JP2013143397A - Led light source device - Google Patents

Led light source device Download PDF

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JP2013143397A
JP2013143397A JP2012001402A JP2012001402A JP2013143397A JP 2013143397 A JP2013143397 A JP 2013143397A JP 2012001402 A JP2012001402 A JP 2012001402A JP 2012001402 A JP2012001402 A JP 2012001402A JP 2013143397 A JP2013143397 A JP 2013143397A
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polyhedron
led
light source
source device
heat
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Jun Niekawa
潤 贄川
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Okano Electric Wire Co Ltd
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Okano Electric Wire Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide an LED light source device having a simple structure, high versatility, and a high degree of freedom of design when being applied to an illuminating device.SOLUTION: An LED light source device comprises a polyhedron 3 including a plurality of surfaces 4 each having one or more LED chips 1 disposed thereon via an insulator, and vertical direction axes R of the respective surfaces 4 each having the LED chip 1 disposed thereon crossing each other at one intersection C in an inner center portion of the polyhedron 3. The device radially illuminates light using the intersection C as a center when the LED chips 1 illuminate light toward the outside of the polyhedron 3 along directions of the vertical direction axes R. The device may include heat dissipation means 5 for transmitting heat from the intersection of the vertical direction axes R of the respective surfaces 4 to the outside of the polyhedron 3O to dissipate the heat. One end of the heat dissipation means is provided in the inside of the polyhedron 3, and the other end thereof is led out to the outside of the polyhedron 3.

Description

本発明は、LED(発光ダイオード)を用いて形成されるLED光源装置に関するものである。   The present invention relates to an LED light source device formed using an LED (light emitting diode).

従来、ランプ光源としては、白熱灯等のランプ中心(照明中心)を基準とした光照射角度範囲が360度の光源が用いられている。また、近年、光源としてLEDが注目されるようになってきている(例えば、特許文献1、2、参照)。   Conventionally, as a lamp light source, a light source having a light irradiation angle range of 360 degrees with respect to a lamp center (illumination center) such as an incandescent lamp is used. In recent years, LEDs have attracted attention as light sources (see, for example, Patent Documents 1 and 2).

LEDは、例えば図4(a)に示されるような、例えばサファイヤの基板2上にp型とn型の半導体13および活性層14を形成したLEDチップ1として用いられるものであり、電気配線12から電流を流すことにより光が照射される。LEDチップ1の大きさは様々であるが、例えば0.3mm〜1mmの小さいものが一般に用いられており、LEDチップ1から照射される光の照射方向は、図の矢印Aに示すように、基板2に対して鉛直方向軸である。   The LED is used as an LED chip 1 in which p-type and n-type semiconductors 13 and an active layer 14 are formed on, for example, a sapphire substrate 2 as shown in FIG. The light is irradiated by passing an electric current from. Although the size of the LED chip 1 is various, for example, a small one of 0.3 mm to 1 mm is generally used, and the irradiation direction of light emitted from the LED chip 1 is as shown by an arrow A in the figure A vertical axis with respect to the substrate 2.

LEDチップ1を用いた光源装置としては、例えば図4(b)に示されるように、樹脂キャップ15を備えたパッケージ内にLEDチップ1を設けて光の照射方向を制御する構成が一般に用いられている。この光源装置の光照射領域は基板2に対して鉛直方向軸を中心とし、樹脂キャップ15により光の照射角度制御を行うことにより照射角度を広げている。   As a light source device using the LED chip 1, for example, as shown in FIG. 4B, a configuration in which the LED chip 1 is provided in a package including a resin cap 15 to control the light irradiation direction is generally used. ing. The light irradiation area of the light source device is centered on the vertical axis with respect to the substrate 2, and the irradiation angle is widened by controlling the light irradiation angle with the resin cap 15.

特開2005−239354号公報JP 2005-239354 A 特開2009−187773号公報JP 2009-187773 A

ところで、現在、駐車場や、野球やサッカーなどのスポーツスタジアム等の産業用分野の照明としては、水銀ランプやナトリウムランプ等を用いた照度の高い照明装置が用いられているが、LEDは、一つ一つの光量が大きくはないために、前記のような産業用分野の照明装置として用いるためには多数のLED光源装置を配設する必要が生じることになる。   By the way, at present, as illumination in industrial fields such as parking lots and sports stadiums such as baseball and soccer, lighting devices with high illuminance using mercury lamps, sodium lamps, etc. are used. Since each light quantity is not large, it is necessary to dispose a large number of LED light source devices in order to use the lighting device in the industrial field as described above.

