M412301 五、新型說明： 【新型所屬之技術領域】 本案係屬於照明裝置的領域，特別是關於一種 熱電分離且易組裝之模組化LED光源結構。 【先前技術】 按 由於發光二極體（Light Emitting Diode，LED)具備低耗電、長壽命、低廢熱及高亮度 等優近年來，使用LED發光源作為照明之燈具 種類也越來越多，經常可見其用於如：路燈、室内 照明燈具、檯燈甚至是手電筒等照明燈具，均係利 用一發光晶片（或稱作LED晶粒）經電流導通後而 ^出冗光，該發光晶片發亮時會有升溫發熱的問 題特別疋一些高功率的發光晶片在使用時還會發 =呵溫，致使照明燈具之控制電路板過熱而快速損 壞’而使得壽命大幅減損；況且，該發光晶片在溫 度過高的情況下，還發生光衰的現象進而影響照: ▲ 4瑚偬用LED的照明燈具都係借助特別嗖 °十的散熱模組，以快速驅散使用時的熱量進而延長 使用壽命及維持照明效果，該種散熱模組係採用= 扇強制對流作主動式散熱，或是利用㈣ 用風 被動"V私為從 …、·"片進行 曰式散…、荨方式’而可利用空氣流動強制 置。你困欣熱 用風扇強制對流的散熱模組須外接 加電力缸浐曰 设书力而增 耗扣，疋故，一般最常見的散熱模組還是採 3 $散熱靜Η AA、j_ 散，夕a的破動式散熱而透過熱傳導將熱量驅 埶=數散熱模組的設計係必須同時考慮絕緣及散 搭配政果，而在該散熱模組之一部份使用如樹 散飯2緣材質以包覆保護具有導電效果之構件，該 鋁人 邛分係使用散熱效果佳且塑形容易的 从 仁疋因為金屬材質會有導電性佳，必須多 夫於％緣的效果，且組裝不當容易造成該LED 晶片短路。 除了燈具結構的散熱設計很重要之外， 製造LED光源所使用的控制電路板之設計也相當重 要、本身即具有良好的散熱性且必須能夠對應不 同燈t而進行不同的變化。是故，本創作人係提供 /種^組化led光源結構’其利用電著塗佈有絕緣 層 土材以及没置於二絕緣散熱層之間的線路 好«效果。再者’本創作亦可進行複數 形態之串接使用’或直接與外部之—電力源電連接 使用，大幅提昇其應用時的便利性。 【新型内容】 本創作之一目的，旨為担Μ ^ 曰在k供一種金屬製或非金 屬製的m LED光源結構，其同時兼顧絕緣及散 熱之效果’故能在導電使用之餘大幅提昇散熱效果。 本創作之另-目的，旨在提供—種模組化LED 光源結構，其線路層之設計係便於進行複數形態之 串接使用，或直接與外部之—電力源電連接使用， 4 大幅提昇其應用時的便利性。 為達上述目的’本創作之模組化led光源結構， 可以複數形態進行串接使用，或與外部之一電力源 電連接使用，其包括：一基材，係金屬材質而製成 之平板結構體，該基材係具有至少一放置部及複數 甸穿孔；一第一絕緣層，設於該基材之一面，且該 第一絕緣層未包覆該放置部及該等穿孔；一線路 層，設於該第一絕緣層之一面，使該基材及該線路 層相互絕緣，且該線路層係具有複數個電極部；一 第二絕緣層，設於該線路層之一面，且該第二絕緣 層未包覆該放置部及該等電極部；至少一發光晶 片，設於該放置部内，使該發光晶片分別與該基Z 及該電極部電連接；及至少一封裝部，包覆設於該 放置部及該發光晶片之上。 其中，本創作之該模組化LED光源結構所使用 之該封裝部係中央隆起之凸透鏡結構體，能夠有效 増加該發光晶片之發光效率及其發光範圍。 另外，並於該線路層對應該等電極部之一側分 別•又有一電極材料，該等電極材料係穿設於該基材 之該等穿孔内部，並將該等電極材料之一端與該等 電極部相連接’另—端則外露於該基材之另一面而 可增加串接使用或直接使用時的便利性。 其中，該第一絕緣層及該第二絕緣層係絕緣散 熱膠’而可提供該基材與該線路層之間的絕緣效 5 M412301 果’且可使熱電分離而有較值的散熱效果。 其中，該基材之表面進/步使用了電著方式而 包覆設置有一外絕緣層，以提昇該外絕緣層之附著 效果’大幅減少外界因組裝不良的短路現象。 再者’為了提昇本創作之該模組化led光源結 構之發光效率，以及降低製造成本，其中之該放置 係為一凹槽’以將該發光晶片放置於該放置部 時’達到匯聚該發光晶片發亮時之光線的效果。又 或是於該第二絕緣層之一側設有至少一套環，且該 套環係對應環設於該放置部之周緣，亦可用來匯聚 光線之效果。而為了降低製造成本，該第二絕緣層 亦可使用絕緣油墨。又或是該第二絕緣層係包括一 玻纖板及覆設於該玻纖板外部之一絕緣膠，該玻纖 板係具有至少一透孔，且該透孔係對應該放置部的 位置而形成一凹槽，而可形成絕緣用之板材。 據此’本創作係均採用熱電分離之設計，將該 線路層及該絕緣導熱層係層疊設置，而兼顧絕緣、 導電及散熱等功效，故能在導電使用之餘大幅提昇 散熱效果。再者，該基材之表面透過電著方式佈設 有一外絕緣層，且該外絕緣層係採用了高反射光線 效果的絕緣材料’而能提幵該外絕緣層之附著效 果’大幅減少外界因組裝不良的短路現象，且能發 揮良好的反射光線效果。 【實施方式】 6 M412301 為使貝審查委員成清楚了解本創作之内容，謹 以下列說明搭配圖式，敬請參閱。 請參閱第1、2圖，係為本創作較佳實施例的立 體分解圖及其組裝後的剖視圖。如圖中所示，本創 作之模組化LED光源結構1係包括—基材1丨、一第 -絕緣層12、-線路層13、一第二絕緣層H、複 數個發光晶片1 5及複數個封裝部1 6。 其中該基材11係金屬材料而製成之平板結構 體，並以CNC加王或化學钱刻等方式於該基材…口 工而使其表面具有複數個放置部lu及複數個穿孔 112’如圖中所示’該等放置部ill係成對並排設於 該基材11之上表面’且該等放置部lu係分別為一 凹槽狀結構設置，而該等穿孔112係設置於鄰近該 基板11之側緣處。應注意的是’本創作更利用電著 (Electro_coating)方式於該基材u之表面設置有 —外絕緣層113,由於電著方式能夠提昇該外絕緣 層113之附著效果，而避免發生脫落現象，且該外 絕緣層113之設置能夠大幅減少外界因組裝不良的 短路現象。 該第一絕緣層12係採用兼具絕緣及導教效果的 絕緣散熱膠而係塗佈設於該基材u之—面，且使# f12—絕緣層12未包覆該等放置部⑴及該等穿孔 該線路層13係提供成品之電性連接效果而設置 7 於該第一絕緣層12之一面’使該基材ii及該線路 層1 3相互絕緣，且該線路層1 3係具有複數個電極 部1 31 ’且該等電極部1 31設置於對應該等放置部 111之一側。再者，於該線路層13對應該等電極部 131之内部係分別設有一電極材料132，且該等電極 材料1 32係分別穿設於該基材u之該穿孔丨丨2内 部’且一端係與該電極部1 31電連接，另一端則外 露於該基材11之外部，以增加串接使用或直接使用 時的便利性。 該第二絕緣層14同樣採用兼具絕緣及導熱效果 的絕緣散熱膠而係塗佈設於該線路層1 3之一面，使 之το全包覆該線路層13’且該第二絕緣層14並未 包覆該等放置部1 Π及該等電極部1 31。本創作係 藉由該第一絕緣層丨2及該第二絕緣層i 4，使本創 作在使用時熱電分離而有良好的導電性、絕緣性及 散熱性等效果。再者，該第二絕緣層亦可直接使用 絕緣油墨而遮蔽該線路層1 3，可降低製造成本且兼 顧了使用時的絕緣效果。 該複數個發光晶片1 5係各別設置於該等放置部 111内’使該等發光晶片1 5分別與該基材11及該 電極部1 31電連接。 該複數個封裝部1 6係採透過一半圓形外罩工6 i 包覆於該放置部111上，並將如環氧樹脂等封裝材 料灌注至該半圓形外罩161之内部，待其乾燥後而 M412301 製得，故該等封裝部16完整包覆設於該等放置部 111及該發光晶片1 5之後，使該等封裝部1 6形成 係中央隆起之凸透鏡結構體，故能使該等發光晶片 15發亮時的光線更加集中、均勻’而提高該等發光 晶片15之發光效率。 再者，請參閱第3、4圖，係為本創作較佳實施 例另一種實施態樣的結構示意圖及其剖視圖。