006108339A1 publication Critical patent/WO2006108339A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements

Definitions

  • the invention relates to a light source with a semiconductor light emitting diode (LED) as an illuminant, in particular to an LED white light source suitable for general illumination, in particular to an LED white light source based on a metal circuit board, belonging to the technical field of electric light source and illumination.
  • LED semiconductor light emitting diode
  • the incandescent lamp is the representative of the first generation of electric light source. It is powered by heating the tungsten wire to make it glow in a hot state, but the luminous efficiency is low and the service life is short. Since then, people have invented fluorescent lamps, and the history of electric light sources has undergone a new revolution. The significance of this revolution is so great that 70% of the artificial light in the world is still from fluorescent lamps. However, fluorescent lamps are not an ideal illumination source. The main performances are as follows: First, the fluorescent lamp has poor color rendering performance and is prone to color variation; second, there is brightness stroboscopic, which is easy to cause visual fatigue; Third, fluorescent lamps have more serious mercury. Pollution problems are not good for the manufacture and use of lamps and environmental protection.
  • high-power LED lighting usually encloses a large-sized blue-light LBD chip in the mode of FIG. 1.
  • the main part is a plastic insulating frame 1 with a lug 11 made of a molding material, aluminum, copper or alloy material.
  • the heat sink 2 is embedded in the middle of the insulating frame 1,
  • a soft rubber 13 is coated between the insulating frame 1 and the heat sink 2, and the silicon carrier sheet 3 with the printed circuit pattern is soldered to the heat sink 2 by the solder material 4, and the LED chip 5 is pressed on the silicon carrier sheet by flipping.
  • the metal contact electrode contact 6 of 3 is connected to the electrode contact tab 11 by a gold wire 7.
  • a yellow phosphor 9 is uniformly applied around the LED chip 5; in addition, an optical lens 8 is fixed to the insulating frame 1, and the gap between the chip and the optical lens needs to fill the epoxy or silicone resin 12.
  • the assembled LED chips are all covered inside the optical lens 8.
  • the blue LED chip produces blue light, while the yellow phosphor is excited to produce yellow light, and the yellow light and blue light are mixed to produce white light.
  • the LED light source of the prior art package has a complicated structure, a complicated manufacturing process, and many components are used, and the installation of the heat sink, the optical lens, the heat sink and the like, and the filling of the soft glue are required. Manually completed, making production costs too high, product quality is difficult to guarantee.
  • the LED lighting fixtures on the market are basically based on the traditional luminaires.
  • the LED white light source is added. This is just a simple form of assembly. When using this kind of lighting fixture, the heat generated by the LED can not be fully distributed to the luminaire. In the external environment, the internal temperature of the LED rises, resulting in a decrease in luminous efficiency and even the failure of the entire product.
  • the expected life of the LED is difficult to guarantee; on the other hand, since the LED light source is a very intense point light source, it must be used for lighting fixtures.
  • optical components such as a light diffusing sheet or a diffusing reflector are used to make the light into a uniform and soft integrated surface light source, and the technical problem has not been effectively solved in the prior art.
  • the object of the present invention is to overcome the deficiencies of the prior art, and to improve the structure of the LED, and to provide a simple structure, easy processing, long service life and good effect.
  • An LED white light source based on a metal circuit board the blue LED chip is used as an illuminant, the bottom surface of the chip is directly soldered on the metal circuit board of the control circuit thereof, and the other surface of the chip is coated with epoxy or silicon transparent resin, in the metal
  • One side of the circuit board forms a hemisphere; the periphery of the hemisphere is provided with a silver-plated light reflecting area, the shape of which is an inverted circular dome surface; and a hemispherical crown shape containing a yellow phosphor above the light reflecting area
  • the inner surface of the light transmissive sheet is coincident with the conical surface of the light reflecting region to form a closed three-dimensional structure, and the hemisphere including the LED chip is located at the bottom of the three-dimensional structure.
  • a bowl-shaped pit may be disposed on the metal circuit board, the LED chip is soldered at the bottom of the pit, and the periphery of the pit is polished and plated to become a light reflecting area; the metal circuit board It can also be a flat structure, the LED chip is directly soldered on the circuit board, and a light reflecting bowl is additionally disposed around the LED chip.
  • the yellow phosphor may be coated on the inner and outer surfaces of the light transmissive sheet; when the light transmissive sheet is made of a molding material, it may also be directly in the manufacturing material. A yellow phosphor is added, and then injected into a light-transmissive sheet, so that the yellow phosphors are uniformly distributed inside the material of the light-transmitting sheet.
  • the bowl-shaped pit is a concave circular sill
  • the height of the truncated cone is 1. 5 ⁇ 6 mm
  • the cone angle is preferably 30 ° - 120 °
  • the height of the light reflecting bowl is also 1.5 to 6 mm
  • the taper angle is also preferably in the range of 30 to 120 degrees.
  • the invention provides a semiconductor light-emitting diode white light source which adopts a high-efficiency blue LED chip and is directly packaged based on a metal circuit board, and its outstanding substantive features and remarkable progress are mainly embodied in the following aspects: ,
  • the LED chip is directly packaged by a circuit board with a metal interlayer, and the structure is convenient.
  • the light-transmissive sheet is equivalent to the lampshade, and the yellow phosphor powder can be disposed on the light-transmitting sheet in various ways, and can be manufactured and processed very uniformly, completely solving the white light that appears in the single white light high-power LED packaging process in the prior art.
  • the uneven technical problem, and the phosphor in the invention is not in direct contact with the chip, and can effectively prevent the phosphor from rapidly deteriorating due to long-term contact with high temperature;
  • the metal circuit board is integrated with the LED chip.
  • the chip is directly mounted on the metal circuit board with heat dissipation function.
  • the integrated light source has an effective heat dissipation channel, and the heat dissipation area increases and the thermal resistance decreases.
