WO2011035645A1

WO2011035645A1 - Led light bulb with multiple layers of radiating structures

Info

Publication number: WO2011035645A1
Application number: PCT/CN2010/075355
Authority: WO
Inventors: 沈李豪
Original assignee: Shen Lihao
Priority date: 2009-09-27
Filing date: 2010-07-21
Publication date: 2011-03-31
Also published as: CN201526837U

Abstract

A LED light bulb with multiple layers of radiating structures, comprises a LED circuit carrier, a main body 02) of a lamp cup, a controller (04), LED chips (05) and a lamp cover (06). The LED circuit carrier can be a planar LED circuit carrier (10), which has an A base load surface (101) and the whole circle of the edge of which s folded into a wide edge (014). The LED circuit carrier can be also a cap-like LED circuit carrier (01), the center part of which is humped to form the first base load surface (011). The whole circle of the edge of the first base load surface (011) is folded into a wide edge (014), then folded again towards the circumambience and extends to form a brim-like second base load surface (012) and continues to form the Nth base load surface by analogy. The main body (02) of the lamp cup has a structure of multiple layers, and comprises the first layer amp cup (021), the second layer lamp cup (022), and till the Nth layer lamp cup by analogy. Each base load surface (101, 011, 012) is provided with a circuit board. The LED circuit carrier is made of heat conductive material. The main body (02) of the lamp cup is made of radiating material. Radiating vents (03) are densely distributed in the side walls of the second layer lamp cup (022) till the Nth layer lamp cup. The LED light bulb with multiple layers of radiating structures has a good radiating effect and a long life.

Description

LED bulb with multi-layer heat dissipation structure

Technical field

The utility model relates to the technical field of application of LED chips, in particular to an LED bulb with a multi-layer heat dissipation structure.

Background 3⁄4

LED (Light Emitting Diode) is a solid-state semiconductor device that converts electricity directly into light. Standard electric lamps are undergoing a revolution. In order to protect energy and respond to global warming, some states and other countries in the United States have begun to ban the use of energy-efficient incandescent bulbs. A variety of new technologies are being used to replace incandescent bulbs, with compact vacuum fluorescent lamps (CFLs) being the primary alternative. Although this CFL lamp consumes only 20% of the incandescent lamp, it contains toxic mercury. In contrast, LED lights provide a more efficient and environmentally friendly solution.

The LED light source has the advantages of using low-voltage power supply, low energy consumption, strong applicability, high stability, short response time, no pollution to the environment, multi-color light emission, etc., although with the gradual improvement of the luminous efficiency of white LED, white light The possibility of LED application in the field of lighting is also increasing, but to achieve the lumens required for illumination, no matter which method is used, it is necessary to handle extremely high heat in a very small LED package. Dissipating this heat, in addition to various packaging materials, there will be problems of product reliability due to the difference in expansion coefficient between each other. The luminous efficiency of the chip will decrease significantly with the increase of temperature, and the service life will be significantly shortened. And increase the cost of lumens. Therefore, how to dissipate the heat in the assembly has become an important issue in current LED applications.

The existing heat dissipation methods applied to LEDs generally add heat sinks to the LEDs to dissipate heat in a manner that increases the heat dissipation area. When the power is larger, the area of the heat sink is larger, and sometimes the heat dissipation requirement cannot be met. Therefore, the heat generation problem of most LEDs is difficult to solve by relying solely on the heat sink, and there are also a series of large weight, large volume, and relatively low cost. The problem is illustrated as follows:

Case 1: As disclosed in the Chinese Utility Model Patent No. 200410047327. 0, the LED is first placed on the metal body, and then the LED and the metal body are placed on the heat sink body. There are multiple heat sink fins on the heat sink body. This type of passive heat dissipation can meet the heat dissipation requirements when the LED heat is relatively small, but when multiple LEDs are densely arranged or/and the LED power is relatively large, this heat dissipation method cannot effectively dissipate the LED. .

Case 2: The patent CN1807971A (application number 200610038143. 7) also discloses a high-power high-brightness illumination lamp. The principle is to use the forced convection of the fan to effectively dissipate heat on the heat sink on the back surface to achieve heat dissipation. The life of the fan is limited, and the shockproof performance and the stability of the work are all far from the LED. Therefore, the LED illuminator using the forced convection of the fan must have a bottleneck on the fan. The long life of the LED itself and the stability of the work are difficult to play. It also causes the LED lights to become complicated in assembly and the total weight increases.