如圖 中所示，為配合製程上的需求，有時該基材丨丨之該 放置部111並未設有凹槽狀結構而是呈現平面狀 態’為了確保該發光晶片1 5的發光效率，且為了確 保該封裝部1 6設置後的位置，係於該第二絕緣層 1 4之頂面設有至少一套環1 7，該套環1 7係呈圓環 狀且略大於該放置部111的尺寸，並將該套環17 ^ 應設置於該放置部111之周緣，亦有匯聚光線之效 果’並可確保該封裝部1 6的設置位置。 另外，請參閱第5、6圖，係為本創作較佳實施 例再一種貫施態樣的結構示意圖及其剖視圖。其 中’為了能夠降低製造成本並兼顧發光效率該第 二絕緣層14係以另一種型式呈現而疊置於該基材 11之一側，供以包覆該線路層13，且該第二絕緣層 14係包括一玻纖板141及覆設於該玻纖板141外^ 之一絕緣膠142 ’且於該玻纖板141上設有一方形 的透孔1411，且該等孔1411係對應該放置部^ 的位置而形成一方形的凹槽，該玻纖板連同該絕緣 9 圏 2301 膠即形成一絕緣用之板材。 綜上，本創作之該模組化LED光源結構1係採 用金屬材料作為其基材Π，其優點係採用了熱電分 離之設計，將該基材1 1、該等絕緣層1 2、〗4及該 線路層1 3 4係以層疊方式設置，而能兼顧絕緣、導 電及散熱等功效，且在導電使用之餘大幅提昇散熱 效果。再者，該基材π表面之該外絕緣層 的設置，大幅減少外界因組裝不良的短路現象，且 能發揮良好的反射光線效果。 —WΜ · <平又狂舅；5也例而 已’並非用以限定本創作眚 /L , 41卞只施之犯圍，其他如：該 基板之形狀、尺寸戋姑暂埜 丁4材貝荨’或是使用發光晶片的 類型或數量，抑或I兮·智α Μ ρ次疋該4絕緣散熱層及該等封裝部 的轉變方式，亦皆在太宏 Λ • 隹本案的乾疇之中；是故，該所 屬技術領域中呈有诵舍A 4 1 八、吊知識者，或是熟悉此技術所 作出等效或輕易的變化者 h Μ㈤ 化者，在不脫離本創作之精神 與把圍下所作之均等變 — 變化與修飾，皆應涵盍於本創 作之專利範圍内。 10 M412301 【圖式簡單說明】 第1圖，為本創作較佳實施例的立體分解圖。 第2圖，為本創作較佳實施例組裝後的剖視圖。 第3圖，為本創作較佳實施例另一種實施態樣的結 構示意圖。 第4圖，為本創作較佳實施例另一種實施態樣的剖 視圖。M412301 V. New description: [New technical field] This case belongs to the field of lighting devices, especially for a modular LED light source structure that is thermoelectrically separated and easy to assemble. [Prior Art] According to the light-emitting diode (LED), it has low power consumption, long life, low waste heat and high brightness. In recent years, there are more and more types of lamps using LED illumination sources as illumination. It is often seen that it is used for lighting fixtures such as street lamps, indoor lighting fixtures, desk lamps and even flashlights, all of which use a light-emitting chip (or called an LED die) to conduct light after being turned on, and the light-emitting chip is brightened. There is a problem of heating and heating. In particular, some high-powered illuminating wafers will also emit temperature when they are used, causing the control panel of the lighting fixture to overheat and quickly damage, and the life is greatly impaired. Moreover, the illuminating wafer is at a temperature. In the case of too high, the phenomenon of light decay also affects the photo: ▲ 4 LED lighting fixtures are all equipped with a special heat dissipation module to quickly dissipate the heat during use and prolong the service life and maintain Lighting effect, the heat dissipation module adopts = fan forced convection for active heat dissipation, or uses (4) passive use of the wind "V private" from ..., · " film Formula scattered ..., nettle manner 'but may force set by the air flow. You are trapped by the fan and forced to convect the cooling module to be externally connected with the power cylinder to set the book power and increase the consumption of buckles. Therefore, the most common heat dissipation module is still 3 A cooling, quiet AA, j_ scattered, eve A broken heat dissipation and heat transfer through heat conduction = the design of the number of heat dissipation modules must consider both insulation and dispersion, and use one of the heat dissipation modules as a tree Covering and protecting the component with conductive effect, the aluminum mandrel system uses heat dissipation effect and is easy to shape from the kernel. Because the metal material has good conductivity, it must have a multi-effect of the edge, and improper assembly is easy to cause The LED chip is shorted. In addition to the importance of the heat dissipation design of the luminaire structure, the design of the control circuit board used to fabricate the LED light source is also