しかしながら、図4(b)に示したようなLED光源装置のランプ中心を基準とした照射角度はせいぜい180度であり、一般照明の照射角度範囲が360度であるのに対して半分程度で狭い。したがって、従来のLED光源装置は、LED光源装置を複数設けて産業用分野の照明装置を形成しようとすると、その設計の自由度が小さくなり、LED光源装置を有効に利用できないといった問題が生じる。   However, the irradiation angle based on the lamp center of the LED light source device as shown in FIG. 4B is 180 degrees at most, and the irradiation angle range of the general illumination is 360 degrees, but is narrow at about half. . Therefore, when a conventional LED light source device is provided with a plurality of LED light source devices to form an illuminating device in the industrial field, there is a problem that the degree of freedom of design is reduced and the LED light source device cannot be used effectively.

本発明は、前記課題を解決するために成されたものであり、その目的は、照射角度範囲が広く、その範囲を均一に照射でき、照明器具として汎用性が高く、産業用分野の照明装置に利用する場合にも設計の自由度を高められるLED光源装置を提供することにある。   The present invention has been made in order to solve the above-mentioned problems, and its purpose is to provide a wide illumination angle range, uniformly illuminate the range, high versatility as a lighting fixture, and an industrial lighting device. Another object of the present invention is to provide an LED light source device that can increase the degree of freedom in design even when used in the above.

上記目的を達成するために、本発明は次のような構成をもって課題を解決するための手段としている。すなわち、第1の発明は、多面体を形成する複数の面の表面にそれぞれ1つ以上のLEDチップが配設されて、該LEDチップが配設された各面の鉛直方向軸が前記多面体の内部中央部位において一つの交点で交わる態様に形成されており、前記LEDチップから前記多面体の外側に向けて前記鉛直方向軸に沿った方向に光を照射することによって前記交点を中心として放射状に光を照射する構成をもって課題を解決する手段としている。   In order to achieve the above object, the present invention has the following configuration as means for solving the problems. That is, according to the first aspect of the present invention, one or more LED chips are disposed on the surfaces of a plurality of surfaces forming a polyhedron, and the vertical axis of each surface on which the LED chips are disposed is the interior of the polyhedron. It is formed in an aspect where it intersects at one intersection in the central part, and radiates light radially around the intersection by irradiating light from the LED chip toward the outside of the polyhedron along the vertical axis. It is a means to solve the problem with the configuration of irradiation.

また、第2の発明は、前記第1の発明の構成に加え、前記多面体の内部には各面の鉛直方向軸の交点から多面体の外部に熱を伝えることにより放熱する放熱手段の一端側が設けられ、該放熱手段の他端側は前記多面体の外部に引き出されていることを特徴とする。   Further, in the second invention, in addition to the configuration of the first invention, one end side of a heat radiation means for dissipating heat by transferring heat from the intersection of the vertical axes of each surface to the outside of the polyhedron is provided inside the polyhedron. The other end side of the heat dissipating means is drawn out of the polyhedron.

さらに、第3の発明は、前記第2の発明の構成に加え、前記放熱手段の多面体から引き出されている部位にLEDチップへの電流供給経路が設けられていることを特徴とする。   Further, the third invention is characterized in that, in addition to the configuration of the second invention, a current supply path to the LED chip is provided in a portion drawn out from the polyhedron of the heat radiating means.

さらに、第4の発明は、前記第2または第3の発明の構成に加え、前記放熱手段の他端側は多面体を保持する外部の保持部材に接続されており、前記放熱手段の多面体から引き出されている部位が多面体の前記保持部材への接続支持部を兼ねていることを特徴とする。   Further, in the fourth invention, in addition to the configuration of the second or third invention, the other end side of the heat radiating means is connected to an external holding member that holds the polyhedron, and is pulled out from the polyhedron of the heat radiating means. The region that is also used as a connection support portion to the holding member of the polyhedron is characterized in that

さらに、第5の発明は、前記第1乃至第4のいずれか一つの発明の構成に加え、前記多面体は球状に形成されており、該球状多面体の外径が80mm以下に形成されていることを特徴とする。   Further, according to a fifth invention, in addition to the configuration of any one of the first to fourth inventions, the polyhedron is formed in a spherical shape, and the outer diameter of the spherical polyhedron is formed to be 80 mm or less. It is characterized by.