Case 3: An LED lighting bulb structure, such as the patent application number 200820117326. 2, is provided with a bulb controller inside the lamp cap, the bottom surface of the bulb controller is fixed by an upper joint cover, and an inner sleeve is fixed on the bottom surface of the upper joint cover. a heat dissipating fin set of at least one heat pipe and a lower joint cover, a bulb case with a built-in tray is screwed to the outer periphery of the lower joint cover, and a plurality of LED lamps corresponding to the plurality of heat pipes are protruded from the bottom surface of the tray Therefore, the plurality of LED lamp sets generate heat energy, and the hot and cold exchanges of the plurality of heat pipes and the fins are separated to allow cold and heat to be separated. Although the structure can improve a certain heat dissipation effect, the structure is complicated. It is not easy to assemble and has a large overall weight, which is not easy to be widely used.

Utility model content

The purpose of the utility model is to overcome the above-mentioned deficiencies of the prior art, and to provide an LED light bulb with a multi-layer heat dissipation structure with good heat dissipation performance, low energy consumption, low light decay and simple process.

The technical solution adopted by the utility model to solve the above technical problems is:

An LED bulb having a multi-layer heat dissipation structure is constructed, including an LED line carrier, a lamp cup assembly, a controller, an LED chip, and a lamp cover.

The LED line carrier, which may be planar, that is, a planar LED line carrier, has an A-based carrier surface and the entire circumference of the edge is folded into a wide side (so-called wide side refers to the edge of the A-based surface) Fold a certain width to be the edge of the A-based carrier surface. Since the planar LED line carrier is very thin, after folding a certain width, the actual effect is made to thicken the edge of the A-based carrier surface to increase the overall thickness of the lamp cup. Corresponding The contact surface of the cup wall at the mouth of the cup. The LED line carrier can also be shaped to have a full-circle hat-like hat shape, that is, a hat-shaped LED line carrier, the central portion of which is arched to form a first base carrier surface, the first base carrier surface The full circle of the edge is folded into a wide side and then folded around to form a second base-like surface forming a brim, and so on to the Nth base surface, where N is a positive integer greater than or equal to 2, The entire circumference of the outer circumference of the base surface is folded into a wide side.

The lamp cup is generally of a multi-layer structure, having a first layer of light cups, a second layer of light cups, and so on to the Nth layer of light cups, wherein N is a positive integer greater than or equal to 2; the first layer of light cups Located in a central portion of the overall color of the lamp cup, forming a first space therein, the diameter of the second layer of the cup cup is larger than the diameter of the first layer of the cup cup and is set on the outer circumference of the first layer of the lamp cup, and the second layer of the cup Forming a second space with the first layer of the lamp cup, the number of layers of the lamp cup and the number of layers of the space, and so on; except for the wall of the lamp at the mouth of the outermost lamp cup is a blade shape, at the mouth of the other layers of the lamp cup The wall of the lamp is folded into a wide side.

For a planar LED line carrier, the A-based carrier surface is fitted to the lamp cup and is positioned close to the cup mouth, and the wide side of the edge of the A-based carrier surface is folded. The innermost outermost lamp cup of the lamp cup is fitted close to the wall of the cup at the mouth of the cup.

For the hat-shaped LED line carrier, the number and position of the first base to the Nth base are corresponding to the first to Nth cups of the entire cup, the first base to the first The N-based carrier faces are respectively fitted to the corresponding cups of the lamp cups and positioned near the respective cup mouths, and the wide sides of the outermost base-loading faces are fitted into the outermost lamp cups. Positioned near the cup opening, the wide sides of the base surface of the other layers are fitted to the outer near cup opening of the corresponding layer of the respective light cup.

A circuit board is disposed on the A base carrier surface and the first base carrier surface to the Nth base carrier surface.

The LED line carrier is made of a material having thermal conductivity.

The lamp cup is generally made of a heat dissipation material.

