CN103438374B - The LEDbulb lamp of 360 degree of luminescences - Google Patents
The LEDbulb lamp of 360 degree of luminescences Download PDFInfo
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- CN103438374B CN103438374B CN201310380402.4A CN201310380402A CN103438374B CN 103438374 B CN103438374 B CN 103438374B CN 201310380402 A CN201310380402 A CN 201310380402A CN 103438374 B CN103438374 B CN 103438374B
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Abstract
The invention provides a kind of LEDbulb lamp of 360 degree of luminescences, comprising: a spherical housing and the pedestal be attached thereto; One heat conduction supporting column, it is arranged on pedestal; Multiple transparent ceramic base, it is arranged in heat conduction supporting column, and multiple transparent ceramic base arranges multiple LED die respectively, and described heat conduction supporting column and transparent ceramic base are vertical setting; One drive circuit, it is positioned at pedestal, and described LED die is electrically connected with drive circuit.The present invention can improve the light extraction efficiency of whole lamp, has the advantage that cost is low and the life-span is long.
Description
Technical field
The present invention relates to a kind of light emitting diode construction.More specifically, the present invention relates to a kind of LEDbulb lamp of 360 degree of luminescences of conveniently replaced light source.
Background technology
Light emitting diode (LED) has life-span length, energy-saving and environmental protection, coloury advantage, therefore, along with the development of the technology such as extension, chip, encapsulation, the further raising of luminous efficiency, LED by progressively for illumination, display, medical treatment etc. every field.At present, most of LED is only luminous in certain spatial angle range, therefore, forms speculum, and LED chip be arranged on light tight and show to be coated with on the pedestal in reflecting layer in chip fabrication processes in the opposite side of LED chip light-emitting area.Although, the reflectivity of current speculum can accomplish more than 90%, but consider that the reflectivity in the actual reflecting layer of cost is mostly lower than 80%, the light that LED sends is sponged much by reflecting layer itself, chip, Frame lamp assembly after repeatedly launching, and greatly reduces the luminous efficiency of LED lamp.
In addition, in full solid angle alight tool form, such as, in bulb lamp, wish that LED light source is luminous in the spatial angle range of 360 degree as tungsten filament.Therefore, prior art provides some " accurate full angle " emitting led light fixtures utilizing one side light extracting LED chip to form, as accompanying drawing 1.LEDbulb lamp 1 as shown in Figure 1, it comprises lamp screw socket 11, pedestal 12 and lampshade 13, center fluorescent tube 14 is arranged multiple LED board 15, center fluorescent tube 14 arranges the groove 141 of multiple embedding LED board 15, center fluorescent tube 14 and central seat 16 combine for dispelling the heat, and arrange circuit board 17 in pedestal 12.Because the LED on LED board 15 is one direction luminescence, luminescence in 360 degree of spatial angle range could be realized so need many LED to be outwards attached on center fluorescent tube 14, this structure process is complicated, the LED needed is many, groove 141 edge also can not be ignored the absorption of light and restriction, and LED board 15 cannot be changed, once part LED board 15 does not work, the brightness of whole LEDbulb lamp on different lighting angle is different, affects attractive in appearance; In addition, once LED lost efficacy, must must change whole bulb lamp thus cause waste.
In order to solve the problem changing LED board, US Patent No. 2007/0159828A1 proposes the LED board adopting plug type, as shown in Figure 2.This LEDbulb lamp comprises lampshade 100, pedestal 110 and LED module 20.LED module 20 comprises multiple LED board 21 and triangular prism shaped thermal column 22, by slot 221 and radiating fin 222 on thermal column 22, the LED board 21 with LED211 inserts slot 221 and is fixed on thermal column 22, thermal column 22 and pedestal 110 are connected and fixed by the through hole 223 of thermal column 22 central authorities and the through hole 111 of pedestal 110 central authorities by heat-removal bar 23, pedestal 110 outer wall forms screw thread 112 and is connected with blanket socket.The replacing problem of LED board is solved in US Patent No. 2007/0159828A1, waste and convenient part can be avoided to change, but the edge of slot 221 and radiating fin can increase greatly to the absorption of light, and conveniently plug, triangular prism shaped thermal column major part area cannot arrange LED board, causing bulb lamp different angles luminous intensity skewness, is not 360 degree of luminescences truly.