  • the problem of heat generation on the design of two-dimensional light source for semiconductor illumination minimizes the influence of temperature rise on the stability of high-power LEDs, effectively solves the problem of heat dissipation in the use of light sources, and prolongs the service life of light sources;
  • the light is stable, no stroboscopic, no infrared and ultraviolet light, and the light guiding device is arranged in the light emitting part of the LED, which can improve the light extraction efficiency of the chip, effectively control the light angle and light intensity distribution, and then optimize the light.
  • the geometrical matching relationship between the reflective area and the transparent sheet makes the point light source formed by the blue LED become an integrated surface light source with soft light, which improves visual comfort and can be directly applied to the LED lamp;
  • FIG. 1 is a schematic diagram of a typical LED package mode in the prior art.
  • Fig. 2 is a schematic view showing the structure of a main body according to an embodiment of the present invention
  • Fig. 2a is a schematic structural view of a portion of the metal wiring board of Fig. 2
  • Fig. 2b is a plan view of Fig. 2a.
  • Fig. 3 is a schematic view showing the structure of a main body according to another embodiment of the present invention.
  • Fig. 3a is a structural view showing a portion of the metal wiring board and the light reflecting bowl of Fig. 3
  • Fig. 3b is a plan view of Fig. 3a.
  • 20 metal circuit boards, 21 pits, 22 is an LED chip, 23 light reflection area, 24 is a hemisphere formed by coating an epoxy chip or a silicon-based transparent resin, 25 light-transmissive sheets, 26 mounting holes, 27 contact electrodes, 28 alloy coating, 29 light reflecting bowl.
  • the high-power LED has smooth illumination, no stroboscopic, no infrared and ultraviolet rays. It is an electric light source that is very beneficial to people's physical and mental health. It must solve two technical problems when it is used to manufacture lighting fixtures.
  • LED converts electrical energy into light energy. Because of the resistance and non-radiative recombination, some heat will be generated. If the heat is not fully dissipated, the internal temperature of the LED will rise, resulting in a decrease in LED luminous efficiency. High, the LED will fail. Therefore, when designing the LED lighting source, it is necessary to ensure good heat dissipation, otherwise it will be difficult to guarantee the expected life of the LED.
  • the LED light source is a point light source with very high luminous intensity.
  • the point source and the light of the LED should be diffused.
  • An optical component such as a sheet or a diffuse reflector is used together, and the light is fused, scattered, and diffused to become an integrated surface light source with uniform light and softness.
  • the invention starts from solving the above two technical problems, overcomes the various shortcomings of the prior art, and adopts a white light generating mode which is completely different from the traditional white LED design and the combined lighting, and proposes a semiconductor white light source suitable for general illumination. Its technical measures are:
  • the other surface of the chip is coated with an epoxy or silicon-based transparent resin, and a hemisphere is formed on one side of the metal wiring board to protect the LED chip and help to derive the light emission of the LED.
  • the periphery of the hemisphere is provided with a light-reflecting area with a silver-plated surface, which is in the shape of an inverted conical surface.
  • a light-transmissive sheet containing a yellow phosphor in a hemispherical crown shape is disposed above the light reflecting region, and an inner surface of the light-transmitting sheet is coincident with a conical surface of the light-reflecting region to form a closed three-dimensional structure, and the hemisphere including the LED chip
  • the body is located at the bottom of the three-dimensional structure.
  • the LED chip is soldered to the bottom of the pit, and the periphery of the pit is polished and plated to become a light reflection zone.
  • the metal circuit board is still a flat structure, the LED chip is directly connected to the metal circuit board, and then a light reflecting bowl is arranged around the LED chip, and the inner surface of the light reflecting bowl is processed into a light reflecting area.
  • the bowl-shaped pit is actually a concave truncated cone.
  • the height of the truncated cone is 1. 5 ⁇ 6 mm, and the cone angle is preferably 30 ° ⁇ 120.
  • the height of the light reflecting bowl is also 1. 5 ⁇ 6 mm, and the cone angle is also 30. ⁇ 120.
  • the light-transmissive sheet can be regarded as a lamp cover, and the yellow phosphor can be attached to the light-transmitting sheet in various ways.
  • a yellow phosphor or a material containing a yellow phosphor is uniformly and firmly coated on the inner surface or the outer surface of the lampshade by a sputtering, evaporation or coating process to form a yellow phosphor layer;
  • a yellow phosphor is added to the transparent molding material of the processing lampshade in a certain proportion, and then injection-molded, and a yellow phosphor is uniformly distributed in the obtained light-transmitting sheet.
  • the LED chip When the power is introduced, the LED chip generates blue light, is optically adjusted by epoxy or silicon-based transparent resin, diffuses under the action of the light-reflecting region, and transmits through the light-transmissive sheet containing the yellow phosphor, and forms an integral combination by diffusion and color mixing.
  • a semiconductor white light source suitable for general illumination.
  • the substrate of the metal wiring board 20 is made of metal aluminum, copper or other alloy plate having a thickness of 0.5 to 3 mm, and a large-area substrate surface application machine.
  • the mechanical and chemical methods are pre-treated, and the circular mounting holes 26 and the truncated cone-shaped dimples 21 are mechanically stamped, and then the bottom and the periphery of the dimples 21 are polished and plated to form a bright reflecting bowl, and the LEDs are formed.
  • the chip 22 is soldered to the bottom of the reflecting bowl, and the periphery of the bowl becomes the light reflecting area 23.
  • the chip needs to be specially evaporated or coated with indium gold, gold tin or a similar alloy to form an alloy coating 28 suitable for soldering the bottom surface of the chip. Partial protection of the polished and silver plated partially coated protective film prior to further processing.
  • a metal oxide substrate is coated with an insulating and thermally conductive layer by chemical oxidation, and a conductive metal having a main component of copper is coated on the insulating and thermally conductive layer by a deposition and plating process, and then ordinary printing is performed on the metal layer.
  • the board fabrication process produces very fine conductive traces and contact electrodes 27.