A heat dissipation vent is densely disposed on the wall of the second to fourth N cups of the lamp cup. Compared with the prior art, the utility model has the following advantages and beneficial effects:

1. The LED line carrier can be shaped as a hat-shaped LED line carrier, and has a plurality of base loading surfaces, and each of the base loading surfaces can be provided with an electronic circuit to increase the surface area of the carrier to increase the heat dissipation area of the carrier; 2. When the LED line carrier is shaped as a hat-shaped LED line carrier, the base surface of the LED line carrier can correspond to the multi-layer structure lamp cup, and the thermal energy generated by the LED chip on each base surface is generated through the corresponding layer of the lamp cup. The wall of the cup is dissipated into the air, further dissipating the heat energy, improving the thermal shock resistance of the LED lamp, solving the heat dissipation problem of the LED lamp, and effectively prolonging the service life of the LED illuminator.

3, its multi-layer structure lamp cup, the more the number of lamp cup layers, the larger the total surface area, the better the heat dissipation effect.

4. The second layer of the lamp cup and the cup wall pushed to the Nth layer of the lamp cup are densely covered with a heat dissipation vent hole formed by drilling, punching, forging, etching, punching, etc., and the heat dissipation vent hole is When the LED works hot, it is easy to quickly dissipate the heat energy in each space, effectively improving the heat dissipation efficiency.

5. The first space in the first layer of the lamp cup is a confined space, which can have a good waterproof function. DRAWINGS

The present invention will be further described below in conjunction with the accompanying drawings.

1 is an exploded perspective view of the present invention having a two-layer heat dissipation structure and a planar LED line carrier.

2 is an exploded perspective view of the present invention having a two-layer heat dissipation structure and a hat-shaped LED line carrier. Figure 3 is an overall schematic view of the present invention having a two-layer heat dissipation structure and a hat-shaped LED line carrier.

Figure 4 is an overall schematic view of a two-layer heat dissipation structure and a planar LED line carrier.

Figure 5 is an overall schematic view of the present invention having a three-layer heat dissipation structure and a hat-shaped LED line carrier.

Figure 6 is an overall schematic view of a three-layer heat dissipation structure and a planar LED line carrier.

Figure 7 is a heat dissipation mechanism diagram of the planar LED line carrier of the present invention.

Figure 8 is a partial enlarged view of Figure 7.

Figure 9 is a heat dissipation mechanism diagram of the hat-shaped LED line carrier of the present invention.

Figure 10 is a partial enlarged view of Figure 9.

Among them: 10, flat LED line carrier; 101, A base surface; 01, hat-shaped LED line carrier; 011, first base surface; 012, second base surface; 013, third base surface; Wide side; 02, overall light cup; 021, first layer of light cup; 022, second layer of light cup; 023, third layer of light cup; 0211, First space; 0221, second space; 0231, third space; 03, heat dissipation vent; 0212, flat cup wall; 0213, concave cup wall; 04, controller; 05, LED chip; 07, lamp holder; 08, heat energy escape path.

detailed description

As shown in FIG. 1 to FIG. 6 , the utility model relates to an LED bulb with a multi-layer heat dissipation structure, which comprises an LED line carrier, a lamp cup overall 02, a controller 04, an LED chip 05, a lamp cover 06 and a lamp holder 07. The LED line carrier can be a planar LED line carrier 10 having an A-based carrier surface 101 and the entire circumference of the edge is folded into a wide edge 014 having a base surface 011 and a rim ring 014 is disposed on The base surface is folded down to be fitted, and can be fitted to the corresponding near cup opening of the lamp cup body 02 to be positioned and closely adhered to the cup wall. The so-called wide edge refers to the edge of the A base surface. A certain width is used as the side of the A-based carrier surface. Since the planar LED line carrier is very thin, after folding a certain width, the actual effect is made to thicken the edge of the A-based carrier surface to increase the correspondingness to the overall thickness of the lamp cup. The contact surface of the cup wall at the mouth of the cup; the LED line carrier can also be formed into a hat-shaped LED line carrier 01, the central portion of which is arched to form a first base surface 011, and the edge of the first base surface 011 is completed. Fold into a wide edge 014 and then fold it around Forming a brim-like second base surface 012, and so on to the Nth base surface, the entire circumference of the edge of the outermost base surface is folded into a wide edge 014, which can be fitted to the lamp The corresponding lamp cup of the cup body 02 is positioned near the cup mouth and closely fits with the cup wall; the lamp cup overall 02 is a cup-shaped body of heat dissipation material, having a first layer lamp cup 021, and a second layer lamp cup 022 And pushing to the Nth layer of the lamp cup, the first layer of the lamp cup 021 is located at the center of the lamp cup overall 02, the first layer of the lamp cup 021 forms a first space 0211, and the second layer of the lamp cup 022 cup The diameter of the mouth is larger than the diameter of the first layer of the cup 021 cup and is set outside the first layer of the lamp cup 021, and forms the second space 0221, the number of layers of the lamp cup and the number of layers of space and so on, and except the outermost lamp The cup mouth is blade-shaped, and the wall of the lamp cup at the other layers of the cup is folded into a wide side 014, and can be closely adhered to the inner wall of the flat LED line carrier 10 or the hat-shaped LED line carrier 01.