Summary of the invention
The object of the invention is to, the LEDbulb lamp of 360 degree of luminescences is provided, the light extraction efficiency of whole lamp can be improved, there is the advantage that cost is low and the life-span is long.
The invention provides a kind of LEDbulb lamp of 360 degree of luminescences, comprising:
One spherical housing and the pedestal be attached thereto;
One heat conduction supporting column, it is arranged on pedestal;
Multiple transparent ceramic base, it is arranged in heat conduction supporting column, and multiple transparent ceramic base arranges multiple LED die respectively, and described heat conduction supporting column and transparent ceramic base are vertical setting;
One drive circuit, it is positioned at pedestal, and described LED die is electrically connected with drive circuit.
The invention has the beneficial effects as follows: the LEDbulb lamp providing a kind of truly 360 degree of luminescences, it is along the optical power detection of all angles, and the absorption of light in bulb lamp inside is very little, can improve the light extraction efficiency of whole lamp; In addition, LED board can plug replacing simply, reduces replacement cost, avoids waste.Another advantage of the present invention is, adopt sandwich construction, heat is too concentrated on single substrate can to avoid LED, contributes to the life-span of improving whole light fixture.
Accompanying drawing explanation
For making the object, technical solutions and advantages of the present invention clearly understand, ice-cold below in conjunction with concrete enforcement, and with reference to accompanying drawing, the present invention is described in more detail, wherein:
Fig. 1 is the bulb lamp schematic diagram of 360 degree of luminescences in prior art;
Fig. 2 is the bulb lamp schematic diagram of 360 degree of luminescences of replaceable light source in prior art;
Fig. 3 is the structural representation of 360 degree of luminous bulb lamps of replaceable light source of the present invention;
Fig. 4 is another structural representation of replaceable light source of the present invention;
Fig. 5 is the heat conduction supporting column structural representation of bulb lamp of the present invention;
Fig. 6 A and Fig. 6 B is transparent ceramic base of the present invention arrangement top view;
Fig. 7 A and Fig. 7 B is the transparent ceramic base top view with heat radiation thin-film material of the present invention.
Detailed description of the invention
Refer to shown in Fig. 3, be the LEDbulb lamp of a kind of 360 degree of luminescences provided by the invention, comprise:
One spherical housing 310 and the pedestal 320 be attached thereto;
One heat conduction supporting column 330, it is arranged on pedestal 320; Described heat conduction supporting column 330 can be hollow cylinder, laterally can have the multiple grooves for dispelling the heat in heat conduction supporting column 330 outside wall surface, and this heat conduction supporting column 330 is coated with heat radiation thin-film material.The sidewall of described heat conduction supporting column 330 can be provided with lead hole in the position of aliging with described transparent ceramic base 340.
Transparent ceramic base 340, it is arranged in heat conduction supporting column 330, transparent ceramic base 340 is arranged respectively multiple LED die 301, and described heat conduction supporting column 330 and transparent ceramic base 340 are vertical setting; Described transparent ceramic base 340 is for disc-shaped or centrally become the multiple support arm structure of radial distribution at grade, on the surface of this transparent ceramic base 340, heat radiation thin-film material is set, this heat radiation thin-film material contacts with heat conduction supporting column 330, and the thin-film material that wherein dispels the heat can be graphite paper or transparent grapheme material.The material of described transparent ceramic base 340 is yttrium-aluminium-garnet, aluminium nitride, aluminium oxide, yittrium oxide, beryllium oxide, magnesia, GaAs, zinc sulphide or calcirm-fluoride.When described transparent ceramic base 340 is yttrium-aluminium-garnet, it is doped with Ce
3+.When the quantity of described transparent ceramic base 340 is more than two, the diameter of its each transparent ceramic base 340 is identical or not identical.
One drive circuit 360, it is positioned at pedestal 320, and described LED die 301 is electrically connected with drive circuit.Described LED die 301 can be 360 degree of luminescence chips, and described LED die 301 can be arranged in the middle of two pieces of transparent ceramic base 340.