本発明によれば、多面体を形成する複数の面の表面にそれぞれ1つ以上のLEDチップを配設し、該LEDチップが配設された各面の鉛直方向軸が前記多面体の内部中央部位において一つの交点で交わる態様となるように形成して、LEDチップから前記多面体の外側に向けて前記鉛直方向軸に沿った方向に光を照射することによって、前記交点を中心として放射状に光を照射することができ、光源中心を基準としての光照射角度範囲を360度にできる(仮想点光源と見なせる)。また、LEDを高集積化することができ、十分な照度の確保が容易となる。   According to the present invention, one or more LED chips are disposed on the surfaces of a plurality of surfaces forming a polyhedron, and the vertical axis of each surface on which the LED chips are disposed is located at the inner central portion of the polyhedron. Formed to intersect at one intersection, and irradiate light radially around the intersection by irradiating light from the LED chip toward the outside of the polyhedron along the vertical axis The light irradiation angle range with reference to the center of the light source can be 360 degrees (can be regarded as a virtual point light source). Further, the LEDs can be highly integrated, and sufficient illuminance can be easily ensured.

このように、本発明のLED光源装置は、照射角度範囲が広く、その範囲を均一に照射でき、簡単な構成で照明器具として汎用性が高く、産業用分野の照明装置に利用する場合にも設計の自由度を高めることができるし、LEDの高集積化により照度の確保もできるため、従来の水銀灯等の産業用照明装置の代替光源用として本発明のLED光源装置を用いることもできるようになり、LEDチップを用いた省エネ化が可能な産業用分野の照明装置の形成も可能にできる。   As described above, the LED light source device of the present invention has a wide irradiation angle range, can uniformly irradiate the range, and is highly versatile as a lighting fixture with a simple configuration, and can be used for lighting devices in the industrial field. Since the degree of freedom of design can be increased and the illuminance can be secured by high integration of LEDs, the LED light source device of the present invention can be used as an alternative light source for industrial lighting devices such as conventional mercury lamps. Thus, it is possible to form an illumination device in an industrial field that can save energy using an LED chip.

また、LEDチップから光を照射すると熱が発生するため、例えば従来用いられている電球型のLED光源装置においてはLED基板側の支持部の外周側に凹凸を設ける等の放熱構成を設けているが、本発明においては、多面体内部に放熱手段の一端側を設けて放熱手段の他端側を多面体の外部に引き出し、多面体の内部において各面の鉛直方向軸の交点やその近傍の熱くなる部位から多面体の外部に熱を伝えることにより熱を効率的に外部に放熱することができる。そのため、熱によりLEDチップが劣化することを抑制できるしLEDチップに供給される電力の光変換効率も向上でき、寿命の長いLED光源装置とすることができる。   Further, since heat is generated when light is emitted from the LED chip, for example, in a conventionally used light bulb type LED light source device, a heat dissipation structure is provided such as providing unevenness on the outer peripheral side of the support portion on the LED substrate side. However, in the present invention, one end side of the heat dissipating means is provided inside the polyhedron, and the other end side of the heat dissipating means is drawn out of the polyhedron, and the portion of the polyhedron that becomes hot at the intersection of the vertical axes of each surface and the vicinity The heat can be efficiently radiated to the outside by transferring the heat to the outside of the polyhedron. Therefore, it can suppress that a LED chip deteriorates with a heat | fever, can also improve the light conversion efficiency of the electric power supplied to a LED chip, and can set it as a long-life LED light source device.

さらに、放熱手段を設ける構成において、放熱手段の多面体から引き出されている部位に、LEDチップへの電流供給経路を設けることにより、構成を簡単にでき、見栄えも良好なLED光源装置とすることができる。   Further, in the configuration in which the heat radiating means is provided, by providing a current supply path to the LED chip in the part drawn from the polyhedron of the heat radiating means, the configuration can be simplified and the LED light source device having a good appearance can be obtained. it can.

