CN201526837U

CN201526837U - LED bulb with multiple layers of heat dissipation structures

Info

Publication number: CN201526837U
Application number: CN2009202053313U
Authority: CN
Inventors: 沈李豪
Original assignee: Individual
Current assignee: Individual
Priority date: 2009-09-27
Filing date: 2009-09-27
Publication date: 2010-07-14
Anticipated expiration: 2019-09-27
Also published as: WO2011035645A1

Abstract

An LED bulb with multiple layers of heat dissipation structures relates to the technology of LED application, and comprises an LED line carrier, a total lamp cup body, a controller, an LED chip and a lampshade. The LED line carrier can be shaped into a plane with a substrate carrier surface A, and the whole edges of the plane are folded into wide rims or can be molded into a cap with a whole circle of brims, a first substrate carrier surface is formed by arching the central portion of the cap, the whole edges of the first substrate carrier surface are folded into wide rims and then folded to extend towards all directions to form a brim-like second substrate carrier surface, and an Nth substrate carrier surface is formed by analogy. The total lamp cup body is a multilayer structure and is provided with a first layer of lamp cup, a second layer of lamp cup to an Nth layer of lamp cup by analogy. A circuit board is arranged on the substrate carrier surfaces, the LED line carrier is made of materials with thermal conductive performance, the total lamp cup body is made of heat dissipative materials, heat dissipative air through holes are evenly and densely distributed on the cup walls of the second layer of lamp cup to the Nth layer of lamp cup. The LED bulb has large heat dissipative area and fine heat dissipative effect, and effectively prolongs the service life of LED luminous bodies.

Description

LED bulb with multilayer radiator structure

Technical field

The utility model relates to the led chip applied technical field, relates in particular to a kind of LED bulb with multilayer radiator structure.

Background technology

LED (Light Emitting Diode) is a light emitting diode, is a kind of solid-state semiconductor devices, and it can directly be converted into light to electricity, and photometric standard lamp is experiencing a revolution.For the consideration of the protection energy and reply global warming, some states of the U.S. and some other country begin to ban use of the incandescent lamp bulb of low efficiency.Various new technologies are used to replace incandescent lamp bulb just one after another, and wherein compact type vacuum fluorescent lamp (CFL) is main replacement scheme.Although the power consumption of this CFL lamp is 20% of an incandescent lamp only, contain noxious material mercury.By contrast, the LED lamp can provide more efficient and the solution of environmental protection more.

Led light source has the use low-tension supply, power consumption is few, applicability is strong, stability is high, response time is short, environmentally safe, the advantage of multicolor luminous grade, although along with the progressively raising of white light LEDs luminous efficiency, the possibility that white light LEDs is applied in lighting field is also increasing, but reach the needed lumen number of illumination, no matter be to use which kind of method, the capital is because must handle high heat in minimum LED encapsulation, these heats if assembly can't leave, except various encapsulating materials can have the problem of product reliability owing to the difference of the coefficient of expansion to each other, the luminous efficiency of chip more can have along with the rising of temperature significantly and to descend, and causes shorten significantly service life and improve the lumen cost.Therefore, the heat in the assembly that how to leave becomes the important topic that present LED uses.

Existing application generally all is to add radiator on LED in the heat dissipating method on the LED, dispels the heat in the mode that increases area of dissipation.And the area of fin is just big more when power is big more, sometimes even do not satisfy radiating requirements, so the single dependence fin of the heating problem of most of LED is difficult to solve, and exist big weight large volume, the more high a series of problems of cost illustrate as follows now:

Case one: as the patent No. is the disclosed technical scheme of state's utility model patent among 200410047327.0, earlier LED is arranged on the metallic object, LED and metallic object is arranged on the heat radiation pedestal again, on the heat radiation pedestal a plurality of heat radiation claspers is arranged.The scheme of the passive heat radiation of this class can also satisfy the heat radiation requirement under the smaller situation of LED heating, but when a plurality of LED dense arrangement or/and LED power ratio bigger the time, this radiating mode just can not dispel the heat to LED effectively.