Below in conjunction with Fig. 3 to Fig. 7 and embodiment, the invention will be further described.
According to the first embodiment of the present invention, as shown in Figure 3, described bulb lamp 300 LED chip 301 that comprises spherical housing 310, pedestal 320, spiral shell shape socket 380, heat conduction supporting column 330, transparent ceramic base 340 and be arranged in transparent ceramic base.Wherein, described spherical housing 310 is fixed on pedestal 320 with disconnectable form, such as adopt screw thread and screw socket combine fixing (as between Fig. 1 ball bubble shell 100 and pedestal 110 in conjunction with screw thread and screw socket), or adopt elastic spring engaging, or adopt draw-in groove and protruding rotation to be fixed.Heat conduction supporting column 330 in spherical housing 310 arranges transparent ceramic base 340, heat conduction supporting column 330 is fixed on the pedestal 320 of bulb lamp 300 bottom in disconnectable mode equally, screw thread can be adopted to engage with screw socket, elastic spring or draw-in groove and bar rotate snap fit and fix, thus make heat conduction supporting column 330 and pedestal 320 close contact; Meanwhile, heat conduction supporting column 330 can take off replacing from pedestal 320.Transparent ceramic base 340 is substantially vertically set with heat conduction supporting column 330, and LED die 301 is set in transparent ceramic base, P, the N electrode of LED die 301 are interconnected by the wiring (not shown) in transparent ceramic base 340 and are electrically connected with drive circuit in pedestal 360, to realize power supply and the luminescence of LED die 301.
Wherein spherical housing 310 can adopt transparent glass cover, and also can adopt and prevent the frosted of dazzle or the white lampshade of milk, shape can carry out Art Design as required, such as, be designed to candle light shape, hemispherical etc.
The material that pedestal 320 adopts thermal conductivity high, as aluminium, pottery etc., perforate 321 in pedestal 320, in perforate 321, screw thread (not shown) can be set, or adopt the snap fastener coordinated with heat conduction supporting column 330, such as one or more draw-in groove (not shown), is convenient to heat conduction supporting column 330 and combines closely with pedestal 320, improve mechanical strength and improve heat dispersion.Arrange drive circuit assembly 360 in pedestal 320, the outside of pedestal 320 adopts insulating materials, to meet Electrical Safety standard-required.When adopting ceramic material to form pedestal 320, metal contact pad (not shown) can be set at the sidewall of perforate 321, as structure and the conductive channel of fixing heat conduction supporting column 320.When the LED die 301 that heat conduction supporting column 330 supports break down need to change time, take off heat conduction supporting column 330 by plugging or screwing and change, lamp outer casing and drive circuit can be avoided to change waste.
Heat conduction supporting column 330 arranges with perforate 321 junction the screw thread 332 coordinated with perforate 321, or snap fastener is set, as elastic bumps, coordinate with the draw-in groove in perforate and heat conduction supporting column 330 is locked on pedestal 320, and have good thermo-contact to each other.Heat conduction supporting column 330 can adopt the material of good heat dispersion performance, such as the metal or alloy such as copper, aluminium, can form high reflection layer at electroplating surface, avoids it to the absorption of the light that LED sends.
According to a second embodiment of the present invention, heat conduction supporting column 330 can be multistage cover connected components further, and each socket element can be outwarded winding, and can ensure larger heat radiation contact area, is also convenient to change transparent ceramic base 340.Such as, multistage cover connected components comprises hollow heat conduction supporting column 330 and cylindric nut 350, as shown in Figure 4.
The shape of heat conduction supporting column 330 can be various shape, as cylindrical, prismatic etc.; Heat conduction supporting column 330 such as Fig. 5 adopts hollow cylinder structure, wherein can pass wire, and the LED die 301 be convenient in transparent ceramic base 340 is connected with the drive circuit 360 in pedestal 320; Outer surface forms the threaded region 334 of multiple tool, fixes the nut 350 of transparent ceramic base 340 for spinner; On heat conduction supporting column 330 sidewall of hollow cylinder structure, the position of roughly aliging with transparent ceramic base 340 surface is arranged the through hole 333 leading to boring region, for the LED die 301 in the transparent ceramic base 340 of correspondence being electrically connected with the drive circuit 360 in pedestal 320 by the hollow area 336 in this through hole 333 and heat conduction supporting column 330.