  • the large-area metal circuit board is subjected to punching and surface cleaning to obtain a package basic component of a single LED chip.
  • Directly packaged LED chips are typically fabricated in monopolar or bipolar form.
  • the blue LED chip 22 is placed on the alloy coating 28 and soldered at a temperature of 120 to 350 ° C, and the chip can be firmly soldered to the metal wiring board 20.
  • 25 to 50 micron gold wire bonding is used to electrically connect the LED chip to the conductive line.
  • the LED chip is coated with epoxy or silicon-based transparent resin on the remaining surface of the LED chip, and a hemispherical structure 24 is formed on one side of the metal circuit board to protect the chip and increase the light output. Rate, then a light-transmissive sheet 25 having a surface coated with or internally doped with a yellow phosphor is applied over the pit 21 to form an LED white light source based on a metal wiring board.
  • the light-transmitting sheet 25 is also referred to as a light-diffusing light-transmissive sheet, and can be used as a lamp cover for an LED light source, and is designed into a hemispherical crown shape according to optical principles using a transparent or translucent molding material.
  • FIGS 3, 3a and 3b illustrate another main structure of the present invention which does not machine a dimple on a metal wiring board, but additionally processes an inverted truncated cone shaped light reflection from a metal or plastic material.
  • Bowl 29 the inner surface of which is polished and plated with silver to form a bright
  • the reflecting surface 23 after the LED chip mounting process is completed, places the light reflecting bowl 29 around the LED chip.
  • the other processing of this structure is basically similar to the above.
  • the inner surface thereof can also be coated, which can effectively control the light angle and the light intensity distribution, and improve the light extraction efficiency of the chip.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

There is provided a white light source using LED as luminous body, which includes a taper light reflecting bowl formed on the metal wiring board, alloy coating layer coated in the center of the light reflecting bowl, blue light LED chip having high power bonded on the alloy coating layer, transparent epoxy covering the surface of LED chip, light transmission layer formed on the taper light reflecting bowl, wherein yellow fluorescent material is mixed in the light transmission layer. The white light source is used in illumination field.

Description

基于金属线路板的 LED白光光源  LED white light source based on metal circuit board
技术领域 Technical field
本发明涉及以半导体发光二极管 （LED ) 为发光体的光源， 尤其 涉及适合通用照明的 LED白光光源，特别为一种基于金属线路板的 LED 白光光源， 属于电光源与照明技术领域。  The invention relates to a light source with a semiconductor light emitting diode (LED) as an illuminant, in particular to an LED white light source suitable for general illumination, in particular to an LED white light source based on a metal circuit board, belonging to the technical field of electric light source and illumination.
背景技术 Background technique
自从爱迪生发明了白炽灯泡以后人类进入了照明新时代。 白炽灯 是第一代电光源的代表， 它是靠通电加热钨丝使其处于炽热状态而发 光的， 但发光效率低、 使用寿命短。 此后人们又发明了荧光灯， 使电 光源历史经历了一次新的革命， 这场革命的意义是如此之大， 以致目 前世界上仍有 70%的人造光线来自于荧光灯。 然而荧光灯并不是一种 十分理想的照明光源， 主要表现在： 一是荧光灯显色性能较差， 容易 发生颜色变异； 二是存在亮度频闪， 容易造成视力疲劳； 三是荧光灯 存在比较严重的汞污染问题， 对灯具的制造使用和环境保护均不利。  Since Edison invented incandescent bulbs, humans have entered a new era of lighting. The incandescent lamp is the representative of the first generation of electric light source. It is powered by heating the tungsten wire to make it glow in a hot state, but the luminous efficiency is low and the service life is short. Since then, people have invented fluorescent lamps, and the history of electric light sources has undergone a new revolution. The significance of this revolution is so great that 70% of the artificial light in the world is still from fluorescent lamps. However, fluorescent lamps are not an ideal illumination source. The main performances are as follows: First, the fluorescent lamp has poor color rendering performance and is prone to color variation; second, there is brightness stroboscopic, which is easy to cause visual fatigue; Third, fluorescent lamps have more serious mercury. Pollution problems are not good for the manufacture and use of lamps and environmental protection.
近年来， 随着 LED科学研究不断发展和芯片工艺生产水平不断提 升， 大功率 LED封装技术逐渐成熟， 发光效率得以大大提高， 其应用 领域逐步拓展。 目前 1W 白光 LED 的批量产品的光效指标已经超过 601m/W, 科学技术的进步使 LED极有可能成为新一代照明光源。  In recent years, with the continuous development of LED scientific research and the continuous improvement of the production level of chip technology, the high-power LED packaging technology has gradually matured, the luminous efficiency has been greatly improved, and its application field has been gradually expanded. At present, the light efficiency index of batch products of 1W white LED has exceeded 601m/W, and the advancement of science and technology makes LED very likely to become a new generation of illumination source.
