CN201526914U - LED lamp housing - Google Patents

LED lamp housing Download PDF

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Publication number
CN201526914U
CN201526914U CN2009203132295U CN200920313229U CN201526914U CN 201526914 U CN201526914 U CN 201526914U CN 2009203132295 U CN2009203132295 U CN 2009203132295U CN 200920313229 U CN200920313229 U CN 200920313229U CN 201526914 U CN201526914 U CN 201526914U
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CN
China
Prior art keywords
heat
conducting
led lamp
conducting layer
coating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2009203132295U
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Chinese (zh)
Inventor
沈李豪
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Individual
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Individual
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Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN2009203132295U priority Critical patent/CN201526914U/en
Priority to PCT/CN2009/075953 priority patent/WO2011050550A1/en
Application granted granted Critical
Publication of CN201526914U publication Critical patent/CN201526914U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
    • F21V21/14—Adjustable mountings
    • F21V21/30—Pivoted housings or frames
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

An LED lamp housing comprises a casing used for connecting a lamp cap and a lamp shade, wherein the casing comprises a heat conducting layer and a coating layer, the heat conducting layer has a concave-convex structure and is cover with the coating layer, and the coating layer has the function of heat conduction and heat dissipation. The heat conducting layer is made of copper, aluminum, iron, or stainless steel in the manner of etching, electrolyzing, punching, or stamping, and forms a shape of wave, water wave, or gear tooth, and the coating layer is applied onto the casing by isolated, heat-conducting, and heat-radiating polymer materials, or ceramic materials added with heat-conducting heat-dissipating materials, or traditional PCB plating printing inks added with heat-conducting materials in the manner of spraying or printing; and different materials and component configurations result in different colors of gained coating, therefore, the coating layer can have colors used for enhancing apparent esthetic feeling, such as gold, silver, or coppery. The LED lamp housing can protect the internal LED chip, and the structural characteristics can achieve the effect of rapid heat dissipation.