Transparent ceramic base 340 adopts oxide or Non-oxide Transparent Ceramics, oxidic transparent pottery comprises aluminium oxide, YAG (yttrium-aluminium-garnet), yittrium oxide, beryllium oxide, magnesia etc., and non-oxide ceramics comprises aluminium nitride, GaAs, zinc sulphide, calcirm-fluoride etc.Described transparent ceramic base 340 also can be mix Ce
3+yAG pottery.When transparent ceramic base 340 mixes Ce
3+yAG pottery time, LED die can be clipped in the middle of two transparent ceramic base 340, transparent ceramic base 340 is simultaneously as luminescent conversion layer.
Through hole (not shown) is formed centrally in transparent ceramic base 340, for passing heat conduction supporting column 330, transparent ceramic base 340 connects up and welds LED die 301, LED die 301 can directly upside-down mounting or eutectic be welded on the metal pad (not shown) in transparent ceramic base 340.Longitudinally multiple transparent ceramic base 340 can be connected on conductive pillar 330; The size of multiple transparent ceramic base 340 can be different, also can be identical, can be the symmetric shapes such as circle, ellipse, rectangle, spindle and bow tie; When adopting ellipse, rectangle, spindle, bow tie, the longitudinal arrangement of multiple transparent ceramic base 340 can interlock certain angle, such as, when employing 3 pieces of transparent ceramic base 340, differ 60 degree each other, as shown in Figure 6A, thus make the luminescence of bulb lamp more even in all angles.The circular non-opaque ceramic substrate 340 of preferred employing different-diameter, as shown in Figure 6B, LED die 301 is evenly arranged on the periphery of circular non-opaque ceramic substrate 340, and can be arranged on the upper surface of transparent ceramic base 340, or is arranged on upper surface and lower surface simultaneously.
LED die 301 can adopt small-power chip, is input as below 0.1W, and power or more than 1W high-power chip in also can adopting, can adopt high pressure or AC LED chip, and high voltage LED chip and AC LED chip refer to high pressure and the AC LED of single-chip.LED die 301 adopts 360 degree of luminescence chips, and namely six faces of LED die can bright dipping, and specifically, do not arrange back reflector for packed LED chip, for flip LED chips, the substrate of its upside-down mounting should be printing opacity.
According to the third embodiment of the invention, be delivered to pedestal 320 in order to the heat that LED die 301 in transparent ceramic base 340 produced by heat conduction supporting column 330 and distribute, the heat radiation thin-film material 380 that laterally (along film bearing of trend) heat conductivility is good can be set between the nut 350 of fixing transparent ceramic base 340 and transparent ceramic base 340, the heatsink transverse thin-film material of such as carbon containing, as graphite paper or graphene film, as shown in Figure 4.When the thin-film material 380 that dispels the heat adopts transparent graphene film 386, graphene film 386 is arranged on the middle section of transparent ceramic base 340 around heat conduction supporting column 330, graphene film 386 and transparent ceramic base 340 shape can be consistent or comply with the shape of transparent ceramic base 340, edge close to LED die 301, as shown in Figure 7 B.So being convenient to the heat lateral transport that LED die 301 produced on heat conduction supporting column 330 distributes.When adopting graphite paper 381, graphite paper 381 part be arranged between nut 350 and transparent ceramic base 340 is arranged to around heat conduction supporting column 330 and disc of fitting surperficial with heat conduction supporting column 330, preferably in disc graphite paper 381 edge conjunction extension 382, this extension 382 is stretched to and close to LED die 301, extension 382 width is set to below 1mm, avoids it to be in the light as far as possible.As shown in Figure 7 A.Preferably, the surface of graphite paper 381 can cover Ag or A1 and other highly reflective materials, to reduce the absorption of graphite paper 381 to light.In addition, the heat radiation thin-film material electric conductivity of carbon containing is good, guarantee the wiring electric insulation on itself and transparent ceramic base 340 surface.
