CN109578822A - A kind of LED filament lamp of high thermal conductivity - Google Patents
A kind of LED filament lamp of high thermal conductivity Download PDFInfo
- Publication number
- CN109578822A CN109578822A CN201710877365.6A CN201710877365A CN109578822A CN 109578822 A CN109578822 A CN 109578822A CN 201710877365 A CN201710877365 A CN 201710877365A CN 109578822 A CN109578822 A CN 109578822A
- Authority
- CN
- China
- Prior art keywords
- hollow
- connector
- permanent seat
- lampshade
- card slot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/16—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
- F21V17/164—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting the parts being subjected to bending, e.g. snap joints
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention discloses a kind of LED filament lamps of high thermal conductivity, it includes bulb socket, power panel, connector, hollow thermal column, several filament light sources plate, radiating permanent seat, lampshades;Lampshade bottom end is connect with bulb socket;The top of lampshade is equipped with concave circular hole;Radiating permanent seat is equipped in concave circular hole;Radiating permanent seat is connect with the top of hollow thermal column;The strip card slot that several ring quasi arrays arrange on the outer wall of hollow thermal column;Filament light sources plate is equipped in strip card slot;Outside arcuation protrusion is equipped between two neighboring strip card slot;The bottom end of hollow thermal column is socketed in connector;Connector is located at the top of power panel;Power panel is located in bulb socket;Heat transfer of the invention is more intuitive, conveniently, is truly realized the high thermal conductivity of LED filament lamp, while also solving cause thermal damage and light decay because of LED chip caused by radiating not in time, and the reduction of the luminous flux avoided also extends the service life of filament lamp.
Description
Technical field
The present invention relates to LED technology fields, and in particular to a kind of LED filament lamp of high thermal conductivity.
Background technique
In recent years, LED filament shines because it has 360 ° of full angles, is widely used on filament lamp, existing LED
Filament is that one group of LED chip encapsulation is formed LED filament on the transparent substrate, then connects multiple filaments to form similar tungsten
The illumination effect of silk lamp.Currently, LED filament is substantially without radiator, LED filament can not carry out heat conducting and radiating, so being difficult
The heat that LED chip generates is conducted, heat can only lean on radiation and the convection current of internal gas to carry out thermally conductive and heat dissipation, be easy
The accumulation of heat is caused, so that the lost of life of LED filament.
Existing LED filament lamp, which generallys use, fills heat-conducting gas and glass envelope bubble technique manufacture, skill of this technique to envelope bubble
Art requires high, and equipment is expensive, and envelope bubble is easy to cause not to be tamping, explosion, the problems such as glass envelope is frangible.Long-time service is difficult to avoid that meeting
Leak air problem, and gas leakage will lead to heat-sinking capability reduction even LED filament and be burned out;And the heat dissipation performance of gas is limited,
The exploitation of low-power LED filament lamp can only be met, and once do high-power, the heat of the generation of LED filament can not shed in time,
The cause thermal damage and light decay of LED chip are easily caused, so that the lux maintenance of whole lamp is low, the service life is short.
Summary of the invention
In view of the defects and deficiencies of the prior art, the present invention intends to provide a kind of simple structure and reasonable design, make
With the LED filament lamp of convenient high thermal conductivity.