さらに、放熱手段の他端側を、多面体を保持する外部の保持部材に接続し、放熱手段の多面体から引き出されている部位が多面体の前記保持部材への接続支持部を兼ねるようにすることによって、多面体を保持部材に接続保持したLED光源装置を、簡単な構成で容易に形成することができる。   Furthermore, by connecting the other end side of the heat dissipation means to an external holding member that holds the polyhedron, the part drawn out from the polyhedron of the heat dissipation means also serves as a connection support part to the holding member of the polyhedron. The LED light source device in which the polyhedron is connected and held to the holding member can be easily formed with a simple configuration.

さらに、多面体を球状に形成し、該球状多面体の外径を80mm以下に形成することにより、LEDからの光の照射方向を均等な放射状にでき、例えば、従来、投光器の光源であったHID(高輝度放電)ランプを用いた照明器具に流用することが可能となり、汎用性の高いLED光源装置とすることができる。   Furthermore, by forming the polyhedron in a spherical shape and forming the outer diameter of the spherical polyhedron to be 80 mm or less, the irradiation direction of the light from the LED can be made uniform, for example, HID ( A high-luminance discharge) lamp can be used for a lighting fixture, and a highly versatile LED light source device can be obtained.

本発明に係るLED光源装置の第1実施例を示す模式的な斜視図(a)と模式的な断面図(b)である。It is the typical perspective view (a) and typical sectional view (b) which show the 1st example of the LED light source device concerning the present invention. 本発明に係るLED光源装置の第2実施例を示す模式的な斜視図である。It is a typical perspective view which shows 2nd Example of the LED light source device which concerns on this invention. 本発明に係るLED光源装置に適用される多面体の他の例を示す説明図である。It is explanatory drawing which shows the other example of the polyhedron applied to the LED light source device which concerns on this invention. LEDチップを説明するための模式的な断面説明図(a)とLEDチップを用いた従来の光源装置の例を示す断面説明図(b)である。It is typical sectional explanatory drawing (a) for demonstrating an LED chip, and sectional explanatory drawing (b) which shows the example of the conventional light source device using an LED chip.

以下、本発明の実施の形態を図面に基づき説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

図1(a)には、本発明に係るLED光源装置の第1実施例が模式的に示されている。同図に示されるように、第1実施例のLED光源装置は、球状のサッカーボール形状に形成された多面体3を有している。この多面体3は、銅製のブロックの周りにアルミニウム製の基板を配設して形成されており、20枚の正六角形の面4と12枚の正五角形の面4との組み合わせによる球状の三十二面体である。球状多面体3の外径は、80mm以下の適宜の値(例えば約30mm)に形成されている。   FIG. 1 (a) schematically shows a first embodiment of the LED light source device according to the present invention. As shown in the figure, the LED light source device of the first embodiment has a polyhedron 3 formed in a spherical soccer ball shape. The polyhedron 3 is formed by disposing an aluminum substrate around a copper block, and has a spherical shape of 30 by combining 20 regular hexagonal surfaces 4 and 12 regular pentagonal surfaces 4. It is a dihedron. The outer diameter of the spherical polyhedron 3 is formed to an appropriate value of 80 mm or less (for example, about 30 mm).

多面体3を形成する複数の面4の表面には、それぞれ1つのLEDチップ1が絶縁層(図示せず)を介して配設されており、図1(b)に示すように、LEDチップ1が配設された各面の鉛直方向軸Rが、多面体3の内部中央部位において、一つの交点Cで交わる態様に形成されている。そして、本実施例は、LEDチップ1から多面体3の外側に向けて、鉛直方向軸Rに沿った方向に光を照射することによって、交点Cを中心とし、図1(a)に示すように放射状に光を照射することを特徴とする。   One LED chip 1 is disposed on each of the surfaces 4 forming the polyhedron 3 via an insulating layer (not shown). As shown in FIG. Is formed in such a manner that the vertical axis R of each surface on which the is arranged intersects at one intersection C in the inner central portion of the polyhedron 3. In this embodiment, light is irradiated in the direction along the vertical axis R from the LED chip 1 toward the outside of the polyhedron 3, with the intersection C as the center, as shown in FIG. It is characterized by irradiating light radially.