Description

A kind of LED lamp outer casing
Technical field
The utility model relates to a kind of LED lamp outer casing, refers to a kind of LED lamp outer casing with heat sinking function especially.
Background technology
The LED light emitting diode is a kind of solid-state semiconductor devices, and it can directly be converted into light to electricity, and photometric standard lamp is experiencing a revolution.For the consideration of the protection energy and reply global warming, some states of the U.S. and some other country begin to ban use of the incandescent lamp bulb of low efficiency.Various new technologies are used to replace incandescent lamp bulb just one after another, and wherein compact type vacuum fluorescent lamp (CFL) is main replacement scheme.Although the power consumption of this CFL lamp is 20% of an incandescent lamp only, contain noxious material mercury.By contrast, the LED lamp can provide more efficient and the solution of environmental protection more.
Led light source has the use low-tension supply, power consumption is few, applicability is strong, stability is high, response time is short, environmentally safe, advantage such as multicolor luminous, although along with the progressively raising of white light LEDs luminous efficiency, the possibility that white light LEDs is applied in lighting field is also increasing, but reach the needed lumen number of illumination, no matter be to use which kind of method, the capital is restricted because must handle high this technical barrier of heat in minimum LED encapsulation, these heats if assembly can't leave, except various encapsulating materials can produce the problem of product reliability owing to the difference of the coefficient of expansion to each other, the luminous efficiency of chip also can obviously descend along with the rising of temperature, and causes obviously shorten its service life and the raising of lumen cost.Therefore, the heat in the assembly that how to leave becomes the important topic that present LED uses.
Existing application generally all is to add radiator on LED in the heat dissipating method on the LED, dispels the heat in the mode that increases area of dissipation.Power is big more, required fin area is just big more, and very big sometimes radiator does not all satisfy radiating requirements, so the single dependence fin of the heating problem of most of LED is difficult to solve, and exist big weight, large volume, the more high a series of problems of cost, illustrate as follows:
Case one: the patent No. is that 200410047327.0 the disclosed technical scheme of Chinese invention patent is earlier LED to be arranged on the metallic object, LED and metallic object is arranged on the radiating seat again, and a plurality of heat radiation claspers are arranged on the radiating seat.The scheme of the passive heat radiation of this class can also satisfy the heat radiation requirement under the smaller situation of LED heating, but when a plurality of LED dense arrangement or LED power ratio were bigger, this radiating mode just can not dispel the heat to LED effectively.
Case two: patent CN1807971A (application number 200610038143.7) discloses the radiator structure of high-power and high-luminance illuminating lamp again, and its principle is to utilize fan forced convection, and the heat on its backside heat device is distributed fast, thereby reaches the purpose of heat radiation.Yet the life-span of fan is limited, and all there are huge gap in shockproof properties and working stability performance with LED, therefore, use the inevitable technical bottleneck that on fan, exists of LED illuminating lamp of fan forced convection, not only make the advantages such as life-span length, working stability of LED itself be difficult to performance, also can cause the LED lamp to become complicated at fit on, gross weight and cost increase.
Case three: number of patent application is a kind of LED lighting bulb structure of 200820117326.2, be provided with a bulb controller in lamp holder inside, this bulb controller bottom surface is fixing to engage lid on one, covering the bottom surface at last joint is fixed with the radiating fin group of an inner sheathed at least one heat pipe and engages lid once, engage in this time and to cover periphery and spin and one be built-in with the bulb shell of pallet, and be projected with a plurality of LED lamp groups of corresponding a plurality of heat pipes in tray bottom surface; By this, the heat energy that a plurality of LED lamp groups are produced is via the hot cold exchange of a plurality of heat pipes and radiating fin group, allow cold and hot separation, though this kind structure can improve certain radiating effect, its complex structure, it is bigger to be difficult for assembling and overall weight, is difficult for extensive use.
The utility model content
The purpose of this utility model is: overcome existing LED lamp outer casing heat conduction and heat radiation defect of insufficient, a kind of LED lamp outer casing of heat conduction and heat radiation better effects if is provided.
The utility model solves the problems of the technologies described above the technical scheme that is adopted:
A kind of LED lamp outer casing comprises the housing that is used to connect lamp holder and lampshade, and described housing comprises the heat-conducting layer with concaveconvex structure and the dope layer with heat conduction and heat radiation function of heat-conducting layer outer side covers.
Described heat-conducting layer with concaveconvex structure is to utilize Heat Conduction Material to make by the mode of etching, electrolysis, punching press or embossing, is waveform, water wave shape or form of gear tooth, and its material can be copper or aluminium or iron or stainless steel or thermal conductive ceramic.
Described dope layer with heat conduction and heat radiation function also can be plated on the housing by the mode that anode is handled by insulation, easily the macromolecular material of heat conduction and heat radiation or the traditional PCB making sheet printing ink that is added with the ceramic material of heat conduction and heat radiation material or is added with Heat Conduction Material are coated on the housing by the mode of spraying or printing; Material and composition configuration are different, the color relation difference of the coating that draws, and thus, dope layer can have the color that gold, silver color or coppery etc. are used to strengthen aesthetic appearance.