important, inherently good heat dissipation and must be able to vary differently depending on the lamp t. Therefore, the creator provides a kind of grouped led light source structure, which utilizes an electric layer coated with an insulating layer of soil material and a line that is not placed between the two insulating heat dissipation layers. Furthermore, 'this creation can also be used in tandem with multiple forms' or directly connected to external power sources, greatly improving the convenience of its application. [New content] One of the purposes of this creation is to provide a metal or non-metal m LED light source structure, which takes into account the effects of insulation and heat dissipation, so it can be greatly improved in the use of conductive heat radiation. The purpose of this creation is to provide a modular LED light source structure. The design of the circuit layer is convenient for serial connection of multiple forms, or directly connected to the external power source, 4 greatly enhances its Convenience when applied. In order to achieve the above purpose, the modular LED light source structure of the present invention can be used in series or in combination with one external power source, and includes: a substrate, a flat structure made of a metal material. The substrate has at least one placement portion and a plurality of perforations; a first insulating layer is disposed on one side of the substrate, and the first insulating layer does not cover the placement portion and the perforations; Providing one surface of the first insulating layer to insulate the substrate and the circuit layer from each other, and the circuit layer has a plurality of electrode portions; a second insulating layer is disposed on one side of the circuit layer, and the first The second insulating layer does not cover the placement portion and the electrode portions; at least one light-emitting chip is disposed in the placement portion to electrically connect the light-emitting chip to the base Z and the electrode portion; and at least one package portion is coated And disposed on the placement portion and the luminescent wafer. The packaged portion used in the modular LED light source structure of the present invention is a centrally raised convex lens structure, which can effectively increase the luminous efficiency of the light-emitting chip and the light-emitting range thereof. In addition, an electrode material is disposed on one side of the circuit layer corresponding to the electrode portion, and the electrode materials are disposed inside the perforations of the substrate, and one end of the electrode materials is The electrode portion is connected to the other end and exposed to the other side of the substrate to increase the convenience of serial use or direct use. Wherein, the first insulating layer and the second insulating layer are insulating heat dissipating rubbers to provide an insulation effect between the substrate and the circuit layer, and the thermoelectric separation can be performed to have a relatively high heat dissipation effect. Wherein, the surface of the substrate is electrically formed and coated with an outer insulating layer to enhance the adhesion effect of the outer insulating layer, which greatly reduces external short circuit due to poor assembly. Furthermore, in order to enhance the luminous efficiency of the