Case two: disclose the high-power and high-luminance illuminating lamp again as patent CN1807971A (application number 200610038143.7), its principle is to utilize fan forced convection to reach effectively the heat quick heat radiating on its backside heat device, and reach the purpose of heat radiation, yet the life-span of fan is limited, and all there are huge gap in shockproof properties and working stability performance with LED, therefore, use the inevitable bottleneck that on fan, exists of LED luminaire of fan forced convection, the life-span of LED itself is long, advantages such as working stability are difficult to performance, also can cause the LED lamp to become complicated at fit on, gross weight increases.

Case three: be a kind of LED lighting bulb structure of 200820117326.2 as number of patent application, for being provided with a bulb controller in lamp holder inside, this bulb controller bottom surface is fixing to engage lid on one, covering the bottom surface at last joint is fixed with the radiating fin group of an inner sheathed at least one heat pipe and engages lid once, engage in this time and to cover periphery and be spirally connected and one be built-in with the bulb shell of pallet, and be projected with a plurality of LED lamp groups of corresponding a plurality of heat pipes in tray bottom surface; By this, make a plurality of LED lamp groups produce heat energy, via the hot cold exchange of a plurality of heat pipes and radiating fin group, allow cold and hot separation, though this kind structure can improve certain radiating effect, its complex structure, it is bigger to be difficult for assembling and overall weight, is difficult for extensive use.

The utility model content

The purpose of this utility model is to overcome the above-mentioned deficiency of prior art, the LED bulb that provide a kind of perfect heat-dissipating, energy consumption is low, light decay is little, technology simply has the multilayer radiator structure.

The utility model solves the problems of the technologies described above the technical scheme that is adopted:

Construct a kind of LED bulb, comprise that a LED circuit carrier, Lamp cup are overall, a controller, led chip and lampshade with multilayer radiator structure.

Described LED circuit carrier, it can be plane, it is plane LED circuit carrier, the whole circle that it has an A base load face and its edge folds into wide shape limit, and (so-called wide shape limit refers to that A base load face edge folds certain width with the limit as A base load face, because of plane LED circuit carrier very thin, after folding certain width, the actual effect of generation thickens the limit of A base load face, with the contact-making surface of the overall corresponding near rim of a cup place wall of cup of increase and Lamp cup.Following synonym); Described LED circuit carrier also can be shaped to the hat that has as the whole circle shade, it is hat LED circuit carrier, arch upward to form the first base load face in its centre, the whole circle at the edge of the first base load face fold into wide shape limit again to around fold the second base load face that stretches out as the formation shade, and by that analogy to N base load face, wherein N is the positive integer more than or equal to 2, and the whole circle at the edge of the base load face of outmost turns folds into wide shape limit.

Described Lamp cup is a sandwich construction totally, has the ground floor Lamp cup, second layer Lamp cup, and by that analogy to N layer Lamp cup, wherein N is the positive integer more than or equal to 2; The ground floor Lamp cup is positioned at the overall centre of described Lamp cup, form first space in it, second layer Lamp cup rim of a cup diameter is greater than ground floor Lamp cup rim of a cup diameter and be sheathed on ground floor Lamp cup periphery, form second space between second layer Lamp cup and ground floor Lamp cup, the Lamp cup number of plies and the space number of plies are by that analogy; Except that the lamp wall at outermost layer Lamp cup rim of a cup place is the bladed, the lamp wall at other each layer Lamp cup rim of a cup place folds into wide shape limit.

For plane LED circuit carrier, its described A base load face is embedded in that described Lamp cup is overall locatees near the rim of a cup place, and the inside of the wide shape limit that folds of the whole circle at the edge of described A base load face and the overall outermost layer Lamp cup of described Lamp cup is near the wall of cup applying at rim of a cup place.

For hat LED circuit carrier, overall ground floor Lamp cup to the N layer Lamp cup of the quantity of first base load face to the N base load face and position and described Lamp cup is corresponding, first base load face to the N base load face all is embedded in the close rim of a cup place separately of each overall respective layer Lamp cup of described Lamp cup and locatees, and except the wide shape limit of outermost layer base load face is embedded in the location, nearly rim of a cup place of outermost layer Lamp cup inside, the wide shape limit of the base load face of other each layer all is embedded in the location, outside near rim of a cup place of each layer Lamp cup corresponding with it.

On the described A base load face and on first base load face to the N base load face circuit board is set.

Described LED circuit carrier, its material is the material with heat conductivility.

Make described Lamp cup and totally adopt the heat radiation material.