なお、本実施例に適用されている多面体3を形成するアルミニウム製基板の各面4には、隣り合う適宜のLEDチップ1同士を接続することにより多面体3に設けられている全てのLEDチップ1を直列に接続するためのプリント配線(図示せず)が形成されており、各面4にLEDチップ1を実装することにより、LEDチップ1を直列接続したLEDチップ直列接続回路が形成される。   In addition, on each surface 4 of the aluminum substrate forming the polyhedron 3 applied to the present embodiment, all LED chips 1 provided in the polyhedron 3 are connected by connecting adjacent LED chips 1 adjacent to each other. A printed wiring (not shown) for connecting the LED chips 1 in series is formed, and by mounting the LED chips 1 on each surface 4, an LED chip series connection circuit in which the LED chips 1 are connected in series is formed.

また、図1(b)に示されるように、多面体3には、一端側が開口の通路状の挿入部6が形成されて、挿入部6には放熱手段5の一端側が挿入されている。放熱手段5は、多面体3の各面4の鉛直方向軸Rの交点Cから多面体3の外部に熱を伝えることにより放熱する手段であり、外径4mmφの銅製のヒートパイプを有して形成されている。放熱手段5の他端側は多面体3の外部に引き出されており、前記LEDチップ1は、放熱手段5の引き出し部が形成された1つの面4を除く全ての(31個の)面4に設けられている。放熱手段5の挿入部6に挿入されている部分は、LED光源装置の作製時に、ヒートパイプの放熱手段5を挿入部6に挿入した状態でヒートパイプ内の流体に圧力を加えることによりヒートパイプの放熱手段5の表面を挿入部6に密着させている。なお、必要に応じ、放熱手段5の表面と挿入部6の内壁との間に熱伝導性の高い接着剤を設けてもよい。   Further, as shown in FIG. 1B, the polyhedron 3 is formed with a passage-shaped insertion portion 6 having an opening on one end side, and one end side of the heat dissipating means 5 is inserted into the insertion portion 6. The heat dissipating means 5 is a means for dissipating heat by transferring heat from the intersection C of the vertical axis R of each surface 4 of the polyhedron 3 to the outside of the polyhedron 3, and is formed with a copper heat pipe having an outer diameter of 4 mmφ. ing. The other end side of the heat dissipating means 5 is drawn to the outside of the polyhedron 3, and the LED chip 1 is placed on all (31) faces 4 except for one face 4 on which the lead portion of the heat dissipating means 5 is formed. Is provided. The portion of the heat dissipating means 5 inserted into the insertion portion 6 is formed by applying pressure to the fluid in the heat pipe with the heat dissipating means 5 of the heat pipe inserted into the insertion portion 6 when the LED light source device is manufactured. The surface of the heat radiating means 5 is in close contact with the insertion portion 6. In addition, you may provide an adhesive agent with high heat conductivity between the surface of the thermal radiation means 5 and the inner wall of the insertion part 6 as needed.

なお、本実施例では、多面体3の31個の面4にそれぞれ1つのLEDチップ1を設けており、それぞれのLEDチップ1の出力を1Wとすると合計31Wの出力を有する光源となり、LEDチップ1を用いると、この総出力のうち約6割は熱となるが、前記銅製のヒートパイプの放熱手段5を用いてLEDチップ1から出る熱の吸熱を行うことにより、熱を効率的に外部に排出することができる。   In this embodiment, one LED chip 1 is provided on each of the 31 surfaces 4 of the polyhedron 3, and when the output of each LED chip 1 is 1 W, the light source has a total output of 31 W, and the LED chip 1 About 60% of this total output becomes heat, but by using the heat dissipating means 5 of the copper heat pipe, the heat emitted from the LED chip 1 is absorbed so that the heat can be efficiently transferred to the outside. Can be discharged.

また、放熱手段5の多面体3から引き出されている部位には電気配線9が設けられており、電気配線9は、複数のLEDチップ1の前記直列回路に電流を供給することにより各LEDチップ1に電流を供給する電流供給経路として機能する。放熱手段5の他端側は、多面体3を保持する外部の保持部材7に接続されており、放熱手段5の多面体3から引き出されている部位は、多面体3の保持部材7への接続支持部8を兼ねている。   In addition, an electrical wiring 9 is provided in a portion of the heat dissipation means 5 drawn from the polyhedron 3, and the electrical wiring 9 supplies each LED chip 1 by supplying current to the series circuit of the plurality of LED chips 1. It functions as a current supply path for supplying current to. The other end side of the heat dissipating means 5 is connected to an external holding member 7 that holds the polyhedron 3, and a portion drawn out from the polyhedron 3 of the heat dissipating means 5 is a connection support portion for the holding member 7 of the polyhedron 3. Also serves as 8.