modular LED light source structure of the present invention and to reduce the manufacturing cost, the placement is a groove to "set the illuminating light when the illuminating wafer is placed on the placing portion" The effect of light when the wafer is lit. Or at least one set of rings is disposed on one side of the second insulating layer, and the corresponding ring is disposed on the periphery of the placing portion, and can also be used to concentrate light. In order to reduce the manufacturing cost, the second insulating layer may also use an insulating ink. Or the second insulating layer comprises a fiberglass board and an insulating glue covering the outside of the fiberglass board, the glass fiber board having at least one through hole, and the through hole is corresponding to the position of the placing part A groove is formed to form a sheet for insulation. According to the design of the thermoelectric separation, the circuit layer and the insulating and thermally conductive layer are laminated, and the effects of insulation, conduction and heat dissipation are taken into consideration, so that the heat dissipation effect can be greatly improved in addition to the conductive use. Furthermore, the surface of the substrate is electrically disposed with an outer insulating layer, and the outer insulating layer is made of an insulating material with high reflection light effect, and the adhesion effect of the outer insulating layer can be improved. Poor short-circuiting of the assembly and good reflection of light. [Embodiment] 6 M412301 In order to make the members of the Board of Directors clearly understand the contents of this creation, please refer to the following description. Referring to Figures 1 and 2, there is shown a perspective view of a preferred embodiment of the present invention and a cross-sectional view thereof after assembly. As shown in the figure, the modular LED light source structure 1 of the present invention comprises a substrate 1 , a first insulating layer 12 , a circuit layer 13 , a second insulating layer H , a plurality of light emitting chips 15 and A plurality of encapsulation portions 16 . Wherein the substrate 11 is a flat structure made of a metal material, and the substrate is provided with a plurality of placement portions lu and a plurality of perforations 112' on the surface of the substrate by CNC or chemical etching. As shown in the figure, 'the placement portions ill are arranged side by side on the upper surface of the substrate 11' and the placement portions are respectively provided in a groove-like structure, and the perforations 112 are disposed adjacent to each other. At the side edge of the substrate 11. It should be noted that the present invention is further provided with an outer insulating layer 113 on the surface of the substrate u by means of an electro_coating method, and the adhesion effect of the outer insulating layer 113 can be improved by an electric method to avoid falling off. Moreover, the provision of the outer insulating layer 113 can greatly reduce the short circuit phenomenon due to poor assembly. The first insulating layer 12 is coated on the surface of the substrate u by using an insulating heat-dissipating adhesive having both insulation and teaching effects, and the #f12-insulating layer 12 is not covered with the placing portions (1) and The perforated circuit layer 