To achieve the above object, the technical solution adopted by the present invention is that: it includes bulb socket, power panel, connector, hollow
Thermal column, several filament light sources plate, radiating permanent seat, lampshades;Lampshade bottom end is connect with bulb socket;Power panel, connector, sky
Heart thermal column, several filament light sources plates, radiating permanent seat are each provided in the space that bulb socket and lampshade are formed;The top of lampshade
Equipped with concave circular hole;Radiating permanent seat is equipped in concave circular hole;Radiating permanent seat is connect with the top of hollow thermal column;It is hollow to dissipate
The strip card slot that several ring quasi arrays arrange on the outer wall of plume;Filament light sources plate is equipped in strip card slot;Adjacent two
Outside arcuation protrusion is equipped between a strip card slot;The bottom end of hollow thermal column is socketed in connector;Connector is located at electricity
The top of source plate;Power panel is located in bulb socket;
Preferably, the filament light sources plate is equipped with substrate;The substrate is rectangular substrate;The material of substrate is ceramics
Plate or superconduction aluminum substrate;Packaging LED chips region, circuit region and welding resistance pad are successively arranged on the outer surface of substrate;Circuit
Region is equipped with circuit layer;Welding resistance pad is electrically connected with circuit layer;Packaging LED chips region is equipped with LED chip, bonding is led
Line, fluorescent glue;LED chip is electrically connected by bonding lead with circuit layer;Fluorescent glue is completely covered on LED chip, bonding lead
On;
Preferably, the connector is cylinder-shaped link;The middle part of connector is equipped with to be cooperated with the bottom end of hollow thermal column
The installation through-hole of connection;The inner wall of installation through-hole is equipped with the lesser calorie for assembling lamp mercerising source plate corresponding with strip card slot
Slot;The side wall of small card slot is equipped with extension type metal contact jaw;Extension type metal contact jaw passes through conducting wire and power panel electricity
Connection;
Preferably, the hollow thermal column is hollow round table structure;The material of hollow thermal column is that aluminium or heat conductive insulating are moulded
Expect material;Pass through the technology mode package of plating, spraying plating or sputtering on the outer surface of arcuation protrusion on hollow heat dissipation column outer wall
There is film layer;
Preferably, the lampshade crosses hemisphere bubble shell structure for transparent or semitransparent;The material of lampshade is plastics or glass material
Matter;
Preferably, the radiating permanent seat is transparent or semitransparent convex cylindrical structure;The top of radiating permanent seat is under
Several heat release holes are equipped on the peripheral wall of end.
After adopting the above structure, a kind of LED filament lamps and lanterns of high thermal conductivity of the present invention have the advantage that
1, single side filament light sources plate is assembled by the strip card slot on hollow thermal column, then the two assembly is assemblied in
Connector, while the welding resistance pad of filament light sources plate is connected with the metal contact jaw in connector, structure is simple to operation, no
It needs to weld, viscose glue;
2, lampshade can be assembled directly by radiating permanent seat and hollow thermal column and then implement to assemble with bulb socket, without envelope
Bubble;
Though 3, filament light sources plate is shone using 180 ° of single side, it is after being assembled to hollow thermal column peripheral wall, the light that is issued
After hollow thermal column surface bulge object diffusing reflection and refraction, 360 ° of light-out effect also will form;
4, hollow thermal column is set as hollow round table structure, and the top and lampshade top of hollow thermal column are combined with heat dissipation and fix
Seat, the heat a part generated that shone by substrate single side pass through thermal column hollow area and the heat dissipation through radiating permanent seat top
Hole is transmitted to the lampshade external world, and another part is collected at the heat release hole transmitting that the heat in lampshade directly passes through radiating permanent seat lower end
To the lampshade external world, the filament lamp in background technique relatively carries out radiant heat transfer heat using heat-conducting gas is rushed, and the present invention is then more
Consider to orientation the transmitting of heat, heat transfer is more intuitive, conveniently, is truly realized the high thermal conductivity of LED filament lamp, together
When also solve cause thermal damage and light decay because of LED chip caused by radiating not in time, the reduction of the luminous flux avoided also extends
The service life of filament lamp.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention without any creative labor, may be used also for those of ordinary skill in the art
To obtain other drawings based on these drawings.
Fig. 1 is assembling schematic diagram of the invention;
Fig. 2 is structural schematic diagram of the invention;
Fig. 3 is the structural schematic diagram of connector;
Fig. 4 is the structural schematic diagram of hollow thermal column;
Fig. 5 is the structural schematic diagram of filament light sources plate;
Fig. 6 is the top view of filament light sources plate;
Fig. 7 is the structural schematic diagram of radiating permanent seat;
Fig. 8 is the schematic cross-section of lampshade.