The flat LED line carrier 10 and the hat-shaped LED line carrier 01 are made of copper, aluminum, iron, stainless steel, ceramic or other stretchable and bendable metal having thermal conductivity, and can be stretched or stamped. Forming a plane or a variety of curved shapes (ie, hat-shaped), such as a stepped shape, a concave-convex shape or the like, and a plurality of base surfaces of the hat-shaped LED line carrier 01 are directly provided with a plurality of electronic circuits corresponding to the base surface, and one or more of the base surfaces are fixed on each of the base surfaces. LED chip 05.

The lamp cup body 02 may be made of copper, aluminum, ceramic or other heat dissipating material, wherein the first space 0211 formed in the first layer of the lamp cup 021 is a closed space; and the lamp cup overall 02, The first space 0211 can accommodate the controller 04 and form a closed space. The cup wall 0212 can be a flat surface wall 0212, or can be a concave-convex shape or a spiral shape formed by electrolysis or etching. The cup wall 0213, the second layer of the lamp cup 022 and the like are pushed to the cup wall of the Nth layer of the cup to be provided with a heat dissipation vent 03 formed by drilling, punching, forging, etching, punching, and the like.

The base surface of the hat-shaped LED line carrier 01 can correspond to the multi-layer lamp wall of the lamp cup body 02, and the wide side 014 of the base layer of the outermost layer is fitted into the outermost lamp cup. Positioned near the mouth of the cup, the wide sides 014 of the base surface of the other layers are fitted to the outer near cup opening of the corresponding layer of the lamp cup.

The LED line carrier, the controller 04, the LED chip 05 and the lampshade 06 of the present invention are assembled in the lamp cup overall 02.

As shown in FIG. 7 and FIG. 8, when the LED bulb of the planar LED line carrier 10 of the present invention operates, the LED chip 05 generates a large amount of thermal energy 08, which is generated by the innermost layer of the LED chip 05 of the A-based carrier surface 101. The thermal energy 08 is made up of the first layer of the lamp cup 021 to form the wide side 014, the first layer of the lamp cup 021 cup wall is discharged to the second space 0221, and the other part of the thermal energy 08 will be folded by the second layer of the lamp cup 022 The wide side 014 is formed, and the wall of the second layer of the lamp cup 022 is dissipated into the air. At the same time, the thermal energy 08 in the first space 0211 can escape into the air through the bottom of the lamp cup, and the second space 0221 The internal thermal energy 08 can be dissipated into the air through the heat dissipation vent 03 on the wall of the second layer of the lamp cup 022, and a large amount of thermal energy 08 is dissipated in this way, thereby improving the heat dissipation efficiency of the LED lamp.

As shown in FIG. 9 and FIG. 10, when the LED bulb of the present invention having the hat-shaped LED line carrier 01 operates, the LED chip 05 generates a large amount of thermal energy 08, and the thermal energy generated by the LED chip 05 on the base surface 011 is 08. The wide side 014 formed by folding, the wall of the first layer of the lamp cup 021 is dissipated to the second space 0221, and the thermal energy 08 generated by the LED chip on the second base surface 012 is made up of The wide side 014, the wall of the second layer of the lamp cup 022 is dissipated into the air, and at the same time, the thermal energy 08 in the first space 0211 can escape into the air through the bottom of the lamp cup, and the heat energy in the second space 0221 08 can be dissipated into the air through the heat dissipation vent 03 on the wall of the 022 cup of the second layer of the lamp cup, and a large amount of thermal energy 08 is dissipated in this way, thereby achieving the effect of improving the heat dissipation efficiency of the LED lamp.