The above; be only the detailed description of the invention in the present invention, but protection scope of the present invention is not limited thereto, any people being familiar with this technology is in the technical scope disclosed by the present invention; the conversion that can expect easily or replacement, all should be encompassed in of the present invention comprising within scope.Therefore, protection scope of the present invention should be as the criterion with the protection domain of claims.
Claims (7)
1. a LEDbulb lamp for 360 degree of luminescences, comprising:
One spherical housing and the pedestal be attached thereto;
One heat conduction supporting column, it is arranged on pedestal;
Multiple transparent ceramic base, it is arranged in heat conduction supporting column, multiple transparent ceramic base arranges multiple LED die respectively, described heat conduction supporting column and transparent ceramic base are vertical setting, described transparent ceramic base is disc-shaped or centrally becomes the multiple support arm structure of radial distribution at grade, arrange heat radiation thin-film material on the surface of this transparent ceramic base, this heat radiation thin-film material contacts with heat conduction supporting column;
One drive circuit, it is positioned at pedestal, and described LED die is electrically connected with drive circuit;
Wherein said heat conduction supporting column is hollow cylinder, and laterally have the multiple grooves for dispelling the heat in heat conduction supporting column outside wall surface, this heat conduction supporting column is coated with heat radiation thin-film material;
Described multiple LED die is 360 degree of luminescence chips;
Described pedestal adopts the snap fastener coordinated with heat conduction supporting column, takes off heat conduction supporting column by plugging or screwing and changes.
2. the LEDbulb lamp of 360 degree of luminescences as claimed in claim 1, the position that the sidewall of wherein said heat conduction supporting column aligns with described transparent ceramic base is provided with lead hole.
3. the LEDbulb lamp of 360 degree of luminescences as claimed in claim 1, the thin-film material that wherein dispels the heat is graphite paper or transparent grapheme material.
4. the LEDbulb lamp of 360 degree of luminescences as claimed in claim 1, the material of wherein said transparent ceramic base is yttrium-aluminium-garnet, aluminium nitride, aluminium oxide, yittrium oxide, beryllium oxide, magnesia, GaAs, zinc sulphide or calcirm-fluoride.
5. the LEDbulb lamp of 360 degree of luminescences as claimed in claim 4, when wherein said transparent ceramic base is yttrium-aluminium-garnet, it is doped with Ce
3+.
6. the LEDbulb lamp of 360 degree of luminescences as claimed in claim 1, wherein said LED die is arranged in the middle of two pieces of transparent ceramic base.
7. the LEDbulb lamp of 360 degree of luminescences as claimed in claim 1, the diameter of wherein said multiple transparent ceramic base is identical or not identical.
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| CN201310380402.4A CN103438374B (en) | 2013-08-28 | 2013-08-28 | The LEDbulb lamp of 360 degree of luminescences |
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| CN201310380402.4A CN103438374B (en) | 2013-08-28 | 2013-08-28 | The LEDbulb lamp of 360 degree of luminescences |
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| CN103438374B true CN103438374B (en) | 2015-12-23 |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103824929B (en) * | 2014-03-24 | 2016-09-21 | 武汉和光照明科技有限公司 | Make the formula of light-transmitting substrate, light-transmitting substrate, LED light module and lamp |
| CN104613351A (en) * | 2015-02-14 | 2015-05-13 | 吴鼎鼎 | LED light-emitting device |
| CN107388068B (en) * | 2017-09-01 | 2024-02-23 | 葛铁汉 | LED lamp body |
| DE102019129080B4 (en) * | 2019-10-28 | 2024-03-28 | Dennis Ritzerfeld | Light guide device and set |
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| CN201944575U (en) * | 2010-11-17 | 2011-08-24 | 浙江雄邦节能产品有限公司 | Ceramic substrate LED light source |
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| CN201706335U (en) * | 2010-05-28 | 2011-01-12 | 陈烱勋 | Light emitting diode streetlamp |
| CN102454903A (en) * | 2010-10-27 | 2012-05-16 | 林伟盛 | LED lighting bulb |
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