CN202660320U - Light-emitting diode (LED) light fitting structure with heat flow channel - Google Patents
Light-emitting diode (LED) light fitting structure with heat flow channel Download PDFInfo
- Publication number
- CN202660320U CN202660320U CN2012202875926U CN201220287592U CN202660320U CN 202660320 U CN202660320 U CN 202660320U CN 2012202875926 U CN2012202875926 U CN 2012202875926U CN 201220287592 U CN201220287592 U CN 201220287592U CN 202660320 U CN202660320 U CN 202660320U
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- China
- Prior art keywords
- fin
- fitting structure
- heat passage
- heat
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003292 glue Substances 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 7
- 230000004888 barrier function Effects 0.000 claims description 3
- 239000004568 cement Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims description 2
- 239000011810 insulating material Substances 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 description 4
- 230000000149 penetrating effect Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 239000002360 explosive Substances 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
Images
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The utility model discloses a light-emitting diode (LED) light fitting structure with a heat flow channel. The LED light fitting structure is characterized by comprising a plurality of radiating fins, wherein the radiating fins have thin-type sheet shapes, the back surfaces of the radiating fins are opposite to each other, and the radiating fins are rotatablely distributed around a center shaft to form a through heat flow channel; the inner wall of the heat flow channel is communicated with a free space; the length direction of the radiating fins corresponds to the center shaft, and each radiating fin is divided into an upper section and a lower section along the length direction; and an LED chip which is fixed through a chip-on-board (COB) process is arranged on the front surface of each upper section, and all the lower sections are fixed on a permanent seat. When the LED chips are in operation, the heat generated by the LED chips does not need additional multi-stage heat transfer guide components such as a support, auxiliary heat-conducting glue and the like, and is directly conducted to the upper sections of the radiating fins; and the lower sections are far away from the heat to ensure that a channel of which the inner wall directly contacts with the free space and the two ends have temperature difference is formed in the heat flow channel, so that the heat convection efficiency of the radiating fins and the back sides thereof is brought into full play, and finally the radiating environment of an LED light source is greatly improved, especially when the volume of the entire device is small.
Description
Technical field
The utility model relates to a kind of LED fitting structure with heat passage.
Background technology
Existing led light source is used for illumination, and the extra heat that produces is processed in the time of must be to its work, to such an extent as to the junction temperature of led light source is controlled at below the safe temperature effectively, safeguards life-span and light output that it is specified.Usually, such treatment step is exactly the design of whole system radiator portion, utilizes fin and makes it to form specific structure, and the heat in the led light source can be come out timely and effectively.
When the volume of whole light fixture is larger, be not difficult to adopt to have large-area thermal component, yet when smaller size smaller, the effective area of thermal component is strictly limited, make the effective surface area of itself and air generation thermal convection current limited, its heat dissipation environment is more abominable.Common way, but all be that packaged led light source is fixed on the substrate of heat conduction, again substrate is fixed in the radiator of exposure, to such an extent as to from the led light source to the external space, have heat conduction via and convective region.But these class methods often its heat conduction path are long, can not give full play to the efficient of spreader surface thermal convection current, make heat dispersion limited.
The utility model content
Longer for existing LED lamp cooling structure heat conduction path, can not make the restriction of the abundant thermal convection current of spreader surface, the utility model proposes a kind of LED fitting structure with heat passage, its technical scheme is as follows:
With the LED fitting structure of heat passage, it comprises the multi-disc fin, and described fin is thin type sheet, and its reverse side distributes around central shaft revolution in opposite directions and forms a heat passage that connects, and the inwall of described heat passage is communicated with free space; The length direction of described fin is suitable with described central shaft, is divided into epimere and hypomere by its length direction; Its epimere front arranges the fixing led chip of COB technique, and its hypomere is fixed to one another in a holder.
Preferred person as the technical program can be achieved as follows:
In one preferred embodiment, described led chip adopts insulating cement to be fixed in described fin; Have affixed transit line on the described fin, described transit line one end is connected in described led chip, and the other end is connected in the lead-in wire from described fin outside.On this basis, in the preferred embodiment, described fin is conductive material, and described transit line is fixed in described fin by an insulating barrier.In another preferred embodiment, described radiator is insulating materials, and described transit line directly adheres to and is fixed in described fin.
In one preferred embodiment, described holder with the bottom with standard lamp head; Its front of the epimere of described fin all has cell-shell and covers; All having opening on described cell-shell and the holder is communicated with described heat passage two ends respectively.
In one preferred embodiment, described fin has three, and it is with respect to described central shaft Rotational Symmetry.
In one preferred embodiment, its front of the epimere of described fin has the high reflectance surface.
