AU2011101723A4 - Led module and lighting device - Google Patents

Led module and lighting device Download PDF

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Publication number
AU2011101723A4
AU2011101723A4 AU2011101723A AU2011101723A AU2011101723A4 AU 2011101723 A4 AU2011101723 A4 AU 2011101723A4 AU 2011101723 A AU2011101723 A AU 2011101723A AU 2011101723 A AU2011101723 A AU 2011101723A AU 2011101723 A4 AU2011101723 A4 AU 2011101723A4
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AU
Australia
Prior art keywords
reflective cup
led module
substrate plate
circuit layer
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
AU2011101723A
Inventor
Shaobo Pi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Refond Optoelectronics Co Ltd
Original Assignee
Shenzhen Refond Optoelectronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Refond Optoelectronics Co Ltd filed Critical Shenzhen Refond Optoelectronics Co Ltd
Application granted granted Critical
Publication of AU2011101723A4 publication Critical patent/AU2011101723A4/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09054—Raised area or protrusion of metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)

Abstract

The present utility model is directed to illumination, and provides an LED module and a lighting device, wherein the LED module includes a substrate plate configured for dissipating heat; at least one reflective cup formed into an integrated body with the substrate plate; an insulating layer and a circuit layer laminated on the substrate plate excluding the area of the reflective cup, the insulating layer extending upwards along the outer surface of the reflective cup to separate the reflective cup from the circuit layer; and a chip disposed at the bottom of the reflective cup, the chip being electrically connected with the circuit layer via bonding lines. The substrate plate and the reflective cup are formed into an integrated body, and the chip contacts directly with the substrate plate, this structure accelerates the heat dissipation, has more stable efficiency of light emitting and a longer life span.