なお、本実施例は、図1に示されるように保持部材7に多面体3を1つ設けた構成のLED光源装置としているが、1つの保持部材7に複数の多面体3を設け、接続支持部8を兼ねた放熱手段5によって接続して照明装置を形成することもでき、このようにすることによって、例えば駐車場や、野球やサッカーなどのスポーツスタジアム等の産業用分野の照明として用いることもできる。   In this embodiment, as shown in FIG. 1, the LED light source device has a configuration in which one holding member 7 is provided with one polyhedron 3, but a plurality of polyhedrons 3 are provided on one holding member 7, and a connection support portion is provided. It is also possible to form a lighting device by connecting with the heat radiating means 5 which also serves as 8, and in this way, it can also be used as lighting in industrial fields such as parking lots and sports stadiums such as baseball and soccer. it can.

図2には、本発明に係るLED光源装置の第2実施例が模式的に示されている。なお、第2実施例の説明において、前記第1実施例と同一名称部分には同一符号を付し、その重複説明は省略または簡略化する。   FIG. 2 schematically shows a second embodiment of the LED light source device according to the present invention. In the description of the second embodiment, the same reference numerals are assigned to the same name portions as those in the first embodiment, and the duplicate description is omitted or simplified.

第2実施例は、前記第1実施例とほぼ同様に構成されており、第2実施例が前記第1実施例と異なる特徴的なことは、保持部材7が反射鏡10により形成されていることである。このように、第2実施例では、保持部材7を反射鏡10により形成することにより、光の照射角度を図の矢印に示す方向として配光性を持たせている。   The second embodiment is configured in substantially the same manner as the first embodiment. The second embodiment is different from the first embodiment in that the holding member 7 is formed by the reflecting mirror 10. That is. As described above, in the second embodiment, the holding member 7 is formed by the reflecting mirror 10 so that the light irradiation angle is given as the direction indicated by the arrow in the drawing.

なお、第2実施例でも、1つの多面体3を設けて照明装置を形成することもできるし、複数の多面体3を設けて照明装置を形成することもでき、複数の多面体3を有する構成とすることによって、前記第1実施例と同様に、産業用照明としての利用もできる。   In the second embodiment as well, a lighting device can be formed by providing one polyhedron 3, or a lighting device can be formed by providing a plurality of polyhedrons 3, which has a plurality of polyhedrons 3. Thus, as in the first embodiment, it can also be used as industrial lighting.

なお、本発明は前記実施例に限定されることなく、様々な実施の形態を採り得る。例えば、前記各実施例では多面体3のほぼ全ての面4(放熱手段5の匹だし部が形成されている面以外の面4)にLEDチップ1を1つずつ設けたが、LEDチップ1は、例えば多面体3を形成する面4の数が多い場合に、LEDチップ1を設けない面4を複数設けてもよいし、全ての面4にLEDチップ1を設けてもよい。また、1つの面4に複数のLEDチップ1を配設してもよく、LEDチップ1の配設態様や配設数は、適宜設定されるものである。   In addition, this invention can take various embodiment, without being limited to the said Example. For example, in each of the above-described embodiments, one LED chip 1 is provided on almost all the surfaces 4 of the polyhedron 3 (the surfaces 4 other than the surface on which the radiating means 5 is added). For example, when the number of the surfaces 4 that form the polyhedron 3 is large, a plurality of surfaces 4 that are not provided with the LED chips 1 may be provided, or the LED chips 1 may be provided on all the surfaces 4. Moreover, you may arrange | position the several LED chip 1 in the one surface 4, and the arrangement | positioning aspect and the number of arrangement | positioning of the LED chip 1 are set suitably.

また、前記各実施例では、多面体3の外径を30mmとしたが、多面体3の大きさは特に限定されるものでなく、適宜設定されるものである。   In each of the above-described embodiments, the outer diameter of the polyhedron 3 is set to 30 mm. However, the size of the polyhedron 3 is not particularly limited and is appropriately set.