Description of symbols:
1, bulb socket;2, power panel;3, connector;4, filament light sources plate;5, hollow thermal column;6, radiating permanent seat;7, lampshade;
3-1, small card slot;3-2, extension type metal contact jaw;3-3, installation through-hole;4-1, substrate;4-2, welding resistance pad;4-3, encapsulation
LED core panel region;4-4, circuit region;4-31, LED chip;4-32, bonding lead;4-33, fluorescent glue;4-41, circuit layer;
5-1, boring region;The top of 5-2, hollow thermal column;5-3, strip card slot;5-4, arcuation protrusion;5-5, it is hollow dissipate
The bottom end of plume;6-1, heat release hole;6-2, lower end peripheral wall;7-1, concave circular hole;The top of 7-2, lampshade;The bottom of 7-3, lampshade
End.
Specific embodiment
With reference to the accompanying drawing, the present invention is further illustrated.
Referring to shown in Fig. 1-2,4, present embodiment the technical solution adopted is that: it include bulb socket 1, power panel 2,
Connector 3, hollow thermal column 5, several filament light sources plates 4, radiating permanent seat 6, lampshade 7;The bottom end 7-3 and bulb socket of lampshade
1 connection;Power panel 2, connector 3, hollow thermal column 5, several filament light sources plates 4, radiating permanent seat 6 are each provided at bulb socket 1
In the space formed with lampshade 7;The top 7-2 of lampshade is equipped with concave circular hole 7-1;Radiating permanent seat is equipped in concave circular hole 7-1
6;Radiating permanent seat 6 is connect with the top 5-2 of hollow thermal column;Several ring quasi arrays arrange on the outer wall of hollow thermal column 5
Strip card slot 5-3;Filament light sources plate 4 is equipped in strip card slot 5-3;Filament light sources plate 4 shines the heat generated through sky
The periphery wall of heart thermal column 5 is transmitted to boring region 5-1, radiates;It is equipped between two neighboring strip card slot 5-3
Outside arcuation protrusion 5-4;The bottom end 5-5 of hollow thermal column is socketed in connector 3;Connector 3 is located at the top of power panel 2;
Power panel 2 is located in bulb socket 1;
Referring to shown in Fig. 5-6, the filament light sources plate 4 is equipped with substrate 4-1;The substrate 4-1 is rectangular substrate;Base
The material of plate 4-1 is ceramic wafer or superconduction aluminum substrate;Packaging LED chips are from top to bottom successively arranged on the outer surface of substrate 4-1
Region 4-3, circuit region 4-4 and welding resistance pad 4-2;Circuit region 4-4 is equipped with circuit layer 4-41;Welding resistance pad 4-2 and electricity
Floor 4-41 electrical connection in road is played the role of introducing power supply;Packaging LED chips region 4-3 is equipped with LED chip 4-31, bonding
Conducting wire 4-32, fluorescent glue 4-33;LED chip 4-31 is electrically connected by bonding lead 4-32 with circuit layer 4-41, is formed circuit and is led
It is logical;Fluorescent glue 4-33 is completely covered on LED chip 4-31, bonding lead 4-32;
Shown in referring to Fig. 3, the connector 3 is cylinder-shaped link;The middle part of connector 3 is equipped with the bottom with hollow thermal column
Hold the installation through-hole 3-3 being cooperatively connected;The inner wall of installation through-hole 3-3 is equipped with corresponding with strip card slot for assembling filament
The small card slot 3-1 of light source board;The side wall of small card slot 3-1 is equipped with extension type metal contact jaw 3-2, the contact of extension type metal
End 3-2 is inserted into after small card slot 3-1 for filament light sources plate 4 to carry out contact with the welding resistance pad 4-2 on filament light sources plate and is connected;It can
Telescopic metal contact jaw 3-2 is electrically connected by conducting wire with power panel 2;
Referring to shown in Fig. 4, the hollow thermal column 5 is hollow round table structure;The material of hollow thermal column 5 is aluminium or thermally conductive