Description

LED MODULE AND LIGHTING DEVICE TECHNICAL FIELD [0001] The present utility model relates to illumination devices, and more particularly, to an LED Module and a lighting device. BACKGROUND [0002] With the rapid development of the LED illumination technology, the quality requirements for the LED lighting device, for example in the aspects of stability, life span and the like, is becoming higher and higher. Nowadays, in most cases, an LED module includes a substrate plate, one or more reflective cup(s) formed on the substrate plate, and corresponding chip(s) disposed in the reflective cup(s). A traditional substrate plate includes a substrate plate body, an insulating layer and a circuit layer laminated on the substrate plate body, and a chip which contacts directly with the circuit layer exposed at the bottom of a reflective cup such that the chip is electrically connected with the driving circuit. In this type of LED module, an inevitable problem of poor air tightness exists in the connection between the reflective cup and the substrate plate, as a result the vapor can easily infiltrate into the inflective cup, and may decrease the lighting efficiency of the chip; on the other hand, the heat generated by the chip cannot dissipate outwards rapidly because there is an insulating layer disposed between the circuit layer and the substrate plate body in this LED module; and the lighting effect of the whole module is instability, and the life span thereof is shortened because the module with the traditional structure has poor moisture resistance and bad heat dissipation. SUMMARY [0003] The objective of the present utility model is to provide an LED module, and provide a solution to the problem of poor moisture resistance and bad heat dissipation of the LED modules in the prior art. [0004] Another objective of the present utility model is to provide an LED device comprising a light emitting assembly, wherein the light emitting assembly includes at least one above-mentioned LED module. [0005] The above-mentioned technical problems can be solved through the following technical solutions: an LED module including a substrate plate configured for dissipating heat; a reflective cup formed into an integrated body with the substrate plate; an insulating layer and a circuit layer being laminated on the substrate plate excluding the area of the reflective cup, the insulating layer extending upwards along the outer surface of the reflective cup to separate the reflective cup from the circuit layer; and a chip disposed at the bottom of the reflective cup, the chip being electrically coupled with the circuit layer via bonding lines. [0006] In preferred embodiments of the present utility model: [0007] The depth of the reflective cup is 2-10 times the height of the chip. [0008] The reflective cup has the shape of a frustum of a cone, and the angle between an inner surface and a bottom surface of the reflective cup is in the range 90 degrees to 150 degrees. [0009] A metal plating layer is coated on the inner surface and the bottom surface of the reflective cup. [0010] The reflective cup is filled with transparent glue mixed with phosphor powder. [0011] A lens is covered on the mouth of the reflective cup. [0012] The circuit layer is made of copper foil by etching or punching according to the predetermined circuit structure. [0013] A metal plating layer, a paste mask layer or a easily-welding layer is disposed on a surface of the circuit layer. [0014] This utility model further provides a lighting device including a light emitting assembly, wherein the lighting emitting assembly includes at least one above-mentioned LED module. [0015] In the present utility model, the substrate plate and the reflective cup are formed into an integrated body, and the chip contacts directly with the substrate plate, thus the heat generated by the chip transmits outwards via the substrate layer, and the heat dissipation is accelerated; furthermore, the reflective cup is installed on the 2 substrate plate independently in the traditional LED module, and the connection between the reflective cup and the substrate plate is not tight enough, so the performances of waterproof and moisture resistance thereof are not good enough, while in the present utility model the reflective cup and the substrate plate are formed into an integrated body, which can totally avoid the above said problem; meanwhile the insulating layer extends upwards along the outer surface of the reflective cup to separate the reflective cup from the circuit layer, thus the problem of short circuit caused by the circuit layer contacting with the reflective cup is avoided. The LED model with superior performance of heat dissipation and moisture resistance hasadvantages of more stable light emitting effect and longer life span. Furthermore, the substrate plate and the reflective cup are formed into an integrated body, thus saving the process of installing the reflective cup on the substrate plate, increasing the production efficiency and reducing the cost of production. BRIEF DESCRIPTION OF THE DRAWINGS [0016] FIG. 1 is a sectional schematic view of an LED module according to an embodiment of the present utility model; [0017] FIG. 2 is a schematic view of a first step of the manufacturing process of an LED module according to the embodiment of the present utility model; [0018] FIG. 3 is a schematic view of a second step of the manufacturing process of an LED module according to the embodiment of the present utility model; [0019] FIG. 4 is a schematic view of a third step of the manufacturing process of an LED module according to the embodiment of the present utility model; [0020] FIG. 5 is a schematic view of a fourth step of the manufacturing process of an LED module according to the embodiment of the present utility model; [0021] FIG. 6 is a schematic view of a fifth step of the manufacturing process of an LED module according to the embodiment of the present utility model; [0022] FIG. 7 is a structural schematic view of a lighting device according to the embodiment of the present utility model. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS [0023] Objects, advantages and embodiments of the present utility model will be 3 explained below in detail with reference to the preferred embodiments and the accompanying drawings. However, it is to be appreciated that the following description of the embodiment is merely exemplary in nature and is not intended to limit the utility model. [0024] Referring to FIG. 1, the LED module mainly includes a substrate plate 101 with the function of heat transmission; at least one reflective cup 102 arranged on the substrate plate 101, the substrate plate 101 and the reflective cup 102 formed into an integrated body; and an insulating layer 103 and a circuit layer 104 laminated on the substrate plate 101, the insulating layer 103 separating the substrate layer 101 from the circuit layer 104. The insulating layer 103 extends upwards along the outer surface 1021 of the reflective cup 102 to separate the reflective cup 102 from the circuit layer 104, to thereby avoid a problem of short circuit caused by the circuit layer 104 contacting with the reflective cup 102. There is a chip 105 disposed