The utility model has the advantages of simple structure, remarkable heat dissipation effect, low cost, environmental protection and energy saving.

The specific embodiments of the present invention have been described in detail above. However, it should be understood that the embodiments of the present invention are not limited to the embodiments, and the description of the embodiments is only for the purpose of understanding the spirit of the present invention. Various modifications of the invention are intended to be included within the scope of the invention.

Claims

Claim

1. An LED bulb having a multi-layer heat dissipation structure, comprising an LED line carrier, a lamp cup overall, a controller, an LED chip and a lampshade;

The LED line carrier, which may be planar, that is, a planar LED line carrier, has an A-based carrier surface and the entire circumference of the edge is folded into a wide side; the LED line carrier may also be shaped to have The full-circle hat-like hat shape, that is, the hat-shaped LED line carrier, the central portion of which is arched to form the first base carrier surface, and the entire circumference of the edge of the first base carrier surface is folded into a wide side and then folded around. Extending the second base surface forming a brim, and so on to the Nth base surface, wherein N is a positive integer greater than or equal to 2, and the entire circumference of the outer circumference of the base surface is folded into a full circle Wide side

The lamp cup is generally of a multi-layer structure, having a first layer of light cups, a second layer of light cups, and so on to the Nth layer of light cups, wherein N is a positive integer greater than or equal to 2; the first layer of light cups Located in a central portion of the overall color of the lamp cup, forming a first space therein, the diameter of the second layer of the cup cup is larger than the diameter of the first layer of the cup cup and is set on the outer circumference of the first layer of the lamp cup, and the second layer of the cup Forming a second space with the first layer of the lamp cup, the number of layers of the lamp cup and the number of layers of the space, and so on; except for the wall of the lamp at the mouth of the outermost lamp cup is a blade shape, at the mouth of the other layers of the lamp cup The wall of the lamp is folded into a wide side;

For a planar LED line carrier, the A-based carrier surface is fitted to the lamp cup and is positioned close to the cup mouth, and the wide side of the edge of the A-based carrier surface is folded. The innermost outermost lamp cup of the lamp cup is fitted close to the cup wall at the mouth of the cup;

For the hat-shaped LED line carrier, the number and position of the first base to the Nth base are corresponding to the first to Nth cups of the entire cup, the first base to the first The N-based carrier faces are respectively fitted to the corresponding cups of the lamp cups and positioned near the respective cup mouths, and the wide sides of the outermost base-loading faces are fitted into the outermost lamp cups. Position near the cup, the base surface of the other layers The wide sides are respectively fitted to the outer near cup opening of the corresponding layer of the lamp cup;

a circuit board is disposed on the A base carrier surface and the first base carrier surface to the Nth base carrier surface;

The LED line carrier is made of a material having thermal conductivity;

The lamp cup is generally made of a heat dissipation material;

A heat dissipation vent is densely disposed on the wall of the second to fourth N cups of the lamp cup.

2. The LED light bulb having a multi-layer heat dissipation structure according to claim 1, wherein: the LED line carrier is formed into a planar LED line carrier or a hat-shaped LED line carrier by stretching or stamping.

The LED light bulb having a multi-layer heat dissipation structure according to claim 1, wherein: one or more of the first base surface to the Nth base surface of the A-type carrier surface of the LED line carrier are respectively provided. The LED chips are connected to the corresponding boards.

4. The LED light bulb having a multi-layer heat dissipation structure according to claim 1, wherein: the heat conductive material for forming the LED line carrier is copper, or aluminum, or iron, or stainless steel, or a thermally conductive ceramic.

5. The LED light bulb having a multi-layer heat dissipation structure according to claim 1, wherein: the heat dissipation material of the lamp cup is made of copper, or aluminum, or iron, or stainless steel, or a thermally conductive ceramic.

The LED light bulb with a multi-layer heat dissipation structure according to claim 1, wherein: the first space of the first layer of the lamp cup is placed in a controller connected to the circuit board and forms a sealed Space, the wall of the cup may be flat, or may be a concave-convex or spiral uneven surface formed by electrolysis or etching.