Ambroin material;Pass through the technique of plating, spraying plating or sputtering on the outer surface of arcuation protrusion 5-4 on hollow heat dissipation column outer wall
Mode is enclosed with film layer, and film layer plays diffusing reflection and refraction action;The light that filament light sources plate 4 issues is through hollow thermal column
After film layer diffusing reflection and refraction on the arcuation protrusion of border, finally reflected away by lampshade 7;
Referring to shown in Fig. 8, the lampshade 7 crosses hemisphere bubble shell structure for transparent or semitransparent, can be by hollow thermal column 5, lamp
The storages such as mercerising source plate 4 are wherein;The material of lampshade 7 is plastics or glass material;
Referring to shown in Fig. 7, the radiating permanent seat 6 is transparent or semitransparent convex cylindrical structure;The top of radiating permanent seat
Several heat release holes 6-1 is equipped on end and lower end peripheral wall 6-2;The heat release hole on top can be by the hollow area collection of hollow thermal column
Poly- heat is transmitted to the external world by heat release hole, and heat release hole can pass through the luminous certain heat generated of light source board on the peripheral wall of lower end
Heat release hole is transmitted to the external world.
After adopting the above structure, a kind of LED filament lamps and lanterns of high thermal conductivity described in present embodiment have following
Advantage:
1, single side filament light sources plate is assembled by the strip card slot on hollow thermal column, then the two assembly is assemblied in
Connector, while the welding resistance pad of filament light sources plate is connected with the metal contact jaw in connector, structure is simple to operation, no
It needs to weld, viscose glue;
2, lampshade can be assembled directly by radiating permanent seat and hollow thermal column and then implement to assemble with bulb socket, without envelope
Bubble;
Though 3, filament light sources plate is shone using 180 ° of single side, it is after being assembled to hollow thermal column peripheral wall, the light that is issued
After hollow thermal column surface bulge object diffusing reflection and refraction, 360 ° of light-out effect also will form;
4, hollow thermal column is set as hollow round table structure, and the top and lampshade top of hollow thermal column are combined with heat dissipation and fix
Seat, the heat a part generated that shone by substrate single side pass through thermal column hollow area and the heat dissipation through radiating permanent seat top
Hole is transmitted to the lampshade external world, and another part is collected at the heat release hole transmitting that the heat in lampshade directly passes through radiating permanent seat lower end
To the lampshade external world, the filament lamp in background technique relatively carries out radiant heat transfer heat using heat-conducting gas is rushed, and the present invention is then more
Consider to orientation the transmitting of heat, heat transfer is more intuitive, conveniently, is truly realized the high thermal conductivity of LED filament lamp, together
When also solve cause thermal damage and light decay because of LED chip caused by radiating not in time, the reduction of the luminous flux avoided also extends
The service life of filament lamp.
The above is only used to illustrate the technical scheme of the present invention and not to limit it, and those of ordinary skill in the art are to this hair
The other modifications or equivalent replacement that bright technical solution is made, as long as it does not depart from the spirit and scope of the technical scheme of the present invention,
It is intended to be within the scope of the claims of the invention.