at the bottom of the reflective cup 102, the chip 105 electrically coupled to the circuit layer 104 via two bonding lines 106, each of the bonding lines 106 connected to the chip 105 by one end, and connected to the circuit layer 104 by the other end, supplying electric power to the chip 105. The substrate plate 101 according to this embodiment functions as the supporting and heat transmission body of the whole module, and the heat generated by the chip 105 transmits outwards through the substrate plate 101 directly, accelerating the heat transmission, increasing the stability of the lighting emitting of the LED module; meanwhile the heat of the substrate plate 101 and the electricity of the circuit layer 104 are separated from each other, so the circuit layer 104 cannot be effected by the heat, and to a certain extent the stability of the LED module is increased; on the other hand, in the traditional LED module the reflective cups are disposed on the surface of the substrate plate independently, and the connection between the reflective cups and the substrate plate is not tight enough, as a result the performances of waterproof and moisture resistance thereof are not good enough, while in the present utility model, the reflective cup 102 and the substrate plate 101 are formed into an integrated body, which avoids the above said problem of poor air tightness, and has a better performance of waterproof and moisture resistance. 4 Furthermore, the substrate plate 101 and the reflective cup 102 are formed into an integrated body, saving the process of installing reflective cup on the substrate plate, increasing the production efficiency and reducing the cost of production. [0025] Referring to FIGS. 2-6, the LED module can be manufactured as follows: [0026] In a first step, a substrate plate is taken and a reflective cup 102 is formed on the front surface thereof according to a predetermined size and shape, to obtain a substrate plate 101 with a reflective cup 102, wherein the reflective cup 102 can be made by the process of punching, drilling and milling or molding, as shown in FIG. 2. [0027] In a second step, an insulating layer 103 is disposed on the surface of the substrate plate 101 excluding the area of the reflective cup 102, and the insulating layer 103 extends upwards along the outer surface 1021 of the reflective cup 102 to the mouth of the reflective cup 102, as shown in FIG. 3. [0028] In a third step, the circuit layer 104 is formed on the surface of the insulating layer 103. In particular, a copper foil is pressed onto the surface of the insulating layer 103, then the circuit layer 104 is produced by etching the copper foil using an etchant according to the predetermined circuit structure, alternatively, the circuit layer 104 may be formed by linear cutting or punching of a circuit structure before pressing into a circuit layer on the insulating layer 103, as shown in FIG. 4. [0029] In a fourth step, a chip 105 is disposed at the bottom of the reflective cup 102, the chip 105 and the circuit layer 104 are connected by welding bonding lines 106 among them, as shown in FIG. 5. [0030] In a fifth step, the reflective cup 102 is filled with encapsulation glue mixed with phosphor powder and then covered with a lens 107 to protect the chip 105 and the bonding lines 106, as shown in FIG. 6. [0031] In this embodiment, the depth of the reflective cup 102 may be 1-20 times the height of the chip 105. It is not favorable for adjusting the direction of the emitted light when the depth of the reflective cup 102 is too short, however, the loss of the emitted light will increase when the depth of the reflective cup 102 is too large, so the preferred depth of the reflective cup 102 of this example is 2-10 times the height of the chip 105, and more preferably, the depth is about 5 times the height of the chip 5 105. [0032] Furthermore, referring to FIG. 2, the preferable shape of the reflective cup 102 is a frustum of a cone, and there is an obtuse angle between the inner surface 1022(i.e. the reflecting surface) and the bottom surface 1023 of the reflective cup, which may be 90-150 degrees. The directivity and the light intensity of the emitted light may be significantly improved by adjusting the height of the reflective cup 102 and the inclination angle of the inner surface 1022 properly. [0033] The substrate plate 101 is preferably made of metallic material, so as to improve the performance of the heat transmission of the LED module. Furthermore, the reflective cup 102 formed into an integrated body with the substrate plate 101 is also made of metallic material, the light reflectivity of the metallic reflective cup is much higher than that of traditional plastic reflective cup, which increases the light efficiency of the LED module. [0034] Furthermore, there may be a metal plating layer coated on the inner surface 1022 and the bottom surface 1023 of the reflective cup 102, wherein the metal plating layer is preferably a silver plating layer so as to improve the reflectivity of the reflective cup 102 and the lighting efficiency of the LED module. [0035] In this embodiment, there may be a transparent glue mixed with phosphor powder incapsulated in the reflective cup 102 to protect the chip 105 and obtain different color of emitted light. Furthermore, there may be a lens 107 covering the mouth of the reflective cup 102 to protect both the chip 105 and the bonding lines 106. In particular, there may be an independent lens 107 disposed at the mouth of each reflective cup 102, alternatively, there may be a group of lenses connected into one piece arranged on the surface of the whole module, and the lenses 107 of the group are in a one-to-one relationship with the reflective cups 102. The lens 107 may have the structure of flat panel or convex lens, depending on the actual demand. [0036] Furthermore, the lens 107 may be formed at the mouth of the reflective cup 102 by mould pressing, or be formed by filling a lens material such as silica gel into the cup and drying it thereafter. [0037] Furthermore, the refractive index of the transparent glue mixed with 6 phosphor powder is higher than that of lens 107, so as to improve the light emitting efficiency. [0038] In this embodiment, the surface of the circuit layer 104 may be surface treated such as by coating a metal plating, a paste mask layer or an easily-welding layer or thereon, to facilitate the connection between the bonding lines 106 and the circuit layer 104. [0039] The LED module according to this utility model is adapted to function as a light emitting assembly installed in a lighting device, such as in the daylight damp in FIG. 7. In particular, one single LED module 201 may be used as the light emitting assembly, and a plurality of LED modules 201 arranged in a predetermined mode may also be used as a light emitting assembly installed in the lamp tube 202 of the lighting device. [0040] The description hereinabove is only the preferred example of the present utility model, but not to limit the present invention, and all such modifications, alternatives and improvements that fall within the spirit and broad scope of the present utility model, are intended to be embraced in the scope of the present utility model. 7