The preparation method of described a kind of LED lamp outer casing comprises the steps:
1. the operation of on the housing of the lamp outer casing of moulding not, printing or being coated with, exposing, developing according to the preparation method of traditional printing technology.
2. make the heat-conducting layer surface form concaveconvex structure by modes such as etching, electrolysis, punching press or embossing.
3. use modes such as stretching, forging, punching press to make heat-conducting layer moulding (as shapes such as bulb shell, PAR lamp housing, street lamp shell, desk lamp shells).
4. the mode by spraying, electrophoresis or printing applies that one deck has the heat conduction and heat radiation dope layer of different colours or the mode of handling by anode plates dope layer on the outer surface of heat-conducting layer.
With respect to prior art, the utlity model has following beneficial effect:
1, the heat-conducting layer with concaveconvex structure that adopts Heat Conduction Material to make can be protected led chip, has increased the area of dissipation of heat-conducting layer again effectively, has improved the radiating efficiency of light fixture, and then has prolonged the service life of light fixture.
2, the outer surface at heat-conducting layer applies the dope layer that one deck has the heat conduction and heat radiation function, when the temperature of LED lighting raises fast, this dope layer can derive the heat on the heat-conducting layer and be dispersed in the air rapidly, and then has improved the rate of heat dissipation and the reliability of products of shell.
3, the dope layer on the housing has color, can be gold, silver color or coppery, and this color has been enriched the visual effect of LED light fixture outward appearance.
Description of drawings:
Fig. 1 is the schematic diagram of the bulb of the utility model.
Fig. 2 is the schematic diagram of the PAR lamp of the utility model.
Fig. 3 is the schematic diagram of the MR16 shot-light of the utility model.
Fig. 4 is the schematic diagram of the street lamp of the utility model.
Fig. 5 is the schematic diagram of the desk lamp of the utility model.
Among the figure:
The 01-housing, the 02-dope layer, the 04-heat-conducting layer,
The 20-lamp holder, the 30-lampshade.
The specific embodiment:
Below in conjunction with accompanying drawing the specific embodiment is illustrated:
LED bulb as shown in Figure 1 comprises lamp holder 20, housing 01 and lampshade 30, and housing 01 is between lamp holder 20 and the lampshade 30, and surrounds a closed space jointly with them, and this closed space has been protected effectively and has been in its inner led chip.Wherein, housing 01 is divided into dope layer 02 and heat-conducting layer 04, heat-conducting layer 04 by aluminium block through punching press with stretch and to make, outer then be coated on the heat-conducting layer 04 by the macromolecular material of heat conduction and heat radiation insulation, easy and make, make whole housing 01 be the form of gear tooth of silver color.When led chip is started working, the part of the heat of its generation can accumulate in the above-mentioned closed space, cause the temperature in the space to raise, the temperature that raises will be delivered to the external world by the housing of being made up of heat-conducting layer 04 and dope layer 02 01, wherein, the effect of dope layer 02 is to quicken dispersing of heat on the heat-conducting layer 04, thereby has reduced the temperature in the closed space rapidly, has avoided the continuation of temperature to raise.The design feature of this form of gear tooth has more effectively enlarged its area of dissipation, has improved radiating efficiency.
PAR lamp as shown in Figure 2 also comprises lamp holder 20, housing 01 and lampshade 30, and housing 01 is between lamp holder 20 and the lampshade 30, and surrounds a closed space jointly with them, and this closed space has been protected effectively and has been in its inner led chip.Wherein, housing 01 is divided into dope layer 02 and heat-conducting layer 04, heat-conducting layer 04 by copper through punching press with stretch and to make, outer then be coated on the heat-conducting layer 04 by the material that traditional PCB making sheet printing ink and Heat Conduction Material mix and make, make whole housing 01 aenescent water wave shape.When led chip is started working, the part of the heat of its generation can accumulate in the above-mentioned closed space, cause the temperature in the space to raise, the temperature that raises will be delivered to the external world by the housing of being made up of heat-conducting layer 04 and dope layer 02 01, wherein, the effect of dope layer 02 is to quicken dispersing of heat on the heat-conducting layer 04, thereby has reduced the temperature in the closed space rapidly, has avoided the continuation of temperature to raise.The design feature of this water wave shape has more effectively enlarged its area of dissipation, has improved radiating efficiency.
The housing 01 of MR16 shot-light as shown in Figure 3 is a waveform, the housing 01 of street lamp shown in Figure 4 is a form of gear tooth, the housing 01 of desk lamp shown in Figure 5 is a water wave shape, though the hull shape on these LED lamps is different, but it forms structure is the same, all be divided into heat-conducting layer 04 and dope layer 02, just its use material and processing method are different, and the shape of housing 01 also can be designed to difformity as the case may be.
Certainly, above embodiment just is explanation rather than restriction the utility model, the above only is preferred embodiment of the present utility model, so all equivalences of being done according to the described method of the utility model application range change or modify, is included in the utility model application range.