Claims (6)
1. a kind of LED filament lamp of high thermal conductivity, it is characterised in that it includes bulb socket, power panel, connector, hollow heat dissipation
Column, several filament light sources plate, radiating permanent seat, lampshades;Lampshade bottom end is connect with bulb socket;Power panel, connector, it is hollow dissipate
Plume, several filament light sources plates, radiating permanent seat are each provided in the space that bulb socket and lampshade are formed;The top of lampshade is equipped with
Concave circular hole;Radiating permanent seat is equipped in concave circular hole;Radiating permanent seat is connect with the top of hollow thermal column;Hollow thermal column
Outer wall on several ring quasi arrays arrangement strip card slot;Filament light sources plate is equipped in strip card slot;Two neighboring length
Outside arcuation protrusion is equipped between strip-shaped clamp groove;The bottom end of hollow thermal column is socketed in connector;Connector is located at power panel
Top;Power panel is located in bulb socket.
2. a kind of LED filament lamp of high thermal conductivity according to claim 1, it is characterised in that the filament light sources plate
It is equipped with substrate;The substrate is rectangular substrate;The material of substrate is ceramic wafer or superconduction aluminum substrate;The outer surface of substrate
On be successively arranged packaging LED chips region, circuit region and welding resistance pad;Circuit region is equipped with circuit layer;Welding resistance pad with
Circuit layer electrical connection;Packaging LED chips region is equipped with LED chip, bonding lead, fluorescent glue;LED chip passes through bonding lead
It is electrically connected with circuit layer;Fluorescent glue is completely covered on LED chip, on bonding lead.
3. a kind of LED filament lamp of high thermal conductivity according to claim 1, it is characterised in that the connector is circle
Cylindrical connector;The middle part of connector is equipped with the installation through-hole being cooperatively connected with the bottom end of hollow thermal column;Installation through-hole it is interior
Wall is equipped with the small card slot for assembling lamp mercerising source plate corresponding with strip card slot;The side wall of small card slot is equipped with scalable
Formula metal contact jaw;Extension type metal contact jaw is electrically connected by conducting wire with power panel.
4. a kind of LED filament lamp of high thermal conductivity according to claim 1, it is characterised in that the hollow thermal column
For hollow round table structure;The material of hollow thermal column is aluminium or moulded heat-conductive insulated plastics material;Arc on hollow heat dissipation column outer wall
Film layer is enclosed with by the technology mode of plating, spraying plating or sputtering on the outer surface of shape protrusion.
5. a kind of LED filament lamp of high thermal conductivity according to claim 1, it is characterised in that the lampshade is transparent
Or translucent hemisphere bubble shell structure excessively;The material of lampshade is plastics or glass material.
6. a kind of LED filament lamp of high thermal conductivity according to claim 1, it is characterised in that the radiating permanent seat
For transparent or semitransparent convex cylindrical structure;Several heat release holes are equipped on the top of radiating permanent seat and lower end peripheral wall.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710877365.6A CN109578822A (en) | 2017-09-26 | 2017-09-26 | A kind of LED filament lamp of high thermal conductivity |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710877365.6A CN109578822A (en) | 2017-09-26 | 2017-09-26 | A kind of LED filament lamp of high thermal conductivity |
Publications (1)
Publication Number | Publication Date |
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CN109578822A true CN109578822A (en) | 2019-04-05 |
Family
ID=65912339
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201710877365.6A Pending CN109578822A (en) | 2017-09-26 | 2017-09-26 | A kind of LED filament lamp of high thermal conductivity |
Country Status (1)
Country | Link |
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CN (1) | CN109578822A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109595482A (en) * | 2017-09-30 | 2019-04-09 | 朗德万斯公司 | LED light |
EP4105545A4 (en) * | 2020-02-11 | 2023-07-26 | Hangzhou SIJUNSI technology Co., Ltd. | Omni-directional light-emitting light cover and light bulb having same |
-
2017
- 2017-09-26 CN CN201710877365.6A patent/CN109578822A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109595482A (en) * | 2017-09-30 | 2019-04-09 | 朗德万斯公司 | LED light |
EP4105545A4 (en) * | 2020-02-11 | 2023-07-26 | Hangzhou SIJUNSI technology Co., Ltd. | Omni-directional light-emitting light cover and light bulb having same |
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