さらに、前記各実施例では、多面体3は三十二面体としたが、多面体3を形成する面4の数は適宜設定されるものである。なお、面4の数を多くすることにより、多面体3をより球形(球状)に近づけることができるため好ましい。   Furthermore, in each of the above-described embodiments, the polyhedron 3 is a thirty-two-hedron, but the number of the surfaces 4 forming the polyhedron 3 is appropriately set. In addition, since the polyhedron 3 can be approximated more spherical (spherical) by increasing the number of the surfaces 4, it is preferable.

多面体3の例として、図3には、本発明のLED照明装置に適用される多面体3のうち、正多面体の例が示されており、図3(a)には正十二面体、図3(b)には正二十面体、図3(c)には正八面体、図3(d)には正六面体、図3(e)には正四面体がそれぞれ示されている。本発明には、このような正多面体を始めとして様々な多面体3をLEDチップ1配設用として適用できるが、前記の如く、多面体3は球状に形成することが好ましく、正多面体とする場合は、図3(a)の正十二面体や図3(b)の正二十面体が好ましい。   As an example of the polyhedron 3, FIG. 3 shows an example of a regular polyhedron among the polyhedrons 3 applied to the LED lighting device of the present invention, and FIG. 3 (a) shows a regular dodecahedron. FIG. 3B shows a regular icosahedron, FIG. 3C shows a regular octahedron, FIG. 3D shows a regular hexahedron, and FIG. 3E shows a regular tetrahedron. In the present invention, various polyhedrons 3 including such a regular polyhedron can be applied for disposing the LED chip 1. However, as described above, the polyhedron 3 is preferably formed in a spherical shape. The icosahedron of FIG. 3A and the icosahedron of FIG. 3B are preferable.

さらに、前記各実施例では、多面体3は、銅製のブロックの表面にアルミニウム製の板を設けた構成としたが、例えばアルミニウム製の板のみで形成して内部が空洞の多面体3にLEDチップ1を配設してもよい。なお、この場合、アルミニウム製の板と放熱部材5との間にスペーサ等の熱伝導部材を設けて、LEDチップ1と放熱部材5とが熱的に接続されるようにすることが望ましい。また、多面体3の材質は特に限定されるものでなく、適宜設定されるものであるが、熱伝導が良好な材料により多面体3を形成し、放熱部材5によって熱の放熱を良好に行えるようにすることが好ましい。   Furthermore, in each said Example, although the polyhedron 3 was set as the structure which provided the board made from aluminum on the surface of a copper block, it is formed only with the board made from aluminum, for example, and the LED chip 1 is formed in the polyhedron 3 with a hollow inside. May be provided. In this case, it is desirable to provide a heat conducting member such as a spacer between the aluminum plate and the heat radiating member 5 so that the LED chip 1 and the heat radiating member 5 are thermally connected. In addition, the material of the polyhedron 3 is not particularly limited and may be set as appropriate, but the polyhedron 3 is formed of a material having good heat conduction so that the heat radiating member 5 can radiate heat well. It is preferable to do.

さらに、前記各実施例では、放熱部材5をヒートパイプにより形成したが、放熱部材5は、ヒートパイプとは限らず、アルミニウムや銅等の金属部材や、アルミニウムや銅等の金属とカーボンナノチューブやグラファイト等の炭素材料とで構成された高熱伝導性の複合部材により形成してもよい。   Furthermore, in each said Example, although the heat radiating member 5 was formed with the heat pipe, the heat radiating member 5 is not restricted to a heat pipe, Metal members, such as aluminum and copper, Metals, such as aluminum and copper, and a carbon nanotube, You may form with the highly heat conductive composite member comprised with carbon materials, such as a graphite.

さらに、前記各実施例では、多面体3を保持する外部の保持部材7に放熱手段5を接続して多面体3の接続支持部とし、かつ、放熱手段5にLEDチップ1への電流供給のための電気配線9を設けたが、放熱手段5以外の接続支持部を設けてもよいし、電気配線9の配設を放熱手段5以外の接続支持部に設けてもよい。   Furthermore, in each said Example, the thermal radiation means 5 is connected to the external holding member 7 holding the polyhedron 3, and it is used as the connection support part of the polyhedron 3, and for the current supply to the LED chip 1 to the thermal radiation means 5 Although the electrical wiring 9 is provided, a connection support portion other than the heat dissipation means 5 may be provided, or the electrical wiring 9 may be provided in a connection support portion other than the heat dissipation means 5.