Claims (4)

1. a LED lamp outer casing comprises the housing that is used to connect lamp holder and lampshade, it is characterized in that: described housing comprises the heat-conducting layer with concaveconvex structure and the dope layer with heat conduction and heat radiation function of heat-conducting layer outer side covers.
2. a kind of LED lamp outer casing according to claim 1 is characterized in that: have the described heat-conducting layer of concaveconvex structure, made by Heat Conduction Material, be waveform or water wave shape or form of gear tooth.
3. a kind of LED lamp outer casing according to claim 2 is characterized in that: the material of described Heat Conduction Material is copper or aluminium or iron or stainless steel or thermal conductive ceramic.
4. a kind of LED lamp outer casing according to claim 1 is characterized in that: the described dope layer with heat conduction and heat radiation function has color, is golden or silver color or coppery.
CN2009203132295U 2009-10-26 2009-10-26 LED lamp housing Expired - Fee Related CN201526914U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2009203132295U CN201526914U (en) 2009-10-26 2009-10-26 LED lamp housing
PCT/CN2009/075953 WO2011050550A1 (en) 2009-10-26 2009-12-24 Led lamp outer shell

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2009203132295U CN201526914U (en) 2009-10-26 2009-10-26 LED lamp housing

Publications (1)

Publication Number Publication Date
CN201526914U true CN201526914U (en) 2010-07-14

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Application Number Title Priority Date Filing Date
CN2009203132295U Expired - Fee Related CN201526914U (en) 2009-10-26 2009-10-26 LED lamp housing

Country Status (2)

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CN (1) CN201526914U (en)
WO (1) WO2011050550A1 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011035645A1 (en) * 2009-09-27 2011-03-31 Shen Lihao Led light bulb with multiple layers of radiating structures
CN102226508A (en) * 2011-05-13 2011-10-26 肖方一 LED (light emitting diode) lamp and preparation method thereof
CN104254904A (en) * 2011-10-31 2014-12-31 登森·西尔 Led light source
CN106324946A (en) * 2016-10-31 2017-01-11 维沃移动通信有限公司 Heat dissipation device for flash lamp
CN107701949A (en) * 2017-10-27 2018-02-16 中山市修本照明有限公司 A kind of lamp outer casing and preparation method thereof and light fixture
CN109587300A (en) * 2018-12-05 2019-04-05 科立视材料科技有限公司 A kind of decoration color heat conducting coating structure and preparation method thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201014249Y (en) * 2006-12-27 2008-01-30 千如电机工业股份有限公司 Lighting improvement device having heat dispersion
CN201121844Y (en) * 2007-11-23 2008-09-24 贤智电子股份有限公司 Outdoor led lamp with high cooling property and its lamp body device
CN201228865Y (en) * 2008-07-17 2009-04-29 张光发 High power LED lighting fixture
CN201302117Y (en) * 2008-11-26 2009-09-02 西安电子科技大学创新数码股份有限公司 Led lighting bulb
CN101482257A (en) * 2008-12-03 2009-07-15 刘端蓉 LED lamp and its cooling method and cooling structure
CN201377694Y (en) * 2009-04-17 2010-01-06 张文周 LED illumination equipment with radiating structure

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011035645A1 (en) * 2009-09-27 2011-03-31 Shen Lihao Led light bulb with multiple layers of radiating structures
CN102226508A (en) * 2011-05-13 2011-10-26 肖方一 LED (light emitting diode) lamp and preparation method thereof
WO2012155807A1 (en) * 2011-05-13 2012-11-22 Yu Zhaopeng Led lamp and manufacture method thereof
CN104254904A (en) * 2011-10-31 2014-12-31 登森·西尔 Led light source
US10429053B2 (en) 2011-10-31 2019-10-01 Epistar Corporation LED light source
US11118775B2 (en) 2011-10-31 2021-09-14 Epistar Corporation LED light source
CN106324946A (en) * 2016-10-31 2017-01-11 维沃移动通信有限公司 Heat dissipation device for flash lamp
CN107701949A (en) * 2017-10-27 2018-02-16 中山市修本照明有限公司 A kind of lamp outer casing and preparation method thereof and light fixture
CN109587300A (en) * 2018-12-05 2019-04-05 科立视材料科技有限公司 A kind of decoration color heat conducting coating structure and preparation method thereof

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Publication number Publication date
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Legal Events

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C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100714

Termination date: 20131026