13 provides the electrical connection effect of the finished product and is disposed 7 on the one surface of the first insulating layer 12 to insulate the substrate ii and the circuit layer 13 from each other, and the circuit layer 13 has A plurality of electrode portions 1 31 ' are provided and the electrode portions 1 31 are disposed on one side of the corresponding placement portion 111. Further, an electrode material 132 is disposed on the inner layer of the circuit layer 13 corresponding to the electrode portion 131, and the electrode materials 1 32 are respectively disposed inside the perforated crucible 2 of the substrate u. The electrode portion 1 31 is electrically connected to the electrode portion 1 31, and the other end is exposed to the outside of the substrate 11 to increase the convenience in serial use or direct use. The second insulating layer 14 is also coated on one side of the circuit layer 13 by using an insulating heat-dissipating adhesive having both insulating and heat-conducting effects, so that the circuit layer 13' is completely covered and the second insulating layer 14 is covered. The placement portions 1 and the electrode portions 1 31 are not covered. According to the first insulating layer 丨2 and the second insulating layer i4, the present invention provides thermoelectric separation during use and has excellent effects of conductivity, insulation, and heat dissipation. Further, the second insulating layer can directly shield the wiring layer 13 by using an insulating ink, and the manufacturing cost can be reduced and the insulating effect at the time of use can be achieved. The plurality of light-emitting chips 15 are separately disposed in the placing portions 111. The light-emitting chips 15 are electrically connected to the substrate 11 and the electrode portion 1 31, respectively. The plurality of encapsulation portions 16 are coated on the placement portion 111 through a semicircular outer cover member 6 i, and a packaging material such as epoxy resin is poured into the semicircular outer cover 161, and after being dried. The M412301 is manufactured. Therefore, the package portions 16 are completely covered by the placement portions 111 and the light-emitting wafers 15, and the package portions 16 are formed into a convex lens structure having a central elevation. When the light-emitting chip 15 is bright, the light is more concentrated and uniform, and the light-emitting efficiency of the light-emitting chips 15 is improved. Furthermore, please refer to Figures 3 and 4, which are schematic structural views and cross-sectional views of another embodiment of the preferred embodiment of the present invention. As shown in the figure, in order to meet the requirements in the process, sometimes the placement portion 111 of the substrate is not provided with a groove-like structure but presents a planar state. To ensure the luminous efficiency of the light-emitting chip 15, And in order to ensure the position of the package portion 16 after the installation, the top surface of the second insulation layer 14 is provided with at least one set of rings 17 , and the collar 17 is annular and slightly larger than the placement portion. The size of the 111, and the collar 17 ^ should be placed on the periphery of the placement portion 111, also has the effect of concentrating light 'and can ensure the position of the