The heat radiation passage all gathers on the wall of cup of second layer Lamp cup to the N layer Lamp cup that described Lamp cup is overall.

With respect to prior art, the utlity model has following advantage and beneficial effect:

1, but the appearance of LED circuit carrier is hat LED circuit carrier, and has a plurality of base load faces, all can be provided with electronic circuit on each base load face, reaches to increase the surface area of carrier, and the area of dissipation of carrier is increased;

When 2, the appearance of LED circuit carrier is hat LED circuit carrier, its base load face can be corresponding with the sandwich construction Lamp cup, the heat energy that produces when the led chip on each base load face is worked, be dispersed in the air via corresponding each layer Lamp cup wall of cup, further disperseed heat energy, improve the hot shock-resistant ability of LED lamp, solved the heat dissipation problem of LED lamp, effectively prolonged the service life of LED illuminator.

3, its sandwich construction Lamp cup, the Lamp cup number of plies is many more, and total surface area is bigger, and radiating effect is better.

4, its second layer Lamp cup with all be densely covered with the heat radiation passage that forms through boring, punching, forging, etching, mode such as punch by that analogy to the wall of cup of N layer Lamp cup, the heat radiation passage distributes the heat energy in each space easily apace at LED work adstante febre, effectively improves radiating efficiency.

5, first space in its ground floor Lamp cup is a confined space, can have good water-proof function.

Description of drawings

The utility model is described in further detail below in conjunction with accompanying drawing.

Fig. 1 is the utility model decomposing schematic representation with two layers of radiator structure and planar LED circuit carrier.

Fig. 2 is the utility model decomposing schematic representation with two layers of radiator structure and hat LED circuit carrier.

Fig. 3 is the utility model overall schematic with two layers of radiator structure and hat LED circuit carrier.

Fig. 4 is the overall schematic with two layers of radiator structure and planar LED circuit carrier.

Fig. 5 is the utility model overall schematic with three layers of radiator structure and hat LED circuit carrier.

Fig. 6 is the overall schematic with three layers of radiator structure and planar LED circuit carrier.

Fig. 7 is that the utility model is the heat radiation mechanism figure of planar LED circuit carrier.

Fig. 8 is the partial enlarged drawing of Fig. 7.

Fig. 9 is that the utility model is the heat radiation mechanism figure of hat LED circuit carrier.

Figure 10 is the partial enlarged drawing of figure nine.

Wherein: 10, planar LED circuit carrier; 101, A base load face; 01, hat LED circuit carrier; 011, the first base load face; 012, the second base load face; 013, the 3rd base load face; 014, wide shape limit; 02, Lamp cup is overall; 021, ground floor Lamp cup; 022, second layer Lamp cup; 023, the 3rd layer of Lamp cup; 0211, first space; 0221, second space; 0231, the 3rd space; 03, heat radiation passage; 0212, burnishing surface wall of cup; 0213, concavo-convex wall of cup; 04, controller; 05, led chip; 06, lampshade; 07, lamp holder; 08, heat energy loss path.

The specific embodiment

To shown in Figure 6, the utility model is a kind of to have multilayer radiator structure LED bulb, comprises a LED circuit carrier, overall 02, one controller 04 of a Lamp cup, led chip 05, lampshade 06 and lamp holder 07 as Fig. 1; Described LED circuit carrier can be a planar LED circuit carrier 10, its whole circle with an A base load face 101 and its edge folds into wide shape limit 014, it has a base load face 011, and its rim 014 is located on to fold downwards around the base load face and makes, can be embedded in the corresponding nearly rim of a cup place of described Lamp cup overall 02 and locate, and tight and wall of cup applying, so-called wide shape limit refers to that A base load face edge folds certain width with the limit as A base load face, because of plane LED circuit carrier very thin, after folding certain width, the actual effect that produces thickens the limit of A base load face, with the contact-making surface of the overall corresponding near rim of a cup place wall of cup of increase and Lamp cup; Described LED circuit carrier also can appearance become hat LED circuit carrier 01, arch upward to form the first base load face 011 in its centre, the whole circle at the edge of the first base load face 011 fold into wide shape limit 014 again to around fold the second base load face 012 that stretches out as the formation shade, and by that analogy to N base load face, the whole circle at the edge of the base load face of outmost turns folds into wide shape limit 014, can be embedded in the location, the nearly rim of a cup of corresponding Lamp cup place of described Lamp cup overall 02, and tight and wall of cup applying; Described Lamp cup overall 02 is the goblet with the heat radiation material, has ground floor Lamp cup 021, second layer Lamp cup 022, and by that analogy to N layer Lamp cup, its ground floor Lamp cup 021 is positioned at the centre of described Lamp cup overall 02, form first space 0211 in the ground floor Lamp cup 021, second layer Lamp cup 022 rim of a cup diameter is greater than ground floor Lamp cup 021 rim of a cup diameter and be sheathed on outside the ground floor Lamp cup 021, and form second space 0221, the Lamp cup number of plies and the space number of plies are by that analogy, and except outermost layer Lamp cup rim of a cup is the bladed, the lamp wall at other each layer Lamp cup rim of a cup place folds into wide shape limit 014, and can fit tightly with the inwall of planar LED circuit carrier 10 or hat LED circuit carrier 01.