目前大功率 LED照明通常是将大尺寸蓝光 LBD芯片按照图 1的模 式进行封装， 其主体部分是一个以模塑材料制成的带有接线片 11 的 塑料绝缘框架 1 , 铝、铜或合金材质的热沉 2嵌装在绝缘框架 1中间， 绝缘框架 1和热沉 2之间涂有软性胶 13 ,带有印刷电路图 ^的硅载体 片 3用焊接材料 4焊在热沉 2上， LED芯片 5则以倒装方式压在硅载 体片 3的金属接触电极接点 6上， 通过金丝 7与电极接点接线片 11 连接。 在 LED芯片 5的四周均匀涂敷一层黄色荧光粉 9; 另外， 在绝 缘框架 1上固定有光学透镜 8 , 芯片和光学透镜之间的空隙需要填补 环氧或硅类树脂 12。 组装后的 LED芯片全部罩于光学透镜 8的内部。 当通电的时候， 蓝光 LED芯片产生蓝光， 同时激发黄色荧光粉产生黄 光， 黄光与蓝光混合后产生白光。 为解决 LED的散热问题， 通常还需 将热沉 2 安装在一块专门的铝板、 銅板或其它合金板材的散热片 10 上， 从而制成一种带有散热片的 LED白光光源。 At present, high-power LED lighting usually encloses a large-sized blue-light LBD chip in the mode of FIG. 1. The main part is a plastic insulating frame 1 with a lug 11 made of a molding material, aluminum, copper or alloy material. The heat sink 2 is embedded in the middle of the insulating frame 1, A soft rubber 13 is coated between the insulating frame 1 and the heat sink 2, and the silicon carrier sheet 3 with the printed circuit pattern is soldered to the heat sink 2 by the solder material 4, and the LED chip 5 is pressed on the silicon carrier sheet by flipping. The metal contact electrode contact 6 of 3 is connected to the electrode contact tab 11 by a gold wire 7. A yellow phosphor 9 is uniformly applied around the LED chip 5; in addition, an optical lens 8 is fixed to the insulating frame 1, and the gap between the chip and the optical lens needs to fill the epoxy or silicone resin 12. The assembled LED chips are all covered inside the optical lens 8. When energized, the blue LED chip produces blue light, while the yellow phosphor is excited to produce yellow light, and the yellow light and blue light are mixed to produce white light. In order to solve the problem of heat dissipation of the LED, it is usually necessary to mount the heat sink 2 on a heat sink 10 of a special aluminum plate, copper plate or other alloy plate to form an LED white light source with a heat sink.
由此可见， 现有技术封装后的 LED白光光源结构复杂、 制造工序 繁瑣， 使用的零部件较多， 其中热沉、 光学透镜、 散热片等部件的安 装以及软性胶的填充等过程还需手工完成， 使得生产成本过高、 产品 质量难以保证。 目前面市的 LED照明灯具基本上是在传统灯具的基础 上加装上述 LED白光光源， 这只是一种简单形式的组装， 应用这种照 明灯具， LED 工作时产生的热量并不能充分散发到灯具所处的外部环 境当中，使 LED内部温度上升，导致发光效率下降乃至整个产品失效， LED预期的使用寿命难以保证； 另一方面， 由于 LED光源是非常强烈 眩目的点光源， 用于照明灯具还必须另外配装光扩散片或漫反射板等 光学组件， 使光线变成均匀柔和的一体化的面光源， 该技术问题在现 有技术中也未能得到有效解决。  It can be seen that the LED light source of the prior art package has a complicated structure, a complicated manufacturing process, and many components are used, and the installation of the heat sink, the optical lens, the heat sink and the like, and the filling of the soft glue are required. Manually completed, making production costs too high, product quality is difficult to guarantee. At present, the LED lighting fixtures on the market are basically based on the traditional luminaires. The LED white light source is added. This is just a simple form of assembly. When using this kind of lighting fixture, the heat generated by the LED can not be fully distributed to the luminaire. In the external environment, the internal temperature of the LED rises, resulting in a decrease in luminous efficiency and even the failure of the entire product. The expected life of the LED is difficult to guarantee; on the other hand, since the LED light source is a very intense point light source, it must be used for lighting fixtures. In addition, optical components such as a light diffusing sheet or a diffusing reflector are used to make the light into a uniform and soft integrated surface light source, and the technical problem has not been effectively solved in the prior art.
发明内容 Summary of the invention
本发明的目的在于克服现有技术的不足， 从改变 LED的封装方式 入手， 提供一种结构简便、 易于加工、 使用寿命长、 效果良好的基于 金属线路板的 LED白光光源。 The object of the present invention is to overcome the deficiencies of the prior art, and to improve the structure of the LED, and to provide a simple structure, easy processing, long service life and good effect. LED white light source for metal circuit boards.
本发明的目的通过以下技术方案来实现：  The object of the invention is achieved by the following technical solutions:
一种基于金属线路板的 LED白光光源，以蓝光 LED芯片为发光体， 芯片的底面直接焊接在其控制电路的金属线路板上， 芯片的其它表面 涂敷环氧或硅类透明树脂， 在金属线路板的一侧形成半球体； 所述半 球体的四周设有表面镀银的光反射区， 其形状为倒置的圆雉面； 在光 反射区的上方设有半球冠形状的含有黄色荧光粉的透光片， 透光片的 内表面与光反射区的圓锥面吻合， 形成一个封闭的立体结构， 所述包 含 LED芯片的半球体位于该立体结构的底部。  An LED white light source based on a metal circuit board, the blue LED chip is used as an illuminant, the bottom surface of the chip is directly soldered on the metal circuit board of the control circuit thereof, and the other surface of the chip is coated with epoxy or silicon transparent resin, in the metal One side of the circuit board forms a hemisphere; the periphery of the hemisphere is provided with a silver-plated light reflecting area, the shape of which is an inverted circular dome surface; and a hemispherical crown shape containing a yellow phosphor above the light reflecting area The inner surface of the light transmissive sheet is coincident with the conical surface of the light reflecting region to form a closed three-dimensional structure, and the hemisphere including the LED chip is located at the bottom of the three-dimensional structure.
本发明的目的还通过以下优选技术方案来进一步实现：  The object of the invention is further achieved by the following preferred technical solutions:
上述基于金属线路板的 LED白光光源中， 可以在金属线路板上设 置碗状凹坑， LED 芯片焊接在凹坑的底部， 凹坑的四周经抛光镀 4艮后 成为光反射区； 金属线路板也可以为平板结构， LED 芯片直接焊接在 线路板上， 在 LED芯片四周另外设置光反射碗。  In the above-mentioned LED white light source based on the metal circuit board, a bowl-shaped pit may be disposed on the metal circuit board, the LED chip is soldered at the bottom of the pit, and the periphery of the pit is polished and plated to become a light reflecting area; the metal circuit board It can also be a flat structure, the LED chip is directly soldered on the circuit board, and a light reflecting bowl is additionally disposed around the LED chip.