In one preferred embodiment, described fin epimere front has a pasting area on plane; The fixing described led chip of array distribution in this pasting area, described led chip top covers fluorescent material, and described fluorescent material periphery have its scope of restriction enclose frame glue.
In one preferred embodiment, the hypomere of described fin is fixed in the side of described holder, and the front of this hypomere has the part that exposes in the free space.
The beneficial effect that the utility model brings is:
1. when led chip is worked, the heat of its generation does not need the Multi-stage heat conducting parts such as extra support, auxiliary heat conduction glue, but direct heat conducts to the epimere of fin, and its hypomere is away from must be, to such an extent as to heat passage forms an inwall and directly contacts the passage that free space, two ends have the temperature difference, give full play to the thermal convection current efficient of its reverse side of fin, finally greatly improved the heat dissipation environment of led light source, particularly like this when whole device is set to smaller size smaller.
2. the structure that surrounds of three fin can illuminate with minimum fin quantity whole spheroid space.
3. the fixing side of holder of the hypomere of fin 10, the front of this hypomere has the part that exposes in the free space, makes the larger to flow area of fin.
Description of drawings
The utility model is described in further detail below in conjunction with accompanying drawing embodiment:
Fig. 1 is the schematic perspective view of the utility model embodiment one;
Fig. 2 is the explosive view of the utility model embodiment two;
Fig. 3 is the front view of a fin 10 embodiment illustrated in fig. 2;
Fig. 4 is one of them cross-sectional view of fin shown in Figure 3;
Heat flow path signal when Fig. 5 is front view embodiment illustrated in fig. 2 and work;
Heat flow path schematic diagram when Fig. 6 is the utility model embodiment three front views and work.
The specific embodiment
Embodiment one:
As shown in Figure 1, the schematic perspective view of the utility model embodiment one;
This is with the LED fitting structure of heat passage, and it comprises multi-disc fin 10, and fin 10 is rectangular thin type sheet, is divided into epimere and hypomere by its length direction; Its epimere 11 fronts are provided with led chip 51, and this led chip 51 adopts COB technique to be fixed in epimere 11, and the hypomere of fin 10 is plugged in the holder 20 with mesopore annular.
The reverse side of fin 10 toward each other.And all center on central shaft revolution and distribute, to such an extent as to form a heat passage 29 that connects, and the length direction of fin 10 is suitable with central shaft, although not necessarily strictly parallel, it is penetrating that its condition is that heat passage 29 can keep.As seen, when led chip 51 work, the heat of its generation does not need extra support, the Multi-stage heat conducting parts such as auxiliary heat conduction glue, but the direction of heat flow shown in Fig. 4 thick-line arrow, direct heat conducts to the epimere 11 of fin 10, and its hypomere is away from must be, to such an extent as to heat passage 29 forms an inwall and directly contacts free space, two ends have the passage of the temperature difference, so, if present embodiment one is placed according to attitude shown in Figure 1, then air flow is among the figure shown in the dotted arrow, can form lasting hot-fluid, thereby give full play to the thermal convection current efficient of fin 10 its reverse side, finally greatly improved the heat dissipation environment of led light source 51, particularly like this when whole device is set to smaller size smaller.
Embodiment two:
Fig. 2 is the explosive view of the utility model embodiment two; This embodiment is the bulb lamp form of a standard specification.Fin 10 has three, and it is with respect to the central shaft Rotational Symmetry of this bulb lamp.Holder 20 lower ends are connected with a standard lamp head 30.Above holder 20, cell-shell 40 of snapping, especially, cell-shell 40 tops have upper shed 41, and corresponding holder 20 sides have under shed 21, and are mutually penetrating 21 from upper shed 41 under shed, and are communicated with free space.
As shown in Figure 3, be the front view of a fin 10 of present embodiment; Fig. 4 is one of them cross-sectional view of fin shown in Figure 3; Fin 10 details of present embodiment two are described in conjunction with this two figure:
Fin 10 epimere central authorities have a pasting area 50; The led chip 51 of these pasting area 50 interior fixedly array distribution, led chip 51 is designed to suitable topological structure, mutually with line consist of corresponding string in parallel or combination; And led chip 51 tops have covered fluorescent material 52, and this fluorescent material 52 is not pure person, is the composition that has mixed moulding glue, such as silica gel.In the periphery of fluorescent material 52 global shapes, have limit its scope enclose frame glue 53.Also have transit line 54 near the pasting area 50, be used for making the led chip 51 on the fin 10 to introduce the power supply supply, and can mount and dismount easily.Because fin 10 is aluminium, so transit line 54 need to be fixed in epimere 11 by an insulating barrier 55.
So the front of each epimere 11 has a complete LED module, the white light for illumination can occur; The structure that three fin 10 surround can illuminate whole spheroid space with minimum fin 10 quantity.