Claims (9)

1. An LED module comprising: a substrate plate configured for dissipating heat; at least one reflective cup formed into an integrated body with the substrate plate; an insulating layer and a circuit layer laminated on the substrate plate excluding the area of the reflective cup, the insulating layer extending upwards along the outer surface of the reflective cup to separate the reflective cup from the circuit layer; and a chip disposed at the bottom of the reflective cup and being electrically coupled with the circuit layer via bonding lines.
2. The LED module of claim 1, wherein the depth of the reflective cup is 2-10 times the height of the chip.
3. The LED module of claim 1 or claim 2, wherein the reflective cup has the shape of a frustum of a cone, and the angle between an inner surface and a bottom surface of the reflective cup is in the range 90 degrees to 150 degrees.
4. The LED module of claim 3, wherein a metal plating layer is disposed on the inner surface and the bottom surface of the reflective cup.
5. The LED module of claim 1, wherein the reflective cup is filled with transparent glue mixed with phosphor powder.
6. The LED module of claim 5, wherein a lens is covered the mouth of the reflective cup.
7. The LED module of claim 1, wherein the circuit layer is made of copper foil by etching or punching according to the predetermined circuit structure.
8. The LED module of claim 1 or claim 7, wherein a metal plating layer, a paste mask layer or an easily-welding layer is disposed on a surface of the circuit layer.
9. A lighting device comprising a light emitting assembly, wherein the lighting emitting assembly comprises at least one LED module according to any of claim I to claim 8. 8
AU2011101723A 2011-08-09 2011-10-28 Led module and lighting device Ceased AU2011101723A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201120287230.2 2011-08-09
CN2011202872302U CN202188450U (en) 2011-08-09 2011-08-09 LED (light-emitting diode) module and lighting device

Publications (1)

Publication Number Publication Date
AU2011101723A4 true AU2011101723A4 (en) 2013-01-10

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AU2011101723A Ceased AU2011101723A4 (en) 2011-08-09 2011-10-28 Led module and lighting device

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JP (1) JP3186293U (en)
CN (1) CN202188450U (en)
AU (1) AU2011101723A4 (en)
DE (1) DE212011100217U1 (en)
FR (1) FR2979003B3 (en)
WO (1) WO2013020330A1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104701443A (en) * 2013-12-05 2015-06-10 董挺波 LED substrate applicable to simple line COB package and method for preparing same
KR20160112116A (en) * 2015-03-18 2016-09-28 엘지이노텍 주식회사 Light Emitting Device Array and Lighting System with the Light Emitting Device
CN117954564A (en) * 2024-03-26 2024-04-30 深圳市佑明光电有限公司 Mini LED backlight module without halation and preparation method thereof

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4045781B2 (en) * 2001-08-28 2008-02-13 松下電工株式会社 Light emitting device
CN2540685Y (en) * 2002-06-03 2003-03-19 葛世潮 High-efficient high power light-emitting diode
CN2517112Y (en) * 2002-01-24 2002-10-16 葛世潮 High power light-emitting diode
CN1725518A (en) * 2005-06-24 2006-01-25 南京汉德森半导体照明有限公司 Packing base for large power semiconductor LED
JP5130815B2 (en) * 2007-07-25 2013-01-30 三菱化学株式会社 LED chip fixing substrate and manufacturing method thereof
TW201022327A (en) * 2008-10-30 2010-06-16 Solvay Advanced Polymers Llc Hydroquinone-containing polyesters having improved whiteness

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Publication number Publication date
FR2979003B3 (en) 2013-08-09
CN202188450U (en) 2012-04-11
FR2979003A3 (en) 2013-02-15
WO2013020330A1 (en) 2013-02-14
JP3186293U (en) 2013-10-03
DE212011100217U1 (en) 2014-04-04

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