Planar LED circuit carrier 10 and hat LED circuit carrier 01, its material is copper, aluminium, iron, stainless steel, pottery or other tensility, the flexible metal with heat conductivility, can form (being hat) of the curved surface appearance plane or various by modes such as stretching or punching presses, as stepped shape, concaveconvex shape etc., and directly be provided with a plurality of being in series with the corresponding electronic circuit of base load face on 01 more than base load face of hat LED circuit carrier and connect, all be installed with one or more led chip 05 on each base load face.

Described Lamp cup is overall 02, and its material can be copper, aluminium, pottery or other heat sink material, and wherein first space 0211 that forms in the ground floor Lamp cup 021 is a confined space; And described Lamp cup overall 02, can ccontaining controller 04 in its first space 0211 and form a confined space, its wall of cup 0212 can be a burnishing surface wall of cup 0212, also can be the concavo-convex wall of cup 0213 of shapes such as the concave-convex that forms through modes such as electrolysis or etchings, spirality, second layer Lamp cup 022 with all be densely covered with the heat radiation passage 03 that forms through boring, punching, forging, etching, mode such as punch by that analogy to the wall of cup of N layer Lamp cup.

The base load face of described hat LED circuit carrier 01 can be corresponding with the multilayer lamp wall of Lamp cup overall 02, and except the wide shape limit 014 of outermost base load face is embedded in location, outermost Lamp cup inner near rim of a cup place, the wide shape limit 014 of the base load face of other each layer all is embedded in the location, outside near rim of a cup place of corresponding each layer Lamp cup with it.

LED circuit carrier described in the utility model, controller 04, led chip 05 and lampshade 06 are assemblied in Lamp cup overall 02.

As Fig. 7, shown in Figure 8, when the LED bulb of planar LED circuit carrier 10 of the present utility model operates, led chip 05 can produce a large amount of heat energy 08, the heat energy 08 that the led chip 05 of its A base load face 101 innermost layers is produced is folded the wide shape limit 014 that makes by ground floor Lamp cup 021, import ground floor Lamp cup 021 wall of cup to 0221 loss of second space, another part heat energy 08 will fold the wide shape limit 014 that makes by second layer Lamp cup 022, import the loss in air of second layer Lamp cup 022 wall of cup, meanwhile, heat energy 08 in first space 0211 can spill in the air by the Lamp cup bottom, heat energy 08 in second space 0221 can spill in the air by the heat radiation passage 03 on second layer Lamp cup 022 wall of cup, a large amount of heat energy 08 are by the loss of this kind mode, thus the radiating efficiency of raising LED lamp.

As Fig. 9, shown in Figure 10, when the utlity model has the LED bulb running of hat LED circuit carrier 01, led chip 05 can produce a large amount of heat energy 08, the heat energy 08 that led chip 05 on the base load face 011 is produced is by folding the wide shape limit 014 that makes, import ground floor Lamp cup 021 wall of cup to 0221 loss of second space, the heat energy that led chip produced 08 on the second base load face 012 is by folding the wide shape limit 014 that makes, import the loss in air of second layer Lamp cup 022 wall of cup, meanwhile, heat energy 08 in first space 0211 can spill in the air by the Lamp cup bottom, heat energy 08 in second space 0221 can spill in the air by the heat radiation passage 03 on second layer Lamp cup 022 wall of cup, a large amount of heat energy 08 pass through the loss of this kind mode, thereby reach the effect of the radiating efficiency that improves the LED lamp.