Heat flow path signal when being front view embodiment illustrated in fig. 2 and work such as Fig. 5; Cell-shell 40 has covered all fin 10 its epimeres 11, the upper shed 41 at its top is to keeping penetrating between the under shed 21 of holder 20, and be communicated in free space, when whole light fixture is placed according to angle shown in Figure 5 or 180 °, under Action of Gravity Field, air-flow can flow along the dashed trace among the figure, consists of eucyclic heat dissipation environment.Embodiment three:
As Fig. 6 be originally show the embodiment front view and when work the heat flow path schematic diagram, be explained in conjunction with this figure:
Present embodiment three still is the form of a bulb lamp, compares with embodiment two, and three rotational symmetric fin are still arranged, and the holder of fixing cooling fins; The heat passage cross section that its shape of upper shed that different is on the cell-shell 40 and fin surround matches, and under shed 21 belows also have larger air intake, the volume of air-flow in the unit interval by upper shed 41, under shed 21 is larger, and its whole lamp heat dispersion is better.In the present embodiment, the hypomere 12 of fin is the side of holder 20 fixedly, and the front of this hypomere 12 has the part that exposes in the free space, makes the larger to flow area of fin 21.
For obtaining good illuminating effect, in the present embodiment, its front of the epimere of fin has the high reflectance surface, and in conjunction with the distribution of led chip, makes it more even in spatial distribution, meets the lighting requirement of bulb lamp.
The above, it only is the utility model preferred embodiment, so can not limit according to this scope that the utility model is implemented, the equivalence of namely doing according to the utility model claim and description changes and modifies, and all should still belong in the scope that the utility model contains.
Claims (9)
1. with the LED fitting structure of heat passage, it is characterized in that: it comprises the multi-disc fin, described fin is thin type sheet, and its reverse side distributes around central shaft revolution in opposite directions and forms a heat passage that connects, and the inwall of described heat passage is communicated with free space; The length direction of described fin is suitable with described central shaft, is divided into epimere and hypomere by its length direction; Its epimere front arranges the fixing led chip of COB technique, and its hypomere is fixed to one another in a holder.
2. described LED fitting structure with heat passage according to claim 1, it is characterized in that: described led chip adopts insulating cement to be fixed in described fin; Have affixed transit line on the described fin, described transit line one end is connected in described led chip, and the other end is connected in the lead-in wire from described fin outside.
3. described LED fitting structure with heat passage according to claim 2, it is characterized in that: described fin is conductive material, and described transit line is fixed in described fin by an insulating barrier.
4. described LED fitting structure with heat passage according to claim 2, it is characterized in that: described fin is insulating materials, described transit line directly adheres to and is fixed in described fin.
5. described LED fitting structure with heat passage according to claim 1 is characterized in that: described holder with the bottom with standard lamp head; Its front of the epimere of described fin all has cell-shell and covers; All having opening on described cell-shell and the holder is communicated with described heat passage two ends respectively.
6. described LED fitting structure with heat passage according to claim 1, it is characterized in that: described fin has three, and it is with respect to described central shaft Rotational Symmetry.
7. described LED fitting structure with heat passage according to claim 1, it is characterized in that: its front of the epimere of described fin has the high reflectance surface.
8. described LED fitting structure with heat passage according to claim 1, it is characterized in that: described fin epimere front has a pasting area on plane; The fixing described led chip of array distribution in this pasting area, described led chip top covers fluorescent material, and described fluorescent material periphery have its scope of restriction enclose frame glue.
9. described LED fitting structure with heat passage according to claim 1, it is characterized in that: the hypomere of described fin is fixed in the side of described holder, and the front of this hypomere has the part that exposes in the free space.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2012202875926U CN202660320U (en) | 2012-06-15 | 2012-06-15 | Light-emitting diode (LED) light fitting structure with heat flow channel |
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CN2012202875926U CN202660320U (en) | 2012-06-15 | 2012-06-15 | Light-emitting diode (LED) light fitting structure with heat flow channel |
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CN202660320U true CN202660320U (en) | 2013-01-09 |
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CN2012202875926U Expired - Fee Related CN202660320U (en) | 2012-06-15 | 2012-06-15 | Light-emitting diode (LED) light fitting structure with heat flow channel |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103225794A (en) * | 2013-05-16 | 2013-07-31 | 浙江奥司朗照明电器有限公司 | Heat radiating shell of LED (Light Emitting Diode) lamp |
-
2012
- 2012-06-15 CN CN2012202875926U patent/CN202660320U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103225794A (en) * | 2013-05-16 | 2013-07-31 | 浙江奥司朗照明电器有限公司 | Heat radiating shell of LED (Light Emitting Diode) lamp |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130109 Termination date: 20180615 |
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CF01 | Termination of patent right due to non-payment of annual fee |