进一步地， 上述基于金属线路板的 LED白光光源中， 所述黄色荧 光粉可以涂覆在透光片的内、外表面； 当透光片采用模塑材料制造时， 还可以在制造材料中直接添加黄色荧光粉， 然后再注塑成透光片， 使 黄色荧光粉均勾分布在透光片的材料内部。  Further, in the LED white light source based on the metal circuit board, the yellow phosphor may be coated on the inner and outer surfaces of the light transmissive sheet; when the light transmissive sheet is made of a molding material, it may also be directly in the manufacturing material. A yellow phosphor is added, and then injected into a light-transmissive sheet, so that the yellow phosphors are uniformly distributed inside the material of the light-transmitting sheet.
更进一步地， 上述基于金属线路板的 LED白光光源中， 所述碗状 凹坑是一个下凹的圆雉台， 圓锥台高度为 1. 5 ~ 6 毫米， 圆锥角优选 30° - 120°; 所述光反射碗的高度也为 1. 5 ~ 6毫米， 圆锥角也优选在 30° ~ 120°范围之内。  Further, in the above-mentioned LED white light source based on the metal circuit board, the bowl-shaped pit is a concave circular sill, the height of the truncated cone is 1. 5 ~ 6 mm, and the cone angle is preferably 30 ° - 120 ° The height of the light reflecting bowl is also 1.5 to 6 mm, and the taper angle is also preferably in the range of 30 to 120 degrees.
本发明提供了一种采用高效蓝光 LED芯片、 基于金属线路板直接 封装的半导体发光二极管白光光源， 其突出的实质性特点和显著的进 步主要体现在以下几方面： , The invention provides a semiconductor light-emitting diode white light source which adopts a high-efficiency blue LED chip and is directly packaged based on a metal circuit board, and its outstanding substantive features and remarkable progress are mainly embodied in the following aspects: ,
( 1 )采用带金属夹层的线路板直接封装 LED 芯片， 结构筒便。 透光片相当于灯罩， 黄色荧光粉设置在透光片上可以有多种方式， 并 且能够制造加工得非常均匀， 完全解决了现有技术中单颗白光大功率 LED封装过程中时有出现的白光不均匀的技术难题， 而且本发明中荧 光粉不与芯片直接接触， 能够有效防止荧光粉因长期接触高温而导致 性能快速衰退；  (1) The LED chip is directly packaged by a circuit board with a metal interlayer, and the structure is convenient. The light-transmissive sheet is equivalent to the lampshade, and the yellow phosphor powder can be disposed on the light-transmitting sheet in various ways, and can be manufactured and processed very uniformly, completely solving the white light that appears in the single white light high-power LED packaging process in the prior art. The uneven technical problem, and the phosphor in the invention is not in direct contact with the chip, and can effectively prevent the phosphor from rapidly deteriorating due to long-term contact with high temperature;
( 2 )金属线路板与 LED 芯片呈一体化设计， 芯片直接安装在带 有散热功能的金属线路板上， 构成的一体化光源具有有效的散热通 道， 散热面积增加、 热阻减小， 突破了发热问题对半导体照明二维光 源设计的限制， 把温升对大功率 LED稳定性的影响降到最低程度， 有 效地解决了光源使用中的散热问题， 延长了光源使用寿命；  (2) The metal circuit board is integrated with the LED chip. The chip is directly mounted on the metal circuit board with heat dissipation function. The integrated light source has an effective heat dissipation channel, and the heat dissipation area increases and the thermal resistance decreases. The problem of heat generation on the design of two-dimensional light source for semiconductor illumination minimizes the influence of temperature rise on the stability of high-power LEDs, effectively solves the problem of heat dissipation in the use of light sources, and prolongs the service life of light sources;
( 3 )解决了目前 LED灯具在二次光学设计方面遇到的技术难题。 采用大功率 LED作为光源，发光平稳、无频闪、 不含红外线和紫外线， 在 LED的发光部位设置导光装置， 能够提高芯片的出光效率， 有效控 制出光角度和光强分布， 再通过优化光反射区与透光片在几何尺寸方 面的匹配关系， 使蓝光 LED形成的点光源变成光线柔和的一体化的面 光源， 提高了视觉舒适性， 可以直接应用于 LED灯具；  (3) Solved the technical problems encountered in the secondary optical design of LED lamps. Using high-power LED as the light source, the light is stable, no stroboscopic, no infrared and ultraviolet light, and the light guiding device is arranged in the light emitting part of the LED, which can improve the light extraction efficiency of the chip, effectively control the light angle and light intensity distribution, and then optimize the light. The geometrical matching relationship between the reflective area and the transparent sheet makes the point light source formed by the blue LED become an integrated surface light source with soft light, which improves visual comfort and can be directly applied to the LED lamp;
( 4 ) 可实施标准化规模生产， 与现有技术相比大大减少光源及 灯具的零部件， 生产成本显著降低。 产品体积小、 薄型化、 结构牢固、 可靠性高、 使用寿命长， 它不含玻璃灯泡、 灯丝等易损坏的部件， 是 一种实心的全固体结构， 能够经受得住震^、 冲击而不致引起损坏， 使用寿命长达五万小时以上， 而传统光源中白炽灯只有 1000 小时左 右， 荧光灯也只有 5000小时左右。  (4) It is possible to implement standardized scale production, which greatly reduces the parts of light sources and lamps compared with the prior art, and the production cost is significantly reduced. The product is small in size, thin in shape, firm in structure, high in reliability and long in service life. It does not contain fragile parts such as glass bulbs and filaments. It is a solid all-solid structure that can withstand shocks and impacts. It causes damage and has a service life of more than 50,000 hours. In traditional light sources, incandescent lamps are only about 1000 hours, and fluorescent lamps are only about 5,000 hours.
附图说明 图 1是现有技术中比较典型的 LED封装模式示意图。 DRAWINGS FIG. 1 is a schematic diagram of a typical LED package mode in the prior art.