The utility model is simple in structure, and radiating effect is remarkable, and cost is low, environmental protection and energy saving.

Describe specific embodiment of the utility model above in detail.But should be appreciated that embodiment of the present utility model is not limited in these embodiment, the description of these embodiment only is used for helping to understand spirit of the present utility model.Under the spirit that the utility model disclosed, the various variation examples to the utility model is done all should be included in the scope of the present utility model.

Claims

1. the LED bulb that has the multilayer radiator structure comprises that a LED circuit carrier, Lamp cup are overall, a controller, led chip and lampshade; It is characterized in that:

Described LED circuit carrier, it can be plane, promptly plane LED circuit carrier, the whole circle that it has an A base load face and its edge folds into wide shape limit; Described LED circuit carrier also can be shaped to the hat that has as the whole circle shade, it is hat LED circuit carrier, arch upward to form the first base load face in its centre, the whole circle at the edge of the first base load face fold into wide shape limit again to around fold the second base load face that stretches out as the formation shade, and by that analogy to N base load face, wherein N is the positive integer more than or equal to 2, and the whole circle at the edge of the base load face of outmost turns folds into wide shape limit;

Described Lamp cup is a sandwich construction totally, has the ground floor Lamp cup, second layer Lamp cup, and by that analogy to N layer Lamp cup, wherein N is the positive integer more than or equal to 2; The ground floor Lamp cup is positioned at the overall centre of described Lamp cup, form first space in it, second layer Lamp cup rim of a cup diameter is greater than ground floor Lamp cup rim of a cup diameter and be sheathed on ground floor Lamp cup periphery, form second space between second layer Lamp cup and ground floor Lamp cup, the Lamp cup number of plies and the space number of plies are by that analogy; Except that the lamp wall at outermost layer Lamp cup rim of a cup place is the bladed, the lamp wall at other each layer Lamp cup rim of a cup place folds into wide shape limit;

For plane LED circuit carrier, its described A base load face is embedded in that described Lamp cup is overall locatees near the rim of a cup place, and the inside of the wide shape limit that folds of the whole circle at the edge of described A base load face and the overall outermost layer Lamp cup of described Lamp cup is near the wall of cup applying at rim of a cup place;

For hat LED circuit carrier, overall ground floor Lamp cup to the N layer Lamp cup of the quantity of first base load face to the N base load face and position and described Lamp cup is corresponding, first base load face to the N base load face all is embedded in the close rim of a cup place separately of each overall respective layer Lamp cup of described Lamp cup and locatees, and except the wide shape limit of outermost layer base load face is embedded in the location, nearly rim of a cup place of outermost layer Lamp cup inside, the wide shape limit of the base load face of other each layer all is embedded in the location, outside near rim of a cup place of each layer Lamp cup corresponding with it;

On the described A base load face and on first base load face to the N base load face circuit board is set;

Described LED circuit carrier, its material is the material with heat conductivility;

Make described Lamp cup and totally adopt the heat radiation material;

2. the LED bulb with multilayer radiator structure according to claim 1 is characterized in that: described LED circuit carrier forms planar LED circuit carrier or hat LED circuit carrier by stretching or punching press.

3. the LED bulb with multilayer radiator structure according to claim 1 is characterized in that: on the A base load face of described LED circuit carrier, on first base load face to the N base load face more than one led chip is set respectively, and connects corresponding circuit board.

4. the LED bulb with multilayer radiator structure according to claim 1 is characterized in that: make the heat conductivility material of described LED circuit carrier, be copper or aluminium or iron or stainless steel or thermal conductive ceramic.

5. the LED bulb with multilayer radiator structure according to claim 1 is characterized in that: making the overall heat radiation material of described Lamp cup is copper or aluminium or iron or stainless steel or thermal conductive ceramic.

6. the LED bulb with multilayer radiator structure according to claim 1, it is characterized in that: first space content of the ground floor Lamp cup that described Lamp cup is overall is put the controller that is connected with circuit board and is formed a confined space, its wall of cup can be the plane, also can be concave-convex, spiral out-of-flatness face through electrolysis or etching mode formation.