本発明のLED光源装置は、光源中心を基準としての光照射角度範囲を実質的に360度にでき、LEDの高集積化や十分な照度の確保が容易であるので、家庭用としても産業用分野の照明装置としても利用できる。   The LED light source device of the present invention can make the light irradiation angle range with reference to the center of the light source substantially 360 degrees, and it is easy to highly integrate LEDs and ensure sufficient illuminance. It can also be used as a lighting device in the field.

1 LEDチップ
2 基板
3 多面体
4 面
5 放熱手段
6 挿入部
7 保持部材
8 接続支持部
9 電気配線
10 反射板
DESCRIPTION OF SYMBOLS 1 LED chip 2 Board | substrate 3 Polyhedron 4 surface 5 Thermal radiation means 6 Insertion part 7 Holding member 8 Connection support part 9 Electric wiring 10 Reflector

Claims (5)

多面体を形成する複数の面の表面にそれぞれ1つ以上のLEDチップが配設されて、該LEDチップが配設された各面の鉛直方向軸が前記多面体の内部中央部位において一つの交点で交わる態様に形成されており、前記LEDチップから前記多面体の外側に向けて前記鉛直方向軸に沿った方向に光を照射することによって前記交点を中心として放射状に光を照射することを特徴とするLED光源装置。   One or more LED chips are disposed on the surfaces of a plurality of surfaces forming the polyhedron, and the vertical axes of the surfaces on which the LED chips are disposed intersect at one intersection at the inner central portion of the polyhedron. LED which is formed in an aspect and irradiates light radially around the intersection by irradiating light from the LED chip toward the outside of the polyhedron in a direction along the vertical axis Light source device. 多面体の内部には各面の鉛直方向軸の交点から多面体の外部に熱を伝えることにより放熱する放熱手段の一端側が設けられ、該放熱手段の他端側は前記多面体の外部に引き出されていることを特徴とする請求項1記載のLED光源装置。   Inside the polyhedron is provided one end side of a heat radiating means for radiating heat by transferring heat from the intersection of the vertical axes of each surface to the outside of the polyhedron, and the other end side of the heat radiating means is drawn out of the polyhedron. The LED light source device according to claim 1. 放熱手段の多面体から引き出されている部位にLEDチップへの電流供給経路が設けられていることを特徴とする請求項2記載のLED光源装置。   The LED light source device according to claim 2, wherein a current supply path to the LED chip is provided at a portion drawn out from the polyhedron of the heat dissipating means. 放熱手段の他端側は多面体を保持する外部の保持部材に接続されており、前記放熱手段の多面体から引き出されている部位が多面体の前記保持部材への接続支持部を兼ねていることを特徴とする請求項2または請求項3記載のLED光源装置。   The other end side of the heat dissipating means is connected to an external holding member that holds the polyhedron, and a portion drawn out from the polyhedron of the heat dissipating means also serves as a connection support part of the polyhedron to the holding member. The LED light source device according to claim 2 or 3. 多面体は球状に形成されており、該球状多面体の外径が80mm以下に形成されていることを特徴とする請求項1乃至請求項4のいずれか一つに記載のLED光源装置。   5. The LED light source device according to claim 1, wherein the polyhedron is formed in a spherical shape, and the outer diameter of the spherical polyhedron is 80 mm or less.
JP2012001402A 2012-01-06 2012-01-06 Led light source device Pending JP2013143397A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016201408A (en) * 2015-04-08 2016-12-01 日亜化学工業株式会社 Light emitting device and light source device
JP2019504440A (en) * 2015-12-22 2019-02-14 ソッツィ アッレダメンティ エス アール エルSozzi Arredamenti S.R.L. Modular lighting system
CN110010011A (en) * 2017-12-01 2019-07-12 乐金显示有限公司 Polyhedral display device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016201408A (en) * 2015-04-08 2016-12-01 日亜化学工業株式会社 Light emitting device and light source device
JP2019504440A (en) * 2015-12-22 2019-02-14 ソッツィ アッレダメンティ エス アール エルSozzi Arredamenti S.R.L. Modular lighting system
CN110010011A (en) * 2017-12-01 2019-07-12 乐金显示有限公司 Polyhedral display device
CN110010011B (en) * 2017-12-01 2022-12-06 乐金显示有限公司 Polyhedral display device

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