图 2是本发明一种实施方式的主体结构示意图， 图 2a是图 2中 金属线路板部分的结构示意图， 图 2b是图 2a的俯视图。  Fig. 2 is a schematic view showing the structure of a main body according to an embodiment of the present invention, Fig. 2a is a schematic structural view of a portion of the metal wiring board of Fig. 2, and Fig. 2b is a plan view of Fig. 2a.
图 3是本发明另一种实施方式的主体结构示意图， 图 3a是图 3 中金属线路板及光反射碗部分的结构示意图，图 3b是图 3a的俯视图。  Fig. 3 is a schematic view showing the structure of a main body according to another embodiment of the present invention. Fig. 3a is a structural view showing a portion of the metal wiring board and the light reflecting bowl of Fig. 3, and Fig. 3b is a plan view of Fig. 3a.
图中： 20金属线路板， 21凹坑， 22是 LED芯片， 23光反射区， 24是 LED芯片涂敷环氧或硅类透明树脂而形成的半球体， 25透光片 , 26安装孔， 27接触电极， 28合金涂层， 29光反射碗。  In the figure: 20 metal circuit boards, 21 pits, 22 is an LED chip, 23 light reflection area, 24 is a hemisphere formed by coating an epoxy chip or a silicon-based transparent resin, 25 light-transmissive sheets, 26 mounting holes, 27 contact electrodes, 28 alloy coating, 29 light reflecting bowl.
具体实施方式 detailed description
大功率 LED发光平稳、 无频闪、 不含红外线和紫外线， 是一种非 常有益于人们身心健康的电光源， 应用它制造照明灯具时必须解决两 大技术难题。 其一， LED将电能转变为光能过程中， 由于有电阻和非 辐射复合等作用必然会产生一些热，如果热量不能充分散发出去， LED 内部温度将上升， 导致 LED发光效率下降； 温度上升过高， LED将失 效。 因此， 在设计 LED照明光源时， 要切实保证散热良好， 否则将难 以保证 LED预期使用寿命。 其二， LED光源是一种发光强度非常高的 点光源， 若简单应用于照明会令人感觉光亮眩目、 艮不舒服， 所以在 设计照明光源时， 要将发光二极管的点光源与光扩散片或漫反射板等 光学组件配合使用， 光线通过折射、 散射和漫反射变成光线均匀柔和 的一体化的面光源。  The high-power LED has smooth illumination, no stroboscopic, no infrared and ultraviolet rays. It is an electric light source that is very beneficial to people's physical and mental health. It must solve two technical problems when it is used to manufacture lighting fixtures. First, LED converts electrical energy into light energy. Because of the resistance and non-radiative recombination, some heat will be generated. If the heat is not fully dissipated, the internal temperature of the LED will rise, resulting in a decrease in LED luminous efficiency. High, the LED will fail. Therefore, when designing the LED lighting source, it is necessary to ensure good heat dissipation, otherwise it will be difficult to guarantee the expected life of the LED. Secondly, the LED light source is a point light source with very high luminous intensity. If it is simply applied to the illumination, it will feel dazzling and uncomfortable. Therefore, when designing the illumination source, the point source and the light of the LED should be diffused. An optical component such as a sheet or a diffuse reflector is used together, and the light is fused, scattered, and diffused to become an integrated surface light source with uniform light and softness.
本发明从解决上述两大技术难题入手， 克服现有技术的种种不 足，采用与传统的白光 LED设计和组合灯具完全不同的白光产生方式, 提出了一种适合通用照明的半导体白光光源。 其技术措施是：  The invention starts from solving the above two technical problems, overcomes the various shortcomings of the prior art, and adopts a white light generating mode which is completely different from the traditional white LED design and the combined lighting, and proposes a semiconductor white light source suitable for general illumination. Its technical measures are:
将 1W以上的大功率蓝光 LED芯片的底面焊接在其控制电路的金 属线路板上， 芯片的其它表面涂敷环氧或硅类透明树脂， 在金属线路 板的一侧形成半球体， 以保护 LED芯片和帮助导出 LED的发光。 所述 半球体的四周设有表面镀银的光反射区， 其形状为倒置的圆锥面。 在 光反射区的上方设有半球冠形状的含有黄色荧光粉的透光片 , 透光片 的内表面与光反射区的圆锥面吻合， 形成一个封闭的立体结构， 所述 包含 LED芯片的半球体位于该立体结构的底部。 Solder the bottom surface of a high-power blue LED chip of 1W or more to the gold of its control circuit On the circuit board, the other surface of the chip is coated with an epoxy or silicon-based transparent resin, and a hemisphere is formed on one side of the metal wiring board to protect the LED chip and help to derive the light emission of the LED. The periphery of the hemisphere is provided with a light-reflecting area with a silver-plated surface, which is in the shape of an inverted conical surface. A light-transmissive sheet containing a yellow phosphor in a hemispherical crown shape is disposed above the light reflecting region, and an inner surface of the light-transmitting sheet is coincident with a conical surface of the light-reflecting region to form a closed three-dimensional structure, and the hemisphere including the LED chip The body is located at the bottom of the three-dimensional structure.
光反射区的设置有两种方案， 一种是将金属线路板局部冲击压成 凹坑， LED 芯片焊接在凹坑的底部， 凹坑的四周经抛光镀银后成为光 反射区； 另一种是金属线路板仍旧是平板结构， LED 芯片直接悍接在 金属线路板上， 然后在 LED芯片四周设置光反射碗， 光反射碗的内表 面加工成为光反射区。 碗状凹坑实际上是一个下凹的圓锥台， 圓锥台 的高度范围是 1. 5 ~ 6毫米、 圆锥角优选 30° ~ 120。； 光反射碗的高度 也为 1. 5 ~ 6亳米， 圆锥角也在 30。 ~ 120。范围之内。  There are two options for setting the light reflection zone. One is to press the partial impact of the metal circuit board into a pit. The LED chip is soldered to the bottom of the pit, and the periphery of the pit is polished and plated to become a light reflection zone. The metal circuit board is still a flat structure, the LED chip is directly connected to the metal circuit board, and then a light reflecting bowl is arranged around the LED chip, and the inner surface of the light reflecting bowl is processed into a light reflecting area. The bowl-shaped pit is actually a concave truncated cone. The height of the truncated cone is 1. 5 ~ 6 mm, and the cone angle is preferably 30 ° ~ 120. The height of the light reflecting bowl is also 1. 5 ~ 6 mm, and the cone angle is also 30. ~ 120. Within the scope.