package portion 16. In addition, please refer to Figures 5 and 6, which are schematic views of a preferred embodiment of the present invention and a cross-sectional view thereof. In order to reduce the manufacturing cost and achieve the luminous efficiency, the second insulating layer 14 is presented on the side of the substrate 11 in another form, for covering the circuit layer 13, and the second insulating layer The 14 series includes a fiberglass board 141 and an insulating glue 142 ′ disposed on the outside of the fiberglass board 141 and a square through hole 1411 is disposed on the fiberglass board 141, and the holes 1411 are correspondingly placed. The position of the portion ^ forms a square groove, and the fiberglass plate together with the insulating 9 圏 2301 glue forms a plate for insulation. In summary, the modular LED light source structure 1 of the present invention uses a metal material as its substrate Π, and its advantage is the design of thermoelectric separation, the substrate 1 1 , the insulating layers 1 2 , 4 And the circuit layer 134 is arranged in a stacked manner, and can take into consideration the effects of insulation, conduction, heat dissipation, etc., and greatly improve the heat dissipation effect after the conductive use. Further, the provision of the outer insulating layer on the surface of the substrate π greatly reduces the short-circuit phenomenon due to poor assembly and exhibits a good reflection of light. —WΜ · <Flat and arrogant; 5 is also just 'not used to limit the creation of 眚 / L, 41 卞 only applied to the peri, other such as: the shape and size of the substrate 戋 暂 野 野 4 4荨 'Or the type or number of illuminating wafers, or I 兮 智 α Μ ρ 疋 疋 疋 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 Therefore, in the technical field, there is a person who knows the equivalent or easy change of the technology, or who is familiar with the technology, and who does not deviate from the spirit of this creation. The changes made to the surrounding – changes and modifications – should be covered by the scope of this creation. 10 M412301 [Simplified description of the drawings] Fig. 1 is an exploded perspective view of a preferred embodiment of the present invention. Figure 2 is a cross-sectional view of the preferred embodiment of the present invention assembled. Figure 3 is a block diagram showing another embodiment of the preferred embodiment of the present invention. Figure 4 is a cross-sectional view showing another embodiment of the preferred embodiment of the present invention.
第5圖，為本創作較佳實施例另一種實施態樣的結 構示意圖。 第6圖，為本創作較佳實施例另一種實施態樣的剖 視圖。 【主要元件符號 1 模組 11 基材 111 放置 112 穿孔 113 外絕 12 第一 13 線路 131 電極 132 電極 14 第二 141 玻纖 1411 透孔Figure 5 is a block diagram showing another embodiment of the preferred embodiment of the present invention. Figure 6 is a cross-sectional view showing another embodiment of the preferred embodiment of the present invention. [Main component symbol 1 Module 11 Substrate 111 Placement 112 Perforation 113 Outer 12 First 13 Line 131 Electrode 132 Electrode 14 Second 141 Glass Fiber 1411 Through Hole
說明】 化LED光源結構 部 緣層 絕緣層 層 部 材料 絕緣層 板 M412301 142 絕 緣 膠 15 發 光 晶片 16 封 裝 部 161 半 圓 形外罩 17 套 環 12Description] LED light source structure edge layer insulation layer layer material insulation layer board M412301 142 insulation glue 15 light wafer 16 package part 161 semi-circular cover 17 sets of rings 12