透光片可视为灯罩， 黄色荧光粉有多种方式附着到透光片上。 一 是通过溅射、 蒸发或涂敷工艺等方法将黄色荧光粉或含有黄色荧光粉 的材料均匀、 牢固地涂布在灯罩的内表面或者外表面， 形成黄色荧光 粉层； 也可以在用于加工灯罩的透明模塑材料中按一定比例添加黄色 荧光粉， 然后注塑成型， 制得的透光片中即均匀分布有黄色荧光粉。  The light-transmissive sheet can be regarded as a lamp cover, and the yellow phosphor can be attached to the light-transmitting sheet in various ways. First, a yellow phosphor or a material containing a yellow phosphor is uniformly and firmly coated on the inner surface or the outer surface of the lampshade by a sputtering, evaporation or coating process to form a yellow phosphor layer; A yellow phosphor is added to the transparent molding material of the processing lampshade in a certain proportion, and then injection-molded, and a yellow phosphor is uniformly distributed in the obtained light-transmitting sheet.
当引入电源以后， LED 芯片产生蓝光， 经环氧或硅类透明树脂进 行光学调整， 在光反射区的作用下发散并透过含有黄色荧光粉的透光 片， 通过扩散和混色形成整体组合一体化、 适合通用照明的半导体白 光光源。  When the power is introduced, the LED chip generates blue light, is optically adjusted by epoxy or silicon-based transparent resin, diffuses under the action of the light-reflecting region, and transmits through the light-transmissive sheet containing the yellow phosphor, and forms an integral combination by diffusion and color mixing. A semiconductor white light source suitable for general illumination.
下面结合附图对本发明主体结构的加工过程作进一步说明。 如图 2、 图 2a和图 2b所示， 金属线路板 20的基材使用厚度为 0. 5 ~ 3毫米的金属铝、铜或其它合金板材， 大面积的基材表面运用机 械和化学方法先进行预处理， 再经过机械冲压加工出圆形安装孔 26 和圆锥台形状的凹坑 21 ,然后对凹坑 21的底部和四周进行抛光镀银， 形成光亮的反射碗， LED芯片 22焊接在反射碗的底部， 而碗的四周则 成为光反射区 23。 其中， 在反射碗底部芯片就位之处需要专门蒸发或 涂复铟金、金锡或相似的合金，形成适合芯片底面焊接的合金涂层 28。 在进一步加工前， 对于抛光及镀银部分涂覆防护膜加以局部保护。 接 着， 采用化学氧化的方法在金属基材上覆盖一层绝缘导热层， 在绝缘 导热层上釆用沉积和电镀工艺覆盖一层主要成分是铜的导电金属， 然 后在该金属层上采用普通印刷线路板制作工艺加工出非常精细的导 电线路和接触电极 27。 经过以上加工处理的大面积金属线路板， 经过 冲裁和表面清洗处理， 制得单只 LED芯片的封装基础部件。 The processing of the main structure of the present invention will be further described below with reference to the accompanying drawings. As shown in FIG. 2, FIG. 2a and FIG. 2b, the substrate of the metal wiring board 20 is made of metal aluminum, copper or other alloy plate having a thickness of 0.5 to 3 mm, and a large-area substrate surface application machine. The mechanical and chemical methods are pre-treated, and the circular mounting holes 26 and the truncated cone-shaped dimples 21 are mechanically stamped, and then the bottom and the periphery of the dimples 21 are polished and plated to form a bright reflecting bowl, and the LEDs are formed. The chip 22 is soldered to the bottom of the reflecting bowl, and the periphery of the bowl becomes the light reflecting area 23. Among them, in the bottom of the reflector bowl, the chip needs to be specially evaporated or coated with indium gold, gold tin or a similar alloy to form an alloy coating 28 suitable for soldering the bottom surface of the chip. Partial protection of the polished and silver plated partially coated protective film prior to further processing. Next, a metal oxide substrate is coated with an insulating and thermally conductive layer by chemical oxidation, and a conductive metal having a main component of copper is coated on the insulating and thermally conductive layer by a deposition and plating process, and then ordinary printing is performed on the metal layer. The board fabrication process produces very fine conductive traces and contact electrodes 27. After the above processing, the large-area metal circuit board is subjected to punching and surface cleaning to obtain a package basic component of a single LED chip.
直接封装的 LED芯片通常被制成单极或双极形式。 蓝光 LED棵芯 片 22安放在合金涂层 28上， 在 120 ~ 350 °C温度下进行焊接， 芯片能 够牢固地焊接在金属线路板 20上。 另一方面， 采用 25 ~ 50微米的金 丝焊接， 使 LED芯片与导电线路之间实现电气连接。  Directly packaged LED chips are typically fabricated in monopolar or bipolar form. The blue LED chip 22 is placed on the alloy coating 28 and soldered at a temperature of 120 to 350 ° C, and the chip can be firmly soldered to the metal wiring board 20. On the other hand, 25 to 50 micron gold wire bonding is used to electrically connect the LED chip to the conductive line.
LED芯片在金属线路板贴装工序完成之后， 在 LED芯片的其余表 面上涂敷环氧或硅类透明树脂， 在金属线路板的一侧形成一个半球体 式结构 24 , 用以保护芯片和增加出光率， 然后在凹坑 21的上方加装 表面涂有或者内部掺有黄色荧光粉的透光片 25 ,从而制成基于金属线 路板的 LED白光光源。  After the metal chip board mounting process is completed, the LED chip is coated with epoxy or silicon-based transparent resin on the remaining surface of the LED chip, and a hemispherical structure 24 is formed on one side of the metal circuit board to protect the chip and increase the light output. Rate, then a light-transmissive sheet 25 having a surface coated with or internally doped with a yellow phosphor is applied over the pit 21 to form an LED white light source based on a metal wiring board.
上述透光片 25又称为光扩散透光片， 它可以作为 LED光源的灯 罩， 采用透明或半透明模塑材料按照光学原理设计成半球冠形状。  The light-transmitting sheet 25 is also referred to as a light-diffusing light-transmissive sheet, and can be used as a lamp cover for an LED light source, and is designed into a hemispherical crown shape according to optical principles using a transparent or translucent molding material.
图 3、 图 3a和图 3b示意了本发明另外一种主体结构， 这种结构 不是在金属线路板上加工凹坑， 而是用金属或塑料材料另外加工一只 倒圓锥台形状的光反射碗 29 ,其内表面经过抛光电镀银层形成光亮的 反射面 23 , 当 LED芯片贴装工序完成之后将光反射碗 29安置在 LED 芯片四周。除此之外，这种结构的其它加工过程与上述情况基本类似。 Figures 3, 3a and 3b illustrate another main structure of the present invention which does not machine a dimple on a metal wiring board, but additionally processes an inverted truncated cone shaped light reflection from a metal or plastic material. Bowl 29, the inner surface of which is polished and plated with silver to form a bright The reflecting surface 23, after the LED chip mounting process is completed, places the light reflecting bowl 29 around the LED chip. Apart from this, the other processing of this structure is basically similar to the above.
采用光反射碗 29 结构时， 其内表面还可以采用镀膜方式， 能够 有效地控制出光角度和光强分布， 提高芯片的出光效率。  When the light reflection bowl 29 structure is adopted, the inner surface thereof can also be coated, which can effectively control the light angle and the light intensity distribution, and improve the light extraction efficiency of the chip.

Claims

权 利 要 求 Rights request
1. 基于金属线路板的 LED白光光源， 其特征在于： 蓝光 LED芯 片的底面焊接在其控制电路的金属线路板上， 芯片的其它表面涂敷环 氧或硅类透明树脂， 在金属线路板的一侧形成半球体； 所述半球体的 四周设有表面镀银的光反射区， 其形状为倒置的圆雉面； 在光反射区 的上方设有半球冠形状的含有黄色荧光粉的透光片， 透光片的内表面 与光反射区的圆锥面吻合， 形成一个封闭的立体结构， 所述包含 LED 芯片的半球体位于该立体结构的底部。 1. LED white light source based on metal circuit board, characterized in that: the bottom surface of the blue LED chip is soldered on the metal circuit board of the control circuit, and the other surface of the chip is coated with epoxy or silicon transparent resin, in the metal circuit board a hemisphere is formed on one side; a light reflection region on the surface of the hemisphere is provided with a silver-plated surface, and the shape is an inverted circular dome; and a hemispherical crown-shaped light containing yellow phosphor is disposed above the light reflection region. The inner surface of the light-transmissive sheet is coincident with the conical surface of the light-reflecting region to form a closed three-dimensional structure, and the hemisphere including the LED chip is located at the bottom of the three-dimensional structure.
2. 根据权利要求 1所述的基于金属线路板的 LED白光光源， 其 特征在于： 所述金属线路板上设有碗状凹坑， LED 芯片焊接在凹坑的 底部， 凹坑的内表面经抛光镀银后成为光反射区。 2. The metal circuit board-based LED white light source according to claim 1, wherein: the metal circuit board is provided with a bowl-shaped recess, and the LED chip is soldered to the bottom of the pit, and the inner surface of the pit is After polishing and silver plating, it becomes a light reflection area.
3. 根据权利要求 1所述的基于金属线路板的 LED白光光源， 其 特征在于： 所述金属线路板为平板结构， LED 芯片直接焊接在金属线 路板上， LED 芯片四周安装有光反射碗， 光反射碗的内表面为光反射 区。 3. The metal circuit board-based LED white light source according to claim 1, wherein: the metal circuit board is a flat plate structure, the LED chip is directly soldered on the metal circuit board, and the light reflecting bowl is installed around the LED chip. The inner surface of the light reflecting bowl is a light reflecting area.
4. 根据权利要求 1或 2或 3所述的基于金属线路板的 LED白光 光源， 其特征在于： 所述黄色荧光粉涂覆在透光片的内表面和 /或外 表面。 The metal wiring board-based LED white light source according to claim 1 or 2 or 3, wherein the yellow phosphor is coated on an inner surface and/or an outer surface of the light transmissive sheet.
5. 根据权利要求 1或 2或 3所述的基于金属线路板的 LED白光 光源， 其特征在于： 所述黄色荧光粉均勾分布在透光片的材料内部。 The metal circuit board-based LED white light source according to claim 1 or 2 or 3, wherein the yellow phosphors are uniformly distributed inside the material of the light-transmitting sheet.
6. 根据权利要求 2所述的基于金属线路板的 LED白光光源， 其 特征在于： 所述碗状凹坑是一个下凹的圆锥台， 圓锥台高度为 1. 5 ~ 6 毫米， 圆锥角为 30° ~ 120。。 The slanting angle is 1. 5 ~ 6 mm, the taper angle is 1. The height of the truncated cone is 1. 5 ~ 6 mm, the taper angle It is 30° ~ 120. .
7. 根据权利要求 3所述的基于金属线路板的 LED白光光源， 其 特征在于：所述光反射碗的高度为 1· 5 ~ 6毫米， 圆锥角为 30。 ~ 120。。 7. The metal circuit board-based LED white light source according to claim 3 , wherein the light reflecting bowl has a height of 1.5 to 6 mm and a cone angle of 30. ~ 120. .
PCT/CN2006/000488 2005-04-15 2006-03-24 Led white light source based on metal wiring board WO2006108339A1 (en)

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